CN202694402U - Organic radio frequency identification tag - Google Patents
Organic radio frequency identification tag Download PDFInfo
- Publication number
- CN202694402U CN202694402U CN 201220363142 CN201220363142U CN202694402U CN 202694402 U CN202694402 U CN 202694402U CN 201220363142 CN201220363142 CN 201220363142 CN 201220363142 U CN201220363142 U CN 201220363142U CN 202694402 U CN202694402 U CN 202694402U
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Abstract
The utility model relates to an organic radio frequency identification tag, in particular to an organic radio frequency identification tag carrying a thin organic thin film integrated circuit. The organic radio frequency identification tag comprises a flexible substrate (32), an antenna (11) and an organic thin film integrated circuit device (13) with an organic thin film transistor (OTFT), wherein the antenna is arranged on the flexible substrate, and is electrically connected with the organic thin film integrated circuit device; the flexible substrate combining the antenna and the organic thin film integrated circuit device is arranged in a laminated resin layer (45); a filler layer (24) is arranged around the antenna in the laminated resin layer; and a thermal expansion coefficient of a filler forming the filler layer is not more than 1.5 times of that of the antenna. According to the organic radio frequency identification tag, stress caused by a difference between thermal expansion coefficients of different materials can be eliminated, so that the stripping and breakage of the filler layer around the antenna and between the antenna and the OTFT can be avoided.
Description
Technical field
The utility model relates to a kind of organic radio-frequency (RF) identification (ORFID) label, particularly relates to a kind of organic radio-frequency (RF) identification (ORFID) label that is carrying very thin organic film integrated circuit.
Background technology
In recent years, in various industry member, such as food industry, process industry or other industry etc. all requires to improve and strengthen safety and the management system of commodity, thereby increased the quantity of information of commodity.Yet the main information on commodity is just made country origin, manufacturer, sequence number or out of Memory, and mainly being has tens symbols in the bar code to provide, and quantity of information is very little.In addition, in the situation of using bar code, carried out one by one by manual, need the long time so that read bar code.Therefore, replace bar code system, adopt the automatic identification technology of electromagnetic noncontact ic tag, also be referred to as RFID (radio-frequency (RF) identification) technology, have received increasing attention.
In the various modern electronic devices that comprise integrated circuit, flat-panel monitor, smart card and radio-frequency (RF) identification (RFID) label, use widely and comprise that the thin film circuit devices of transistor, diode etc. forms logical circuit.Recently, important research and development is towards using organic semiconducting materials to form the direction effort of thin-film transistor circuit.Organic semiconducting materials provides a large amount of manufacturing advantages for the transistor manufacturing that comprises the reduction process temperature.Particularly, organic semiconducting materials allows to make OTFT (OTFT) at flexible substrate such as thin glass, condensate or based on the substrate of paper.
In addition, organic semiconducting materials can use low-cost manufacturing technique such as printing, impression or cover mould and form.Although along with the performance characteristic that continues research and development and improved OTFT, also there are challenge in device performance and stability.
At present, in the commodity of the RFID label of the contactless or contact of bonding, according to kind, a large amount of commodity can use under wide temperature range condition.In the situation of this type of commodity of the contactless RFID label that bondd because be used for the antenna of communication and the resin thermal expansivity that around antenna, provides on difference, can produce stress to the larger resin of thermal expansivity, so that the resin fracture.In addition, with contact IC chip attach in the situation on the commodity, because the difference between the thermal expansivity of contact electrode and the resin that provides around the contact electrode and so that the resin fracture.These all can affect manufacturing output, serviceable life and the reliability of RFID label naturally, and other correlative factor etc.
Summary of the invention
The utility model is considered above-mentioned present situation, proposes a kind of structure of ORFID label, even when the temperature that the ORFID label is provided exists very large difference, also can avoid the resin of cover antenna or contact electrode owing to stress produces fracture.
The technical scheme that the utility model adopts:
A kind of organic RFID tag, comprise: flexible substrate (32), antenna (11), the organic film integrated circuit (IC)-components (13) that has comprised OTFT, described antenna is arranged on the flexible substrate (32), antenna (11) and organic film integrated circuit (IC)-components (13) are electrically connected, the flexible substrate (32) that combines antenna (11) and organic film integrated circuit (IC)-components (13) is arranged in the stacked resin bed (45), be provided with packed layer (24) around stacked resin bed (45) inside antenna, the thermal expansivity that consists of the filling agent of described packed layer is not more than 1.5 times of thermal expansivity of described antenna.
Described organic RFID tag is characterized in that: antenna adopts one or more metal materials among Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Co or the Ti.
Described organic RFID tag, filling agent adopts sensitization organic material, non-sensitization organic material or thermal resistance organic resin material.Filling agent is a kind of packing material or has reduction or the potpourri of the function of the thermal expansivity of increase packed layer.Material as filling agent comprises, but is not restricted to silicon dioxide (SiO
2), aluminium oxide (Al
2O
3), boron nitride (BN), manganese oxide, aluminium nitride (AlN), silicon nitride, glass fibre (continuous glass fibre such as the glass bar of column), silicon dioxide (for example, spherical silicon dioxide), carbon fiber, calcium carbonate, mica (talcite) and mica.
Described organic RFID tag is provided with tack coat and separating layer in a side of described stacked resin bed (45); Described tack coat uses one or more in cyanoacrylate adhesive material, vinyl acetate resin emulsion fluid, elastomeric material, Corvic material, vinyl acetate solvent material, epoxy material and the hot-melt material; Separating layer adopts paper, plastics, PET, polypropylene, tygon, polystyrene, nylon or inorganic material.
The thickness of described organic film integrated circuit (IC)-components is 0.05 to 2 μ m.The concept of thin film integrated circuit device is different from the routine that forms at silicon wafer " IC(integrated circuit) chip ", represented integrated circuit (IC)-components comprises take OTFT as typical film active element, with the interconnective lead-in wire of organic film active component, and the lead-in wire that organic film active component and external structure (for example, at the antenna in the contactless ORFID label situation or the contact electrode in contact ORFID label situation) are connected.
The ORFID label has identification and is distributed in commodity in the market and the function of store commodity information, basically, the one side of ORFID label is adhesive surface, so that the ORFID label can be attached to above the commodity, the ORFID label comprises that it can repeatedly repeat the function of bonding.
Antenna has the function with external read device/write device or other etc. communication, and can be formed on the substrate that forms the ORFID label, perhaps in organic film integrated circuit (IC)-components together integrated formation.This substrate self can be substrate or the unexposed substrate (interior substrate or inner-layer substrate) that exposes.Substrate can have single layer structure or stepped construction, and its material does not have special restriction.Substrate can adopt the rule that covers or apply.
The beneficial effects of the utility model:
1, the organic RFID tag of the utility model has antenna, and it is formed on the formed substrate of ORFID label; The organic film integrated circuit (IC)-components comprises OTFT and is connected with antenna, and comprises filling agent and contact, make it with substrate to reduce between the conductive material of packed layer and antenna or packed layer and form the packed layer of the thermal expansion coefficient difference between the film of the organic film active component such as OTFT.Therefore, might eliminate since between different materials the caused stress of the difference of thermal expansivity, thereby can avoid around the antenna and the peeling off and break of the packed layer that between antenna and OTFT, provides.
2, the organic RFID tag of the utility model, packed layer have high formation performance (low viscosity, low thixotropy, high bonding stability and best particle size), heat dissipation characteristics and high heat conduction.Filler material can reduce to form the difference of thermal expansivity of the conductive material of the film of the film active element such as OTFT or antenna, this just might be avoided peeling off of packed layer and break, this peel off and break be by middlely using thermal expansion coefficient difference between the different materials to produce in that antenna and OTFT are integrated.For example, using in the situation of resin as packed layer, because resin has than conductive material or the larger thermal expansivity (CTE) of semiconductor material, by in packed layer, comprising filling agent, the CTE of resin will be close to the CTE of conductive material or semiconductor material, thereby can reduce thermal expansion.
Description of drawings
Fig. 1: the technological process of production synoptic diagram of the utility model ORFID label;
Fig. 2: the utility model ORFID label finished product enlarged drawing;
Fig. 3: the commercial examples of the ORFID label of the present utility model that bondd.
Embodiment
Embodiment one: referring to Fig. 2, the organic RFID tag of the utility model, comprise: flexible substrate 32, antenna 11, and the organic film integrated circuit (IC)-components 13 that comprises OTFT, described antenna is arranged on the flexible substrate 32, antenna 11 and organic film integrated circuit (IC)-components 13 are electrically connected, the flexible substrate 32 that combines antenna 11 and organic film integrated circuit (IC)-components 13 is arranged in the stacked resin bed 45, be provided with packed layer 24 around stacked resin bed 45 inside antennas, the thermal expansivity that consists of the filling agent 28 of described packed layer is not more than 1.5 times of thermal expansivity of described antenna.
Antenna adopts one or more metal materials among Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Co or the Ti.Filling agent adopts sensitization organic material, non-sensitization organic material or thermal resistance organic resin material, filling agent adopt silicon dioxide, aluminium oxide, boron nitride, manganese oxide, aluminium nitride, silicon nitride, glass fibre, silicon dioxide, carbon fiber, calcium carbonate, mica, silver powder, copper powders may, nickel by powder and the copper powders may that is covered with by silver in one or more materials.
Side at described stacked resin bed 45 is provided with tack coat and separating layer; Described tack coat uses one or more in cyanoacrylate adhesive material, vinyl acetate resin emulsion fluid, elastomeric material, Corvic material, vinyl acetate solvent material, epoxy material and the hot-melt material; Separating layer adopts paper, plastics, PET, polypropylene, tygon, polystyrene, nylon or inorganic material.
Fig. 1 is the manufacturing streamline of ORFID label of the present utility model.As shown in Figure 1, by the label standby label paper that provides the parts steamboat to be provided for the ORFID tag substrate made of paper, and use IDF chip attach parts 302 with the IDF chip attach on the desired location of substrate.In this case, can suitably use such as binding material or ACF material or such as the method for ultraviolet bonding or UV bonding.Then, when substrate is when arranging in the strip mode, can adopt substrate separation parts 309 with respect to each independent ORFID label separate substrates.Subsequently, use stack system 310, with to carrying out lamination process around the independent substrate.Packed layer 24 around the IDF chip adopts filling agent to cover in advance.Like this, just finished the ORFID label.After the desired location of strip substrate forms the IDF chip and carries out lamination process, can be with respect to each ORFID label separate substrates.Can be collected parts 307 through the ORFID label after the lamination process collects.
Fig. 2 is the amplification profile synoptic diagram of finishing product that adopts the ORFID label of said method manufacturing.In the label substrate, form antenna 11 and the organic film integrated circuit (IC)-components 13 that is being connected antenna 11, and adopted the stacked resin bed 45 that is inserted in the packed layer 24 that wherein comprises filling agent 28 to cover the label substrate with established antenna 11 and organic film integrated circuit (IC)-components 13.In order in thermal treatment of lamination process etc., to protect organic film integrated circuit (IC)-components 13 and antenna 11, the thermal resistance organic resin that packed layer 24 uses such as silane.
Fig. 3 has shown the books 123 of the ORFID label 20 that bondd.ORFID label of the present utility model is quite thin.Therefore, when the ORFID label is placed on such as books 123 article, can not damage its function or design.In addition, in the situation of non-contact type organic film integrated circuit (IC)-components, antenna and chip can integratedly form, so that it can directly be transferred to non-contact type organic film integrated circuit (IC)-components on the commodity with curved surface more easily.
Claims (4)
1. organic RFID tag, comprise: flexible substrate (32), antenna (11), the organic film integrated circuit (IC)-components (13) that comprises OTFT, it is characterized in that: described antenna is arranged on the flexible substrate (32), antenna (11) and organic film integrated circuit (IC)-components (13) are electrically connected, the flexible substrate (32) that combines antenna (11) and organic film integrated circuit (IC)-components (13) is arranged in the stacked resin bed (45), be provided with packed layer (24) around stacked resin bed (45) inside antenna, the thermal expansivity of filling agent is not more than 1.5 times of thermal expansivity of described antenna material in the packed layer.
2. organic RFID tag according to claim 1 is characterized in that: antenna employing Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Co or Ti metal material.
3. organic RFID tag according to claim 1 and 2 is characterized in that: filling agent employing sensitization organic material, non-sensitization organic material or thermal resistance organic resin material.
4. organic RFID tag according to claim 3, it is characterized in that: the side at described stacked resin bed (45) is provided with tack coat and separating layer; Separating layer adopts paper, plastics, PET, polypropylene, tygon, polystyrene, nylon or inorganic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220363142 CN202694402U (en) | 2012-07-26 | 2012-07-26 | Organic radio frequency identification tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220363142 CN202694402U (en) | 2012-07-26 | 2012-07-26 | Organic radio frequency identification tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202694402U true CN202694402U (en) | 2013-01-23 |
Family
ID=47549985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220363142 Expired - Fee Related CN202694402U (en) | 2012-07-26 | 2012-07-26 | Organic radio frequency identification tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202694402U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109285441A (en) * | 2018-10-25 | 2019-01-29 | 惠州市浩明科技股份有限公司 | Anti-fake clothing labels structure |
| CN112434771A (en) * | 2019-11-05 | 2021-03-02 | 友达光电股份有限公司 | Flexible wireless communication chip and wireless communication label |
-
2012
- 2012-07-26 CN CN 201220363142 patent/CN202694402U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109285441A (en) * | 2018-10-25 | 2019-01-29 | 惠州市浩明科技股份有限公司 | Anti-fake clothing labels structure |
| CN112434771A (en) * | 2019-11-05 | 2021-03-02 | 友达光电股份有限公司 | Flexible wireless communication chip and wireless communication label |
| CN112434771B (en) * | 2019-11-05 | 2023-08-18 | 友达光电股份有限公司 | Flexible wireless communication chip and wireless communication tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20130726 |