CN110516778B - Electronic tag packaging method applied to RFID dinner plate - Google Patents
Electronic tag packaging method applied to RFID dinner plate Download PDFInfo
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- CN110516778B CN110516778B CN201910762535.5A CN201910762535A CN110516778B CN 110516778 B CN110516778 B CN 110516778B CN 201910762535 A CN201910762535 A CN 201910762535A CN 110516778 B CN110516778 B CN 110516778B
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- Prior art keywords
- glue
- electronic tag
- rfid
- packaging
- dinner plate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
Abstract
The method adopts two different glues to package the electronic tag twice, the thermal expansion coefficient of the two glues and the thermal expansion coefficient of an antenna coil realize the thermal matching of a whole structure, the bending strength of an outer packaging layer is larger than that of an inner packaging layer, the deformation fracture generated by bearing high pressure in the process of implanting the electronic tag into a dish is reduced by the outer packaging layer, the tag fracture damage caused by micro deformation of the outer packaging layer is avoided by the inner packaging layer, the difference of the bending strength of the two packaging layers strengthens the high temperature resistance of a product, and the high pressure resistance of the product is improved. The electronic tag manufactured by the packaging method has the characteristics of high temperature and high pressure resistance, the reliability is high, the temperature resistance reaches 150 ℃, the impact temperature reaches 260 ℃, the reliability is high in an application scene of the RFID dinner plate, and the high-temperature impact caused by repeated disinfection is resisted.
Description
Technical Field
The invention relates to an electronic tag packaging method, in particular to an electronic tag packaging method applied to an RFID dinner plate.
Background
The RFID dinner plate is an automatic recognition technology which can be used for automatically recognizing tableware by implanting an electronic tag at the bottom of the dinner plate (melamine material). The dinner plate is automatically identified through the radio frequency signals, related data are acquired, manual intervention is not needed in identification work, a plurality of dinner plates can be identified at the same time, and the operation is rapid and convenient. The RFID dinner plate is suitable for automatic pricing terminal equipment of a self-service canteen and a restaurant, and is an important component of a fast settlement system of the intelligent dish self-service (selected) restaurant. The intelligent disc system adopts an international ISO/IEC15693 standard RFID radio frequency technology, an RFID radio frequency chip is implanted at the bottom of each tableware, after the tableware enters a settlement area (a radio frequency antenna induction area), the RFID radio frequency chip at the bottom of the tableware is subjected to read-write operation, and the communication and management of the RFID radio frequency chip at the bottom of the tableware are realized by means of a computer and a communication technology thereof, so that the quick settlement management is realized.
At present, an electronic tag package applied to an RFID dinner plate comprises an electronic tag chip, a package pin, an antenna coil and a substrate, and is packaged in a filler together through electrical connection.
The packing body is epoxy resin glue, the types of the epoxy resin glue used by different manufacturers are mostly different, and only high temperature resistance and high pressure resistance are considered when the glue is selected, so that the integrity of the chip is protected, but the epoxy resin has the characteristics of large thermal expansion coefficient and large surface tension, and in the process of manufacturing the RFID dinner plate, if the RFID dinner plate is subjected to the production process of hundreds of high temperature and tens of atmospheric pressures, the welding spots are separated or the wires are broken due to the large tension of the epoxy resin near the connection of the packaging pins and the wires of the electronic tag, so that the electronic tag cannot be normally used, and the purpose of automatic settlement cannot be realized. After the electronic tags in the dishes are damaged, the tags cannot be removed for repair, and only the new electronic tags are replaced, so that the price of the dishes on the market is far higher than that of the electronic tags, and the whole dishes are discarded due to the damage of the electronic tags, so that the operation cost is greatly increased.
Referring to fig. 1, a conventional electronic tag package 60 for an RFID dinner plate is shown, in which an electronic tag CHIP 61 is fixed on a substrate 63 by FLIP CHIP (FLIP CHIP), package pins 62 are electrically connected to the electronic tag CHIP 61, an antenna coil 64 is electrically connected to the package pins 62 by SMT reflow soldering, and finally the above components are packaged by a filler 66. The filler 66 applied to the RFID dish system is an epoxy with various properties. Through the packaging mode, if the RFID dinner plate is subjected to the production process of hundreds of DEG C and tens of atmospheric pressure, the tags are subjected to collision and high temperature continuously especially in application scenes such as bowl and dish washing, high-temperature disinfection and the like, so that the damage rate of the tags is increased, and the identification reliability of the RFID dinner plate is affected.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electronic tag packaging method applied to an RFID dinner plate, and the electronic tag manufactured by adopting the packaging mode has high reliability and is resistant to high-temperature impact caused by repeated disinfection in an application scene of the RFID dinner plate.
In order to solve the technical problems, the invention adopts the following technical scheme: an electronic tag packaging method applied to an RFID dinner plate comprises the following steps: s01), preparing an electronic tag, namely preparing an electronic tag chip, a soldering lug, a ceramic substrate and an antenna coil, wherein the electronic tag chip is welded on the ceramic substrate through the soldering lug, and the antenna coil is electrically connected with the electronic tag chip through a wire; s02), packaging the bare electronic tag prepared in the step S01 for the first time, placing the electronic tag into a die 1, and adopting a thermal expansion coefficient of 8 multiplied by 10 -6 Per DEG C to 12X 10 -6 The first glue between every two DEG C is used for packaging the exposed electronic tag for the first time, the exposed electronic tag is dripped into the die 1 provided with the electronic tag within the operable time after the first glue is prepared, the glue dosage is used for enabling the thickness of the first packaging layer to be between 0.9mm and 1.3mm, and then the electronic tag with the first packaging layer is put into an incubator for curing; s03), placing the electronic tag packaged in the step S02 into a die 2, wherein the thermal expansion coefficient is 7 multiplied by 10 -6 Per DEG C to 13X 10 -6 And (3) carrying out secondary packaging on the electronic tag by using a second glue between every two DEG C, wherein the bending strength of the second glue is an order of magnitude larger than that of the first glue, dripping the second glue into a die 2 provided with the electronic tag within the operational time period when the second glue is prepared, and using the glue to ensure that the thickness of a second packaging layer is between 1.9m and 2.7mm, and then naturally curing for a specific time.
Further, the first glue in the step S02 is JL-202 pouring AB glue or SY-314 pouring crystal glue, the mass ratio A of the JL-202 pouring AB glue is B=5:1, and the mass ratio A of the SY-314 pouring crystal glue is B=3:1.
Further, the second adhesive in the step S03 is a JL-610 epoxy resin AB quick-drying adhesive or a JL-660 epoxy resin AB adhesive, wherein the mass ratio A of the JL-610 epoxy resin AB quick-drying adhesive is B=1:1, and the mass ratio A of the JL-660 epoxy resin AB adhesive is B=1:1.
Further, in step S02, if the first glue is JL-202 encapsulating AB glue, the electronic tag with the first encapsulation layer is placed in a 60-DEG C incubator for curing for 3 hours, and if the first glue is SY-314 encapsulating crystal glue, the electronic tag with the first encapsulation layer is placed in the 60-DEG C incubator for curing for 90 minutes.
Further, in step S03, if the second glue is JL-610 epoxy resin AB quick-drying glue, the electronic tag after the second encapsulation is naturally cured for 10-15min, and if the second glue is JL-660 epoxy resin AB glue, the electronic tag after the second encapsulation is naturally cured for 2-4h.
Further, the operable time period after the first glue is proportioned is 40min or 25min.
Further, the operational time period after the second glue is proportioned is 5-8min or 35min.
Further, the first glue or the second glue is operated at a temperature of-10 ℃ to 40 ℃.
The invention has the beneficial effects that: according to the invention, the electronic tag is packaged twice by adopting two different glues, the thermal expansion coefficient of the two glues and the thermal expansion coefficient of the antenna coil are subjected to full-structure thermal matching, the bending strength of the outer packaging layer is larger than that of the inner packaging layer, the deformation fracture generated by bearing high pressure in the process of implanting the electronic tag into a bowl and dish is reduced by the outer packaging layer, the tag fracture damage caused by micro deformation of the outer packaging layer is avoided by the inner packaging layer, the high-temperature resistance of the product is enhanced by the difference of the bending strengths of the two packaging layers, and the high-pressure resistance of the product is improved. The electronic tag manufactured by the packaging method has the characteristics of high temperature and high pressure resistance, the reliability is high, the temperature resistance reaches 150 ℃, the impact temperature reaches 260 ℃, the reliability is high in an application scene of the RFID dinner plate, and the high-temperature impact caused by repeated disinfection is resisted.
Drawings
Fig. 1 is a schematic structural view of an electronic tag of a conventional RFID dinner plate;
FIG. 2 is a schematic diagram of an electronic label package according to the present invention;
FIG. 3 is a flow chart of the electronic label packaging method of the present invention;
in the figure: 60. the electronic tag comprises an electronic tag body, 61, an electronic tag chip, 62, package pins, 63, a substrate, 64, an antenna coil, 65, a wire, 66, a filler body, 10, an electronic tag body, 11, an electronic tag chip, 12, a soldering lug, 13, a ceramic substrate, 14, an antenna coil, 15, a wire, 16, a first packaging layer, 18 and a second packaging layer.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific examples.
Example 1
The embodiment discloses an electronic tag packaging method applied to an RFID dinner plate, wherein the packaged electronic tag is shown in fig. 2, and the packaging method comprises the following steps:
1) Preparing a chip 11;
2) Extruding the chip 11, the soldering lug 12 and the ceramic substrate 13 together by an inverse packaging machine;
3) And (3) SMT reflow soldering, namely opening the soldering equipment, setting reflow soldering conditions according to the process conditions, and placing the fixed antenna coil 14 and the ceramic substrate soldering lug into the reflow soldering equipment for processing and soldering.
4) Packaging the processed bare electronic tag, placing the electronic tag into a die 1, encapsulating the AB glue 16 by adopting JL-202, wherein the mass ratio A of the glue is B=5:1, the operation temperature is-10-40 ℃, the operation time is 40min after the matching, and the glue is solidified after 40min, so that the unused matching glue can not be used any more. 1ml of prepared AB glue is sucked by a dropper and dripped into a die 1 provided with an electronic tag, and the die is placed into a 60-DEG C incubator for curing for 3 hours. In this step, the thickness of the first encapsulation layer 16 is 1.2mm.
5) And (3) placing the cured electronic tag into a die 2, adopting JL-610 epoxy resin AB quick-drying adhesive 18, wherein the mass ratio A of the resin adhesive is B=1:1, the operating temperature is-10-40 ℃, and the operating time is 5-8min after the resin adhesive is proportioned. 1ml of prepared AB glue is sucked by a dropper and dripped into a die 2 provided with an electronic tag, and the glue is naturally solidified for 10-15min. In this step, the thickness of the second encapsulation layer 18 is 2.5 mm.
The high-reliability electronic tag packaging method has the advantages of high temperature resistance, high voltage resistance, reliable electrical connection and the like. During packaging, factors such as thermal expansion rate and bending strength of the two AB adhesives are comprehensively considered, and requirements such as thermal matching and mechanical strength are required to be met. Therefore, in order to realize the reliability of the product, the parameter characteristics and the structural characteristics of the product should be considered.
In this embodiment, the thermal expansion coefficient of the coil is 15×10 -6 Thermal expansion coefficient of JL-202 adhesive is 9×10 at/deg.C -6 Thermal expansion coefficient of JL-610 adhesive is 8X10 °C -6 Heat matching is realized by the whole structure at the temperature of/℃; the bending strength of the JL-610 adhesive is 102Kg/mm 2 The deformation and fracture caused by high pressure bearing in the process of implanting the electronic tag into the bowl and dish are reduced, and the bending strength of the JL-202 adhesive is 11Kg/mm 2 The label breakage and damage caused by the micro deformation of the JL-610 adhesive are ensured.
Example 2
The embodiment discloses an electronic tag packaging method applied to an RFID dinner plate, wherein the packaged electronic tag is shown in fig. 2, and the packaging method comprises the following steps:
1) Preparing a chip 11;
2) Extruding the chip 11, the soldering lug 12 and the ceramic substrate 13 together by an inverse packaging machine;
3) And (3) SMT reflow soldering, namely opening the soldering equipment, setting reflow soldering conditions according to the process conditions, and placing the fixed antenna coil 14 and the ceramic substrate soldering lug into the reflow soldering equipment for processing and soldering.
4) Packaging the processed bare electronic tag, placing the electronic tag into a die 1, encapsulating crystal glue by SY-314, wherein the mass ratio A of glue is B=3:1, the operation temperature is 0-30 ℃, the operation time is 25min after the matching, and the glue starts to be solidified after 25min, so that the unspecified matching glue can not be used any more. 1ml of prepared AB glue is sucked by a dropper and dripped into a die 1 provided with an electronic tag, and the die is placed into a 60-DEG incubator for curing for 90 minutes. In this step, the thickness of the first encapsulation layer 16 is 1.0mm.
5) The cured electronic tag is placed into a die 2, JL-660 epoxy resin AB glue 18 is adopted, the resin glue mass ratio A is B=1:1, the operation temperature is-10 ℃ to 40 ℃, and the operation time is 35min after the matching. And (3) sucking 1ml of prepared AB glue by using a dropper, dripping the AB glue into a die 2 provided with the electronic tag, and naturally curing for 2-4h. In this step, the thickness of the second encapsulation layer 18 is 2.6mm.
The high-reliability electronic tag packaging method has the advantages of high temperature resistance, high voltage resistance, reliable electrical connection and the like. During packaging, factors such as thermal expansion rate and bending strength of the two AB adhesives are comprehensively considered, and requirements such as thermal matching and mechanical strength are required to be met. Therefore, in order to realize the reliability of the product, the parameter characteristics and the structural characteristics of the product should be considered.
In this embodiment, the thermal expansion coefficient of the coil is 14.5X10 -6 Thermal expansion coefficient of SY-314 glue is 11 multiplied by 10 at/DEG C -6 JL-660 gel having a thermal expansion coefficient of 8X10 at/DEG C -6 Heat matching is realized by the whole structure at the temperature of/℃; the bending strength of the JL-660 adhesive is 112Kg/mm 2 The deformation and fracture caused by high pressure bearing in the process of implanting the electronic tag into the bowl and dish are reduced, and the bending strength of SY-314 glue is 13Kg/mm 2 The label breakage and damage caused by the micro deformation of the JL-660 glue are ensured.
The foregoing description is only of the basic principles and preferred embodiments of the present invention, and modifications and alternatives thereto will occur to those skilled in the art to which the present invention pertains, as defined by the appended claims.
Claims (8)
1. An electronic tag packaging method applied to an RFID dinner plate is characterized by comprising the following steps of: the method comprises the following steps: s01), preparing an electronic tag, namely preparing an electronic tag chip, a soldering lug, a ceramic substrate and an antenna coil, wherein the electronic tag chip is welded on the ceramic substrate through the soldering lug, and the antenna coil is electrically connected with the electronic tag chip through a wire; s02), packaging the bare electronic tag prepared in the step S01 for the first time, placing the electronic tag into a die 1, and adopting a thermal expansion coefficient of 8 multiplied by 10 -6 Per DEG C to 12X 10 -6 The first glue between every two DEG C is used for packaging the exposed electronic tag for the first time, the exposed electronic tag is dripped into the die 1 provided with the electronic tag within the operable time after the first glue is prepared, the glue dosage is used for enabling the thickness of the first packaging layer to be between 0.9mm and 1.3mm, and then the electronic tag with the first packaging layer is put into an incubator for curing; s03), placing the electronic tag packaged in the step S02 into a die 2, wherein the thermal expansion coefficient is 7 multiplied by 10 -6 Per DEG C to 13X 10 -6 The second glue between the temperature/DEG C is used for carrying out secondary packaging on the electronic tag, and the second glue is used for carrying out secondary packaging on the electronic tagThe bending strength of the glue is an order of magnitude greater than that of the first glue, the glue is dripped into the mould 2 provided with the electronic tag within the operational time period when the second glue is prepared, the glue is used in an amount that the thickness of the second packaging layer is between 1.9m and 2.7mm, and then the glue is naturally cured for a specific time.
2. The electronic label packaging method applied to the RFID dinner plate according to claim 1, wherein: the first glue in the step S02 is JL-202 pouring AB glue or SY-314 pouring crystal glue, wherein the mass ratio A of the JL-202 pouring AB glue is B=5:1, and the mass ratio A of the SY-314 pouring crystal glue is B=3:1.
3. The electronic label packaging method applied to the RFID dinner plate according to claim 1, wherein: the second glue in the step S03 is JL-610 epoxy resin AB quick-drying glue or JL-660 epoxy resin AB glue, wherein the mass ratio A of the JL-610 epoxy resin AB quick-drying glue is B=1:1, and the mass ratio A of the JL-660 epoxy resin AB glue is B=1:1.
4. The electronic label packaging method applied to the RFID dinner plate according to claim 2, wherein: in step S02, if the first glue is JL-202 encapsulating AB glue, the electronic tag with the first encapsulation layer is placed in a 60-DEG C incubator to be cured for 3 hours, and if the first glue is SY-314 encapsulating crystal glue, the electronic tag with the first encapsulation layer is placed in the 60-DEG C incubator to be cured for 90 minutes.
5. The electronic label packaging method applied to the RFID dinner plate according to claim 2, wherein: in step S03, if the second glue is JL-610 epoxy resin AB quick-drying glue, the electronic label subjected to the second encapsulation is naturally cured for 10-15min, and if the second glue is JL-660 epoxy resin AB glue, the electronic label subjected to the second encapsulation is naturally cured for 2-4h.
6. The electronic label packaging method applied to the RFID dinner plate according to claim 2, wherein: the operable time period after the first glue is proportioned is 40min or 25min.
7. The method for packaging an electronic tag for an RFID dinner plate according to claim 3, wherein: the operational time after the second glue is proportioned is 5-8min or 35min.
8. The electronic label packaging method applied to the RFID dinner plate according to claim 2 or 3, wherein: the first glue or the second glue has an operating temperature of-10 ℃ to 40 ℃.
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| CN201910762535.5A CN110516778B (en) | 2019-08-19 | 2019-08-19 | Electronic tag packaging method applied to RFID dinner plate |
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| CN201910762535.5A CN110516778B (en) | 2019-08-19 | 2019-08-19 | Electronic tag packaging method applied to RFID dinner plate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113379022A (en) * | 2021-06-07 | 2021-09-10 | 湖南孚谷物联科技有限公司 | RFID label for high-frequency smart tableware |
| CN117457302B (en) * | 2023-12-13 | 2024-03-22 | 东莞高端精密电子股份有限公司 | High-precision resistor, resistor packaging device and packaging process |
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