CN114421139B - Radio frequency antenna manufacturing method and radio frequency antenna - Google Patents
Radio frequency antenna manufacturing method and radio frequency antenna Download PDFInfo
- Publication number
- CN114421139B CN114421139B CN202210336497.9A CN202210336497A CN114421139B CN 114421139 B CN114421139 B CN 114421139B CN 202210336497 A CN202210336497 A CN 202210336497A CN 114421139 B CN114421139 B CN 114421139B
- Authority
- CN
- China
- Prior art keywords
- conductive
- radio frequency
- frequency antenna
- conductive medium
- medium layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 96
- 239000004020 conductor Substances 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 60
- 238000003801 milling Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 238000004080 punching Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 26
- 238000003466 welding Methods 0.000 abstract description 26
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000007812 deficiency Effects 0.000 abstract description 2
- 239000002390 adhesive tape Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 229910052755 nonmetal Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000009933 burial Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention relates to the technical field of antenna manufacturing, in particular to a radio frequency antenna manufacturing method and a radio frequency antenna, wherein an enameled coil is implanted on a base material according to a target shape, then an insulating layer of a lead part is removed by adopting a milling or polishing mode, a conductor of the lead part is exposed, then a conductive medium is dripped on a coiled conductive material to form a conductive coiled material, a structure which is electrically connected with the conductor is formed in a target area where the conductive coiled material is pressed on the conductor of the lead part, and the conductor and the conductive medium layer form an integral and electrically connected radio frequency antenna finished product, so that the invention does not need to adopt a butt-welding mode to remove the insulating layer on the enameled coil in the process of manufacturing the radio frequency antenna as in the prior art, solves the problem that the base material is welded through due to more welding spots when the insulating layer on the enameled coil is removed by adopting the butt-welding mode in the prior art, leading to inefficiencies and yield-affecting technical deficiencies.
Description
Technical Field
The invention relates to the technical field of antenna manufacturing, in particular to a radio frequency antenna manufacturing method and a radio frequency antenna.
Background
At present, different types of smart cards with different functions are widely applied in various fields.
And the antenna is the main structure of the material in the smart card.
In the prior art, the production process flow of the smart card is as follows:
the method comprises the steps of punching a base material positioning hole and a conductive sheet clearance hole → placing a non-metal base material on a workbench of an ultrasonic wave thread burial machine, positioning materials by using the positioning hole, determining the position of thread burial and the clearance hole crossed by a thread end, attaching an adhesive tape at the position of the clearance hole crossed by the non-metal base material of the thread burial, filling the conductive sheet (a connecting welding table) such as a tin sheet or a copper sheet into the clearance hole, melting an insulating layer of an antenna by using a butt-welding mode, conducting connection between a lead and the conductive sheet → tearing the adhesive tape → covering a layer of fabric on the upper surface and the lower surface of the smart card middle material, and laminating at high temperature to obtain the smart card middle material product.
In the process flow, when the butt-welding procedure is carried out, the base material is easy to be welded through due to more welding points, and the defects of low manufacturing efficiency, high reject ratio and the like are further caused.
Disclosure of Invention
The invention mainly aims to provide a radio frequency antenna manufacturing method and a radio frequency antenna, and aims to solve the technical problems that in the welding process of manufacturing an intelligent card by adopting a welding process in the prior art, a base material is easy to weld through due to more welding spots, and further, the manufacturing efficiency is low and the reject ratio is high.
In order to achieve the above object, in a first aspect, the present invention provides a method for manufacturing a radio frequency antenna, including the following steps:
implanting an enameled coil onto a base material according to a target shape, wherein the enameled coil comprises a coil part implanted onto the base material and at least two lead parts which are electrically connected with the coil part respectively;
removing the insulating layer of the lead part to expose the conductor of the lead part;
forming a conductive medium layer on the coiled conductive material to obtain a conductive coiled material;
punching the conductive coiled material to a target area where the conductor is located to obtain a finished product of the radio frequency antenna;
the method for punching the conductive coiled material to the target area where the conductor is located to obtain the finished product of the radio frequency antenna comprises the following steps:
heating the conductive coiled material, and positioning a target area where the heated conductive coiled material and the conductor are located; wherein the conductive coil is heated to 110-150 ℃;
punching the conductive coiled material to form a conductive sheet, and pressing the conductive sheet into the target area to obtain a radio frequency antenna secondary body;
and laminating the secondary radio frequency antenna body to enable the conductive medium to be conducted with the target area, so as to obtain a finished radio frequency antenna.
Optionally, the removing the insulating layer of the lead portion to expose the conductor of the enameled wire includes:
and milling or grinding to remove the insulating layer of the lead part and expose the conductor of the enameled wire.
Optionally, the substrate is at least one of non-metallic materials such as PVC, ABS, PET, PETG, PC, TESLIN, paper, and the like.
Optionally, the conductive medium includes at least one of solder paste, conductive paste, or ACF.
Optionally, the forming a conductive medium layer on the wound conductive material to obtain a conductive coiled material includes the following steps:
when the conductive medium layer is made of tin paste or conductive adhesive, the conductive medium is dripped or sprayed on the coiled conductive material;
heating and melting the coiled material dripped or sprayed with the conductive medium to form a conductive medium layer to obtain a conductive coiled material;
or,
the method for forming the conductive medium layer on the coiled conductive material to obtain the conductive coiled material comprises the following steps of:
and when the conductive medium layer is made of the ACF, attaching the conductive medium to the target area where the conductor is located to form the conductive medium layer, so as to obtain the conductive coiled material.
Optionally, the forming a conductive medium layer on the wound conductive material to obtain a conductive coiled material includes the following steps:
when the conductive medium layer is made of tin paste or conductive adhesive, the conductive medium is dripped or sprayed on the coiled conductive material;
heating and melting the coiled material into which the conductive medium is dripped or sprayed to form a first conductive medium layer;
and attaching an ACF (anisotropic conductive film) to the first conductive medium layer to form a second conductive medium layer, wherein the second conductive medium layer is electrically connected with the first conductive medium layer to obtain the conductive coiled material.
Optionally, the surface of the conductive sheet is one of square, circular or polygonal.
Optionally, the conductive sheet is any one of a tin sheet, a copper sheet or a gold sheet;
or,
the conductive sheet is a non-metallic material with a conductive function.
In a second aspect, the present invention provides a radio frequency antenna, which is manufactured by the above-mentioned radio frequency antenna manufacturing method.
Has the advantages that:
the technical proposal of the invention is that the enameled coil is implanted on the base material according to the target shape, then the insulating layer of the lead part is removed by adopting a milling or grinding mode to expose the conductor of the lead part, then the conductive medium is dripped on the coiled conductive material to form the conductive coiled material, a structure electrically connected to the conductor is formed in a target area where the conductor of the lead portion is pressed from the conductive coil, and the conductor and the conductive medium layer are integrated and electrically connected, so that in the process of manufacturing the radio-frequency antenna, the insulating layer on the enameled coil is not removed in a butt-joint mode in the prior art, and the technical defects that in the prior art, when the insulating layer on the enameled coil is removed in the butt-joint mode, the base material is welded through due to more welding points, the efficiency is low, and the yield is influenced are overcome.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for manufacturing an RF antenna and a first embodiment of an RF antenna according to the present invention;
FIG. 2 is a schematic flow chart of a process for fabricating the single RF antenna of FIG. 1;
FIG. 3 is a flowchart illustrating the step S300 illustrated in FIG. 2;
FIG. 4 is an enlarged view of part A of FIG. 2;
fig. 5 is an enlarged schematic view of a part B in fig. 2.
The reference numbers illustrate:
| reference numerals | Name(s) | Reference numerals | Name(s) |
| 100 | |
201 | |
| 200 | Enameled |
202 | |
| 300 | |
400 | Conductive sheet |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise explicitly stated or limited, the terms "connected", "fixed", and the like are to be understood broadly, for example, "fixed" may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B", including either A or B or both A and B. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
At present, different types and different functions of intelligent or radio frequency antennas are widely applied in various fields.
The traditional production process flow of the smart card or the radio frequency antenna medium material is as follows:
punching a substrate positioning hole and a conductive sheet clearance hole, and punching two holes for positioning materials in all processes and clearance holes with the shapes and sizes equivalent to those of a chip and a conductive sheet on non-metallic substrates such as PVC, ABS, PET, PETG, PC, TESLIN, paper and the like;
burying the wire: placing nonmetal base materials such as PVC, ABS, PET, PETG, PC, TESLIN, paper and the like on a workbench of an ultrasonic thread burying machine, positioning the materials by using positioning holes, and determining the position of coil thread burying and a clearance hole position crossed by a thread end;
pasting an adhesive tape: sticking adhesive tapes on the positions of the clearance holes crossing the conductive sheet on the material which finishes the wire embedding;
filling a tin sheet: filling conductive sheets (connecting welding platforms) such as tin sheets or copper sheets into the clearance holes, and fixing the conductive sheets in the holes by using adhesive tapes attached in the previous process to ensure that the conductive sheets do not shift;
butt-welding: melting the insulating layer of the antenna and connecting the conducting wire with the conducting sheet material in a conducting way through a welding process;
tearing the adhesive tape: after touch welding, the conductive sheet and the lead are connected and fixed, and the adhesive tape is torn off;
stacking and laminating: covering a layer of face fabric on the upper and lower surfaces of the middle material respectively, and performing high-temperature lamination.
In the process flow, the processes are complex, each process requires a large amount of manual operation, full automation cannot be realized, and in the butt-welding process, due to the large number of welding points and the overhigh temperature during butt-welding, the base material is easily welded through, and the reject ratio and the yield are extremely high. Meanwhile, in the prior art, when the adhesive tape tearing process is carried out, the adhesive tape is mostly torn off manually, and the efficiency of making the old products and the yield of finished products are seriously influenced.
The invention provides a radio frequency antenna manufacturing method and a radio frequency antenna, wherein an enameled coil is implanted on a base material according to a target shape, a coil part is arranged on the base material, a lead part is arranged outside the base material, then an insulating layer of the lead part is removed in a milling or polishing mode, a conductor of the lead part is exposed, a conductive medium layer electrically connected with the conductor is formed in a target area where the conductor of the lead part is located by utilizing the conductive medium, a conductive sheet is placed in the target area, and the conductive sheet and the conductive medium layer form an integral and electrically connected radio frequency antenna finished product, so that the insulating layer on the enameled coil does not need to be removed in a butt-welding mode in the process of manufacturing the radio frequency antenna, the problem that the base material is welded through due to more welding points when the insulating layer on the enameled coil is removed in the butt-welding mode in the prior art is solved, leading to inefficiencies and yield-affecting technical deficiencies.
The inventive concept of the present invention will be further elucidated below in connection with some specific embodiments.
The invention provides a radio frequency antenna manufacturing method and a radio frequency antenna.
As shown in fig. 1 and fig. 2, a method for manufacturing a radio frequency antenna according to a first embodiment of the present invention is provided.
In this embodiment, the method for manufacturing the rf antenna includes the following steps:
s100, implanting an enameled coil 200 onto a base material 100 according to a target shape, wherein the enameled coil 200 comprises a coil part 201 implanted onto the base material 100 and at least two lead parts 202 which are respectively electrically connected with the coil part 201;
in the present embodiment, the enameled coil 200 is implanted on the substrate 100 in a target shape, so that the enameled coil 200 and the substrate 100 form an integral body. When the embedding is performed on the base material 100, the procedure of punching the clearance holes on the conductive sheet 400 of the base material 100 and avoiding or crossing the clearance holes of the coil 200 to be enameled when the embedding is performed in the conventional technology is omitted. The operation time of the buried wire can be effectively shortened, and the manufacturing efficiency is improved.
It should be noted that, in the present embodiment, the exemplary enameled coil 200 is a coil structure formed by enclosing enameled wires according to a target shape. It is further clear that the illustrated enameled wire is a main variety of winding wire, and is composed of a conductor and an insulating layer, and the bare wire is annealed and softened, and then is subjected to painting and baking for multiple times. However, it is not easy to produce a product which meets both the standard requirements and the customer requirements, and it is influenced by the quality of raw materials, process parameters, production equipment, environment and other factors, so that various enameled wires have different quality characteristics, but have four properties of mechanical property, chemical property, electrical property and thermal property.
In the present embodiment, the target shape of the example is preset according to the type of the smart card or the rf antenna. In actual implementation, the exemplary target shape may be, but is not limited to, the following: circular, oval, square, polygonal, or geometric with arcuate sides.
It is further clarified and explained that the preferred shape of the coil portion 201 in the present embodiment is a circular shape or a square shape when laid on the substrate 100 in the example, and the preferred shape of the lead portion 202 in the example is a serpentine shape or an S shape when laid on the substrate 100 in the example. Of course, as a preferred embodiment, the lead portions 202 illustrated in the present embodiment are preferably two, which are respectively provided at both ends of the coil portion 201 illustrated in the present embodiment, and are both electrically connected to the coil portion 201.
S200, removing the insulating layer of the lead part 202 to expose the conductor of the lead part 202;
in this embodiment, when the insulating layer of the lead portion 202 is removed, a target area needs to be defined first, and the insulating layer of the enameled wire of the lead portion 202 is removed in a milling or grinding manner on the target area, so that only the insulating layer of the designated area of the enameled wire is removed, thereby avoiding damage to the base material 100 and effectively improving the yield.
It should be particularly clear and explained that, in the present embodiment, when the insulating layer of the lead portion 202 having the exemplary shape is removed, only the insulating layer of the waist portion of the lead portion 202 having the exemplary shape is removed. More specifically, referring to fig. 4, when the lead portion 202 has a "serpentine shape" or a "bow-like" shape, only the waist portion of the shape is removed, and the insulation layer of the extension enamel wire having the bent portion and connecting at least one of the bent portions does not need to be removed. The design has the advantages that in the actual use process, only the conductive medium needs to be dripped or attached to the conductor, complete electrical connection with the whole lead part 202 is not needed, and meanwhile, through the arrangement mode, more electric signal or communication signal transmission points can be arranged between the conductive medium layer 300 and the conductive medium layer in the actual use process, so that the transmission efficiency and the use effect of the intelligent card or the radio frequency antenna are effectively improved.
Of course, in the actual use process, a person skilled in the art can also determine the position of the lead portion 202 according to actual needs, and no matter which position of the insulating layer is removed by the removal method described in the present invention, the position falls into the protection range of the person, and therefore, the description is omitted here.
S300, forming a conductive medium layer 300 on the coiled conductive material to obtain a conductive coiled material;
referring to fig. 3, in the present embodiment, a conductive medium is dropped onto the wound conductive material, so that the wound conductive material and the conductive medium layer 300 form an integral conductive coiled material, thereby overcoming the defects that the solder foil needs to be filled in the clearance hole and the electrical connection between the solder foil and the conductor of the enameled coil 200 needs to be realized by using a butt-welding method in the conventional process, avoiding the loss of the substrate 100 during the butt-welding, and improving the yield and the efficiency of manufacturing the smart card or the radio frequency antenna.
It should be particularly clear and explained that, in the present embodiment, the conductive medium exemplified in the present embodiment may be any conventional conductive medium, and it may be exemplified that, the conductive medium exemplified in the present embodiment preferably employs at least one of solder paste, conductive paste or ACF.
It can be further explained that the coiled conductive material exemplified in the present embodiment can be, but is not limited to, the following types: metal materials such as tin sheets, copper sheets and gold sheets, non-metal materials with a conductive function, IC chips and the like.
S400, punching the conductive coiled material to a target area where the conductor is located to obtain a finished product of the radio frequency antenna.
It is further clear and explained that in the present embodiment, the exemplary sheet structure with conductive function, the conductive sheet 400 used in the present invention includes, but is not limited to, a sheet made of metal material such as copper sheet, gold sheet, tin sheet, etc., and a sheet made of non-metal material with conductive function. A copper sheet or a tin sheet is preferably used as the conductive sheet 400 in this embodiment.
It can be further exemplified that, in the present embodiment, the target temperature is generally controlled to be between 110 ℃ and 150 ℃ during lamination, and in actual use, a specific temperature value at which the lamination process is performed needs to be determined according to the type of the material of the selected conductive medium, in the present embodiment, if the conductive medium used is 110 ℃, that is, the solder paste which is fused, the lamination temperature is controlled to be a constant value between 115 ℃ and 120 ℃ or fluctuates within a range of about 5 ℃ higher than the melting temperature of the conductive medium in actual use.
The advantage of adopting this control mode is that, in practical application, the substrate 100 will not be damaged due to the higher laminating temperature, and the yield and finished product quality of the smart card or rf antenna are further improved.
In this embodiment, it may also be exemplified that, when performing lamination, the target pressure value is controlled to be a smart card or a radio frequency antenna capable of laminating the conductive sheet 400 and the conductive medium layer 300 as a whole. In the present embodiment, the target pressure value is preferably 16MPa, i.e., 16KG per square centimeter. By adopting the target pressure value, the technical personnel in the field can effectively ensure that the base material 100 can not be damaged due to the over-high pressure when the intelligent card or the radio frequency antenna is manufactured by adopting the method, and the yield of the intelligent card or the radio frequency antenna is effectively improved.
In this embodiment, it should be noted that the substrate 100, the enameled coil 200, the conductive medium layer 300 and the conductive sheet 400 are disposed in the following manner: the substrate 100 is disposed from bottom to top, and it is further clear that the enameled coil 200, the conductive medium layer 300 and the conductive sheet 400 are disposed from bottom to top in sequence on the bottom layer.
Optionally, the removing the insulation layer of the lead portion 202 to expose the conductor of the enameled wire includes the following steps:
s201, removing the insulating layer of the lead part 202 by milling or grinding to expose the conductor of the enameled wire.
In the embodiment, the insulating layer of the lead part 202 is removed by milling or grinding, so that the method is not the same as the prior art in use, and the insulating layer needs to be removed by a butt-welding method, thereby effectively solving the technical defect that the base material is damaged when the insulating layer is removed by the butt-welding method in the prior art.
Optionally, the substrate 100 is at least one of non-metallic materials such as PVC, ABS, PET, PETG, PC, TESLIN, paper, and the like.
In yet another embodiment, the substrate 100 is selected before the rf antenna is fabricated, and the selection of which type of substrate 100 is used is based on selecting a non-metallic material having a certain thickness as the substrate 100. Of course, in this embodiment, at least one of PVC, ABS, PET, PETG, PC, TESLIN, and paper may be preferably used.
It can be further noted that, in the present embodiment, the substrate 100 is required to have a certain thickness because, in practical application, the enameled coil 200 needs to be implanted onto the substrate 100, and if the substrate 100 does not have a thickness, the enameled coil 200 cannot be implanted onto the substrate 100, or the substrate 100 is damaged after being implanted onto the substrate 100, which finally affects the yield.
Optionally, the step of die-cutting the conductive coiled material to a target area where the conductor is located to obtain a finished product of the radio frequency antenna includes the following steps:
s410, heating the conductive coiled material, and positioning a target area where the heated conductive coiled material and the conductor are located;
in this embodiment, the conductive coiled material is heated to melt the cured conductive medium, so that the conductive sheet punched to the target area can be electrically connected with the conductor of the target area to form an integral structure, thereby achieving the function of promoting the conduction between the conductive sheet and the conductor.
S420, punching the conductive coiled material to form a conductive sheet 400, and pressing the conductive sheet 400 into the target area to obtain a radio frequency antenna secondary body;
and S430, laminating the secondary body of the radio frequency antenna to enable the conductive medium to be conducted with the target area, so as to obtain a finished product of the radio frequency antenna.
In the embodiment, the heated conductive coil material is directly punched on the target area of the coil end, in which the coil is implanted and milled or ground, so that the radio frequency antenna structure can be directly punched and formed on the target area in the actual operation of the invention. Therefore, the overall automation efficiency is improved, and the overall process is optimized. Simple and quick, and high automation efficiency.
It can be further stated that, in this embodiment, when punching the conductive coil material to the target area, the punching head needs to be heated and appropriately pressurized, so that when punching the conductive coil material to the target area, the conductive coil material needs to be preheated and pre-pressurized, and in this way, the conductive coil material can be punched to the target area to form the conductive sheet structure. The automation efficiency of the whole process is improved.
In this embodiment, the substrate in the rf antenna sub-body is not easily deformed when laminated at a high temperature under pressure by reheating during lamination, thereby ensuring the yield of the rf antenna as a whole.
Optionally, the conductive medium includes at least one of solder paste, conductive paste, or ACF.
It is particularly and explicitly stated that in the present embodiment, the solder paste illustrated is a new type of solder material that accompanies SMT. The solder paste is a complex system and is a paste body formed by mixing solder powder, soldering flux and other additives. The soldering paste has certain viscosity at normal temperature, can initially adhere electronic components to a set position, and welds the welded components and the printed circuit bonding pad together to form permanent connection along with volatilization of the solvent and part of the additives at the welding temperature.
In the prior art, conventional solder pastes are classified into low-temperature solder pastes, medium-temperature solder pastes, and high-temperature solder pastes. In the present embodiment, the type of the solder paste selected is selected according to the melting temperature of the substrate 100, and in order to ensure that a richer substrate 100 can be selected in practical applications, the solder paste exemplified in the present embodiment is preferably a low-temperature solder paste.
In this embodiment, it can be further exemplified that the conductive adhesive is an adhesive having a certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material. The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain requirements on the conductivity and the adhesive bonding strength and also has certain special requirements. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like. The conductive paste can be classified into silver-based conductive paste, gold-based conductive paste, copper-based conductive paste, and carbon-based conductive paste, according to the kind of conductive particles in the conductive paste, and the silver-based conductive paste is most widely used.
In this embodiment, an exemplary ACF is called an Anisotropic Conductive Film (ACF), which is a Conductive Film structure, and when in use, the ACF is attached to the Film.
Optionally, the forming the conductive medium layer 300 on the wound conductive material to obtain the conductive coil includes the following steps:
s310, when the conductive medium layer 300 is made of tin paste or conductive adhesive, dripping or spraying a conductive medium on the coiled conductive material;
in this embodiment, when solder paste or conductive paste is used as the conductive medium, the conductive medium is directly dripped into the target area by a dripping method, and the conductive medium layer 300 is manufactured in the target area where the conductor is located by the dripping method, so that the consumption of the conductive medium can be controlled by the method, and meanwhile, automatic dripping equipment can be set to drip the conductive medium into the target area where the conductor is located during actual use, so that the purpose of automatically manufacturing the conductive medium layer 300 is finally achieved. Meanwhile, the invention also ensures that the electric connection effect between the conductive medium and the conductor is more stable in actual use, and ensures the transmission effect of electric signals or communication signals in the actual use process.
S320, heating and melting the coiled material into which the conductive medium is dripped or sprayed to form a conductive medium layer 300, so as to obtain a conductive coiled material;
in this embodiment, the conductive medium is solidified on the wound conductive material to form the conductive medium layer by heating and melting the wound conductive material and the conductive medium dropped onto the wound conductive material.
In another modification, the step a310 of forming the conductive medium layer 300 on the wound conductive material to obtain the conductive coil includes the following steps:
and A320, when the conductive medium layer 300 is made of the ACF, attaching the conductive medium to the target area where the conductor is located to form the conductive medium layer 300, so as to obtain the conductive coil.
In the present embodiment, the ACF is used for the conductive medium layer 300, so that the amount of the conductive medium material can be controlled, and the forming effect of the conductive medium layer 300 can be ensured during actual use.
As a further improved embodiment, the forming of the conductive medium layer 300 on the wound conductive material to obtain the conductive coil includes the following steps:
b310, when the conductive medium layer 300 is made of tin paste or conductive adhesive, dripping or spraying a conductive medium on the coiled conductive material;
b320, heating and melting the coiled material into which the conductive medium is dripped or sprayed to form a first conductive medium layer 300;
and B330, attaching an ACF to the first conductive medium layer 300 to form a second conductive medium layer 300, wherein the second conductive medium layer 300 is electrically connected with the first conductive medium layer 300 to obtain a conductive coil.
In this embodiment, the first conductive medium layer 300 is formed by dropping solder paste or conductive paste as a conductive medium into a target area, so that the conductive medium is electrically connected to the conductor, thereby ensuring the conductive effect of the conductive medium layer 300. On the basis, the ACF is attached to the first conductive medium layer 300 to form the second conductive medium layer 300, so that the conductive effect of the conductive medium layer 300 can be more effectively guaranteed when the ACF is used.
Optionally, the surface of the conductive sheet 400 is one of square, circular, or polygonal.
Optionally, the conductive sheet 400 is any one of a tin sheet, a copper sheet or a gold sheet;
or,
the conductive sheet 400 is a non-metallic material having a conductive function.
When the method disclosed by the invention is used for manufacturing the smart card or the radio frequency antenna, a person skilled in the art does not need to adopt a butt-joint mode to realize the electric connection between the conductive medium layer 300 and the conductor as the conventional technology, so that the technical defect that the base material 100 is easy to damage due to a butt-joint process in the prior art is effectively overcome. Meanwhile, the process is changed, so that the purpose of automatically manufacturing the intelligent card or the radio frequency antenna can be realized during actual operation, and the manufacturing efficiency of the intelligent card or the radio frequency antenna is effectively improved.
In a second aspect, as shown in fig. 4 and 5, the present invention provides an rf antenna manufactured by the method for manufacturing an rf antenna described above.
In this embodiment, an exemplary rf antenna includes:
the substrate (100) is provided with a plurality of layers,
the enameled coil 200 is arranged on the base material 100, and two ends of the enameled coil 200 are arranged outside the base material 100;
a conductive dielectric body disposed on the enameled coil 200, the conductive dielectric body electrically connected to the enameled coil 200; and
a conductive sheet 400, wherein the conductive sheet 400 is disposed on the conductive medium body, and the conductive sheet 400 is electrically connected to the conductive medium body.
According to the scheme, the enameled coil is implanted onto the base material according to the target shape, then the insulating layer of the lead part is removed in a milling or polishing mode, the conductor of the lead part is exposed, then the conductive medium is dripped onto the coiled conductive material to form the conductive coiled material, the conductive coiled material is pressed to the target area where the conductor of the lead part is located to form a structure, and the conductor and the conductive medium layer form a whole and are electrically connected to form a finished radio frequency antenna.
The above description is only an alternative embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, which are within the spirit of the present invention, are included in the scope of the present invention.
Claims (9)
1. A method for manufacturing a radio frequency antenna is characterized by comprising the following steps:
implanting an enameled coil onto a base material according to a target shape, wherein the enameled coil comprises a coil part implanted onto the base material and at least two lead parts which are electrically connected with the coil part respectively;
removing the insulating layer of the lead part to expose the conductor of the lead part;
forming a conductive medium layer on the coiled conductive material to obtain a conductive coiled material;
punching the conductive coiled material to a target area where the conductor is located to obtain a finished product of the radio frequency antenna;
the method for punching the conductive coiled material to the target area where the conductor is located to obtain the finished product of the radio frequency antenna comprises the following steps:
heating the conductive coiled material, and positioning a target area where the heated conductive coiled material and the conductor are located; wherein the conductive coiled material is heated to 110-150 ℃;
punching the conductive coiled material to form a conductive sheet, and pressing the conductive sheet into the target area to obtain a radio frequency antenna secondary body;
and laminating the secondary body of the radio frequency antenna to enable the conductive medium to be conducted with the target area, so as to obtain a finished product of the radio frequency antenna.
2. A method for manufacturing a radio frequency antenna according to claim 1,
the method for removing the insulating layer of the lead part and exposing the conductor of the enameled wire comprises the following steps:
and milling or grinding to remove the insulating layer of the lead part and expose the conductor of the enameled wire.
3. The method of claim 1, wherein the substrate is at least one of PVC, ABS, PET, PETG, PC, TESLIN, and paper.
4. A method for manufacturing a radio frequency antenna according to claim 1,
the conductive medium includes at least one of solder paste, conductive paste, or ACF.
5. A method for manufacturing a radio frequency antenna according to claim 4,
the method for forming the conductive medium layer on the coiled conductive material to obtain the conductive coiled material comprises the following steps of:
when the conductive medium layer is made of tin paste or conductive adhesive, the conductive medium is dripped or sprayed on the coiled conductive material;
heating and melting the coiled material dripped or sprayed with the conductive medium to form a conductive medium layer to obtain a conductive coiled material;
or,
the method for forming the conductive medium layer on the coiled conductive material to obtain the conductive coiled material comprises the following steps of:
and when the conductive medium layer is made of the ACF, attaching the conductive medium to the target area where the conductor is located to form the conductive medium layer, so as to obtain the conductive coiled material.
6. A method for manufacturing a radio frequency antenna according to claim 4,
the method for forming the conductive medium layer on the coiled conductive material to obtain the conductive coiled material comprises the following steps of:
when the conductive medium layer is made of tin paste or conductive adhesive, the conductive medium is dripped or sprayed on the coiled conductive material;
heating and melting the coiled material into which the conductive medium is dripped or sprayed to form a first conductive medium layer;
and attaching an ACF (anisotropic conductive film) to the first conductive medium layer to form a second conductive medium layer, wherein the second conductive medium layer is electrically connected with the first conductive medium layer to obtain the conductive coiled material.
7. A method for manufacturing a radio frequency antenna according to claim 4,
the surface of the conductive sheet is one of square, circular or polygonal.
8. A method for manufacturing a radio frequency antenna according to claim 4,
the conductive sheet is any one of a tin sheet, a copper sheet or a gold sheet;
or,
the conductive sheet is a non-metallic material with a conductive function.
9. A radio frequency antenna manufactured by the method of any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210336497.9A CN114421139B (en) | 2022-04-01 | 2022-04-01 | Radio frequency antenna manufacturing method and radio frequency antenna |
| PCT/CN2023/085614 WO2023186132A1 (en) | 2022-04-01 | 2023-03-31 | Radio frequency antenna manufacturing method and radio frequency antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210336497.9A CN114421139B (en) | 2022-04-01 | 2022-04-01 | Radio frequency antenna manufacturing method and radio frequency antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114421139A CN114421139A (en) | 2022-04-29 |
| CN114421139B true CN114421139B (en) | 2022-07-26 |
Family
ID=81263692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210336497.9A Active CN114421139B (en) | 2022-04-01 | 2022-04-01 | Radio frequency antenna manufacturing method and radio frequency antenna |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114421139B (en) |
| WO (1) | WO2023186132A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421139B (en) * | 2022-04-01 | 2022-07-26 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1754283A (en) * | 2002-12-31 | 2006-03-29 | 艾利丹尼森公司 | Rfid device and method of forming |
| CN1993703A (en) * | 2004-06-18 | 2007-07-04 | 艾利丹尼森公司 | Rfid device and method of forming |
| CN101165967A (en) * | 2006-10-16 | 2008-04-23 | 连展科技（深圳）有限公司 | Antenna continuous manufacture method |
| CN101292272A (en) * | 2005-10-18 | 2008-10-22 | 艾利丹尼森公司 | Label with electronic components and method of making same |
| CN102576420A (en) * | 2009-09-25 | 2012-07-11 | 艾利丹尼森公司 | Method, system and apparatus for manufacturing a radio frequency identification device |
| CN110689105A (en) * | 2018-09-26 | 2020-01-14 | 湖北用芯物联科技有限公司 | Packaging method of ultrathin RFID (radio frequency identification) intelligent card |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1252861C (en) * | 2002-09-19 | 2006-04-19 | 上海浦江智能卡系统有限公司 | Method for mfg. double-interface card with implanted antenna |
| US20070163704A1 (en) * | 2006-01-18 | 2007-07-19 | Upm Rafsec Oy | Method for manufacturing a label comprising a transponder |
| FR2899000B1 (en) * | 2006-03-24 | 2008-10-17 | Arjowiggins Security Soc Par A | RADIOFREQUENCY DEVICE COMPRISING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED ANTENNA AND COUPLED ELECTROMAGNETICALLY TO AN AMPLIFICATION ANTENNA |
| CN101609514B (en) * | 2008-06-20 | 2013-04-24 | 上海中京电子标签集成技术有限公司 | Method for preparing electric tag with high efficiency |
| CN101877072B (en) * | 2009-04-28 | 2013-02-13 | 吴军华 | Manufacturing method and system of radio frequency self-adhesive label |
| US8613132B2 (en) * | 2009-11-09 | 2013-12-24 | Feinics Amatech Teoranta | Transferring an antenna to an RFID inlay substrate |
| US9272370B2 (en) * | 2010-08-12 | 2016-03-01 | Féinics Amatech Teoranta | Laser ablating structures for antenna modules for dual interface smartcards |
| CN102324056A (en) * | 2011-08-17 | 2012-01-18 | 上海祯显电子科技有限公司 | Non-contact smart card with concealed antenna |
| CN103943962B (en) * | 2014-04-03 | 2017-05-17 | 上海安费诺永亿通讯电子有限公司 | Coil type antenna and manufacturing technology thereof |
| CN104361381A (en) * | 2014-11-17 | 2015-02-18 | 深圳市华鑫精工机械技术有限公司 | Double-interface card and method for packaging double-interface card |
| CN109214494B (en) * | 2018-10-25 | 2021-07-09 | 上海东方磁卡信息股份有限公司 | Contactless smart card and method for manufacturing same |
| CN111382828B (en) * | 2019-05-20 | 2024-02-02 | 上海东方磁卡信息股份有限公司 | Contactless smart card, method and apparatus for manufacturing the same |
| CN114421139B (en) * | 2022-04-01 | 2022-07-26 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
-
2022
- 2022-04-01 CN CN202210336497.9A patent/CN114421139B/en active Active
-
2023
- 2023-03-31 WO PCT/CN2023/085614 patent/WO2023186132A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1754283A (en) * | 2002-12-31 | 2006-03-29 | 艾利丹尼森公司 | Rfid device and method of forming |
| CN1993703A (en) * | 2004-06-18 | 2007-07-04 | 艾利丹尼森公司 | Rfid device and method of forming |
| CN101292272A (en) * | 2005-10-18 | 2008-10-22 | 艾利丹尼森公司 | Label with electronic components and method of making same |
| CN101165967A (en) * | 2006-10-16 | 2008-04-23 | 连展科技（深圳）有限公司 | Antenna continuous manufacture method |
| CN102576420A (en) * | 2009-09-25 | 2012-07-11 | 艾利丹尼森公司 | Method, system and apparatus for manufacturing a radio frequency identification device |
| CN110689105A (en) * | 2018-09-26 | 2020-01-14 | 湖北用芯物联科技有限公司 | Packaging method of ultrathin RFID (radio frequency identification) intelligent card |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023186132A1 (en) | 2023-10-05 |
| CN114421139A (en) | 2022-04-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103493610B (en) | Rigid and flexible substrate and its manufacture method | |
| CN106062903B (en) | The manufacturing method of inductor arrangement, inductor array and multilager base plate and inductor arrangement | |
| CA2569694C (en) | Method of forming circuit assembly | |
| JP4241147B2 (en) | IC card manufacturing method | |
| WO2012061964A1 (en) | Smart dual-interface card and welding packaging process thereof | |
| CN114421139B (en) | Radio frequency antenna manufacturing method and radio frequency antenna | |
| CN209328060U (en) | Component built-in device | |
| CN101689249A (en) | Electronic interface apparatus and method and system for manufacturing same | |
| CN105050313B (en) | The method of multilager base plate and manufacture multilager base plate | |
| CN106030618A (en) | Wireless communication device, method for manufacturing same, and method for producing seal fitted with RFIC element | |
| CN104081885B (en) | Substrate having built-in components | |
| CN102263327A (en) | Manufacturing method of radio frequency identification antenna | |
| CN102360443B (en) | Method for producing dual-interface card | |
| CN109214494B (en) | Contactless smart card and method for manufacturing same | |
| CN111475064B (en) | Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device | |
| CN110689105B (en) | Ultra-thin RFID smart card packaging method | |
| CN105956652B (en) | Smart card and manufacturing method thereof | |
| WO2014082401A1 (en) | Bi-interface smart card and manufacturing method thereof | |
| CN204466070U (en) | Circuit substrate | |
| CN111382828A (en) | Non-contact smart card and manufacturing method and manufacturing equipment thereof | |
| JP4768529B2 (en) | Manufacturing method of wireless IC tag | |
| CN102789589B (en) | Intelligent dual-interface card and welding packaging process for intelligent dual-interface card | |
| CN105956653B (en) | Smart card and manufacturing method thereof | |
| CN220067778U (en) | Jumper wire structure of high-frequency RFID antenna circuit board | |
| CN215187547U (en) | Circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |