JP2010231681A - Rfid tag label, and method of using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID tag label wherein an IC chip is destroyed not to be made reusable when the RFID tag label is peeled off from an object to be stuck. <P>SOLUTION: The IC chip 1 can be destroyed because power of resistance is applied to the IC chip 1 when the RFID tag label is peeled off, by creating a boundary between strong adhesion 3 and weak adhesion 2 at a part where an IC chip 1 exists by using two types of the strong adhesion 3 and the weak adhesion 2 in adhesive strength for sticking the RFID tag label on the object to be stuck. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an RFID tag label used for information management of articles.

  In recent years, an RFID (Radio Frequency Identification) tag is processed into a label shape, and is widely used in the form of being attached to an article and used for information management of the article. Such an RFID label tag includes an IC chip and an antenna. Various information such as ID (Identification) stored in the IC chip can be wirelessly communicated with the reader / writer via the antenna, and the information stored in the IC chip can be read without contact by the reader / writer. On the contrary, it is used for various article management by writing on an IC chip.

  In such a usage state of the RFID tag label, there is a technology for preventing unauthorized use such as information leakage or replacement of an article by peeling the RFID tag label from an object to be pasted and improperly attaching it to another article. It is necessary.

  As a technique for preventing unauthorized use, as shown in Patent Document 1, by cutting a label in advance, when the RFID tag label is peeled off from the object to be attached, the antenna portion is cut from the cut and used as RFID. It has been proposed to cease functioning.

JP2008-134481

  However, in the invention described in Patent Document 1, even when the antenna is disconnected and the RFID function is stopped, the RFID function can be easily achieved by repairing the disconnected part with a conductive material such as silver paste. It is possible to revive. Even if it is difficult to repair the antenna, the IC chip is intact, so it is possible to completely restore the RFID function by removing the IC chip from the disconnected antenna and mounting the IC chip on a new antenna. It is. For this reason, the method of this document does not completely stop the RFID function, and cannot reliably prevent unauthorized use such as information leakage or replacement of articles.

  The present invention can be used illegally in such a situation of use of the RFID tag label by reliably destroying the IC chip and completely stopping the function as RFID when the RFID tag label is peeled off from the object to be attached. It is an issue to prevent the problem beforehand.

  In order to prevent unauthorized use of the RFID tag label, it is necessary to completely stop the function of the RFID, and for that purpose, it is essential to destroy the IC chip. Therefore, the present inventors have examined the destructive force of the IC chip for the purpose of reliably destroying the IC chip.

  The RFID tag label is designed so that the IC chip cannot be easily broken under normal use conditions because the IC chip cannot be managed if it breaks during normal use. Has been. The normal use situation assumes a situation in which surface pressure or point pressure is applied to the IC chip, and usually a pressure resistance of several kg is given.

  However, the present inventors have found that the bending strength is much weaker than the point pressure strength of the IC chip. As an example, point pressure strength and bending strength data for a 1.2 mm × 1.2 mm IC chip are shown in FIG. It has been found that the bending strength is 1/10 or less compared to the point pressure resistance, and the IC chip can be destroyed with a slight force.

  Therefore, in the present invention, the structure is such that when the RFID tag label is peeled off, the IC chip is bent and bending strength is applied. By creating a boundary with different adhesive strength in the IC chip portion, the IC chip is subjected to a bending force during peeling, making it possible to break the IC chip.

  Also, when discarding RFID tag labels that are no longer needed, the IC chip can be destroyed reliably by simply removing the label, so there is no risk of information leakage and safe disposal without unauthorized use. Is possible.

  According to the present invention, when an RFID tag label is to be peeled off, the IC chip can be destroyed so that it cannot be repaired, the function as an RFID can be stopped, and unauthorized use can be prevented.

It is a graph of IC chip thickness, point pressure strength, and bending strength. It is a block diagram of the RFID tag label concerning one Example of this invention. It is sectional drawing of the RFID tag label concerning one Example of this invention. It is the figure which affixed the RFID tag label concerning one Example of this invention on the to-be-adhered thing. It is an example of the range of the area from which the adhesive force of the RFID tag label concerning one Example of this invention differs. It is an example of the range of the area from which the adhesive force of the RFID tag label concerning one Example of this invention differs. It is an example of the range of the area from which the adhesive force of the RFID tag label concerning one Example of this invention differs. It is an example of the range of the area from which the adhesive force of the RFID tag label concerning one Example of this invention differs. It is an example of the range of the area from which the adhesive force of the RFID tag label concerning one Example of this invention differs. It is sectional drawing of the RFID tag label concerning one Example of this invention.

  A first embodiment will be described with reference to the drawings.

  FIG. 2 is a perspective view showing the structure of the RFID tag label, and FIG. 3 is a cross-sectional view taken along the line AB of FIG. Hereinafter, the structure of the RFID tag label will be described with reference to FIGS.

  The semiconductor IC chip 1 has a circuit (not shown) that stores an ID. On the upper layer of the inlet 4 on which the IC chip 1 is mounted, a label paper 6 is formed via an adhesive 5. The label paper 6 is composed of high-quality paper, coated paper, synthetic paper, and the like, and predetermined information can be printed on the surface thereof. The third pressure-sensitive adhesive 5 is a pressure-sensitive adhesive for fixing the inlet 4 and the label paper 6 and is composed of a strong pressure-sensitive adhesive. It is desirable that the inlet 4 and the label paper 6 do not peel off at the time of peeling. The lower layer of the inlet 4 has a first adhesive 2 and a second adhesive 3 for sticking to an object to be attached, and a release paper 7 is formed which is peeled off at the time of use.

  When the RFID label tag is used, as shown in FIG. 4, the release paper 7 is removed, and the first adhesive 2 and the second adhesive 3 are attached to the article 8 to be attached. In this state, a reader / writer (not shown) reads / writes information about the object 8 from the RFID tag label, and serves as an RFID tag label.

  When the use of the RFID tag label is finished, the RFID tag label is peeled off from the object to be attached. At this time, the RFID tag label cannot be repaired in order to prevent the RFID tag label from being improperly attached to another object. It is desirable to destroy and prevent reuse. In this embodiment, by using two types of adhesive strength adhesives as adhesives for attaching the RFID tag label to the article 8 to be attached, the IC chip can be destroyed unrepairably when the RFID tag label is peeled off. Adopt a possible configuration.

  In this embodiment, as the second pressure-sensitive adhesive 3, a strong pressure-sensitive adhesive having a stronger adhesive force than the first pressure-sensitive adhesive is used. When the RFID tag label is peeled off from the adhesive 2 side, the boundary line between the adhesive 2 and the adhesive 3 can be easily peeled off. When the peeling position reaches the boundary between the adhesive 2 and the adhesive 3, the adhesive 3 is strongly adhesive, so the peeling force concentrates on the boundary between the adhesive 2 and the adhesive 3, and the IC The chip 1 is cracked and the IC chip 1 is cracked. The force required to break the IC chip 1 is approximately 1 kg or less if it is a thin IC chip used for a normal RFID tag label, and can be sufficiently covered by the force required for peeling. .

  FIG. 5 is a view of the first pressure-sensitive adhesive 2 and the second pressure-sensitive adhesive 3 as seen from the article to be pasted 8 by removing the release paper 7 of FIG. 2. As shown in FIG. 5, the range of the adhesive 2 and the adhesive 3 is such that a boundary exists at the center of the IC chip, but the boundary line exists inside the projection surface where the IC chip is projected onto the adhesive surface. The center of the IC chip as shown in FIG. 5 is not necessarily required. The ranges of the pressure-sensitive adhesive 2 and the pressure-sensitive adhesive 3 will be described separately in Examples 2 to 6 and respective drawings.

  As the material of the pressure-sensitive adhesive, any of acrylic, rubber, silicon, and urethane may be used. The pressure-sensitive adhesive 2 has a pressure-sensitive adhesive generally called weak pressure-sensitive adhesive, and the pressure-sensitive adhesive 3 has a pressure-sensitive adhesive generally called strong pressure-sensitive adhesive. As long as the adhesive strength of one adhesive 2 is stronger, both may be weak adhesive or strong adhesive.

  As a method of forming the weak adhesive 2 and the strong adhesive 3 on the RFID tag label, there is a method of arranging adhesives of different materials as a first method. As a second method, there is a method in which the adhesive is subjected to treatment such as UV irradiation or laser heating to change the adhesiveness in one range. As a third method, even if the pressure-sensitive adhesive is the same, the surface of the roughened area is subjected to a treatment such as roughening, and the roughened range is improved in stickiness so that the apparent stickiness is different. There is a way to do it. As a fourth method, there is a method in which the second pressure-sensitive adhesive 3 is made larger than the first pressure-sensitive adhesive 2 at a density (pressure-sensitive adhesive forming area per predetermined RFID tag label area) for forming the pressure-sensitive adhesive. The second to fourth methods are advantageous in manufacturing cost because the adhesive of the same material has a difference in adhesive strength, and the adhesive of two types of adhesive strength can be formed by the adhesive of one type of material. is there. Either method may be used.

  In Example 1, the pressure-sensitive adhesive 2 and the pressure-sensitive adhesive 3 were acrylic adhesives of different materials, and pressure-sensitive adhesives having different tackiness. As the pressure-sensitive adhesive 2, one having an adhesive strength of 6 gf / width 25 mm was used, and as the pressure-sensitive adhesive 3, one having 25 gf / width 25 mm was used. In order to reliably destroy the IC chip 1 at the time of peeling, it is desirable that the difference in adhesive force between the adhesive 2 and the adhesive 3 is at least 10 gf / width 25 mm. In order to prevent the RFID tag label from falling off during use, it is desirable that the adhesive strength of the adhesive 2 is at least 1 gf / width 25 mm or more. That is, the adhesive strength of the second pressure-sensitive adhesive 3 is desirably 11 gf / width 25 mm or more.

  The third adhesive 5 holds the IC chip 1 on the label paper 6 side even when the RFID tag label is peeled off, and has a stronger adhesive force than the first adhesive 2 and the second adhesive 3. It is.

  Moreover, in order to make an operator peel an RFID tag label from the 1st adhesive 2 side which is a weak adhesive, the 1st adhesive 2 is used on the label paper 6 of the RFID tag label on the opposite side to an adhesive layer. It is good to display the direction to start peeling corresponding to the position. Not only is the IC chip easily broken when the RFID tag label is peeled off, but it can also be easily peeled off from the side of the pressure-sensitive adhesive 2 having a weak adhesive force, which is advantageous to the operator.

  As Example 2, the configuration of the RFID label tag is the same as that of Example 1, and an example in which the range of the adhesive is different is shown in FIG. FIG. 6 is a diagram showing the range of the adhesive 2 and the adhesive 3. In Example 1, the boundary line between the pressure-sensitive adhesive 2 and the pressure-sensitive adhesive 3 is orthogonal to the long side, but in this example, an arbitrary angle 9 is given to the long side instead of a right angle. As long as the boundary line between the adhesive 2 and the adhesive 3 is inside the IC chip 1, the angle may be any.

  When the RFID label tag is peeled off, it is usually peeled from the corner 10 of the label in the longitudinal direction (long side direction in the case of a rectangle). Therefore, first, the adhesive 2 and the adhesive 3 are preferably arranged so as to be aligned in the longitudinal direction of the RFID tag label. Further, in this embodiment, the peeling boundary of the RFID label tag is peeled off obliquely rather than at a right angle with respect to the long side. Therefore, the structure of the second embodiment is a structure that exerts a bending force on the IC chip 1 without difficulty. is there. The label sheet 6 displays an instruction for the operator to remove the RFID label tag from the corner 10.

  As Example 3, an example in which the pressure-sensitive adhesive range is different from Example 1 is shown in FIG. In this embodiment, the adhesive 3 imparted with strong adhesiveness is provided in the form of a strip near the center of the IC chip 1, and two adhesives imparted with weaker adhesiveness than the adhesive 3 are provided at other locations on both sides thereof. It formed as the adhesive 2a and the adhesive 2b in the area | region. The material and adhesive strength of the adhesive 2a and the adhesive 2b may be the same or different. The boundary between the pressure-sensitive adhesive 3 and the pressure-sensitive adhesive 2 a and the boundary between the pressure-sensitive adhesive 3 and the pressure-sensitive adhesive 2 b both pass over the IC chip 1.

  This structure can be peeled off from any of the four corners of the RFID tag label. In Example 1 or Example 2, since the second adhesive 3 cannot be peeled off, the peelable direction was determined. In Example 3, however, the RFID tag label is peeled off from any corner. Is possible.

  As Example 4, an example in which the pressure-sensitive adhesive range is different as in Example 3 is shown in FIG. The pressure-sensitive adhesive 3 imparted with strong tack was disposed obliquely with respect to the IC chip 1, and the other positions were the pressure-sensitive adhesive 2 imparted with weak tack. Similar to the third embodiment, the structure can be peeled off from any of the four corners of the RFID tag label, and similarly to the second embodiment, the IC chip 1 is subjected to a bending force without difficulty.

  As Example 5, an example in which the pressure-sensitive adhesive range is different as in Example 3 is shown in FIG. The pressure-sensitive adhesive 3 imparted with strong tackiness was applied to the center of the IC chip 1, and the other positions were designated as pressure-sensitive adhesive 2 imparted with weak tackiness. That is, the region where the second adhesive is formed and the boundary between the first adhesive 2 and the second adhesive 3 are all within the projection plane of the IC chip 1. Similar to the third embodiment, the structure can be peeled off from any of the four corners of the RFID tag label.

  In the case of this structure, since a strong adhesive can be supplied using a dispenser or the like, it can be manufactured by improving the current apparatus without requiring a special manufacturing apparatus.

As Example 6, the configuration is the same as that of Example 1, but an example in which the direction of the inlet is different is shown in FIG. In FIG. 10, the inlet 4 is arranged upward and the label paper 6 is bonded to the upper layer via the pressure-sensitive adhesive 5, and the pressure-sensitive adhesives 2 and 3 for sticking to an object to be attached are provided in the lower layer of the inlet. The difference from Example 1 is that a release paper 8 that is peeled off during use is formed. Any one of Examples 1 to 5 can be applied to the formation region in the surface direction of the pressure-sensitive adhesives 2 and 3.

  Even if the adhesives 2 and 3 are not directly under the IC chip as in this embodiment, the adhesives 2 and 3 are present via the inlet base material and the like, and the adhesive in the projection surface of the IC chip 1 onto the adhesive is present. If the boundary between the agents 2 and 3 exists, a bending force is applied to the IC chip 1 as in the first embodiment, and the IC chip 1 can be destroyed at the time of peeling.

DESCRIPTION OF SYMBOLS 1 IC chip, 2 1st adhesion layer, 2nd adhesion layer, 4 inlet, 5 adhesion layer, 6 label paper, 7 release paper, 8 to-be-adhered thing, 9 adhesive application angle.

Claims (14)

An IC chip for storing the ID;
An antenna connected to the IC chip;
An inlet having the IC chip;
In an RFID tag label provided with an adhesive layer for attaching the inlet to an object to be pasted,
The pressure-sensitive adhesive layer has a first pressure-sensitive adhesive and a second pressure-sensitive adhesive having a stronger adhesive force than the first pressure-sensitive adhesive,
An RFID tag label, wherein a boundary between the first adhesive and the second adhesive is present in a region where the IC chip is projected onto the adhesive layer. In claim 1,
The RFID tag label, wherein a difference in adhesive force between the first adhesive and the second adhesive is 10 gf / width 25 mm or more. In claim 1,
The RFID tag label, wherein the first adhesive and the second adhesive are made of different materials. In claim 1,
The first adhesive and the second adhesive are adhesives of the same material,
An RFID tag label characterized in that a difference in adhesive force is formed by processing one or both. In claim 1,
The RFID tag label has a longitudinal direction;
The RFID tag label, wherein the first pressure-sensitive adhesive and the second pressure-sensitive adhesive are arranged in the longitudinal direction. In claim 5,
The RFID tag label, wherein a boundary between the first pressure-sensitive adhesive and the second pressure-sensitive adhesive is orthogonal to the long side of the rectangle. In claim 5,
The RFID tag label, wherein a boundary between the first pressure-sensitive adhesive and the second pressure-sensitive adhesive forms a predetermined angle (except for a right angle) with the long side of the rectangle. In claim 1,
Sandwiching the second adhesive, having the first first adhesive on one side, and having the second first adhesive on the other,
The boundary between the second adhesive and the first first adhesive and the boundary between the second adhesive and the second first adhesive are both attached to the IC chip. An RFID tag label characterized in that it passes through an area projected on a layer. In claim 1,
The RFID tag label, wherein the second adhesive is only in the projection surface of the IC chip and is surrounded by the first adhesive. In claim 1,
The RFID tag label, wherein the IC chip is on the adhesive layer side of the inlet or on the opposite side of the adhesive layer. In claim 1,
An RFID tag label comprising a display showing a position having the first adhesive on a surface opposite to the adhesive layer. An IC chip for storing the ID;
An antenna connected to the IC chip;
An inlet having the IC chip;
In the method of using an RFID tag label provided with an adhesive layer for attaching the inlet to an object to be pasted,
The method of using an RFID tag label, wherein the IC chip is destroyed when the RFID tag label is peeled off from the object to be pasted. In claim 12,
The pressure-sensitive adhesive layer has a first pressure-sensitive adhesive and a second pressure-sensitive adhesive having a stronger adhesive force than the first pressure-sensitive adhesive,
A method of using an RFID tag label, wherein a boundary between the first adhesive and the second adhesive is in a region where the IC chip is projected onto the adhesive layer. In claim 13,
The method of using an RFID tag label, wherein the RFID tag label is peeled off from the side having the second adhesive.

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