JP4835448B2 - IC label for forgery prevention - Google Patents

Description

  The present invention relates to an anti-counterfeit IC (integrated circuit) label which is used by being attached to, for example, a product or its package.

  In recent years, for items that are difficult to forge, such as relatively expensive products such as high-grade liquor and consumables for electrical appliances, an IC label is attached to the product itself or a case that wraps the product to determine its authenticity. Is being pasted. The IC label has a configuration in which an IC inlet (non-contact IC medium) having a high security function is attached to a part of the adhesive surface of a sealed label (label base material). According to this IC label, individual identification is made possible by storing identification information unique to the IC chip embedded in the IC inlet.

  However, when a fraudulent contractor, etc. handles a fraudulent article that forges a legitimate article, the IC label attached to the legitimate article is neatly peeled off and reused on the fraudulent article. It becomes difficult to distinguish between regular goods and illegal goods.

Therefore, in recent years, an anti-counterfeit IC label that cannot be reused has been proposed (see, for example, Patent Document 1). According to the anti-counterfeit IC label, when the anti-counterfeit IC label attached to the product is peeled off, the IC inlet antenna and the IC chip are separated, and the IC label does not function.
JP 2003-150924 A

  However, in the above-described conventional anti-counterfeit IC label, the antenna used for the IC inlet is usually etched aluminum or copper on a tough base material such as polyimide, polyethylene naphthalate (PEN), or polyethylene terephthalate (PET). Therefore, when the IC inlet is peeled off from the sealed label, the antenna is often not destroyed, and there is a problem that the IC inlet can be reused.

  The above-mentioned sealed label can be easily forged by means such as color copying. Therefore, even if the sealing label is damaged when the above-described conventional anti-counterfeit IC label is peeled off, if only the IC inlet can be removed from the sealing label attached to the regular article, the forged sealing label is removed. If the IC inlet is pasted, the IC inlet can be reused.

  In the present invention, the above-described conventional problems are considered, and when the non-contact IC medium (IC inlet) is removed from the label base material (sealed label), the antenna of the non-contact IC medium is destroyed, Another object of the present invention is to provide an anti-counterfeit IC label that cannot be reused when the connection portion between the antenna and the IC chip is destroyed.

An anti-counterfeit IC label according to the present invention includes a label base material, a non-contact IC medium that wirelessly transmits identification information stored in an IC chip by an antenna provided on the label base material and provided on a support. , an anti-counterfeit IC label comprising an adhesive material, a for attachment to a landing member, adhered to the label base one What Re or not via an adhesive or a pressure-sensitive adhesive of the antenna and the IC chip The antenna is formed using a conductive paste in which particles made of a conductive material are dissolved or dispersed in a binder, and the support is bonded to the antenna via the adhesive or pressure-sensitive adhesive. and either one of the antenna and the IC chip and one of the IC chip is peeled together with the label base material is characterized by comprising a brittle material is peeled off
With such a feature, when the IC label for forgery prevention is peeled off from the adherend and the non-contact IC medium is peeled off from the label base material, the antenna itself or the connection portion between the antenna and the IC chip is destroyed.
Further, since the antenna itself becomes fragile, the antenna is easily destroyed when trying to take out the non-contact IC medium from the label base material.
In addition, since the antenna of the non-contact IC medium is supported by the support made of a fragile material, the antenna is easily destroyed when the non-contact IC medium is peeled off from the label base material.

In the forgery-preventing IC label according to the present invention, the label base material is preferably brittle.
As a result, when the anti-counterfeit IC label attached to the adherend is peeled off, the label base material is easily damaged and the antenna of the non-contact IC medium attached to the label base material is also easily damaged.

Further, the anti-counterfeit IC label according to the present invention is a solvent detection unit that dissolves in a peeling solvent for peeling off the label base material affixed to the adherend, or the peeling It is preferable that at least one of the solvent detection units that chemically react with the solvent is provided.
Accordingly, when the anti-counterfeit IC label is peeled off from the adherend using the peeling solvent, the solvent detection unit is dissolved or chemically reacted.

In the forgery-preventing IC label according to the present invention, it is preferable that unique identification information for each IC chip is stored in the IC chip.
Thereby, the individual IC chip (counterfeit prevention IC label) is determined by reading the identification information of the IC chip mounted on the forgery prevention IC label.

Moreover, it is preferable that the anti-counterfeit IC label according to the present invention includes a security function unit that can be visually or mechanically detected on the label base material.
Thereby, even if the label base material is duplicated by color copy or the like, the duplicated label base material and the original label base material are identified by visually or mechanically detecting the security function unit.

In addition, the security function unit described above includes an OVD function material whose color tone changes according to an incident angle of an incident light source with respect to the security function unit or a position of an observer's viewpoint with respect to the security function unit, and a specific wavelength. At least one of a fluorescent material or a phosphorescent material that emits an electromagnetic wave having a wavelength different from the specific wavelength, and a liquid crystal material that displays the pattern by taking out the specific polarized light. It is preferable that it consists of such one material.
Thereby, even if it is duplicated by color copy or the like, the security function unit is detected visually or by a machine.

Moreover, it is preferable that the anti-counterfeit IC label according to the present invention has an adhesive strength of 8000 mN / 25 mm or more.
Thereby, when peeling the anti-counterfeit IC label stuck on the adherend, the label base material is easily damaged.

  According to the anti-counterfeit IC label of the present invention, when the non-contact IC medium is peeled off from the label substrate, the antenna of the non-contact IC medium is destroyed or the connection portion between the antenna and the IC chip is destroyed. Therefore, it cannot be reused. For this reason, unauthorized use of the non-contact IC medium can be prevented.

  Embodiments of an anti-counterfeit IC label according to the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of an anti-counterfeit IC label 6, and FIG. 2 is a schematic plan view of the anti-counterfeit IC label 6. 3 is a schematic cross-sectional view of the IC inlet 1 incorporated in the IC label 6 for preventing forgery, FIG. 4 is a schematic plan view of the IC inlet 1, and FIG. 5 is an IC chip 4 provided in the IC inlet 1. FIG.
As shown in FIGS. 1 and 2, the anti-counterfeit IC label 6 includes a sheet-like label base material 7. An IC inlet 1 that wirelessly transmits an identification ID (identification information) stored in the IC chip 4 by an antenna 3 provided on the support 2 is provided on one surface 7 a of the label base material 7. The schematic configuration of the IC inlet 1 includes a configuration in which a patterned antenna 3 is formed on a support 2 and an IC chip 4 is mounted at a substantially central portion of the antenna 3.

As shown in FIG. 5, the antenna 3 is preferably a 2.45 GHz half-wave dipole antenna (common name: dipole antenna). A slit 31 extending in an L shape in plan view is formed in a substantially central portion of the antenna 3 formed on the support 2.
As the IC chip 4, for example, a chip having a square shape with a side length of 0.5 mm and a height of 0.1 mm can be used. In addition, the length dimension and height dimension of the side part of IC chip 4 can be changed suitably. The length of the side is preferably in the range of 0.05 mm to 0.5 mm. The lower limit of 0.05 mm is the minimum size that can physically form a circuit. The shape of the IC chip 4 can be changed as appropriate, for example, a rectangle. Also in this case, the length and height of the side can be changed as appropriate, and the length of the side is preferably in the range of 0.05 mm to 0.5 mm. An IC chip with such dimensions has already been realized with “Muchip” (registered trademark) of Hitachi, Ltd., for example, with dimensions of width 0.4 mm, depth 0.4 mm, and height 0.1 mm. It is well known that it is technically possible to mass-produce and manufacture such IC chips.

  As shown in FIGS. 4 and 5, the IC chip 4 is disposed so as to straddle the slit 31 of the antenna 3. The IC chip 4 is electrically connected to both side portions of the antenna 3 with the slit 31 interposed therebetween. Specifically, the bumps 41 and 41 (connection terminals) of the IC chip 4 are electrically connected to the antenna 3 via the electrical joint 5. The electrical joint 5 is composed of metal particles such as anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) and an adhesive binder, and is electrically connected by curing the adhesive binder under heat and pressure conditions. It is preferable that a real connection is realized. The electrical connection between the antenna 3 and the IC chip 4 is not limited to the above-described contact bonding method using ACP or ACF. For example, non-conductive paste (NCP) or non-conductive film (NCF) is used. A contact bonding method may be used, and furthermore, a metal bonding method using ultrasonic waves (USB) may be used.

As shown in FIGS. 1 and 2, the antenna 3 described above is bonded to the label substrate 7 via an adhesive or a pressure-sensitive adhesive (hereinafter simply referred to as an adhesive 20). More specifically, the surface of the IC inlet 1 on the IC chip 4 side is directed to the one surface 7 a side of the label base material 7. An adhesive 20 is interposed between the antenna 3 of the IC inlet 1 and the one surface 7 a of the label base material 7. At this time, the surface of the IC chip 4 is in contact with one surface 7 a of the label base material 7 .

  The adhesive 20 is provided on the entire one surface 7 a of the label substrate 7, and the adhesive 20 is also interposed between the support 2 and the one surface 7 a of the label substrate 7. Moreover, the adhesive 20 is provided flush with the back surface 2a of the support 2 (the surface opposite to the surface on which the antenna 3 is formed). In other words, the IC inlet 1 is embedded in the adhesive 20 with only the back surface 2a of the support 2 taken out.

  The IC inlet 1 affixed to the label substrate 7 as described above is covered with an adhesive layer 8 (adhesive material) for affixing the forgery-preventing IC label 6 to an adherend (not shown). More specifically, the adhesive layer 8 is laminated on the back surface 2a of the support 2 and the surface of the adhesive 20 formed on the same plane (on the lower side in FIG. 1).

Here, a procedure for manufacturing the anti-counterfeit IC label 6 having the above-described configuration will be described.
First, the IC inlet 1 and the label base material 7 are prepared. At this time, the label base material 7 is prepared without the adhesive layer 8.
Next, the adhesive 20 is provided on the IC inlet 1. For example, the adhesive 20 is dropped on the IC inlet 1. Alternatively, an adhesive 20 (adhesive) may be applied to the IC inlet 1. When the adhesive 20 is dropped, it is desirable that the adhesive 20 has fluidity and firmly adheres to the label substrate 7 and the support 2 after adhesion. Moreover, the adhesive force of the adhesive 20 is set to be larger than the adhesive force of the adhesive layer 8 for attaching to the adherend. As the adhesive 20, for example, a polyethylene resin, an acrylic resin, or the like can be used. The adhesive 20 may be provided on both the antenna 3 and the IC chip 4, or may be provided only on either the antenna 3 or the IC chip 4. The adhesive 20 may be provided on the entire surface of the antenna 3 and / or the IC chip 4 or may be provided on a part of the antenna 3 and / or the IC chip 4.
Next, the IC inlet 1 is affixed to one surface 7 a of the label substrate 7 through the adhesive 20 dropped or applied to the IC inlet 1.
The forgery prevention IC label 6 is manufactured by the above procedure.

  According to the anti-counterfeit IC label 6 having the above-described configuration, the anti-counterfeit IC label 6 can be peeled off from the adherend because the antenna 3 is adhered to the label base material 7 via the adhesive 20. However, if the IC inlet 1 is peeled off from the label base material 7, the antenna 3 is easily destroyed. As a result, reading of information from the IC chip 4 becomes impossible, so that the IC inlet 1 cannot be reused, and unauthorized use of the IC inlet 1 can be prevented.

[Support]
As shown in FIGS. 3 and 4, the support 2 of the IC inlet 1 is preferably a sheet member made of a fragile material that is low in strength and easily cut compared to PEN or PET. Examples of the brittle material constituting the support 2 include high-quality paper, medium-quality paper, fine coated paper, coated paper, art paper, cast coated paper, glassy impregnated paper, kraft paper, synthetic paper, and the like. Can be used.
Thereby, when trying to peel off the IC inlet 1 from the IC label 6 for forgery prevention, the antenna 3 is easily destroyed. Therefore, information reading from the IC chip 4 is not normally performed, and it is possible to leave a history of attempts to destroy or peel off the forgery prevention IC label 6. Moreover, since the antenna 3 is destroyed, it is possible to make forgery by using the IC inlet 1 impossible.

[antenna]
The antenna 3 is preferably an antenna made of a conductive paste in which particles made of a conductive material are dissolved or dispersed in a binder. The conductive material described above is preferably silver-based, and examples of the conductive paste include an evaporative drying type silver paste that contains a binder resin, a solvent, and silver powder to obtain conductivity by contacting them. However, the conductive material is not limited to silver, but for example, a metal powder such as copper or nickel, a conductive carbon powder, a conductive fiber, a conductive whisker or the like dissolved or dispersed in a solvent together with a resin binder is used. it can.

The antenna 3 using the above-described conductive paste is a printed layer formed by a printing method. For example, it can be formed by printing by a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. It is also possible to print conductive ink with a printer.
Thereby, the antenna 3 becomes easy to peel from the support body 2. Since the antenna 3 peeled off from the support 2 is easily destroyed, the above-described antenna 3 can prevent the IC inlet 1 from being reused.

  FIG. 6 is a table showing the results of a scratch test (shear strength test) of the IC inlet 1 having the above-described configuration. This shear strength test is a test in which the peel strength is measured by hooking the IC chip 4. In the three test bodies, an antenna 3 made of 100% silver (Ag) paste was printed on a support 2 made of paper, and an IC chip 4 having a thickness of 100 μm was bonded to the antenna 3 at a predetermined position by an ACP bonding method (180 At + 80 ° C for 30 minutes). These specimens were each destroyed by the shear strength test at the breaking load shown in the table of FIG. The destruction state is peeling of the support 2 and the antenna 3. Considering the test results, it can be seen that, in the case of the Al-PET inlet, the breaking load is 15 (N) or more, so that the IC inlet 1 having the above-described configuration is easily peeled off and easily broken.

[IC chip]
The information stored in the IC chip 4 is preferably read-only. That is, the IC chip 4 is provided with a read-only (non-rewritable) memory, and an identification ID or the like is stored in the read-only memory.
In this case, after the anti-counterfeit IC label 6 is affixed to the adherend and the identification ID is recorded in the memory of the IC chip 4, the anti-counterfeit IC label 6 is peeled off from the adherend. The identification ID is not separated from the adherend and the identification ID is not altered, and it is possible to prevent forgery labels by copying the surface of the label substrate 7 or the like.
Thereby, there is an effect that the authenticity of the identification ID is always ensured.
Ensuring the authenticity and validity of the identification ID means increasing the accuracy of reading the identification ID from the IC chip 3, that is, increasing the accuracy of detection that the identification ID cannot be read. Therefore, it has the meaning of further improving the forgery prevention effect and crime prevention effect described above.

Further, it is preferable that the identification ID stored in the IC chip 4 is a unique number. That is, the identification ID is a unique identification ID unique to each IC chip 4.
In order to make the identification ID a unique number, the following management method can be considered.

  In other words, the contractor who has received an order for the IC label 6 for forgery prevention from the customer orders the manufacturer of the IC label 6 for forgery prevention from the manufacturer of the IC label 6 for forgery prevention. The manufacturer of the anti-counterfeit IC label 6 orders the manufacture of the IC inlet 1 from the manufacturer of the IC inlet 1. The manufacturer of the IC inlet 1 orders the manufacture of the IC chip 4 from the manufacturer of the IC chip 4. The manufacturer of the IC chip 4 requests the ID manager to issue an identification ID. In addition, the above-mentioned contractor, the manufacturer of the IC label 6 for preventing forgery, the manufacturer of the IC inlet 1, the manufacturer of the IC chip 4, and the ID manager are all or part of the same person or organization. There may be. A plurality of each may exist.

  The ID manager stores information such as identification IDs issued in the past (issued identification IDs) and identification IDs that are not preferably assigned for management reasons in the ID issuing machine. This ID issuing machine can newly issue an identification ID having uniqueness by avoiding an issued identification ID or an undesirable identification ID. The ID issuer newly issues a unique identification ID using this ID issuing machine.

  The ID manager can entrust ID management work to an ID management entrustee. The ID manager designates an ID space to be entrusted to an ID management entrustee in advance. (It is assumed that the ID space is a set of IDs that can be specified.) When there are a plurality of ID management entrustees, the ID manager makes sure that the ID spaces entrusted to the respective ID management entrustees do not overlap. . The ID management consignee has an ID issuing machine. This ID issuing machine stores information such as identification IDs issued in the past (issued identification IDs), information such as identification IDs that are not preferable for management reasons, and available ID spaces. The ID management consignee uses this ID issuing machine, and any ID ID issued by the ID issuing machine possessed by any other ID management consigning party or ID issued by the ID issuing machine possessed by the ID manager A new identification ID having uniqueness that does not overlap is issued.

The ID issuing machine possessed by the ID manager or the ID management consignee additionally registers the newly obtained identification ID having uniqueness as a new issued identification ID in the past issued identification ID. To do. Further, the newly obtained identification ID having uniqueness is notified to the manufacturer of the IC chip 4.
In addition, although the description by the human image of an ID manager or an ID management entrustment party was carried out here, even if it is not a human, this is an instruction device that automatically instructs the ID issuing machine to issue an ID according to an order, It may be an instruction program or an instruction system.

  The manufacturer of the IC chip 4 uses the IC chip manufacturing apparatus to manufacture the IC chip 4 based on the obtained unique identification ID. Since not all of the obtained identification IDs are recorded on the IC chip 4 due to the manufacturing yield of the IC chip 4, the identification ID to be shipped in the process of shipping inspection of the IC chip 4 may be recorded. is there.

  The manufacturer of the IC inlet 1 uses the IC tag manufacturing apparatus to manufacture the IC inlet 1 based on the obtained IC chip 4. Since not all of the obtained IC chips 4 are shipped as the IC inlet 1 because of the manufacturing yield of the IC inlet 1, the identification recorded on the IC chip 4 in the process of shipping inspection of the IC inlet 1 The ID may be read and recorded.

  The manufacturer of the anti-counterfeit IC label 6 uses the label manufacturing apparatus to manufacture the anti-counterfeit IC label 6 based on the obtained IC inlet 1. Because not all of the obtained IC inlets 1 are shipped as the anti-counterfeit IC label 6 due to the production yield of the anti-counterfeit IC label 6, the process of the shipment inspection of the anti-counterfeit IC label 6 In some cases, the identification ID recorded on the IC chip 4 is read and recorded.

  The contractor receives the anti-counterfeit IC label 6 from the manufacturer and delivers it to the orderer. At this time, when the contractor receives a list of identification IDs recorded on the IC chip 4 in each of the IC labels 4 to be delivered from the manufacturer of the IC label 6 for forgery prevention and delivers it to the orderer as well. There is.

  By the above process, there is an effect that the anti-counterfeit IC label 6 having the IC chip 4 in which the unique identification ID is recorded can be obtained with certainty. In this case, after the anti-counterfeit IC label 6 is affixed to the object, the ID is separated from the object by peeling off the anti-counterfeit IC label 6 from the object, and The ID is not altered, there is no worry of duplicate IDs, and it is possible to prevent counterfeit labels by copying the label surface. Thereby, there is an effect that the authenticity and validity of the identification ID are always ensured.

  Further, when the identification ID stored in the IC chip 4 is read-only and the identification ID is a unique number, the management information of the adherend to which the anti-counterfeit IC label 6 is pasted is stored in the memory contents of the IC chip 4. Cannot go to update. Therefore, the management information of the adherend is registered in the database together with the information such as the identification ID via the data management device connected to the information reading device, and the contents of the database are sequentially updated as necessary. It is preferable.

When information such as an identification ID stored in the IC chip 4 is read by the information reading device, management of the adherend on the corresponding database via the data management device based on the information such as the identification ID Search for information. The obtained management information is returned to the data management device or the information reading device. By judging whether the returned management information is consistent with the current status of the IC label 6 for preventing forgery and the adherend to which the IC label 6 for preventing forgery is attached, fraud such as forgery Check if there is any.
That is, the identification ID is associated with management information for managing the adherend.

The management information for managing the adherend is assumed to have, for example, the shape, color, model number, management number, etc. of the adherend to which the anti-counterfeit IC label 6 is attached.
An operator reads information such as an identification ID stored in the IC chip 4 of the anti-counterfeit IC label 6 by an information reading device. The data management device searches for management information on the database based on information such as an identification ID. The obtained management information is returned to the data management device or the information reading device.
As a result, the operator obtains the shape, color, model number, management number, etc. of the adherend to which the anti-counterfeit IC label 6 as information registered on the database is attached. Whether the IC label 6 for anti-counterfeiting has been replaced by comparing the obtained information with the shape, color, model number, management number, etc. of the adherend to which the current IC label 6 for anti-counterfeiting is affixed Alternatively, it is possible to check whether the object to be pasted with the IC label 6 for preventing forgery is counterfeited.

When information such as the identification ID stored in the IC chip 4 is read by the information reading device, the management information to be updated together with the information such as the identification ID is managed via the data management device in the corresponding database. Grant / update to
By the above method, there exists an effect which can construct | assemble the management method of the to-be-adhered body to which the IC label 6 for forgery prevention and the IC label 6 for forgery prevention were affixed.

  Further, various information may be stored in the IC chip 4. As a result, not only security management but also traceability such as logistics is possible, and strict management of valuables and personal information becomes possible.

[Label substrate]
It is preferable that the above-mentioned label base material 7 has brittleness (fragility).
That is, the label base material 7 is formed of a brittle film or paper.
As a material of the label substrate 2, for example, a synthetic resin film such as brittle vinyl chloride and brittle polyester mixed with an appropriate amount of a plasticizer such as kaolin and calcium carbonate, or cellulose acetate, low density polyethylene, Examples thereof include films formed by solution film formation of highly crystalline plastic materials such as polystyrene and polyphenylene sulfide. Other materials include UV curable synthetic resin or UV curable synthetic resin mixed with a suitable amount of powder such as kaolin and calcium carbonate, and the resin thin film is cured and dried by UV irradiation. . Further, non-woven fabrics made of synthetic fibers or paper such as art paper, coated paper, and high-quality paper can be used.
Thereby, when it is going to peel off the label base material 7 affixed on the to-be-adhered body, the label base material 7 will fracture | rupture easily with the force which is going to peel off. Therefore, the label base material 7 can be prevented from being peeled off while maintaining the form of the label base material 7 as it is, and an anti-counterfeit effect can be achieved.

Moreover, in order to make the label base material 7 easier to break, it is preferable that slits 13 to 16 are formed in the label base material 7 as shown in FIG.
Note that the shapes of the slits 13 and 14 can be appropriately changed as necessary, and may be linear or curved. Furthermore, by providing the support 16 with slits 16 at regular intervals, the antenna 3 can be further easily broken when the anti-counterfeit IC label 6 is peeled off. Thereby, the label base material 7 and the antenna 3 are cut | disconnected from the slits 15 and 16, and the function as a non-contact IC label can be destroyed completely. In addition, by providing the support 2 without providing the slit 16 in the antenna 3, the antenna 3 can be easily broken while preventing the efficiency of the antenna 3 from being lowered.
The slit 16 can be provided up to the antenna 3. In this case, the antenna 3 can be more easily broken.

[Adhesive]
Moreover, it is preferable that the adhesive force of the above-mentioned adhesive layer 8 is set to 8000 mN / 25 mm according to JIS Z0237.
Thereby, when it is going to peel off the label base material 7 affixed on the to-be-adhered body, the label base material 7 can be broken reliably.
Here, in the anti-counterfeit label, the adhesive layer 8 coated with the IC inlet 1 is configured so that the label base material 7 is broken when the label base material 7 is peeled off from the adherend. It is necessary to make the adhesive force between the adherend and the adhesive 8 stronger than the breaking force of the label substrate 7.
Therefore, a material having an adhesive strength of 8000 mN / 25 mm or more and 30000 mN / 25 mm or less is selected for the adhesive layer 8 according to JIS Z0237. The adhesive strength of the adhesive layer 8 is desired to be greater than the breaking strength of the label base material 7, but the label base material 7 weakened by the slits 13 to 16 etc. in the actual peeling operation should have an adhesive strength of 8000 mN / 25 mm or more. Can leave traces of peeling.

  Further, a release sheet 9 that can be easily peeled is temporarily attached to the surface of the adhesive layer 8 before being attached to the adherend. As the release sheet 9, a separator in which a release agent layer such as a silicone resin is laminated on a paper or plastic sheet by coating or the like is used.

[Solvent detection unit]
By the way, since the antenna 3 is destroyed when the IC label 6 for forgery prevention is turned and peeled, the forgery prevention is performed using a peeling solvent for peeling the label substrate 7 attached to the adherend. It is assumed that the IC label 6 is peeled off.
Therefore, as shown in FIGS. 1 and 2, it is preferable that a solvent coloring layer 12 (solvent detector) is provided on the other surface 7 b of the label substrate 7. The solvent coloring layer 12 has a property of chemically reacting with a peeling solvent for peeling the label substrate 7 attached to the adherend. Examples of the stripping solvent include weakly soluble organic solvents such as ethyl alcohol and acetone, and commercially available seal strippers. The solvent coloring layer 12 has a structure in which dye particles that are insoluble in water and soluble in a peeling solvent are held in a dispersed state with an extender pigment in a resin binder.
As a result, when the anti-counterfeit IC label 6 is attempted to be peeled off using the peeling solvent, the pigment held in a dispersed state is dissolved in the solvent coloring layer 12 and a trace remains as color on the label substrate 7. That is, the solvent coloring layer 12 has a solvent coloring function. In addition, as said dye particle | grains, dyes, such as a leuco dye and a fluorescent whitening agent, can be used, for example.

In addition to the act of peeling with a peeling solvent as described above, it is assumed that the anti-counterfeit IC label 6 is peeled off by softening the adhesive material of the adhesive layer 8 with heat from a dryer or the like. In this case, the above-described dye alone does not reach the melting temperature, and the effect is insufficient.
Therefore, it is preferable to use a thermal coloring material that develops color by thermal stimulation as the material of the solvent coloring layer 12. For example, together with the leuco dye, a developer that binds to the leuco dye by thermal stimulation is dispersed. In this case, a leuco dye is usually a colorless or light-colored material, and a material that manifests as a color tone when reacted with thermal is suitable.
Thereby, the solvent coloring layer 12 has a thermal coloring function, and when the adhesive layer 8 is softened and peeled off by heat, the solvent coloring layer 12 is colored and a trace remains.
The solvent coloring layer 12 only needs to have at least one of the above-described solvent coloring function and thermal coloring function.

  Moreover, it may replace with the above-mentioned solvent coloring layer 12, and may provide the solvent melt | dissolution layer (solvent detection part) which is melt | dissolved in a peeling solvent. Thereby, when peeling of the anti-counterfeit IC label 6 is attempted using the peeling solvent, the solvent-dissolving layer is dissolved by the peeling solvent, and a trace remains on the label substrate 7. In addition, you may provide the above-mentioned solvent coloring layer 12 and a solvent melt | dissolution layer, respectively. Thereby, the trace of peeling remains more reliably.

[Security Function Department]
As shown in FIGS. 1 and 2, it is preferable that the label base material 7 is provided with a security function layer 11 (security function part) for preventing the label base material 7 from being duplicated. The security function layer 11 is provided on the surface of the printing layer 10 provided on the surface of the solvent coloring layer 12 described above, for example. As the security function layer 11, it is preferable to use a material that can be determined by visual inspection or by using a simple device. Examples of such materials include (1) OVD functional materials, (2) fluorescent materials or phosphorescent materials, and (3) liquid crystal materials.

That is, the security functional layer 13 is made of at least one of (1) OVD functional material, (2) fluorescent material or phosphorescent material, and (3) liquid crystal material.
Hereinafter, (1) OVD functional material, (2) fluorescent material or phosphorescent material, or (3) liquid crystal material will be described in order.

(1) First, the OVD functional material will be described.
An OVD (Optical Variable Device) is an image that uses interference of light, and is a display body that produces a color shift in which the color changes depending on the representation of a stereoscopic image and the viewing angle, and is a medium that can be determined by visual inspection. It is. Among them, examples of the OVD such as a hologram and a diffraction grating include a relief type that records light interference fringes on a plane as a fine uneven pattern, and a volume type that records interference fringes in a volume direction.
Also, although the method is different from that of holograms and diffraction gratings, there are multilayer film systems in which thin films of ceramics and metal materials with different optical characteristics are laminated, or materials that cause color change (color shift) depending on the viewing angle due to liquid crystal materials etc. This is an example. These OVDs can be said to be effective means for preventing forgery because they give a unique impression such as stereoscopic images and color shifts and require advanced manufacturing techniques.

Among these OVDs, in consideration of mass productivity and cost, a relief hologram (or a relief diffraction grating) or a multilayer thin film type is preferable, and these OVDs are generally widely used.
First, a relief hologram will be described.
This relief type hologram or relief type diffraction grating is mass-produced using a relief type press plate having a fine uneven pattern forming a hologram or a diffraction grating, respectively. That is, this press plate heats and pressurizes the OVD forming layer to replicate a fine uneven pattern.

The OVD forming layer is for increasing the diffraction efficiency, and is made of a material having a refractive index different from that of the polymer material constituting the relief surface. As a material to be used, high refractive index materials such as TiO ₂ , Si ₂ O ₃ , SiO, Fe ₂ O ₃ , and ZnS having different refractive indexes, Al, Sn, Cr, Ni, Cu, and Au having a higher reflection effect are used. These materials are used alone or in combination. These materials are formed by a well-known thin film forming technique such as a vacuum deposition method or sputtering, and the film thickness is about 0.5 to 100 nm although it varies depending on the application.
In order to prevent the hologram from affecting the communication of the IC inlet 1, it is desirable to specify a metal vapor deposition portion or use a transparent hologram made of a non-metal vapor deposition material.

Furthermore, a multilayer thin film method will be described.
When the multilayer thin film method is used, as described above, the OVD forming layer is formed of a multilayer thin film layer having different optical aptitudes, and is formed by laminating as a metal thin film, a ceramic thin film, or a composite thin film including them together. For example, when thin films having different refractive indexes are stacked, a high refractive index thin film and a low refractive index thin film may be combined, or a specific combination may be stacked alternately. By combining them, a desired multilayer thin film can be obtained.

This multilayer thin film layer is made of a material such as ceramics or metal, and is formed by laminating approximately two or more high refractive index materials and a low refractive index material having a refractive index of about 1.5 with a predetermined film thickness. Examples of materials used are given below.
First, as ceramics, Sb ₂ O ₃ (3.0 = refractive index n: hereinafter the same), Fe ₂ O ₃ (2.7), TiO ₂ (2.6), CdS (2.6), CeO ₂ (2.3), ZnS (2.3), PbCl ₂ (2.3), CdO (2.2), Sb ₂ O ₃ (2.0), WO ₃ (2.0), SiO (2. 0), Si ₂ O ₃ (2.5), In ₂ O ₃ (2.0), PbO (2.6), Ta ₂ O ₃ (2.4), ZnO (2.1), ZrO ₂ ( _{2.0), MgO (1.6),} SiO 2 (1.5), MgF 2 (1.4), CeF 3 (1.6), CaF 2 (1.3~1.4), AlF 3 (1.6), Al ₂ O ₃ (1.6), GaO (1.7), and the like.

And as a metal simple substance or an alloy thin film, Al, Fe, Mg, Zn, Au, Ag, Cr, Ni, Cu, Si etc. are mentioned, for example.
Examples of the low refractive index organic polymer include polyethylene (1.51), polypropylene (1.49), polytetrafluoroethylene (1.35), polymethyl methacrylate (1.49), polystyrene (1 .60) and the like.

By selecting at least one kind from these high refractive index materials or 30% to 60% transparent metal thin film, selecting at least one kind from low refractive index materials, and alternately laminating them at a predetermined thickness, It shows absorption or reflection for visible light.
Note that a thin film made of a metal has a value under a certain condition in the present application because an optical characteristic such as a refractive index changes depending on a state of a constituent material or a forming condition.

Each of the above materials is appropriately selected based on optical properties such as refractive index, reflectance, and transmittance, weather resistance, interlayer adhesion, and the like, and is laminated as a thin film to form a multilayer thin film layer. A known method can be used as the formation method, and the film thickness, film formation speed, number of layers, or optical film thickness (= n · d, n: refractive index, d: film thickness) can be controlled. The vacuum evaporation method and the sputtering method are used.
Depending on whether these OVDs are made into a very thin foil and transferred to an anti-counterfeit IC label 6 or are rubbed into the label, or a finely divided OVD foil is dispersed in a resin binder and printed into ink. It becomes impossible to remove the IC label 6 for forgery prevention and reuse it.

(2) Next, the fluorescent material or the phosphorescent material will be described.
As a fluorescent material or a phosphorescent material, a controlled ink or a special ink that is difficult to obtain is provided on the IC label 6 for forgery prevention by a printing method, and is authentic by visual inspection or using a simple verifier. Judgment is possible.
For example, what brings about an optical effect includes a method of printing ink, fluorescent ink, fluorescent fiber, or the like that emits light when irradiated with ultraviolet rays or infrared light, or a method of printing on paper.

  The image of the drawn character or pattern emits light when irradiated with a black lamp (ultraviolet light) or infrared light (780 nm or more). As a result, an image that was not originally detected under visible light (400 to 700 nm) can be verified visually or through a light receiving element. In particular, since a specific wavelength limited to the material is returned, verification with a simple verifier is possible. Easy and reliable. The material used for the fluorescent color developing portion has a color tone pattern that changes by irradiation with ultraviolet rays or infrared rays, and when dispersed in an ink resin, a colorless and transparent material having a refractive index that is the same as or close to that of the ink resin is preferable.

Moreover, there exists a fluorescent substance as fluorescent material or luminous material.
Examples of the phosphor include an ultraviolet light emitting phosphor and an infrared light emitting phosphor, and examples thereof are given below.
The ultraviolet phosphor emits light in the visible wavelength region when irradiated with ultraviolet rays. For example, Ca ₂ B ₅ O ₃ Cl: Eu ²⁺ , CaWO ₄ , ZnO: Zn ₂ SiO ₄ : Mn, Y ₂ O ₂ S: Eu, ZnS: Ag, YVO ₄ : Eu, Y ₃ O ₃ : Eu, Gd ₂ O ₂ S: Tb, La ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ : Ce, and the like.
The amount of these phosphors added is such that light emission when irradiated with black light can be visually confirmed, or fluorescence can be detected by the light receiving element of the detector.

  In addition, by printing these special inks on the surface of the label base material 7 or squeezing them into the label base material 7 or making the whole into a special shape such as a star shape at that time, further counterfeiting It can be expected that a prevention effect is obtained.

In addition, infrared emitting phosphors include those that emit light in the visible wavelength region and those that emit light in the infrared wavelength region when irradiated with infrared rays.
Examples of the former include YF ₃ : YB, Er, ZnS: CuCo, and the like.
As the latter, for example, LiNd _0.9 Yb _0.1 P ₄ O ₁₂ , LiBi _0.2 Nd _0.7 Yb _0.1 P ₄ O ₁₂ , Nd _0.9 Yb _0.1 Nd ₅ (MoO ₄ ) ₄ , NaNb _0.3 Yb _0.1 P ₄ O ₁₂ , Nd _0.8 Yb _0.2 Na ₅ (WO ₄ ) ₄ , Nd _0.8 Yb _0.2 Na ₅ (Mo _0.5 WO _{0. 5} ) ₄ , Ce _0.05 Gd _0.05 Nd _0.75 Yb _0.25 Na ₅ (W _0.7 Mo _0.3 O ₄ ) ₄ , Nd _0.3 Yb _0.1 Al ₃ (BO ₃ ) ₄ , Nd _0.9 Yb _0.1 Al _2.7 Cr _{0.3 (} BO ₃ ) ₄ , Nd _0.4 P ₅ O ₄ , Nd _0.8 Yb _0.2 K ₃ (PO ₄ ) ₂ etc. is there. The latter emits infrared light having an emission spectrum peak at 980 nm to 1020 nm by irradiating light having an infrared wavelength of around 800 nm.
The amount of the infrared light emitting phosphor added in the ink is such that the light emission can be visually confirmed or the light receiving element of the detector can detect the fluorescence.

(3) Next, the liquid crystal material will be described.
Examples of the liquid crystal material include cholesteric liquid crystal. Cholesteric liquid crystal is a liquid crystal that is aligned in a spiral shape and has polarization separation ability to reflect right or left circularly polarized light having a specific wavelength. The reflected wavelength is determined by the pitch of the spiral period, and the left and right of the circularly polarized light are determined by the direction of the spiral. In normal observation light, the right and left polarized lights are mixed and the image cannot be confirmed, but only one of the polarized lights can be taken out by holding the polarizing filter and can be recognized as an image. In other words, it is called a latent image technique, and the cholesteric liquid crystal is used as a color shift ink and can be camouflaged because the reflection wavelength of reflected light changes depending on the angle.
The liquid crystal material is not limited to cholesteric liquid crystal, and any material that exhibits the same effect may be used.

As described above, since the security function layer 11 is provided, even if the label base material 7 is to be duplicated by color copying or the like, it is impossible to duplicate the same one as the original. For this reason, it is possible to prevent fraudulent acts such as forgery, falsification and alteration by a color copier. In addition, verification can be performed more reliably and quickly by applying special light. Furthermore, determination by a machine is also possible by using a light receiving element.
In addition, when the security function layer 11 is provided, double security management of the electrical confirmation by the IC inlet 1 and the visual confirmation by the security function layer 11 can be performed. Authenticity can be determined.

[Optical identification unit]
As shown in FIGS. 1 and 2, a numbering printing unit (optical identification unit) 17 in which an optically readable optical identification ID (optical identification information) is engraved is provided on the surface of the printing layer 10. Preferably it is.
The numbering printing unit 17 is formed by laser engraving or the like, and forms letters by cutting off the printing ink by blowing the printing ink by laser irradiation. Therefore, the effect of preventing falsification of the optical identification ID can be improved.
Examples of such optical identification IDs include simple alphanumeric characters that can be viewed visually. As examples of mechanical reading, identification IDs are superimposed by techniques such as one-dimensional barcodes, two-dimensional barcodes, and digital watermarks. There is an arbitrary image, an array of dots and symbols, etc.

The optical identification ID described above can be associated with the identification ID recorded on the IC chip 4 as follows.
That is, as an association between the optical identification ID on the database and the identification ID of the IC chip 4, an optical identification ID is generated from the identification ID of the IC chip 4 by data conversion, and the identification ID of the IC chip 4 is converted from the optical identification ID. Generate by data conversion. As an example of data conversion, function conversion including CRC and hash, symmetric encryption, asymmetric encryption, and the like can be used.
Thus, since at least a part of the identification ID and the optical identification ID is associated with each other, there is an effect that the authenticity of the IC label 1 can be easily confirmed visually or by an optical reading device.

Further, the numbering printing unit 17 described above is preferably provided on the same surface as the security function layer 11 described above. That is, the numbering printing unit 17 is printed on the surface of the anti-counterfeit IC label 6 provided with the security function layer 11.
As a result, it is possible to read the numbering printing portion 17 and the security function layer 11 at a time, and it is possible to prevent photographic copying of the anti-counterfeit IC label 6.

Next, specific examples of the present invention will be described.
[Example 1]
As support 2, silver paste was printed on one side of coated paper 85 g / m ² (Mu White Hokuetsu Paper Co., Ltd.) by screen printing (350 mesh), dried at 60 ° C. for 30 seconds, and then dried at 20 ° C. for 20 seconds. Partial drying was performed with a hot air dryer, and slits were made at intervals of 4 mm around the periphery to obtain a printed antenna. Two terminals of a 0.4 mm square IC chip were joined to this antenna by ACP (anisotropic conductive paste) to obtain a paper-based IC inlet. The obtained IC inlet could be read with an IC reader / writer.

  On the other hand, a label substrate made of art paper having a thickness of 90 μm and slits provided at the periphery (length: 3 mm, depth: 1.5 mm), and at each corner (length: 7.5 mm) and antenna installation portion (at intervals of 4 mm) Solvent coloring ink was applied to (width 60 mm, length 39 mm). On top of that, a pattern was printed by offset printing. Furthermore, fluorescent ink that emits light by ultraviolet rays was printed as a security functional layer.

  A polyethylene adhesive was dropped on the antenna and IC chip of the IC inlet, and the IC inlet was attached to a predetermined position of the label base material. Then, an acrylic pressure-sensitive adhesive having an adhesive force of 12000 mN / 25 mm was applied thereon. Finally, polyethylene was laminated on one side of kraft paper, and a silicon-treated separator (thickness: 112 μm) was temporarily adhered thereon to produce an IC label A.

[Example 2]
Also, a double security functional layer is formed by printing a pattern by offset printing on the same label substrate as in Example 1 and further printing special ink that develops color by irradiating infrared rays with a wavelength of 780 nm. did. An acrylic adhesive having an adhesive strength of 12000 mN / 25 mm is applied to the entire surface of the paper-based IC inlet, laminated on the other main surface of the label base material, and further on the acrylic adhesive. Was applied to enclose an IC inlet. Finally, polyethylene was laminated on one side of kraft paper, and a silicon-treated separator (thickness: 112 μm) was temporarily adhered thereon to produce an IC label B.

Below, the comparative example of this invention is demonstrated.
[Comparative Example 1]
An aluminum thin film antenna was formed on a 38 μm PET film by etching. Further, a pattern was printed on a brittle film substrate, and the IC inlet was laminated on the other main surface. At that time, slits were provided only around the film substrate, and an IC label C without a security function layer was produced.

[Comparative Example 2]
Slits were made at 4 mm intervals around the PET film-based IC inlet. A pattern was printed on a brittle film substrate, and the PET film-based IC inlet was laminated on the other main surface. An adhesive layer having an adhesive strength of 8000 mN / 25 mm or less having a low adhesive strength was provided thereon to produce an IC label D.

  The thus produced IC labels A, B, C, and D of Examples 1 and 2 and Comparative Examples 1 and 2 were attached to a box 33 containing a product as shown in FIG. Thereafter, the IC labels A, B, C, and D were carefully removed from the box 33.

  In the IC labels A and B of Examples 1 and 2, when the IC inlet is taken out from the label base material, the bonded portion between the label base material and the IC inlet remains on the label base material side and is completely destroyed. I was able to. In addition, the fragile paper-based printed antenna was easily broken, and the function as a non-contact IC label could be completely broken. Further, when the IC labels A and B were peeled off from the box 33 using a solvent, the label base material itself was colored by the solvent, and the traces could be clearly confirmed. In addition, the label base material from which only the IC inlet was removed was color-copied and the slit was also inserted in the same manner as the genuine product, but it was confirmed as a counterfeit product without a security function layer. In the IC label B of Example 2, printing could be confirmed by irradiating with an infrared light lamp, and discrimination between a very similar counterfeit product and duplicate product was possible.

  On the other hand, when the IC labels C and D of Comparative Examples 1 and 2 for comparison are peeled off vigorously, the label substrate can be expected to break due to differences in slits and adhesive strength, but when carefully peeled off. The label did not break. In particular, it was difficult to break a tough PET film-based antenna. Even if the IC inlet itself was slit like the IC label D, it was difficult to break. Moreover, it could be easily removed from the box 33 by using a solvent or the like. The peeled IC labels C and D could be reused by being pasted on another box. Furthermore, similar products could be easily produced by color copying the design.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the antenna 3 is bonded to the label substrate 7 via the adhesive 20. However, in the present invention , the IC chip 4 is bonded via the adhesive or the adhesive instead of the antenna 3. but it may also have been adhered to the label base material 7.
If only a part of the antenna 3 is adhered to the label base material 7 via the adhesive 20, only a part of the antenna 3 is destroyed when the IC inlet 1 is peeled off from the label base material 7, and the other parts. The part may remain as it is. In this case, the extracted IC inlet 1 can read information only by shortening the communication distance.
On the other hand, when the IC chip 4 is bonded to the label base material 7 instead of the antenna 3, when the IC inlet 1 is peeled off from the label base material 7, the connection portion between the antenna 3 and the IC chip 4 is destroyed. Will be. As a result, information reading becomes completely impossible, and unauthorized use of the IC inlet 1 can be reliably prevented.

  Further, in this embodiment, as shown in FIG. 2, the IC inlet 1 is arranged in a straight direction with respect to the label base material 7. However, the present invention is applied to the IC inlet as shown in FIG. 1 may be disposed obliquely with respect to the label substrate 7. In this case, when the anti-counterfeit IC label 6 is pasted so as to straddle the mating surface 39 between the case 37 and the lid 38, the IC inlet 1 is also disposed so as to straddle the mating surface 39. Therefore, when the cover 38 is separated from the case 37, not only the sealed anti-counterfeit IC label 6 but also the IC inlet 1 can be destroyed. Further, if the label base material 7 is cut along the mating surface 39 in an attempt to take out the IC inlet 1, the IC inlet 1 is also cut, so that the IC inlet 1 can be reliably prevented from being reused.

Moreover, this invention is not limited to using the support body 2 which consists of paper, Tough support bodies, such as a polyimide, a polyethylene naphthalate, a polyethylene terephthalate, can also be used. The present invention can also use a support 2 made of a brittle material other than paper. For example, brittle vinyl chloride, brittle, which is made brittle by mixing an appropriate amount of a plasticizer such as kaolin and calcium carbonate. A support made of a synthetic resin film such as polyester, or a film formed by forming a highly crystalline plastic material such as cellulose acetate, low-density polyethylene, polystyrene, or polyphenylene sulfide by solution film formation can be used. In addition, a support composed of a film formed by using a UV curable synthetic resin or a UV curable synthetic resin mixed with an appropriate amount of powders such as kaolin and calcium carbonate, and curing and drying the resin thin film by UV irradiation. The support body which consists of a nonwoven fabric with a synthetic fiber can also be used.
In the above-described embodiment, a conductive paste formed by a printing method is used as the antenna 3, but the present invention can also use an antenna formed by a method other than the printing method. For example, aluminum or copper can be provided by an etching method.

Further, the present invention is not limited to the label base material 7 having brittleness, and various label base materials can be used. For example, a label substrate 7 made of a synthetic resin such as PET can be used.
Further, the present invention is not limited to the identification ID (identification information) stored in each IC chip 4 being a unique identification ID, and a common identification ID may be stored in each IC chip 4, Alternatively, any one identification ID may be selected from a plurality of types of identification IDs and stored.

Moreover, this invention is not limited to the adhesive force of the contact bonding layer 8 (adhesive material) being 8000 mN / 25mm or more, It is also possible to make the adhesive force of the contact bonding layer 8 smaller than 8000 mN / 25mm.
Furthermore, the present invention can be configured such that the security function layer 11 (security function part), the solvent coloring layer 12 (solvent detection part), the numbering printing part (optical identification part) 17 and the like are not provided. is there.
In addition, in the range which does not deviate from the main point of this invention, it is possible to replace suitably the component in above-mentioned embodiment with a well-known component, and you may combine the above-mentioned modification suitably.

It is a sectional side view showing typically the IC label for forgery prevention in the embodiment of the present invention. It is a top view showing typically the IC label for forgery prevention in the embodiment of the present invention. It is a sectional side view showing typically a non-contact IC medium (IC inlet) in an embodiment of the present invention. It is the top view which represented typically the non-contact IC medium (IC inlet) in embodiment of this invention. It is a top view showing IC chip in an embodiment of the present invention. It is the table | surface which showed the test result of the scratch test (shear strength test) of the non-contact IC medium (IC inlet) in embodiment of this invention. It is explanatory drawing which shows the state which affixed and sealed the IC label on the box in which the goods were incorporated. It is explanatory drawing which shows a mode that the IC label for forgery prevention which provided the non-contact IC medium (IC inlet) incline with respect to the label base material was affixed on the to-be-adhered body.

Explanation of symbols

1 IC inlet (non-contact IC medium)
2 Support 3 Antenna 4 IC chip 6 Anti-counterfeit IC label 7 Label base material 8 Adhesive layer (adhesive)
11 Security Function Layer (Security Function Department)
12 Solvent coloring layer (solvent detector)
20 Adhesive

Claims (7)

A label substrate;
A non-contact IC medium that is provided on the label substrate and wirelessly transmits identification information stored in the IC chip by an antenna provided on the support;
An adhesive for pasting to the adherend,
An anti-counterfeit IC label comprising:
The antenna and one what Re of the IC chip is bonded to the label substrate through an adhesive or pressure-sensitive adhesive,
The antenna is formed using a conductive paste in which particles made of a conductive material are dissolved or dispersed in a binder,
The support is vulnerable to peeling off of either the antenna or the IC chip when the antenna or the IC chip bonded through the adhesive or the adhesive is peeled off together with the label base material. An anti-counterfeit IC label comprising a material . The anti-counterfeit IC label according to claim 1, wherein the label substrate has brittleness. At least one of a solvent detector that dissolves in a peeling solvent for peeling off the label substrate that is attached to the adherend to the label substrate, or a solvent detector that chemically reacts with the peeling solvent The anti-counterfeit IC label according to claim 1 or 2 , wherein the anti-counterfeit IC label is provided. The IC label for forgery prevention according to any one of claims 1 to 3 , wherein the IC chip stores unique identification information for each IC chip. The forgery prevention IC label according to any one of claims 1 to 4 , wherein the label base material is provided with a security function unit that can be visually or mechanically detected. The security function unit
An OVD functional material whose color tone changes according to an incident angle of an incident light source with respect to the security functional unit or according to a position of an observer's viewpoint with respect to the security functional unit;
A fluorescent material or a phosphorescent material that is excited by an electromagnetic wave having a specific wavelength and emits an electromagnetic wave having a wavelength different from the specific wavelength;
The anti-counterfeit IC label according to claim 5 , wherein the anti-counterfeit IC label is made of at least one of a liquid crystal material that displays the pattern by giving the specific pattern polarization and taking out the specific polarization. The anti-counterfeit IC label according to any one of claims 1 to 6 , wherein an adhesive force of the adhesive material is 8000 mN / 25 mm or more.

Images