CN109214494B - Contactless smart card and method for manufacturing same - Google Patents
Contactless smart card and method for manufacturing same Download PDFInfo
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- CN109214494B CN109214494B CN201811249749.4A CN201811249749A CN109214494B CN 109214494 B CN109214494 B CN 109214494B CN 201811249749 A CN201811249749 A CN 201811249749A CN 109214494 B CN109214494 B CN 109214494B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
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- Microelectronics & Electronic Packaging (AREA)
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- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a non-contact smart card and a manufacturing method thereof, wherein the non-contact smart card comprises an antenna, a chip, a first substrate and a second substrate, the chip is positioned between the first substrate and the second substrate, the surfaces of two sides of the chip are respectively in direct contact with the first substrate and the second substrate, the non-contact smart card also comprises two leads, and two ends of the two leads are respectively and electrically connected to the antenna and two pins of the chip so as to conduct the chip to the antenna. The non-contact smart card switches on to the antenna respectively through two pins on the chip of wire to make this non-contact smart card need not to encapsulate the chip and form the module and just can realize switching on between the pin of chip and the antenna on the PCB board, this non-contact smart card is through the direct and first substrate and the contact of second substrate that make the both sides surface of chip directly, has effectively reduced the thickness of this non-contact smart card at the chip position, thereby has promoted the surface smoothness of non-contact smart card.
Description
Technical Field
The invention relates to a non-contact smart card and a manufacturing method thereof.
Background
As shown in fig. 1, in the current production process of the non-contact smart card 1 ', a chip is first disposed on a PCB, and pins of the chip are led out, so that after the chip is packaged as a module 13', the module 13 'is integrally connected to two leads 121' of an antenna 12 'wound around a first substrate 11', and the pins of the chip in the module 13 'are connected to the antenna 12'. After that, the module 13 'and the antenna 12' are hidden between the first substrate 11 'and a second substrate (not shown) by attaching the second substrate (not shown) to the side of the first substrate 11' on which the module 13 'is provided, thereby completing the manufacture of the contactless smart card 1'.
Generally, after a chip is arranged on a PCB and packaged into a module, the whole thickness of the chip is about 0.32mm, and the total thickness of a non-contact smart card meeting the ISO standard is only 0.68 mm-0.84 mm, so that the production process can not overcome the problem that the card is poor in flatness due to the fact that the thickness of the non-contact smart card at the position of the module is relatively large, and after the surface of the non-contact smart card is subjected to pattern printing, the position of the module is whitened to different degrees, and the whole visual effect of the card is affected.
With the increasing demand of non-contact smart cards and the gradual increase of personalized demands, the requirement on the printing quality of products is continuously improved, so that the non-contact smart cards produced in the prior art cannot meet the market demand in the aspect of surface flatness.
Disclosure of Invention
The invention aims to overcome the defect that the printing quality of the card surface cannot meet the requirement due to poor surface flatness of a non-contact smart card in the prior art, and provides the non-contact smart card.
The invention solves the technical problems through the following technical scheme:
the non-contact smart card comprises an antenna, a chip, a first substrate and a second substrate, wherein the first substrate and the second substrate are attached to each other, the chip is located between the first substrate and the second substrate, the surfaces of two sides of the chip are in direct contact with the first substrate and the second substrate respectively, the non-contact smart card further comprises two wires, and two ends of the two wires are electrically connected to the antenna and two pins of the chip respectively so that the chip is conducted to the antenna.
This non-contact smart card switches on to the antenna respectively through two pins on two wires with the chip to make this non-contact smart card need not to set up the PCB board on the chip and form the module and just can realize switching on between the pin of chip and the antenna, this non-contact smart card does not use the PCB board, but make the both sides surface of chip direct and first substrate and the contact of second substrate, effectively reduced the thickness of this non-contact smart card in chip position department, thereby the surface roughness of non-contact smart card has been promoted.
Preferably, the antenna is wound between the first substrate and the second substrate, and two ends of the antenna are provided with leads, and the two leads are arranged on two sides of the chip in parallel.
By arranging the two leads of the antenna in parallel on both sides of the chip, two wires for conducting the chip to the antenna are realized by connecting one end to the leads and the other end to a chip pin located between the two leads.
Preferably, a groove is formed in the first substrate, and the groove is used for accommodating the chip.
Through set up a recess that is used for holding the chip on first substrate, make the chip before being connected to the antenna through the wire, can realize interim location through this recess, improved the product precision when having reduced the production degree of difficulty. In addition, when the groove is used for accommodating the chip, the protruding degree of the chip relative to the surface of the first base material is reduced, and therefore the structure can further improve the flatness of the non-contact smart card in the area.
Preferably, the depth of the groove is equal to the thickness of the chip.
The degree of depth of this recess can make the chip place when its inside, and the chip top can not be higher than the surface of first substrate to thoroughly solve the problem that the thickness of chip can influence non-contact smart card surface roughness.
A manufacturing method of a contactless smart card for manufacturing the contactless smart card as described above, comprising the steps of:
and S1, winding a copper wire on the first base material to form a coil with specified turns and size, and manufacturing the antenna.
S2, moving and placing the chip on the first substrate;
s3, respectively welding the two leads between the two pins of the chip and the antenna to conduct the two pins of the chip to the antenna;
and S4, attaching the second base material to the surface of one side, facing the chip, of the first base material.
The manufacturing method is used for manufacturing the non-contact smart card, the two pins of the chip are conducted with the antenna through the wires in a mode of bridging the chip which is not packaged through the wires, the chip can be applied to the non-contact smart card without being packaged into a module, the thickness of the card of the non-contact smart card in the area where the chip is located is reduced by not using other parts such as a PCB (printed Circuit Board) and the like in the module, and therefore the surface flatness of the non-contact smart card is improved. In addition, the non-contact intelligent card is manufactured by directly using the chip, so that the process of packaging the chip into a module in advance is saved, and the production cost is reduced.
Preferably, the antenna is wound between the first substrate and the second substrate, and both ends of the antenna have leads, and the two leads are disposed on both sides of the chip in parallel, and the step S1 includes the following steps:
s11, winding a copper wire with the diameter of 0.1mm on the first base material in an ultrasonic winding mode to form a coil with the specified number of turns and size, and manufacturing the antenna;
s12, leading free ends of two ends of the copper wire wound into the coil to the first base material in parallel to manufacture two lead wires of the antenna;
the step S2 further includes: the chip is located between two leads of the antenna.
The steps define a manufacturing method of the antenna in the non-contact smart card, in order to enable the surface flatness of the non-contact smart card to meet the requirement, copper wires with the diameter of 0.1mm are adopted to be wound into the antenna, and two ends of the copper wires are arranged on the left side and the right side of the chip in parallel, so that two leads of the chip are respectively conducted to the antenna towards the left side and the right side through two leads.
Preferably, the step S3 includes the following steps:
s31, arranging welding materials on the two pins of the chip;
s32, straightening the lead and fixing two ends of the lead;
s33, adjusting the relative angle between the middle part of the lead and the chip to make the middle part of the lead simultaneously abut against the two pins of the chip and the two leads on the two sides of the chip;
s34, respectively supporting four welding pins at the intersection of the lead wire, the two pins and the two lead wires to form four welding points, so that the lead wire is welded to the two pins and the two lead wires;
and S35, cutting off the part of the lead wire between the two pins and the part of the lead wire outside the two leads.
The steps are a method for welding two leads to two pins of a chip and two leads of an antenna, the leads are straightened and fixed at two ends of the leads simultaneously, so that the leads can be contacted with the two pins of the chip and the two leads of the antenna simultaneously, then four welding pins are abutted to the intersection of the leads, the chip and the antenna, so that the leads are welded and fixed on the chip and the antenna, and finally, the function that the two leads of the chip are respectively conducted to the two leads of the antenna by the two leads is realized by cutting off redundant parts of the leads. The welding method ensures that the relative positions of the welding needle and the wire, the contact of the chip and the lead of the antenna can be determined by straightening the wire, so that the accuracy of the welding position can be ensured when the wire is welded to the contact of the chip in a small structure.
Preferably, the copper wire for manufacturing the antenna is an enameled wire, and the step S31 further includes: and melting the outer insulating layers of the two leads of the antenna by a laser heating mode.
The enameled wire is wound into an antenna through the insulating paint layer coated on the outer layer of the enameled wire, the mutual insulation between two adjacent copper wires can be guaranteed without extra working procedures, and the outer layer insulating layers of the two lead wires are melted away in the step S31 in a laser heating mode, so that the lead wires can be conducted to the lead wires.
Preferably, a groove is formed on the first substrate, the groove is used for accommodating the chip, and in the step S1, the chip is moved and placed in the groove of the first substrate by a robot.
By adopting the mode of moving the chip by the manipulator, the position accuracy between the chip and the first base material can be improved, so that the lead can be more easily welded and fixed on the two pins of the chip in the subsequent steps.
Preferably, in the step S2, an insulating glue is applied to a surface of the chip facing the first substrate and the chip is adhered to the first substrate.
Compared with other chip fixing modes, the bonding fixation has the characteristics of simplicity, convenience, rapidness and the like, is simple to implement, and can avoid the risk of damage to the chip caused by complex procedures.
The positive progress effects of the invention are as follows:
in the non-contact smart card and the manufacturing method thereof, the non-contact smart card respectively conducts two pins on a chip to an antenna through two wires, so that the non-contact smart card can realize the conduction between the pins of the chip and the antenna without packaging the chip on a PCB (printed Circuit Board) and forming a module, the non-contact smart card does not use the PCB, but directly contacts the surfaces of two sides of the chip with a first substrate and a second substrate, the thickness of the non-contact smart card at the position of the chip is effectively reduced, the surface smoothness of the non-contact smart card is improved, and the non-contact smart card can meet the requirement of card surface printing quality.
Drawings
Fig. 1 is a schematic structural diagram of a contactless smart card in the prior art.
Fig. 2 is a schematic structural diagram of a contactless smart card according to an embodiment of the present invention.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2.
FIG. 4 is a flow chart illustrating a manufacturing method according to an embodiment of the invention.
Fig. 5 is a schematic view illustrating a method for bonding wires to leads and leads according to an embodiment of the invention.
Description of reference numerals:
Prior Art
Contactless smart card 1
Antenna 12', lead 121 ″
The invention
Contactless smart card 1
Steps S1-S4
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
As shown in fig. 2 and fig. 3, the present invention provides a contactless smart card 1, which includes an antenna 12, a chip 13, and a first substrate 11 and a second substrate (not shown) attached to each other, wherein the chip 13 is located between the first substrate 11 and the second substrate (not shown) and two side surfaces of the chip 13 are in direct contact with the first substrate 11 and the second substrate (not shown), respectively, the contactless smart card 1 further includes two wires 14, two ends of the two wires 14 are respectively used for electrically connecting to the antenna 12 and two pins 131 of the chip 13, so that the chip 13 can be conducted to the antenna 12.
The non-contact smart card 1 respectively conducts the two pins 131 on the chip 13 to the antenna 12 through the two wires 14, so that the non-contact smart card 1 can achieve conduction between the pins 131 of the chip 13 and the antenna 12 without packaging the chip 13 on a PCB and forming a module, and the non-contact smart card 1 does not use a PCB but directly contacts the two side surfaces of the chip 13 with the first substrate 11 and the second substrate (not shown in the figure). Since the thickness of the chip 13 is about 0.12mm, the thickness of the contactless smart card 1 at the position of the chip 13 can be effectively reduced by only using the chip 13 without using a module, so that the surface of the contactless smart card 1 is kept flat, and the requirement of the printing quality of the card surface can be met.
The antenna 12 of the contactless smart card 1 is wound between a first substrate 11 and a second substrate (not shown in the figure), and both ends of the antenna 12 have leads 121, and the two leads 121 are disposed in parallel on both sides of the chip 13.
By arranging the two leads 121 of the antenna 12 in parallel on both sides of the chip 13, the two wires 14 for conducting the chip 13 to the antenna 12 are realized by connecting one end to the lead 121 and the other end to the pin 131 of the chip 13 located between the two leads 121.
As shown in fig. 2, the first substrate 11 is provided with a groove 111, and the groove 111 is used for accommodating the chip 13. In this embodiment, the recess 111 is a rectangular recess 111 having a shape identical to that of the chip 13 and a size slightly larger than the outer shape of the chip 13. By providing a groove 111 for accommodating the chip 13 on the first substrate 11, the chip 13 can be temporarily positioned by the groove 111 before being connected to the antenna 12 through the wire 14, thereby reducing the difficulty of production and improving the precision of products. In addition, the recess 111 reduces the protrusion degree of the chip 13 relative to the surface of the first substrate 11 when the chip 13 is accommodated, so that the structure can further improve the flatness of the contactless smart card 1 in the area.
Preferably, the depth of the groove 111 may be equal to the thickness of the chip 13, so that the top of the chip 13 is not higher than the surface of the first substrate 11 when the chip 13 is placed in the groove 111, thereby completely solving the problem that the thickness of the chip 13 affects the surface flatness of the contactless smart card 11.
Furthermore, the preferred diameter of the two wires 14 of the contactless smart card 1 is 0.05mm
The flatness of the surface of the contactless smart card 1 is further improved by using a wire 14 having a relatively small diameter to achieve conduction.
As shown in fig. 2, 3 and 4, the present invention also provides a method of manufacturing a contactless smart card 1 for manufacturing the contactless smart card 1 as described above, the method comprising the steps of:
s1, a copper wire is wound around the first base material 11 to form a coil having a predetermined number of turns and a predetermined size, thereby forming the antenna 12.
S2, moving and placing the chip 13 on the first substrate 11;
s3, respectively soldering the two wires 14 between the two pins 131 of the chip 13 and the antenna 12, so that the two pins 131 of the chip 13 are conducted to the antenna 12;
s4, a second substrate (not shown) is attached to the surface of the first substrate 11 facing the chip 13.
The manufacturing method is used for manufacturing the non-contact smart card 1, the two pins 131 of the chip 13 are conducted with the antenna 12 through the conducting wires 14 in a mode that the chip 13 which is not packaged is bridged through the conducting wires 14, the chip 13 can be applied to the non-contact smart card 1 without being packaged into a module, the thickness of the non-contact smart card 1 in the area where the chip 13 is located is reduced through not using other parts such as a PCB (printed circuit board) in the module, and therefore the surface flatness of the non-contact smart card 1 is improved. In addition, by directly using the chip 13 to manufacture the contactless smart card 1, the process of packaging the chip 13 into a module in advance is also saved, and the production cost is reduced.
Further, step S1 of the manufacturing method includes the steps of:
s11, winding a copper wire with the diameter of 0.1mm on the first base material 11 in an ultrasonic winding mode to form a coil with the specified number of turns and size, and manufacturing the antenna 12;
s12, the free ends of the two ends of the copper wire wound into a coil are led to the first substrate 11 in parallel to make two leads 121 of the antenna 12.
The step S2 further includes: the chip 13 is moved and placed on the first base material 11 such that the chip 13 is located between the two leads 121 of the antenna 12.
These steps define a method for manufacturing the antenna 12 in the contactless smart card 1, in order to make the surface flatness of the contactless smart card 1 meet the requirements, a copper wire with a diameter of 0.1mm is used to wind the antenna 12, and two ends of the copper wire are arranged in parallel at the left and right sides of the chip 13, so that two leads 14 conduct two pins 131 of the chip 13 to the antenna 12 towards the left and right sides respectively.
As shown in fig. 2, 3 and 5, the contactless smart card 1 preferably adopts the following steps to solder the wires 14 to the leads 121 and the pins 131 in step S3:
s31, arranging welding materials on the two pins 131 of the chip 13;
s32, straightening the lead 14 and fixing two ends of the lead 14;
s33, adjusting the relative angle between the middle part of the wire 14 and the chip 13, so that the middle part of the wire 14 simultaneously abuts against the two pins 131 of the chip 13 and the two leads 121 on the two sides of the chip 13;
s34, respectively supporting the four welding pins 2 at the intersection positions of the lead 14, the two pins 131 and the two leads 121 to form four welding points, so that the lead 14 is welded to the two pins 131 and the two leads 121;
s35, the portion of the wire 14 between the two leads 131 and the portion outside the two leads 121 are cut.
The steps are a method for welding two leads 14 to two pins 131 of a chip 13 and two leads 121 of an antenna 12, the leads 14 are straightened and fixed at two ends of the leads 14 simultaneously, the leads 14 can be contacted with the two pins 131 of the chip 13 and the two leads 121 of the antenna 12 simultaneously, then four welding pins 2 are pressed at the intersection of the leads 14, the chip 13 and the antenna 12, the leads 14 are welded and fixed on the chip 13 and the antenna 12, and finally, the two leads 14 are respectively conducted to the two leads 121 of the antenna 12 by the two leads 14 through cutting off redundant parts of the leads 14. The bonding method enables the relative positions of the bonding pin 2 and the wire 14, the contact of the chip 13 and the lead 121 of the antenna 12 to be determined by straightening the wire 14, and thus can ensure the accuracy of the bonding position even when the wire 14 is bonded to the contact of the chip 13 in a small structure.
In addition, in the present embodiment, the copper wire used for manufacturing the antenna 12 is an enamel wire, and the enamel wire is coated on the outer layer of the enamel wire, so that after the enamel wire is wound into the antenna 12, the insulation between two adjacent copper wires can be ensured without an additional process, and in step S31 of the manufacturing method, the method includes: the outer layer insulating layers 1211 of the two leads 121 of the antenna 12 are melted by means of laser heating, so that the wires 14 can be conducted to the leads 121.
In the present embodiment, step S31 of the manufacturing method can further include: the chip 13 is moved and placed in the groove 111 of the first substrate 11 by a robot. By moving the chip 13 by the robot, the position accuracy between the chip 13 and the first substrate 11 can be improved, so that the wires 14 can be more easily soldered and fixed to the two pins 131 of the chip 13 in the subsequent steps.
More preferably, the manufacturing method further includes, in step S2: and coating an insulating glue on the surface of the chip 13 facing to the first base material 11 and adhering the chip 13 to the first base material 11. Compared with other modes for fixing the chip 13, the bonding fixation has the characteristics of simplicity, convenience, rapidness and the like, is simple to implement, and can avoid the risk of damage to the chip 13 caused by complex procedures.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (4)
1. A manufacturing method of a non-contact smart card is used for manufacturing the non-contact smart card, the non-contact smart card comprises an antenna, a chip, a first substrate and a second substrate, wherein the first substrate and the second substrate are attached to each other, and the chip is located between the first substrate and the second substrate; the surfaces of the two sides of the chip are respectively in direct contact with the first base material and the second base material, the non-contact smart card further comprises two wires, and two ends of the two wires are respectively electrically connected to the antenna and two pins of the chip so as to conduct the chip to the antenna; the antenna is wound between the first base material and the second base material, leads are arranged at two ends of the antenna, and the two leads are arranged on two sides of the chip in parallel; characterized in that the manufacturing method comprises the following steps:
s1, winding a copper wire on the first base material to form a coil with specified turns and size, and manufacturing the antenna;
the step S1 includes the steps of:
s11, winding a copper wire with the diameter of 0.1mm on the first base material in an ultrasonic winding mode to form a coil with the specified number of turns and size, and manufacturing the antenna;
s12, leading free ends of two ends of the copper wire wound into the coil to the first base material in parallel to manufacture two lead wires of the antenna;
s2, moving and placing the chip on the first substrate; the step S2 further includes: the chip is positioned between two leads of the antenna;
s3, respectively welding the two leads between the two pins of the chip and the antenna to conduct the two pins of the chip to the antenna;
the step S3 includes the steps of:
s31, arranging welding materials on the two pins of the chip;
s32, straightening the lead and fixing two ends of the lead;
s33, adjusting the relative angle between the middle part of the lead and the chip to make the middle part of the lead simultaneously abut against the two pins of the chip and the two leads on the two sides of the chip;
s34, respectively supporting four welding pins at the intersection of the lead wire, the two pins and the two lead wires to form four welding points, so that the lead wire is welded to the two pins and the two lead wires;
s35, cutting off the part of the lead wire between the two pins and the part of the lead wire outside the two leads;
and S4, attaching the second base material to the surface of one side, facing the chip, of the first base material.
2. The manufacturing method according to claim 1, wherein the copper wire of which the antenna is made is an enameled wire, and the step S31 further includes: and melting the outer insulating layers of the two leads of the antenna by a laser heating mode.
3. The manufacturing method according to claim 1 or 2, wherein the first substrate is provided with a recess for accommodating the chip, and in the step S2, the chip is moved and placed in the recess of the first substrate by a robot.
4. The manufacturing method according to claim 1 or 2, wherein in step S2, an insulating paste is applied to a surface of the die facing the first substrate and the die is bonded to the first substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811249749.4A CN109214494B (en) | 2018-10-25 | 2018-10-25 | Contactless smart card and method for manufacturing same |
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| CN201811249749.4A CN109214494B (en) | 2018-10-25 | 2018-10-25 | Contactless smart card and method for manufacturing same |
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| CN109214494B true CN109214494B (en) | 2021-07-09 |
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| CN109786305B (en) * | 2019-01-28 | 2021-02-26 | 上海东方磁卡信息股份有限公司 | Non-contact card manufacturing equipment and non-contact card manufacturing method |
| CN111382828B (en) * | 2019-05-20 | 2024-02-02 | 上海东方磁卡信息股份有限公司 | Contactless smart card, method and apparatus for manufacturing the same |
| CN114421139B (en) * | 2022-04-01 | 2022-07-26 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
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