CN201251792Y - Novel COB model for IC card packaging - Google Patents
Novel COB model for IC card packaging Download PDFInfo
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- CN201251792Y CN201251792Y CNU2008201885479U CN200820188547U CN201251792Y CN 201251792 Y CN201251792 Y CN 201251792Y CN U2008201885479 U CNU2008201885479 U CN U2008201885479U CN 200820188547 U CN200820188547 U CN 200820188547U CN 201251792 Y CN201251792 Y CN 201251792Y
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Abstract
The utility model discloses a COB module for IC card packaging, comprising a PCB circuit base-plate and a copper clad film covered on the surface of the PCB circuit base-plate, an IC chip and a binding aluminum wire. The IC chip of the COB module is fixed on the PCB plate by chip locating glue; and the IC chip is connected with the copper clad film by the binding aluminum wire. A micro chip capacitor is also welded on the copper clad film, and the chip capacitor is connected with the IC chip in parallel; the COB module structure can bind the IC chip and the micro chip capacitor, and welding and glue protection can be conducted at a time; the packaging volume is small, the thickness is small and the packaging cost is low; besides, the volume and thickness of the capacitor meet the international standard on IC card thickness during manufacturing, therefore, the IC card and electronic label using the COB module has the advantages of that the cost is low and long-time continuous operating performance of the IC card can be optimized.
Description
Technical field
The utility model relates to a kind of electrical module that encapsulation is used that blocks, especially for the novel C OB module of thin card of smart card and flexible electronic tag package.
Background technology
The IC chip that conventional smart card is used, usually need carry out the COB module package, the soft encapsulation of the single-chip of on the PCB substrate, realizing just, be that bare chip mounts the combination that nation decides technology and sealing technology, the IC chip uses location glue directly to be attached on the circuit base plate appointed positions, being electrically connected of chip and substrate adopts the aluminium wire line nation method of decide to realize, and covers curing with resin and guarantee the reliability used.General RFID electronic tag or international standard non-contact intelligent card, it is inner mainly is made up of IC chip, resonant capacitance and the dual-mode antenna coil that matches.
Usually; the IC chip internal has been integrated with transmission circuit and resonant capacitance; the technology of this IC chip manufacturing COB is just fairly simple---only play the effect that protection chip and chip and exterior antenna work is electrically connected, as long as the THICKNESS CONTROL of COB module is in 0.45mm.But, because it is bigger that this IC chip has the semiconductor of a taking volume, the IC cost rate is higher, shortcomings such as the stability when establishing electric capacity in the chip under its long-term continuous working is relatively poor, therefore IC chip production merchant has begun resonant capacitance cancellation integrated in the IC, transferring to the outside patch capacitor that adopts realizes tuning, but significantly increased the manufacture craft of smart card or electronic tag encapsulation, and this class does not have the IC chip of integrated capacitance, the card production technology that adds electric capacity at present and make up, all can only be fit to produce off-gauge thick card (thickness=1.8mm), the limitation that causes the application of intelligent card chip to be encapsulated.
Summary of the invention
In order to overcome the deficiency of existing encapsulation technology; the utility model provides a kind of novel C OB module encapsulation construction that is used for smart card; this COB modular structure can be fixed with IC chip and the disposable nation of miniature patch electric capacity, welding and sealing protection, and have that encapsulation volume is little, thin thickness, characteristics that packaging cost is low.
The technical scheme that its technical matters that solves the utility model adopts is:
A kind of novel C OB module that is used for the smart card encapsulation, comprise that PCB circuit substrate and the copper membrane, IC chip and the nation that cover PCB circuit substrate surface decide aluminum steel, the IC chip of described COB module is fixed on the pcb board by chip location glue, the IC chip is decided aluminum steel by nation and is connected surely with copper membrane nation, it is characterized in that also being welded with miniature patch electric capacity on the copper membrane, described patch capacitor is in parallel with the IC chip.
Above-mentioned patch capacitor is welded on the copper membrane by the tin material.
The length of above-mentioned patch capacitor is 0.6mm, and width and thickness are 0.3mm.
The utility model also comprises protects black glue, and the black glue of described protection covers IC chip, patch capacitor and nation and decides the aluminum steel zone, and described novel C OB module comprises within the scope that is allowed when protecting the general thickness of deceiving glue to be controlled at the packaging smart card sheet.
Above-mentioned COB module is by the copper membrane link position on the PCB circuit substrate of black glue covering protection, is electrically connected by butt-joint or welding tin material and external metallization silk antenna.
The said external tinsel is for planting line copper cash or enamel covered wire.
Above-mentioned novel C OB module is applicable to the thin card of non-contact intelligent induction of the international standard thickness that adopts the PVC lamination, also is applicable to the various flexible electronic labels of laminated encapsulation.
The beneficial effects of the utility model are: COB modular structure of the present utility model can be fixed with IC chip and the disposable nation of miniature patch electric capacity, welding and sealing protection, and encapsulation volume is little, thin thickness, packaging cost are low; And the volume of this electric capacity and thickness satisfies the code requirement that can make international standard IC-card thickness, uses IC of the present utility model to have a cost lower and can optimize the IC characteristics of continuous performance over a long time thereby make.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the utility model member connection structure synoptic diagram;
Fig. 2 is a cut-open view of having used IC-card of the present utility model;
Fig. 3 is the cut-open view of another line of vision of IC-card shown in Figure 2.
Embodiment
With reference to Fig. 1; Fig. 2; Fig. 3; the disclosed a kind of novel C OB module that is used for the smart card encapsulation of the utility model; comprise PCB circuit substrate 1 and the copper membrane 2 that covers PCB circuit substrate 1 surface; IC chip 3 and nation decide aluminum steel 4; wherein the IC chip 3 of COB module is to be fixed on the PCB circuit substrate 1 by chip location glue 5; IC chip 3 is decided aluminum steel 4 by nation and is connected surely with copper membrane 2 nations; on copper membrane 2, also be welded with miniature patch electric capacity 7 by tin material 6; patch capacitor 7 is in parallel with IC chip 3; by the disposable nation of IC chip 3 and miniature patch electric capacity 7 is fixed; welding and sealing protection make COB module package volume little; thin thickness; packaging cost is low.
The length of this patch capacitor 7 is 0.6mm, width and thickness are 0.3mm, thereby the volume of this electric capacity and thickness satisfies the code requirement that can make international standard IC-card thickness, uses IC of the present utility model to have a cost lower and can optimize the IC characteristics of continuous performance over a long time thereby make.
Do not welded outside wire antenna 9 by copper membrane 2 link positions on the PCB circuit substrate of black glue covering protection by butt-joint or tin material on the COB module, this external metallization silk antenna is for planting line copper cash or enamel covered wire.
This novel C OB module is applicable to the thin card of non-contact intelligent induction of the international standard thickness of material laminations such as adopting PVC, PET, PPC, also is applicable to laminated encapsulation electronic tag various flexibilities, papery.
Claims (6)
1. the novel C OB module that is used for the smart card encapsulation, comprise that PCB circuit substrate and the copper membrane, IC chip and the nation that cover PCB circuit substrate surface decide aluminum steel, the IC chip of described COB module is fixed on the PCB circuit substrate by chip location glue, the IC chip is decided aluminum steel by nation and is connected surely with copper membrane nation, it is characterized in that also being welded with miniature patch electric capacity on the copper membrane, described patch capacitor is in parallel with the IC chip.
2. the novel C OB module that is used for the smart card encapsulation according to claim 1 is characterized in that described patch capacitor is welded on the copper membrane by the tin material.
3. the novel C OB module that is used for the smart card encapsulation according to claim 1 and 2, the length that it is characterized in that described patch capacitor is 0.6mm, width and thickness are 0.3mm.
4. the novel C OB module that is used for the smart card encapsulation according to claim 1; it is characterized in that it also comprises the black glue of protection; the black glue of described protection covers IC chip, patch capacitor and nation and decides the aluminum steel zone, and described novel C OB module comprises within the scope that is allowed when protecting the general thickness of deceiving glue to be controlled at the packaging smart card sheet.
5. the novel C OB module that is used for the smart card encapsulation according to claim 1; it is characterized in that on the described COB module by the copper membrane link position on the PCB substrate of black glue covering protection, be electrically connected by butt-joint or welding tin material and external metallization silk antenna.
6. the novel C OB module that is used for the smart card encapsulation according to claim 5 is characterized in that described external metallization silk antenna is for planting line copper cash or enamel covered wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201885479U CN201251792Y (en) | 2008-08-12 | 2008-08-12 | Novel COB model for IC card packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201885479U CN201251792Y (en) | 2008-08-12 | 2008-08-12 | Novel COB model for IC card packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201251792Y true CN201251792Y (en) | 2009-06-03 |
Family
ID=40747464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201885479U Expired - Fee Related CN201251792Y (en) | 2008-08-12 | 2008-08-12 | Novel COB model for IC card packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201251792Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065979A (en) * | 2011-10-20 | 2013-04-24 | 上海飞乐音响股份有限公司 | Non-contact type integrated circuit (IC) card manufacturing method based on chip on board (COB) encapsulation |
| CN103268872A (en) * | 2013-04-22 | 2013-08-28 | 深圳市实佳电子有限公司 | Payment-by -pure-card intelligent card loading belt and manufacturing method thereof |
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
| CN108073969A (en) * | 2016-11-16 | 2018-05-25 | 汤远华 | A kind of ticket card and its manufacturing method based on pcb board |
-
2008
- 2008-08-12 CN CNU2008201885479U patent/CN201251792Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065979A (en) * | 2011-10-20 | 2013-04-24 | 上海飞乐音响股份有限公司 | Non-contact type integrated circuit (IC) card manufacturing method based on chip on board (COB) encapsulation |
| CN103268872A (en) * | 2013-04-22 | 2013-08-28 | 深圳市实佳电子有限公司 | Payment-by -pure-card intelligent card loading belt and manufacturing method thereof |
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
| CN108073969A (en) * | 2016-11-16 | 2018-05-25 | 汤远华 | A kind of ticket card and its manufacturing method based on pcb board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHONGSHAN DAHUA INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHONGSHAN CITY DAHUA INTELLIGENT SCIENCE CO., LTD. Effective date: 20090925 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Guangdong province Zhongshan City Xiaolan Town, ten North Road, No. 8 German side streets, zip code: 528415 Patentee after: Tatwah Smarttech Co., Ltd. Address before: Guangdong province Zhongshan City Xiaolan Town, ten North Road, No. 8 German side streets, zip code: 528400 Patentee before: Zhongshan Tatwah Smart Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090603 Termination date: 20150812 |
|
| EXPY | Termination of patent right or utility model |