WO2010121454A1

WO2010121454A1 - Electronic label packaging and its manufacturing method

Info

Publication number: WO2010121454A1
Application number: PCT/CN2009/073381
Authority: WO
Inventors: 杨军良; 钟卫
Original assignee: 上海赞润微电子科技有限公司
Priority date: 2009-04-21
Filing date: 2009-08-20
Publication date: 2010-10-28
Also published as: CN101872752A

Abstract

A kind of electronic label packaging includes: an electronic label wafer, packaging pins and a base board laid on the electronic label wafer and the packaging pins, wherein the packaging pins are connecting to the electronic label wafer electrically, and the electronic label wafer, packaging pins and the base board are packaged in the packing fillings together. The manufacturing method of the electronic label packaging includes: making wafer set, on which making some electronic label wafers arranged in matrix; cutting the wafer set to get a single electronic label wafer; picking-up the electrical label wafer and put it on a base board directly; making packaging pins and put them on the base board; connecting the packaging pins to the electronic label wafer electrically; encapsulating the electronic label wafer, the base board and the packaging pins by packing fillings.

Description

Electronic label packaging and manufacturing method thereof

This application claims priority to Chinese Patent Application No. 200910049730. X, entitled "Electronic Label Packaging and How to Make It", filed on April 21, 2009, the entire contents of which are incorporated herein by reference. In the application. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic label package and to a method of fabricating an electronic label package. BACKGROUND OF THE INVENTION Electronic tags, also known as RFID (Radio Frequency Identification), are non-contact automatic identification technologies. By transmitting radio waves from sensors within a few centimeters to a few meters, the information stored in the electronic tag can be read to identify the identity of the item, person, and appliance represented by the electronic tag. Like other commonly used automatic identification technologies such as bar codes and magnetic strips, radio frequency identification technology is also an automatic identification technology. Each target object corresponds to a unique electronic identification number (UID) in the RF reader, attached to the object to identify the target object, such as a carton, pallet or crates. The RF card reader (transponder) reads the identification code from the electronic tag. The basic RFID system consists of three parts: an antenna or coil, a transceiver with an RFID decoder, and an RFID electronic tag (each tag has a unique electronic identification number).

As technology matures, the application of electronic tags in the fields of identification, logistics management, product tracking and traceability, and anti-counterfeiting is gradually being promoted. This technology has brought great convenience to human beings.

At present, electronic tag wafers packaged by conventional technology are exposed to the air, and such electronic tags and objects, such as cartons, pallets or crates, are subjected to high temperatures of several hundred degrees Celsius and production of several tens of atmospheres. In the process, the damage rate of electronic tags is almost 100%, and it is impossible to identify, manage, track and trace.

The traditional electronic label packaging process is to suck the cut electronic label wafer (Dice) from the wafer tray (wafer) with a nozzle, and then flip the electronic label wafer 180 degrees, and then the electronic label The wafer is positioned on the antenna where the conductive adhesive has been applied, and the antenna and the electronic tag wafer are firmly connected by the subsequent heating and pressing process. In this process, the 180 degree flip is the most critical step. Such devices are generally more expensive. Moreover, the labels produced by this process do not have the ability to withstand high temperatures and high pressures.

Referring to FIG. 1 and FIG. 2, the conventional electronic label package 90 is connected to the antenna 93 on the antenna substrate 94 through the conductive paste 92 after the electronic label wafer 91 is turned 180 degrees. Through this packaging method, the electronic tag wafer is exposed to the air, and the electronic tag and the object, such as a carton, a pallet or a package, are subjected to a high temperature of several hundred degrees Celsius and a production process of several tens of atmospheres. The electronic label damage rate is almost 100%, and it is impossible to identify, manage, track and trace.

The present invention provides a new way to improve or solve the above problems. Summary of the invention

The technical problem to be solved by the present invention is to provide a high temperature resistant, high voltage resistant electronic label package and a method of fabricating the same.

The present invention solves the above technical problems by such technical solutions:

An electronic label package comprising an electronic label wafer, a package lead, a substrate on which the electronic label wafer is placed, a package lead, an electrical connection between the package lead and the electronic label wafer, and an electronic label wafer, a package lead, a wire It is packaged in the package body together with the substrate.

As an improvement of the present invention, electrical connection is made between the package pins and the electronic tag wafer by wires.

As an improvement of the present invention, the package body is a ceramic.

As an improvement of the present invention, the package filling body is an epoxy resin.

The invention further provides a method for fabricating an electronic label package, the method comprising the steps of: fabricating a wafer tray on which a plurality of matrix-arranged electronic label wafers are fabricated; cutting the wafer tray to obtain a separate electronic label wafer Extracting the electronic tag wafer and placing it directly on a substrate; making a package pin and placing the package pin on the substrate; placing the package pin and the electronic tag The wafer is electrically connected; the electronic tag wafer, the substrate and the package pins are potted by the package filling body.

As an improvement of the present invention, in the step of extracting the electronic tag wafer, the extraction is performed by a vacuum suction device.

As an improvement of the present invention, the package leads are electrically connected to the electronic tag wafer by wires which are also potted in the package body.

As an improvement of the present invention, the package body is a ceramic.

Compared with the prior art, the invention has the following advantages: Preventing impurities, high temperature, high pressure in the air, corrosion and damage of the circuit from causing electrical performance degradation or failure, the wafer is completely isolated from the outside, and the wafer is protected. Surfaces and connecting leads, etc., to protect the relatively soft wafer from external force damage and external environment in electrical or thermal physics, and at the same time, the thermal expansion coefficient of the wafer is matched with the thermal expansion coefficient of the frame or substrate by the package, thereby alleviating The damage caused by changes in the external environment such as heat and pressure can prevent wafer damage from failing. BRIEF DESCRIPTION OF THE DRAWINGS Figures 1 and 2 are schematic views of a conventional electronic label package associated with the present invention.

3 is a schematic structural view of an electronic label package of the present invention.

4 is a flow chart of a method of fabricating an electronic label package of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The invention can prevent the electrical properties from degrading or failing due to impurities, high temperature, high pressure and moisture corrosion and damage of the electronic tag wafer in the air through a new packaging method, and the wafer is completely isolated from the outside, and the protection is protected. The surface of the wafer and the connecting leads and the like protect the relatively soft wafer from external force damage and external environment in terms of electrical or thermal physics. At the same time, the thermal expansion coefficient of the wafer is matched with the thermal expansion coefficient of the frame or the substrate by the package, so that the stress generated by the change of the external environment such as heat and pressure can be alleviated, thereby preventing wafer damage failure. Based on heat dissipation The thinner the package, the better. On the other hand, the packaged wafers in this new electronic label package are also easier to install and transport.

The traditional electronic label packaging process is to suck the cut electronic label wafer (Dice) from the wafer tray (wafer) with a nozzle, and then flip the electronic label wafer 180 degrees, and then position the electronic label wafer to the already On the antenna with the conductive adhesive, the antenna and the electronic tag wafer are firmly connected together by the subsequent heating and pressing process. In this process, the 180 degree flip is the most critical step, and such devices are generally More expensive. Moreover, the labels produced by this process do not have the ability to withstand high temperatures.

The package form of the present invention eliminates the step of flipping, directly locating the electronic label wafer from the wafer tray with the nozzle and positioning it on the substrate, and then using the bonding machine to bond the solder joints of the electronic label wafer with the alloy wire as a wire. The pins of the leadframe are connected and then potted with a plastic insulating medium or ceramic potting. Such a complete set of equipment is much less expensive than conventional equipment. The package form of the electronic tag realizes the transformation of the electronic tag from difficulty to difficulty, from complex to simple, thereby reducing the operation, materials and equipment costs, and reducing the quality requirements for the staff, especially Improve product reliability and consistency by minimizing connection resistance, parasitic capacitance, and inductance by achieving wire length and impedance ratio.

Optimized, available for general purpose specifications, refers to the standard size of the package in terms of size, shape, length and electrical characteristics, which is convenient for the end user to transport and use.

The electronic tag packaged by the electronic label package of the invention can be subjected to the temperature of 210 ° C or less in the production process together with the object, and can withstand a pressure environment of up to 20 standard atmospheres, thereby realizing the identification and management of these non-metallic objects by using electronic tags. , tracking and tracing purposes.

Referring to FIG. 3, the electronic label package 10 of the present invention includes an electronic label wafer 11, a substrate 12, a package lead 13, a wire 14 and a package body 15. The electronic tag 11 is connected to the package pin 13 through the wire 14, and the package pin 13 and the electronic tag wafer 11 are positioned on the substrate 12, and the package body 15 encapsulates the above-mentioned components, that is, the above-mentioned components are covered therein. The package body 15 can be ceramic or epoxy.

Referring to FIG. 4, a method for manufacturing an electronic label package of the present invention includes the following steps: Forming an electronic tag wafer on the wafer pad;

Cutting the wafer tray to form a single electronic label wafer;

Extracting the electronic label wafer by using a vacuum adsorption device and directly placing it on the substrate; fixing the package pins on the substrate, and electrically connecting the package pins to the electronic label wafer by using wires; potting the package filling body, placing the electronic label, the wire The package leads and the substrate are enclosed therein.

The packaging situation and the manufacturing method provided by the invention have lower cost, and the electronic label package can go through the temperature of 210 ° C or lower in the production process together with the object, and can withstand a pressure environment of up to 20 standard atmospheres, and realize the use of electronic tags for these. The purpose of identification, management, tracking and tracing of non-metallic objects.

The above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, but equivalent modifications or changes made by those skilled in the art according to the disclosure of the present invention should be Within the scope of protection stated in the request.

Claims

Claim

What is claimed is: 1. An electronic label package comprising an electronic label wafer, a package lead, and a substrate on which the electronic label wafer and the package lead are placed, wherein: the package pin is electrically connected to the electronic label wafer, and the electronic label wafer The package leads and wires are packaged together with the substrate in the package body.

2. The electronic label package of claim 1 wherein: the package pins and the electronic label wafer are electrically connected by wires.

3. The electronic label package according to claim 1 or 2, wherein the package filling body is ceramic.

4. The electronic label package according to claim 1 or 2, wherein the package filling body is an epoxy resin.

5. A method of fabricating an electronic label package according to claim 1, wherein the method comprises the steps of:

Making a wafer tray on which a plurality of matrix-arranged electronic label wafers are fabricated;

Cutting the wafer tray to obtain a separate electronic label wafer;

Extracting an electronic label wafer and placing it directly on a substrate;

Making a package pin and placing the package pin on the substrate;

Electrically connecting the package pin to the electronic tag wafer;

The electronic tag wafer, substrate and package leads are potted with a package fill.

6. The manufacturing method according to claim 5, wherein in the step of extracting the electronic tag wafer, the extraction is performed by a vacuum suction device.

7. The manufacturing method according to claim 5, wherein: the package pin and the electronic tag wafer are electrically connected by a wire, and the wire is also potted in the package body.

8. The manufacturing method according to claim 5 or 6 or 7, wherein the package filling body is ceramic.

9. The manufacturing method according to claim 5 or 6 or 7, wherein the package filling body is an epoxy resin.