CN110689105B - Ultra-thin RFID smart card packaging method - Google Patents
Ultra-thin RFID smart card packaging method Download PDFInfo
- Publication number
- CN110689105B CN110689105B CN201910914090.8A CN201910914090A CN110689105B CN 110689105 B CN110689105 B CN 110689105B CN 201910914090 A CN201910914090 A CN 201910914090A CN 110689105 B CN110689105 B CN 110689105B
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- CN
- China
- Prior art keywords
- antenna
- substrate
- bonding pad
- leads
- rfid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 38
- 238000003475 lamination Methods 0.000 claims abstract description 20
- 238000004804 winding Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
Abstract
The invention is suitable for the technical field of RFID card packaging. The invention discloses an ultrathin RFID smart card packaging method, which comprises the steps of antenna manufacturing, wherein an antenna is formed by winding enameled wires on a first base material according to a set shape, and insulating layers on the surfaces of two leads on the antenna are removed; the mounting step, namely respectively placing two welding spots on the inverted packaging bonding pad of the RFID chip above the two leads of the antenna with the insulating layer removed; and a lamination forming step, wherein a second substrate is covered on the bonding pad on one surface with the welding spots in the mounting step, and the welding spots on the bonding pad are respectively in close contact with the two leads of the antenna to form electric connection, namely one welding spot is electrically conducted with one antenna lead through lamination of the first substrate and the second substrate. Because hard connection is not needed between the two leads of the antenna and the bonding pad through welding, on one hand, the packaging procedure can be reduced, and the packaging efficiency is improved. On the other hand, the thickness of the RFID card can be reduced without welding. Meanwhile, the precision is high by adopting a winding antenna.
Description
Technical Field
The invention relates to the technical field of RFID card packaging, in particular to an ultrathin RFID intelligent card packaging method.
Background
As RFID card users require thinner and thinner, existing RFID card packages can only be fabricated by etching antennas on a substrate. However, due to the accuracy problem of the etched antenna, the transmission line electrical performance of the etched antenna, such as the parasitic inductance parameter accuracy, is insufficient, which affects the antenna performance, and the etched antenna cannot be stacked when the signal transmission distance needs to be increased to manufacture a longer antenna. The antenna manufactured by adopting the enameled wire winding mode has high electrical performance and high precision, but the connection point is required to be welded with the bonding pad, and meanwhile, the RFID chip is required to be bonded with the bonding pad, so that the position of the RFID chip is thicker, the thickness of the RFID card is increased, and meanwhile, the working procedure is also required to be increased.
Disclosure of Invention
The invention mainly solves the technical problem of providing an ultrathin RFID smart card packaging method, which avoids the precision when an antenna is etched, improves the antenna precision, reduces the thickness of the RFID, reduces packaging procedures and improves the packaging efficiency.
In order to solve the above problems, the present invention provides an ultra-thin RFID smart card packaging method, including,
the method comprises the steps of manufacturing an antenna, winding wires on a first base material by using enameled wires according to a set shape to form the antenna, removing insulating layers on the surfaces of two leads on the antenna, or winding the antenna in a set shape by using enameled wires and then fixing the antenna on the first base material, and removing the insulating layers on the surfaces of the two leads on the antenna;
the mounting step, namely placing two welding spots on the inverted packaging bonding pad of the RFID chip above the two leads of the antenna with the insulation layer removed, or placing the two leads of the antenna with the insulation layer removed above the two welding spots on the bonding pad;
and a lamination forming step, wherein a second substrate is covered on a bonding pad on one surface with the welding spots in the mounting step, and the first substrate and the second substrate are laminated to be melted and self-adhered, so that two welding spots on the bonding pad are respectively in close contact with two leads of the antenna to form electric connection, namely one welding spot is electrically conducted with one lead of the antenna.
Further, the substrate comprises PVC.
Further, the RFID chip packaging step comprises the steps of manufacturing an etching circuit on one surface of a bonding pad by etching, and etching a welding spot on the other surface, wherein the welding spot is communicated with the etching circuit. And a bonding pad on one surface with the etching circuit is coated with conductive adhesive, and the RFID chip is fixed with the conductive adhesive after being reversely buckled.
Further, the lamination forming step is followed by a skin lamination step, which includes placing an RFID card back cover and a front cover on the surfaces of the first substrate and the second substrate, respectively, to laminate the back cover and the front cover with the first substrate and the second substrate, thereby forming an RFID card.
The invention relates to an ultrathin RFID smart card packaging method, which comprises the steps of forming an antenna by winding wires on a first base material according to a set shape by using enameled wires, removing insulating layers on the surfaces of two leads on the antenna, or fixing the antenna in a set state by using the enameled wires on the first base material after winding the antenna in a set state, and removing the insulating layers on the surfaces of the two leads on the antenna; the mounting step, namely placing two welding spots on the inverted packaging bonding pad of the RFID chip above the two leads of the antenna with the insulation layer removed, or placing the two leads of the antenna with the insulation layer removed above the two welding spots on the bonding pad; and a lamination forming step, wherein a second substrate is covered on the bonding pad on one surface with the welding spots in the mounting step, and the welding spots on the bonding pad are respectively in close contact with the two leads of the antenna to form electric connection, namely one welding spot is electrically conducted with one antenna lead through lamination of the first substrate and the second substrate. Because hard connection is not needed between the two leads of the antenna and the bonding pad through welding, on one hand, the packaging procedure can be reduced, and the packaging efficiency is improved. On the other hand, the thickness of the RFID card can be reduced without welding. Meanwhile, the antenna is formed by adopting enameled wires, so that the precision is high.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it is apparent that the drawings in the description are some embodiments of the invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of an embodiment of a method for packaging an ultra-thin RFID smart card.
The achievement, functional features and advantages of the object of the present invention will be further described below with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in FIG. 1, the invention provides an embodiment of an ultra-thin RFID smart card packaging method.
An ultra-thin RFID smart card packaging method, comprising,
s11, namely an antenna manufacturing step, winding wires on a first base material by using enameled wires according to a set shape to form an antenna, removing insulating layers on the surfaces of two leads on the antenna, or winding the antenna in a set state by using enameled wires, fixing the antenna on the first base material, and removing the insulating layers on the surfaces of the two leads on the antenna.
S12, namely a mounting step, wherein two welding spots on the inverted packaging bonding pad of the RFID chip are respectively placed or attached above the two leads of the antenna with the insulation layer removed, or the two leads of the antenna with the insulation layer removed are placed above the two welding spots on the bonding pad.
And S13, namely, a lamination forming step, wherein a second substrate is covered on a bonding pad on one surface with the welding spots in the mounting step, and the welding spots on the bonding pad are respectively in close contact with two leads of the antenna to form electric connection, namely, one welding spot is electrically conducted with one antenna lead through the fusion self-adhesion of the lamination of the first substrate and the second substrate. The lamination temperature is set according to the properties of the first substrate and the second substrate, and is only required to be such that the first substrate and the second substrate melt to form self-adhesion at the lamination temperature, for example, when PVC is used as the first substrate and the second substrate, the lamination temperature is about 170 degrees.
S14, namely a surface layer lamination step, respectively placing an RFID card back cover and a front cover on the surfaces of the first substrate and the second substrate for lamination, so that the back cover and the front cover are integrated with the first substrate and the second substrate to form the RFID card.
Specifically, the antenna manufacturing step adopts the prior art, the enameled wire is wound into a set shape on a die to form the antenna, and insulating layers at two ends of the enameled wire, namely the surface of a lead part of the antenna, are removed, so that the conductive copper wires are exposed. And then the RFID chip is reversely packaged, namely, the RFID chip gluing process is to fix the RFID chip reversely with the conductive adhesive, and the packaged RFID chip tray, namely, the reversely packaged bonding pad is adhered to the two leads of the antenna of the insulating layer, so that the reversely packaged bonding pad and the two leads of the antenna can form electric connection after being pressed. And coating a second substrate on the substrate with the bonding pad side in the mounting step, and locally melting the first substrate and the second substrate through lamination to enable the bonding pad and the two leads of the antenna to form close contact to form electric connection.
The RFID chip reverse package specifically comprises an etching circuit manufactured by etching one surface of a bonding pad, and a welding spot etched on the other surface, wherein the welding spot is communicated with the etching circuit. And a bonding pad on one side of the etched circuit is coated with conductive adhesive, the RFID chip is fixed with the conductive adhesive after being reversely buckled, and then the bonding pad on one side of the bonding pad is placed at the position of an antenna lead, so that two bonding pads on each bonding pad are respectively above the two leads, and the two leads are respectively contacted with the two bonding pads during lamination. The RFID chip back-packaging comprises etching a circuit on one surface of a bonding pad by etching, and etching a welding spot on the other surface, wherein the welding spot is communicated with the etching circuit. And a bonding pad on one surface with the etching circuit is coated with conductive adhesive, and the RFID chip is fixed with the conductive adhesive after being reversely buckled. The etched pads, which correspond to RFID chip (wafer) pins, may also be provided on the same side of the etched circuit, as desired. The welding spot and the two leads on the antenna are matched and arranged the same as the above, and the description is omitted.
Because hard connection is not needed between the two leads of the antenna and the bonding pad through welding, on one hand, the welding procedure during packaging can be reduced, and the packaging efficiency is improved. On the other hand, the thickness of the RFID card can be reduced without welding. Meanwhile, the antenna is formed by winding an enamelled wire, so that the electrical performance accuracy is high, the wound antennas can be stacked, the length of the wound antennas is not limited by area, and the wound antennas can be widely used for products with low frequency and high stability requirements.
In this embodiment, the first substrate and the second substrate may be made of PVC, as required. The antenna may be fabricated by winding wire around a mold, molding, and then fixing to the first substrate, as desired.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, and some technical features may be replaced by those described in the foregoing embodiments, which may not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. An ultra-thin RFID smart card packaging method, comprising,
the method comprises the steps of manufacturing an antenna, winding wires on a first base material by using enameled wires according to a set shape to form the antenna, removing insulating layers on the surfaces of two leads on the antenna, or winding the antenna in a set shape by using enameled wires and then fixing the antenna on the first base material, and removing the insulating layers on the surfaces of the two leads on the antenna;
the mounting step, namely placing two welding spots on the inverted packaging bonding pad of the RFID chip above the two leads of the antenna with the insulation layer removed, or placing the two leads of the antenna with the insulation layer removed above the two welding spots on the bonding pad;
and a lamination forming step, wherein a second substrate is covered on a bonding pad on one surface with the welding spots in the mounting step, and the first substrate and the second substrate are laminated to be melted and self-adhered, so that two welding spots on the bonding pad are respectively in close contact with two leads of the antenna to form electric connection, namely one welding spot is electrically conducted with one lead of the antenna.
2. The ultra-thin RFID smart card packaging method of claim 1, wherein the substrate comprises PVC.
3. The method of claim 1, wherein the step of packaging the RFID chip comprises etching a circuit on one surface of the bonding pad by etching, etching a solder joint on the other surface, connecting the solder joint with the etched circuit, coating a conductive adhesive on the bonding pad on one surface with the etched circuit, and fixing the RFID chip with the conductive adhesive after back-off.
4. The method of claim 1, further comprising a skin lamination step after the lamination forming step, wherein the skin lamination step comprises laminating the back cover and the front cover of the RFID card on the surfaces of the first substrate and the second substrate, respectively, such that the back cover and the front cover are integrated with the first substrate and the second substrate to form the RFID card.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811125122 | 2018-09-26 | ||
| CN2018111251228 | 2018-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110689105A CN110689105A (en) | 2020-01-14 |
| CN110689105B true CN110689105B (en) | 2024-04-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910914090.8A Active CN110689105B (en) | 2018-09-26 | 2019-09-25 | Ultra-thin RFID smart card packaging method |
Country Status (1)
| Country | Link |
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| CN (1) | CN110689105B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112038779B (en) * | 2020-09-08 | 2023-05-16 | 日月光半导体制造股份有限公司 | Antenna semiconductor package device and method of manufacturing the same |
| CN114421139B (en) * | 2022-04-01 | 2022-07-26 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
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| CN106684567A (en) * | 2015-11-05 | 2017-05-17 | 伍颖超 | Manufacture technology of electromagnetic touch control antenna board |
| CN107146785A (en) * | 2017-06-21 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | Fan-out package structure of antenna and preparation method thereof is stacked with 3D |
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2019
- 2019-09-25 CN CN201910914090.8A patent/CN110689105B/en active Active
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| CN110689105A (en) | 2020-01-14 |
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Effective date of registration: 20240314 Address after: 2.3 / F, building F, Jinhao Pioneer Park, No.9 Dafu Industrial Zone, Guanlan Aobei community, Longhua New District, Shenzhen, Guangdong 518000 Applicant after: SHENZHEN RONGZHI XING TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 443000 Wujiagang Industrial Park, Yichang City, Hubei Province (by Gongsheng Road) Applicant before: HUBEI UCHIPRFID TECHNOLOGY Co.,Ltd. Country or region before: China |
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