CN108172552A - A kind of encapsulating structure and its packaging method of stent-type electronic tag - Google Patents
A kind of encapsulating structure and its packaging method of stent-type electronic tag Download PDFInfo
- Publication number
- CN108172552A CN108172552A CN201810018112.8A CN201810018112A CN108172552A CN 108172552 A CN108172552 A CN 108172552A CN 201810018112 A CN201810018112 A CN 201810018112A CN 108172552 A CN108172552 A CN 108172552A
- Authority
- CN
- China
- Prior art keywords
- stent
- electronic tag
- integrated circuit
- core material
- finished product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The invention belongs to radio frequency identification tag package technical fields, specifically disclose a kind of encapsulating structure and its packaging method of stent-type electronic tag.The encapsulating structure includes integrated circuit, antenna core material and encapsulating material, the integrated circuit includes stent, chip and packaging plastic material, the bonding wafer is in the bracket, and pass through bonding line and be electrically connected with stent, the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, and label core material finished product and encapsulating material finally are carried out secondary encapsulation is made electronic tag.The encapsulating structure so that the reliability of electronic tag significantly improves, cost is substantially reduced, and so as to which the extensive use for making electronic tag becomes possible, packaging method technical process is simple, equipment investment is few, can effectively reduce the cost of manufacture of integrated circuit.
Description
Technical field
The invention belongs to radio frequency identification tag package technical field, the encapsulating structure of more particularly to a kind of stent-type electronic tag and
Its packaging method.
Background technology
Radio Frequency Identification Technology (RFID, Radio Frequency Identification) is a kind of communication technology, it is logical
It crosses radiofrequency signal automatic identification target object and obtains relevant data information, non-contact two-way is carried out using radio frequency method
Letter, reaches identifying purpose and exchanges data, and identification work is without manual intervention, with recognition speed is fast, dynamic realtime communicates, wears
Permeability and without barrier reading, better safety, storage data capacity it is big, service life is long the advantages that, be widely used in logistics,
The application fields such as retail, manufacture, anti-fake, asset management, identification, traffic.
The groundwork process of RFID technique is：After RFID label tag enters magnetic field, radiofrequency signal that reader is sent out relies on
The energy that sensing electric current is obtained sends out product information (Passive Tag, passive label or the passive mark of storage in the chips
Label) or actively send by RFID label tag the signal (Active Tag, active label or active tag) of a certain frequency, reading
After device reads information and decodes, send to Central Information System and carry out related data processing.
In general, passive label or active label all have integrated circuit or the electronic circuit of silicon chip form, electricity
Sub-circuit stores and transmits identification data to reader.Wherein active label merges the energy from label itself and leads to reader
The antenna of news；And passive label, antenna are used as the converter for electric energy being converted into from the RF energy of reader, chip obtains
It is excited after obtaining energy, and performs the communication function with reader.
The integrated circuit (IC) used in conventional RFID label tag is flip-chip, and the stud bump making work in flip-chip
Skill is complicated, production equipment is expensive, and there are when flip-chip is connected with wiring board low production efficiency, poor reliability etc. ask
Topic.So although industry generally to the promise well of RFID technique, the cost of manufacture height of electronic tag, low production efficiency, can
The commercialization process of RFID technique in practical applications is seriously constrained the problems such as poor by property.
Therefore, encapsulating structure and its side of good, good reliability the electronic tag of a kind of low manufacture cost, production efficiency are researched and developed
Method is extremely urgent.
Invention content
The purpose of the present invention is overcome the deficiencies in the prior art, disclose a kind of encapsulating structure of stent-type electronic tag, should
Encapsulating structure so that the reliability of electronic tag significantly improves, cost is substantially reduced, so as to become the extensive use of electronic tag
Obtaining may.
In order to reach above-mentioned technical purpose, the present invention is realized by following technical scheme：
The encapsulating structure of a kind of stent-type electronic tag of the present invention, including integrated circuit, antenna core material and encapsulation
Material, the integrated circuit include stent, chip and packaging plastic material, and the bonding wafer in the bracket, and passes through bonding line
It is electrically connected with stent, the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, most and then will mark
Label core material finished product and encapsulating material carry out secondary encapsulation and electronic tag are made.
As being further improved for above-mentioned technology, the chip is grinding wafer, wafer cutting gained chip.
As the further improvement of above-mentioned technology, the stent is a kind of printed circuit board (Printed Circuit
Board).Wherein, the printed circuit board (Printed Circuit Board), dielectric layer is BT resins
(Bismaleimide Triazine) or phenolic resin (Phonetic) or epoxy resin (Epoxy) or Polyimide tree
(Polyamide) or one kind in the resins such as polytetrafluoroethylene (PTFE) (Polytetrafluorethylene)；The printed circuit board
(Printed Circuit Board), dielectric layer surface are covered with the metal foil made needed for circuit, such as copper foil, aluminium foil.
In the present invention, the liquid glue or solid that it is liquid under the room temperature that can carry out plastic packaging (Molding) that the packaging plastic, which is,
The epoxy glue of state.
The invention also discloses the packaging methods of the encapsulating structure of above-mentioned stent-type electronic tag, comprise the concrete steps that：
(1) preparation of integrated circuit：By in bonding wafer to stent, die pads and stent pin are realized by bonding line
Electrical connection, then the processes such as plastic packaging (Molding), curing, cutting, test integrated circuit (IC) is made；
(2) prepared by label core material finished product：Printing and patch assembly technique by integrated circuit (IC) and antenna core material into
Product are once encapsulated, and form label core material finished product；
(3) prepared by electronic tag：Label core material finished product and encapsulating material are subjected to secondary encapsulation, pass sequentially through compound, mould
It cuts, test technology is finally made electronic tag.
In the present invention, the preparation process of above-mentioned steps (1) integrated circuit is as follows：
First, by printed circuit board (Printed Circuit Board) by blanking, drilling, the thin metal of chemical plating (such as
Copper), brush board, exposure, etching, cleaning, silk-screen, the processes such as detection are made to encapsulate the stent needed for integrated circuit；
Secondly, the wafer completed, stent, crystal-bonding adhesive will be cut and is put into die bond equipment, carried out chip die bond, baking, complete
Stent after die bond is put into the bonding line that bonding apparatus bonding wafer pad is connect with metal foil (pin)；
Finally, the stent for completing bonding is packed into plastic packaging (Molding) mold and carries out plastic packaging (Molding), then passed through
Integrated circuit finished product is made in the processes such as curing, cutting, test.
In above-mentioned steps (2), the making step of label core material finished product is as follows：
(1) first, it is pressed together on antenna circuit jigsaw with steel mesh corresponding with antenna circuit typesetting, is printed tin cream with scraper plate
It brushes on the corresponding pad of antenna circuit jigsaw, the antenna circuit jigsaw for completing print solder paste is packed into patch device, is integrated
The surface mount of circuit；
(2) then, the antenna circuit board jigsaw that will complete integrated circuit attachment is sent into solder reflow device, melts tin cream,
The electrical connection for completing integrated circuit and antenna is to complete the first time encapsulation of electronic tag, and label core material finished product has been made.
In the present invention, in the production process of the integrated circuit finished product, condition of cure for solidification temperature ranging from：
100 degree to 250 degree, hardening time is 1 minute to 180 minutes.
In the present invention, the material of the antenna core material meets antenna performance and reality for copper, aluminium, silver, electrically conductive ink etc.
Using one kind in the material of needs.And there are insulation performance and satisfaction in fact for paper, plastic film etc. for carrying the base material of antenna
One kind in the material that border needs.
In the present invention, the encapsulating material is the satisfactions such as paper, plastics, glass, ceramics, metal encapsulation requirement and practical need
One or more of Material texture wanted.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) encapsulating structure of electronic tag of the present invention the reliability of electronic tag is significantly improved, cost it is bright
It is aobvious to reduce, so as to which the extensive use for making electronic tag becomes possible.
(2) packaging method of electronic tag of the present invention cuts obtained chip by grinding wafer, wafer
Integrated circuit (IC) is made in the bracket, by techniques such as bonding line, plastic packaging (Molding), curing, cutting, tests in die bond, with
The flip-chip of plantation salient point is compared, and the simple for process of making integrated circuit (IC), equipment investment are few, can effectively reduce
The cost of manufacture of integrated circuit (IC).
(3) packaging method of electronic tag of the present invention, with integrated circuit prepared by such encapsulation technology, using print
The techniques such as brush, surface mount further improve production efficiency, reliability, the maintenanceability of product, thus energy saving,
Reduce production cost so that the extensive use of electronic tag becomes possible.
Description of the drawings
The present invention is described in detail in the following with reference to the drawings and specific embodiments：
Fig. 1 is stent-type Electronic Tag Structure schematic diagram of the present invention；
Fig. 2 is integrated circuit sectional view in the present invention；
Fig. 3 is the composing structure schematic diagram of antenna circuit in the present invention；
Fig. 4 is steel net structure schematic diagram in the present invention (corresponding with antenna circuit consistent).
Specific embodiment
As shown in Figure 1, a kind of encapsulating structure of stent-type electronic tag of the present invention, including integrated circuit 1, antenna
Core material finished product 2 and encapsulating material 3, the integrated circuit 1 include stent 11, chip 12 and packaging plastic 13, and the chip 12 is bonded
In stent 11, and pass through bonding line 14 and be electrically connected with stent 11, the integrated circuit 1 and antenna core material 2 carry out first time envelope
Dress forms label core material finished product, and label core material finished product and encapsulating material 3 finally are carried out secondary encapsulation is made electronic tag.
In the present invention, the material of the antenna core material 2 meets antenna performance and reality for copper, aluminium, silver, electrically conductive ink etc.
There are insulation performance and satisfaction in fact for paper, plastic film etc. using one kind in the material of needs, and for carrying the base material of antenna
One kind in the material that border needs；The encapsulating material 3 is for the satisfactions such as paper, plastics, glass, ceramics, metal encapsulation requirement and in fact
One or more of Material texture that border needs；The chip 12 is grinding wafer, wafer cutting gained chip.
The stent 11 includes metal foil 111 and dielectric layer 112, wherein, the metal foil 111 is 112 surface of dielectric layer
What is be covered with makes the metal foil needed for circuit, such as copper foil, aluminium foil；The dielectric layer 112 is BT resins
(BismaleimideTriazine) or phenolic resin (Phonetic) or epoxy resin (Epoxy) or Polyimide tree
(Polyamide) or one kind in the resins such as polytetrafluoroethylene (PTFE) (Polytetrafluorethylene)；
The packaging plastic 13 be under the room temperature that can carry out plastic packaging (Molding) be the liquid glue of liquid or solid epoxy
Glue.
The invention also discloses the packaging methods of the encapsulating structure of above-mentioned stent-type electronic tag, comprise the concrete steps that：
(1) preparation of integrated circuit：Chip 12 is adhered in stent 11, the pad of chip 12 is realized by bonding line 14
With the electrical connection of 11 pin of stent, integrated circuit 1 then is made by processes such as plastic packaging (Molding), curing, cutting, tests；
(2) prepared by label core material finished product：By printing and patch assembly technique by integrated circuit (IC) and antenna core
Material finished product 2 is once encapsulated, and forms label core material finished product；
(3) prepared by electronic tag：Label core material finished product and encapsulating material 3 are subjected to secondary encapsulation, pass sequentially through compound, mould
It the techniques such as cuts, test and being finally made electronic tag.
In the present invention, the preparation process of above-mentioned steps (1) integrated circuit is as follows：
First, as shown in Fig. 2, metal foil 111 (copper foil) and dielectric layer 112 (BT resin base materials) are combined 0.15mm
Thick printed circuit board (Printed Circuit Board), by blanking, drilling, the thin metal of chemical plating (such as copper), brush board,
The processes such as exposure, etching, cleaning, silk-screen, detection are made to encapsulate the stent 11 needed for integrated circuit；
Then, the wafer completed, stent, crystal-bonding adhesive will be cut and is put into die bond equipment, carried out 12 die bond of chip, complete die bond
Stent 11 afterwards is put into bonding apparatus, the bonding line 14 that 12 pad of bonding wafer is connect with metal foil 111 (copper foil)；
Finally, the stent for completing bonding is packed into plastic packaging (Molding) mold and carries out plastic packaging (Molding), then passed through
The processes such as curing, cutting, test are made integrated circuit finished product, condition of cure for solidification temperature ranging from：100 degree to 250 degree,
Hardening time is 1 minute to 180 minutes.
The making step of label core material finished product is following (as shown in Figure 3, Figure 4) in the present invention：
(1) first, it is pressed together on antenna circuit jigsaw 4 with 4 corresponding steel mesh 5 of antenna circuit jigsaw, with scraper plate by tin
Cream is printed onto in the trepanning 61 of 4 corresponding pad 6 of antenna circuit jigsaw, and the antenna circuit jigsaw 4 for completing print solder paste is packed into patch
Piece equipment, into the surface mount of line integrated circuit；
(2) then, the antenna circuit jigsaw 4 that will complete integrated circuit attachment is sent into solder reflow device, melts tin cream,
The electrical connection for completing integrated circuit and antenna is to complete the first time encapsulation of electronic tag, and label core material finished product has been made.
The invention is not limited in the above embodiment, every various changes or modifications to the present invention do not depart from the present invention
Spirit and scope, if these modification and variations belong within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to also imply that comprising these modification and variations.
Claims (10)
1. a kind of encapsulating structure of stent-type electronic tag, it is characterised in that：Including integrated circuit, antenna core material and package material
Material, the integrated circuit include stent, chip and packaging plastic material, the bonding wafer in the bracket, and pass through bonding line with
Stent is electrically connected, and the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, finally by label core
Material finished product and encapsulating material carry out secondary encapsulation and electronic tag are made.
2. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The chip is ground for wafer
Mill, wafer cutting gained chip.
3. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The stent is a kind of print
Circuit board processed.
4. the encapsulating structure of stent-type electronic tag according to claim 3, it is characterised in that：The printed circuit board,
Its dielectric layer is one kind in BT resins or phenolic resin or epoxy resin or Polyimide tree or polytetrafluoroethylene (PTFE).
5. the encapsulating structure of stent-type electronic tag according to claim 3, it is characterised in that：The printed circuit board,
Its dielectric layer surface is covered with the metal foil made needed for circuit, and the metal foil can make circuit-line can make pin again.
6. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The packaging plastic is can be into
It is the liquid glue of liquid or solid epoxy glue under the room temperature of row plastic packaging (Molding).
7. the packaging method of the encapsulating structure of stent-type electronic tag according to any one of claims 1 to 6, specific to walk
Suddenly it is：
(1) preparation of integrated circuit：By in bonding wafer to stent, the electricity of die pads and stent pin is realized by bonding line
Connection, then integrated circuit (IC) is made in plastic packaging (Molding), curing, cutting, test step；
(2) prepared by label core material finished product：Printing and patch assembly technique by integrated circuit (IC) and antenna core material finished product into
The primary encapsulation of row, forms label core material finished product；
(3) prepared by electronic tag：Label core material finished product and encapsulating material are subjected to secondary encapsulation, compound, cross cutting is passed sequentially through, surveys
Trial work skill is finally made electronic tag.
8. the packaging method of the encapsulating structure of the stent-type electronic tag according to its claim 7, it is characterised in that：
In above-mentioned steps (1), first, by printed circuit board by blanking, drilling, the thin metal of chemical plating, brush board, exposure, etching,
Cleaning, silk-screen, detection process are made to encapsulate the stent needed for integrated circuit；Secondly, will cut complete wafer, stent,
Crystal-bonding adhesive is put into die bond equipment, carries out chip die bond, baking, completes the stent after die bond and is put into bonding apparatus bonding wafer pad
The bonding line being connect with metal foil or pin；
Finally, will complete bonding stent be packed into plastic packaging (Molding) mold carry out plastic packaging (Molding), then by curing,
Integrated circuit finished product is made in the processes such as cutting, test.
9. the packaging method of the encapsulating structure of the stent-type electronic tag according to its claim 7, it is characterised in that：
In above-mentioned steps (2), the making step of label core material finished product is as follows：
(1) first, it is pressed together on antenna circuit jigsaw with steel mesh corresponding with antenna circuit typesetting, is printed solder paste onto with scraper plate
On the corresponding pad of antenna circuit jigsaw, the antenna circuit jigsaw for completing print solder paste is packed into patch device, into line integrated circuit
Surface mount；
(2) then, the antenna circuit board jigsaw that will complete integrated circuit attachment is sent into solder reflow device, melts tin cream, completes
The electrical connection of integrated circuit and antenna completes the first time encapsulation of electronic tag, and label core material finished product has been made.
10. the packaging method of the encapsulating structure of stent-type electronic tag according to claim 8, it is characterised in that：It is described
In the production process of integrated circuit finished product, condition of cure for solidification temperature ranging from：100 degree to 250 degree, hardening time is 1
Minute was to 180 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810018112.8A CN108172552A (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure and its packaging method of stent-type electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810018112.8A CN108172552A (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure and its packaging method of stent-type electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108172552A true CN108172552A (en) | 2018-06-15 |
Family
ID=62517580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810018112.8A Pending CN108172552A (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure and its packaging method of stent-type electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108172552A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114037042A (en) * | 2021-11-04 | 2022-02-11 | 东港股份有限公司 | Reverse packaging process of electronic tag |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015555A (en) * | 1999-06-30 | 2001-01-19 | Toppan Forms Co Ltd | Method for mounting bare ic chip |
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
| CN101482937A (en) * | 2009-03-22 | 2009-07-15 | 上海伊诺尔信息技术有限公司 | Thin non-contact module production method |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
| CN102074534A (en) * | 2009-11-24 | 2011-05-25 | 上海长丰智能卡有限公司 | Micro PCB radio frequency module and packaging method thereof |
| US20130140368A1 (en) * | 2011-12-01 | 2013-06-06 | Mutual-Pak Technology Co., Ltd. | Radio frequency identification tag |
| CN207993846U (en) * | 2018-01-09 | 2018-10-19 | 木林森股份有限公司 | A kind of encapsulating structure of stent-type electronic tag |
-
2018
- 2018-01-09 CN CN201810018112.8A patent/CN108172552A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015555A (en) * | 1999-06-30 | 2001-01-19 | Toppan Forms Co Ltd | Method for mounting bare ic chip |
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
| CN101482937A (en) * | 2009-03-22 | 2009-07-15 | 上海伊诺尔信息技术有限公司 | Thin non-contact module production method |
| CN102074534A (en) * | 2009-11-24 | 2011-05-25 | 上海长丰智能卡有限公司 | Micro PCB radio frequency module and packaging method thereof |
| US20130140368A1 (en) * | 2011-12-01 | 2013-06-06 | Mutual-Pak Technology Co., Ltd. | Radio frequency identification tag |
| CN207993846U (en) * | 2018-01-09 | 2018-10-19 | 木林森股份有限公司 | A kind of encapsulating structure of stent-type electronic tag |
Non-Patent Citations (1)
| Title |
|---|
| 郑清兰等: "《电工电子实训与电工考证指导书》", 北京理工大学出版社, pages: 104 - 111 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114037042A (en) * | 2021-11-04 | 2022-02-11 | 东港股份有限公司 | Reverse packaging process of electronic tag |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6404643B1 (en) | Article having an embedded electronic device, and method of making same | |
| US20180374798A1 (en) | Semiconductor device having emi shielding structure and related methods | |
| US6489218B1 (en) | Singulation method used in leadless packaging process | |
| US7193161B1 (en) | SiP module with a single sided lid | |
| US11222861B2 (en) | Dual-interface IC card module | |
| CN102386106A (en) | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | |
| US20070048901A1 (en) | Wafer-level package and IC module assembly method for the wafer-level package | |
| CN103474406A (en) | Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof | |
| CN101527005A (en) | Novel mobile phone function expansion card and method for achieving same | |
| JP2005275802A (en) | Method for radio wave readable data carrier, board using the method, and electronic component module | |
| US7317395B2 (en) | RFID tag and method of manufacturing the same | |
| CN207993846U (en) | A kind of encapsulating structure of stent-type electronic tag | |
| CN105632943B (en) | The ultra-thin embedded method for packing of chip | |
| CN108172552A (en) | A kind of encapsulating structure and its packaging method of stent-type electronic tag | |
| CN103020696A (en) | Electronic tag manufacturing method | |
| US6524886B2 (en) | Method of making leadless semiconductor package | |
| US9424507B2 (en) | Dual interface IC card components and method for manufacturing the dual-interface IC card components | |
| CN104218009B (en) | Chip card module and the method for manufacturing chip card module | |
| US6610924B1 (en) | Semiconductor package | |
| CN205211727U (en) | Fingerprint identification multi -chip packaging structure | |
| JP2003256798A (en) | Non-contact data carrier and method of manufacturing the data carrier | |
| CN105590904A (en) | Fingerprint identification multi-chip package structure and preparation method thereof | |
| WO2016107298A1 (en) | Molding packaged mini mobile phone intelligent card, and packing method | |
| CN208207884U (en) | Electronic label | |
| CN110571161A (en) | Embedded RFID label packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |