JP2011112758A - Contactless ic label and label-stuck object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contactless IC label and a label-stuck object, in which when the label is peeled, a label substrate is reliably broken and at the same time an antenna of the contactless IC medium is cut to bring the communication function into a completely incapable state. <P>SOLUTION: The IC label A includes, on a major face of a label substrate 1: an adhesive material 5; and a contactless IC medium 7 that transmits, via radiowaves, predetermined identification information stored in a chip 3 through an antenna 4, wherein a notch 2 is formed in a periphery of the IC chip, and the notch has a three-dimensional structure (step-like structure) when the IC label is stuck to an object for sticking B. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is a non-contact IC label that is used by being affixed to a product or its package, and a sticker thereof, which leaves a trace when attempting to peel off from the sticker and at the same time disables the communication function The present invention relates to an IC label and a patch.

  In recent years, for items that are difficult to forge, such as relatively expensive products such as high-class liquor and consumables for electrical appliances, a label is attached to the product itself or a case that wraps it to determine its authenticity. Is being pasted. However, when a fraudulent company handles a fraudulent product that forges a legitimate article, it is authorized for the purchaser by attaching a similar label to the fraudulent article. This makes it difficult to distinguish an article from an illegal article.

  Therefore, a seal label or the like having a forgery prevention function by mounting an IC tag having a high security function has been proposed (see, for example, Patent Document 1). In particular, by embedding an IC chip in which unique identification information is stored, individual discrimination becomes possible.

  However, with the sealed label as described above, it is possible to cleanly remove the sealed label that has been affixed to the regular article from the patch, and the label itself can be reused and affixed to the irregular article. Since it is possible to remove only the non-contact IC medium from the seal label, it is possible to easily reuse the non-contact IC medium by pasting the removed non-contact IC medium on the forged seal label. There's a problem. As a result, the accuracy of authenticity determination is reduced.

  For fraud, such as peeling off the sealed label attached to an authorized article and attaching it to an unauthorized article, make a notch that will cause the sealed label to break when the peeling operation is performed. Etc., and a brittleness treatment for reducing the mechanical strength of the substrate has been proposed (see, for example, Patent Document 2).

JP 2003-150924 A JP 2008-186127 A

  The present invention has been made in view of such circumstances, and the label base material itself is reliably destroyed by the act of peeling the sealed label from the sticking body, and at the same time, the antenna of the non-contact IC medium is also broken. It is an object of the present invention to provide a non-contact IC label and a patch thereof that can reliably disable the communication function.

According to the first aspect of the present invention, a label base material provided with an adhesive material to be attached to a patch having unevenness, and predetermined identification information provided on the label base material and stored in the IC chip are transmitted by an antenna. When a non-contact IC label having a non-contact IC medium having a wirelessly transmitted IC chip and an antenna and provided with a cut in accordance with the unevenness of the paste on the periphery of the IC chip is pasted In addition, in the non-contact IC label, the cut portion has a three-dimensional structure that matches the unevenness of the patch.

  According to a second aspect of the present invention, there is provided a label base material provided with an adhesive material, and a non-contact IC medium provided on the label base material and wirelessly transmitting predetermined identification information stored in an IC chip by an antenna. In the sticking body characterized in that when the non-contact IC label provided with a cut is provided on the periphery of the IC chip, the cut portion is provided with irregularities so as to form a three-dimensional structure. is there.

  In the invention according to claim 3, the depth of the deepest portion of the concave portion of the portion where the uneven portion is pasted with the cut portion of the non-contact IC label is 2 mm or more, the base is 4.3 mm or less, and the deepest The patch according to claim 2, wherein the slope angle to the recess is 25 degrees or more.

  The invention according to claim 4 is the non-contact IC label according to claim 1, wherein an OVD (Optical Variable Device) functional layer is provided so as to cover the cut portion.

  The invention according to claim 5 is characterized in that the cut portion is provided so as to reach an antenna base provided on the antenna of the non-contact IC medium. IC label.

  The invention described in claim 6 is the non-contact IC label according to any one of claims 1, 4, and 5, wherein the label base material is brittle.

  The invention according to claim 7 is characterized in that the antenna of the non-contact IC medium is provided with conductive ink and does not have the antenna base material. It is a non-contact IC label as described in the item.

  The non-contact IC label and the patch of the present invention are configured as described above, the predetermined identification information is stored in the IC chip, and the non-contact IC label attached to the patch has a three-dimensional structure of the cut portion. It is impossible to cleanly remove the non-contact IC label from the sticker, and the label substrate itself is surely destroyed by the act of peeling the sealed label from the sticker, and the antenna of the IC medium is also broken. In order to reliably disable the communication function, it becomes impossible to remove the non-contact IC medium from the sealed label affixed to the authorized article, and fraudulent acts such as using the non-contact IC medium for counterfeiting are also effective. Can be prevented.

  Furthermore, the non-contact IC label of the present invention is provided with an OVD functional layer that changes color depending on the viewing angle at the incision portion, so that the incision portion that becomes a three-dimensional structure when affixed to the patch is also viewed from the front. The visual effect (color change) can be confirmed, and the authenticity can be determined efficiently.

The explanatory view which looked at the example of the embodiment of the 1st non-contact IC label concerning the present invention in the plane Explanatory drawing which looked at the example of the 1st non-contact IC label concerning the present invention in a section (X-Y section). Explanatory drawing which looked at the cross section of the notch before sticking the example of the 2nd non-contact IC label which concerns on this invention to the example of a sticking body, and a sticking body Explanatory drawing which looked at the cross section of the cut part at the time of affixing the example of the 2nd non-contact IC label which concerns on this invention to the example of a sticking body Explanatory drawing which looked at the non-contact IC medium incorporated in an example of the 1st non-contact IC label concerning this invention in the plane It is a graph which shows the relationship between the antenna length (L) at the time of cutting one side of the antenna of the IC tag built in the example of the non-contact IC label which concerns on this invention, and communication distance.

  Hereinafter, the non-contact IC label (A) in the embodiment of the present invention will be described with reference to the drawings. 1 and 2 are a plan view and a cross-sectional view (cross section of FIG. 1X-Y) of an example of a non-contact IC label (A) as an embodiment of the present invention. FIG. 3 is a cross-sectional view of the notches (21, 22) and the uneven portions (91, 92) of the patch (B) when the non-contact IC label (A) as an embodiment of the present invention is stuck to the patch. FIG.

The non-contact IC label (A) includes a label base material (1), and on the front and back surfaces of the label base material (1), a printed layer (on which various information such as the name of the patch is printed) 11) is provided.
In addition, an adhesive layer (5) is provided on the back surface of the label substrate (1), a non-contact IC medium (7) is attached, and an adhesive layer (5) for further attachment to the adhesive body (B) is provided. It has been.

  Further, a release sheet (6) that can be easily peeled off is temporarily attached to the surface of the adhesive layer (5). As the release sheet (6), a release agent layer such as silicon resin is laminated on a paper or plastic sheet by coating or the like.

  The non-contact IC medium (7) is a passive type having no IC chip drive battery. Instead of the passive type, an active type having an IC chip drive battery can be used. In this case, the structure of the non-contact IC medium (7) is complicated, but there is an effect that the reading distance is extended.

  The non-contact IC medium (7) is attached to the adhesive layer (5) on the surface of the antenna base (8) extending in a band shape. The non-contact IC medium (7) is mounted on the antenna (4) formed of a metal such as aluminum or copper and the longitudinal center of the antenna 4 and is electrically connected to the antenna (4). IC chip (3).

  The antenna (4) is formed in a strip shape. For example, when the transmitted / received radio wave has a frequency equal to or higher than that of the microwave, the antenna (4) has a length of the antenna (4) in the vicinity of λ / 2, where λ is the wavelength of the frequency used. It functions as a dipole antenna with good radio wave transmission / reception efficiency. For example, when the use frequency of radio waves is 2.45 GHz, the optimum length in the longitudinal direction of the antenna (4) in the dipole type is about 50 mm to 60 mm.

  The non-contact IC medium (7) receives a radio wave from an information reading device (not shown) by an antenna (4) and supplies a potential difference generated in the longitudinal direction of the antenna (4) to the IC chip (3).

  The IC chip (3) is, for example, formed in a square shape, and the side portion has a length dimension of 0.4 mm and a height dimension of 0.1 mm. In addition, the length dimension of a side part can be suitably changed instead of 0.4 mm.

When a radio wave having an intensity sufficient to supply power sufficient for the operation of the IC chip (3) is irradiated, the IC chip (3) enters an operating state. The IC chip (3) returns information held by the IC chip (3) to the information reading device in accordance with a timing signal or command superimposed on the radio wave from the information reading device. The information reader reads the information stored in the IC chip (3) by measuring the intensity of this re-radiation. Such a procedure of transmitting timing signals and commands from the information reading device to the IC chip (3) and a procedure of transmitting information from the IC chip (3) to the information reading device are referred to as an air protocol.

  When the frequency used is less than the microwave frequency, for example, 13.56 MHz, a coiled antenna is frequently used instead of a dipole antenna. The above is an example of the information reading operation of the IC chip (3) used for the non-contact IC label (A).

  The incision (2) in the label base material (1) shown in FIG. 1 is shown as an example of a V-shape, but the shape of this incision is not limited to a V-shape, and is a cross shape, semi-elliptical shape, half-circle A mold etc. can be provided freely.

  On the other hand, the patch (B) to which the non-contact IC label (A) is attached is provided with a recess (91) as shown in FIG. 3, and the non-contact IC label (A) is cut (21, 22). Designed to match the shape of By attaching the non-contact IC label (A) to the recess (91) of the patch (B) and attaching the non-contact IC label (A), the cut (21, 22) portion has a three-dimensional structure (step). Can do.

  Usually, as a method of peeling a label from a sticking body (B), a cutter etc. is put in the part of the adhesive layer (5) between a label base material (1) and a sticking body (B), and an adhesive layer (5) is attached. The method of peeling off is taken. Under the present circumstances, if a cutter is put in parallel with a label base material (1), it can peel without destroying a label base material (1).

  However, when the non-contact IC label (A) affixed to the patch (B) of the present invention is to be peeled off, the three-dimensional structure (step) will be peeled off with a cutter, but the label substrate (1) It is impossible to put a blade of a cutter in the adhesive layer (5) between the tape and the patch (B) in parallel with the label base material, and it is very difficult to peel it off cleanly.

  At this time, it is preferable that the depth (D) of the recess (91) is 2.5 mm or more, the base (E) is 4.3 mm or less, and the angle θ is 25 degrees or more, thereby further destroying the label substrate. And leave a trace of peeling.

  The patch (B) can be provided with a convex portion (92) as shown in FIG. Thereby, the height (D) of the recess (91) is further increased, and the cutter blade is more difficult to enter. And since the groove is also formed in the convex part (92) when peeled from the opposite direction by 180 degrees, it is difficult to insert the blade of the cutter, and the effect of further preventing the non-contact IC label (A) from being peeled off beautifully There is.

  In addition, when the non-contact IC label (A) is pasted into the recess (91) of the patch (B) and the non-contact IC label (A) is pasted, a dedicated three-dimensional jig matching the shape of the recess (91) of the patch (B) is used. It is preferable to paste. Thereby, the notch | incision (2) of a non-contact IC label (A) can be stuck and stuck without gap in the recessed part (91) of a sticking body (B).

  Further, it is preferable that the cut (2) of the non-contact IC label (A) is provided so as to reach the antenna substrate (8) of the non-contact IC medium (7). Thereby, the antenna can be broken, and the communication function can be disabled by breaking the antenna.

  At this time, the non-contact IC medium (7) is provided so that one side of the V-shaped cut (2) provided so as to reach the antenna base (8) enters the position of 5 mm or less from the IC chip (3).

  This is because when one side of the antenna (4) of the non-contact IC medium (7) is cut and the communication distance is measured and the antenna length (L) is 5 mm or less as shown in FIG. This is because it becomes impossible to design the V-shaped cut (2) so that the antenna length is broken at a position of 5 mm or less when the label is peeled off.

  In particular, the slit portion (41) in FIG. 5 is an important part for impedance matching conditions between the antenna (4) and the IC chip (3), and it is most efficient to disconnect this part. As shown, it is preferable to arrange a V-shaped cut (2) around the slit portion (41).

  In the present invention, when the non-contact IC label (A) is to be peeled off, the label base material (1) is first destroyed, so that the trace can be reliably left. At the same time, the antenna (4) of the non-contact IC medium (7) is broken, and the generation efficiency of the voltage difference in the longitudinal direction of the antenna (4) is reduced, or impedance matching between the antenna (4) and the IC chip (3) is performed. The operation of the IC chip (3) stops due to the deterioration of the above conditions, the electrical connection between the antenna (4) and the IC chip (3) being broken, or the like.

  Since reading of information from the IC chip (3) is not normally performed, it means that the antenna (4) and the IC chip (4) are defective and the combination condition is deteriorated. This suggests the possibility that the history of trying to destroy or peel A) or the act of trying to destroy or peel them exists. Further, it is possible to effectively prevent counterfeiting such as taking out the non-contact IC medium (7) from the non-contact IC label (A) and reusing it.

  An OVD function layer (12) that changes color depending on the viewing angle is provided around the notch (2) of the I non-contact IC label (A). As described above, when the non-contact IC label (A) is pasted on the patch B, the cut 2 portion becomes a three-dimensional structure by being pasted along the recess (91) of the patch B. That is, in the OVD function layer (121) provided on the patch recess (91) of the patch (B) and the OVD function layer (122) pasted on the other patch (B), Because the reflection angle is different, it looks different even when viewed from the front. As a result, the authenticity of the non-contact IC label (A) can be easily and reliably determined visually.

  The OVD functional layer (12) is provided by printing using an OVD functional material. An OVD (Optical Variable Device) is an image that uses interference of light, and is a display that produces a color shift in which the color changes depending on the representation of a stereoscopic image and the viewing angle, and is a medium that can be determined by visual inspection. It is. Among them, examples of the OVD such as a hologram and a diffraction grating include a relief type that records light interference fringes on a plane as a fine uneven pattern, and a volume type that records interference fringes in a volume direction.

  Also, although the method is different from that of holograms and diffraction gratings, there are multilayer film systems in which thin films of ceramics and metal materials with different optical characteristics are laminated, or materials that cause color change (color shift) depending on the viewing angle due to liquid crystal materials etc. This is an example. These OVDs can be said to be effective means for preventing forgery because they give a unique impression such as stereoscopic images and color shifts and require advanced manufacturing techniques.

  Among these OVDs, in consideration of mass productivity and cost, a relief hologram (or a relief diffraction grating) or a multilayer thin film type is preferable, and these OVDs are generally widely used.

  First, a relief hologram will be described. This relief type hologram or relief type diffraction grating is mass-produced using a relief type press plate having a fine uneven pattern forming a hologram or a diffraction grating, respectively. That is, this press plate heats and pressurizes the OVD forming layer to replicate a fine uneven pattern.

  The OVD functional layer (12) is for increasing the diffraction efficiency, and is made of a material having a refractive index different from that of the polymer material constituting the relief surface. Examples of the material used include high refractive index materials such as TiO2, Si2O3, SiO, Fe2O3, and ZnS having different refractive indexes, and metal materials such as Al, Sn, Cr, Ni, Cu, and Au that have a higher reflection effect. These materials are used singly or in layers. These materials are formed by a well-known thin film forming technique such as a vacuum deposition method or sputtering, and the film thickness is about 0.5 to 100 nm although it varies depending on the application.

  In order to prevent the hologram from affecting the communication of the non-contact IC medium (7), it is desirable to specify a metal vapor deposition portion or use a transparent hologram made of an insulating non-metal vapor deposition material.

  Furthermore, a multilayer thin film method will be described. In the case of using the multilayer thin film method, as described above, the OVD functional layer (12) is formed of a multilayer thin film layer having different optical suitability, and is laminated as a metal thin film, a ceramic thin film, or a composite thin film formed by combining them. . For example, when thin films having different refractive indexes are stacked, a high refractive index thin film and a low refractive index thin film may be combined, or a specific combination may be stacked alternately. By combining them, a desired multilayer thin film can be obtained.

  This multilayer thin film layer is made of a material such as ceramics or metal, and is formed by laminating approximately two or more high refractive index materials and a low refractive index material having a refractive index of about 1.5 with a predetermined film thickness. Examples of materials used are given below. First, as ceramics, Sb2O3 (3.0 = refractive index n: hereinafter the same), Fe2O3 (2.7), TiO2 (2.6), CdS (2.6), CeO2 (2.3), ZnS ( 2.3), PbCl2 (2.3), CdO (2.2), Sb2O3 (2.0), WO3 (2.0), SiO (2.0), Si2O3 (2.5), In2O3 (2 .0), PbO (2.6), Ta2O3 (2.4), ZnO (2.1), ZrO2 (2.0), MgO (1.6), SiO2 (1.5), MgF2 (1. 4), CeF3 (1.6), CaF2 (1.3 to 1.4), AlF3 (1.6), Al2O3 (1.6), GaO (1.7) and the like.

  And as a metal simple substance or an alloy thin film, Al, Fe, Mg, Zn, Au, Ag, Cr, Ni, Cu, Si etc. are mentioned, for example. Examples of the low refractive index organic polymer include polyethylene (1.51), polypropylene (1.49), polytetrafluoroethylene (1.35), polymethyl methacrylate (1.49), polystyrene (1 .60) and the like.

  By selecting at least one kind from these high refractive index materials or 30% to 60% transparent metal thin film, selecting at least one kind from low refractive index materials, and alternately laminating them at a predetermined thickness, It shows absorption or reflection for visible light. Note that a thin film made of a metal has a value under a certain condition in the present application because an optical characteristic such as a refractive index changes depending on a state of a constituent material or a forming condition.

Each of the above materials is appropriately selected based on optical properties such as refractive index, reflectance, and transmittance, weather resistance, interlayer adhesion, and the like, and is laminated as a thin film to form a multilayer thin film layer. A known method can be used as the formation method, and the film thickness, film formation speed, number of layers, or optical film thickness (= n · d, n: refractive index, d: film thickness) can be controlled. The vacuum evaporation method and the sputtering method are used.

  These OVDs can be provided by forming them in a very thin foil form and transferring them onto the label substrate (1), or by dispersing the finely divided OVD foil in a resin binder and printing it into an ink.

  It is preferable to use a material having brittleness (fragility) for the label base material (1). Examples of the material for the label substrate (1) include synthetic resin films such as brittle vinyl chloride and brittle polyester that are made brittle by mixing an appropriate amount of a plasticizer such as kaolin and calcium carbonate, or cellulose acetate, low density Examples thereof include films formed by solution film formation of highly crystalline plastic materials such as polyethylene, polystyrene, and polyphenylene sulfide.

  Other materials include UV-cured synthetic resin or UV-cured synthetic resin mixed with an appropriate amount of powder such as kaolin and calcium carbonate, and a film obtained by curing and drying the resin thin film by UV irradiation. . Further, non-woven fabrics made of synthetic fibers or paper such as art paper, coated paper, and high-quality paper can be used.

  Thereby, when it is going to peel off the non-contact IC label (A) affixed on the sticking body, a label base material (1) can be made easier to fracture | rupture and there can exist a forgery prevention effect.

  A brittle substrate can also be used for the antenna substrate (8) of the non-contact IC medium (7).

  The antenna (4) of the non-contact IC medium (7) can also be formed by printing using conductive ink. In that case, it is also possible to print the antenna (4) directly on the label substrate (1) without providing the antenna substrate (8) as shown in FIG. As a result, since the label base material (1) and the antenna (4) are integrated, when the non-contact IC label (A) is to be peeled off from the patch (B), the label base due to the three-dimensional structure of the cut (2) Simultaneously with the destruction of the material (1), it becomes more certain that the antenna (4) is broken to make communication impossible, and the forgery prevention effect can be enhanced.

  As mentioned above, since the non-contact IC label (A) in this invention makes a three-dimensional structure (step) in the notch (2) part when it affixes on a sticking body (B), a non-contact IC label (A) is affixed. When trying to peel off from the body (B), the three-dimensional structure (step) becomes an obstacle, and it is impossible to peel the label base material (1) without destroying it, and a trace can be reliably left. At the same time, the antenna (4) of the non-contact IC medium (7) can be broken to disable the communication function.

  Further, by providing the OVD functional layer (12) so as to be applied to the cut (2), it is possible to perform authenticity determination by visual color change using the above-described three-dimensional structure, and to further enhance the forgery prevention effect. Is possible.

  Next, specific examples of the non-contact IC label (A) of the present invention will be described.

A pattern was printed on a label substrate (width 60 mm, length 39 mm) made of art paper having a thickness of 90 μm by offset printing. Next, an aluminum thin film antenna (4) was formed on a 38 micron PET film by etching. A non-contact IC medium (7) was produced by connecting the antenna (4) and the IC chip (3) having gold bumps by using an anisotropic conductive adhesive and thermocompression bonding.

  After applying an acrylic adhesive having an adhesive strength of 12000 mN / 25 mm to the label substrate (1) and providing an adhesive layer (5), the non-contact IC medium (7) is laminated and further formed thereon. The adhesive layer (5) was laminated, and finally, polyethylene was laminated on one side of the kraft paper, and a silicon-treated separator (6) (thickness: 112 μm) was temporarily adhered thereon.

First, a black ink (trade name) having the following composition is provided on the laser by providing a V-shaped notch arranged so that one side of the V-shape enters a position 1.5 mm from the IC chip (3). : Fine Star R Conk Ink, manufactured by Toyo Ink Manufacturing Co., Ltd.) was subjected to gravure printing so that the cured film thickness was about 2 μm. On top of this, pearl ink having the following composition was applied by silk screen printing to form an OVD functional layer (12). <Pearl ink>
Pigment (trade name: Iriodin 235 manufactured by Merck & Co., Inc.) 8% by mass
Varnish (trade name: SS66 manufactured by Toyo Ink Manufacturing Co., Ltd.) 50% by mass
Solvent (trade name: S718 solvent, manufactured by Toyo Ink Manufacturing Co., Ltd.) 42% by mass

A pattern was printed on a label substrate (1) (width 60 mm, length 39 mm) made of art paper having a thickness of 90 μm by offset printing. On the other main surface, an antenna (4) is formed by screen printing using a silver paste (product name: XA-3106, manufactured by Fujikura Kasei Co., Ltd.), and an IC having this antenna (4) and gold bumps A non-contact IC medium (7) was produced on the label substrate (1) by using an anisotropic conductive adhesive at the connecting portion with the chip (3) and thermocompression bonding.
Thereafter, the adhesive layer (5) was provided in the same manner as in Example 1, and the V-shaped cut (2) and the OVD functional layer (12) were processed to produce a non-contact IC label (A).

Below, the comparative example of this invention is demonstrated.
(Comparative Example 1)

  A non-contact IC medium (7) having an antenna (4) formed by printing a picture on a label substrate (1) made of art paper having a thickness of 90 μm and forming an adhesive layer and etching on the other main surface is laminated. did. Then, the non-contact IC label (A) was produced without performing the cutting process.

  The non-contact IC labels of Examples 1 and 2 and Comparative Example 1 produced in this way were produced and attached to a box containing a product. At that time, the non-contact IC labels of Examples 1 and 2 use a dedicated jig so that the notch of the non-contact IC label fits into a structure having a concave portion and a convex portion as shown in FIG. And pasted. The non-contact IC label of Comparative Example 1 was affixed to a box having no concave and convex structures.

  In the non-contact IC labels of Examples 1 and 2, the color change of the OVD functional layer (12) was first visually observed, and the OVD functional layer (121) pasted on the concave portion and the OVD functional layer ( 122). That is, when viewed from the front, the color stuck in the concave portion was red, and the other color was different from green.

Next, a cutter was put between the adhesive layer (5) of the non-contact IC label (A) affixed to the box as the patch (B), and the three-dimensional structure of the cut (2) part was As a result, the cutter blade could not be inserted and the label substrate (1) could not be removed cleanly. In particular, the non-contact IC label of Example 2 was not able to communicate because the label base material (1) was destroyed and the antenna (4) of the non-contact IC medium (7) was damaged and broken.

  On the other hand, in the non-contact IC label (A) of Comparative Example 1, a cutter blade can be inserted between the adhesive layers (5), and the label substrate (1) can be peeled cleanly without breaking. I was able to reuse the contact IC label. Further, the antenna (4) is difficult to break, and can be used as a non-contact IC label (A) by being attached to a forged label substrate (1).

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

A Non-contact IC label B Paste D Depth of recess 91 E Bottom side of recess 91 Antenna length 1 Label substrate 11 Print layer 12 OVD functional layer 121 OVD functional layer 122 pasted on the patch recess OVD functional layer 2 cut 21 cut recess 22 cut projection 3 IC chip 4 antenna 41 slit portion 5 adhesive layer 6 release sheet 7 non-contact IC medium 8 antenna base 91 patch recess 92 patch protrusion

Claims (7)

  A label base material provided with an adhesive material to be attached to a patch having unevenness, and an IC chip and an antenna provided on the label base material and wirelessly transmitting predetermined identification information stored in the IC chip by an antenna In a non-contact IC label comprising a non-contact IC medium having a non-contact IC medium provided with a cut in accordance with the unevenness of the patch on the periphery of the IC chip, the cut portion is a patch when the non-contact IC label is pasted Non-contact IC label characterized by a three-dimensional structure that matches the unevenness of   A label base material provided with an adhesive material, and a non-contact IC medium provided on the label base material for wirelessly transmitting predetermined identification information stored in the IC chip through an antenna, is cut into the periphery of the IC chip. A sticking body characterized by having an unevenness so that the cut portion has a three-dimensional structure when pasted on a sticking body for pasting a non-contact IC label provided with   The depth of the concave portion of the portion where the uneven portion is attached to the cut portion of the non-contact IC label is 2 mm or more, the base is 4.3 mm or less, and the slope angle to the deepest concave portion is 25 degrees or more. The patch according to claim 2, wherein the patch is.   The non-contact IC label according to claim 1, wherein an OVD (Optical Variable Device) functional layer is provided so as to cover the cut portion.   The non-contact IC label according to claim 1 or 4, wherein the cut portion is provided so as to reach an antenna substrate provided on an antenna of the non-contact IC medium.   The non-contact IC label according to claim 1, wherein the label base material is brittle.   The non-contact IC label according to claim 1, wherein the antenna of the non-contact IC medium is provided with a conductive ink and does not have the antenna base material.