JP2006072804A - Electronic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic tag 1 which is excellent in at least chemical resistance among weather resistance, heat resistance, and chemical resistance, and which is relatively simply structured and is relatively simply manufactured. <P>SOLUTION: An antenna wire 4 and an IC chip 5 electrically connected to the antenna wire 4 are put between first and second laminated glass boards 2 and 3. A hollow section 7 for storing an IC chip can be formed on the internal face of at least one of the first and second glass boards 2 and 3. Also, the internal face of the first glass board 2 is adhered by adhesive to the internal face of the second glass board 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic tag in which an antenna line and an IC (integrated circuit) chip electrically connected to the antenna line are incorporated.

  An RFID (Radio Frequency Identification) system is a system that detects the location of a moving object such as an object or a person. In a service involving manufacturing, sales, distribution, or lending, the moving object such as an object or a person is moved. Applications are spreading mainly around management. This RFID system includes at least an electronic tag attached to a moving body such as an object or a person by pasting, and a reader / writer that is usually a fixed station. The electronic tag, also called a wireless tag or an IC tag, is composed of communication circuits each including an IC chip in which a memory in which information is recorded is incorporated and a small antenna. The reader / writer includes an electromagnetic wave transmission / reception device and an information processing device. An electronic tag usually does not have a power source and operates by electromagnetic induction by electromagnetic waves from a reader / writer. The reader / writer reads or writes information in a non-contact manner with respect to an electronic tag that falls within a distance range in which electromagnetic induction action is possible.

Such an electronic tag is described in, for example, Japanese Patent Application Laid-Open No. 2004-180217. The electronic tag described in this published patent publication (hereinafter referred to as “electronic tag of Patent Document 1”) has an antenna line and an IC chip mounted on an insulating substrate such as a PET (polyethylene terephthalate) film. This is what is called an inlay or an inlet. Such an inlet can be configured as an electronic tag with a cover by being sandwiched between a pair of upper and lower plastic films or a pair of upper and lower paper sheets as a cover material.
JP 2004-180217 A

  In addition to the electronic tag of Patent Document 1, for the purpose of improving heat resistance, an electronic tag using a relatively heat-resistant polyimide resin for an insulating substrate as an inlet substrate, and similarly heat-resistant PPS (polyphenylene sulfide) resin An electronic tag that has been processed so as to cover the entire inlet is also known. Since the electronic tag covering the entire inlet with the PPS resin as described above can withstand some organic solvents, it is also used as an electronic tag for marking laundry to be dry-cleaned.

As a special electronic tag, as described in Japanese Patent Application Laid-Open No. 2003-17514, a capsule-shaped outer shell is made of glass or the like, and an antenna and an IC chip are provided in a slot provided in advance on the inner peripheral wall of the outer shell. The electronic tag main body is arranged, and the slot is filled with a potting material, whereby the electronic tag main body is sealed in the slot with the potting material (hereinafter referred to as “electronic tag of Patent Document 2”). Is also known from the past. The electronic tag of Patent Document 2 is used by being embedded in the livestock body for the purpose of identifying the livestock. In the case of the electronic tag of Patent Document 2, the weather resistance is excellent.
JP 2003-17514 A

However, the conventional electronic tags such as the electronic tags of Patent Documents 1 and 2 as described above have problems as described in the following items (a) to (d).
(A) In the case of an electronic tag such as Patent Document 1, the weather resistance is low, and it cannot be used in an outdoor environment exposed to rain, ultraviolet rays, or the like. The reason is that paper is weak against water and plastic also absorbs water, so that antennas and IC chips are easily corroded, and plastic is deteriorated by ultraviolet rays.
(B) In the case of an electronic tag such as Patent Document 1, since the heat resistance is not sufficient and there is no resistance to extremely low temperatures, the electronic tag cannot be used in applications where the electronic tag is exposed to high or low temperature environments. . The reason is that the inlet substrate and the cover material are usually plastics, and even if PPS resin or the like is used for them, the temperature range of −20 ° C. to 180 ° C. is the limit as the usage environment of the material.
(C) In the case of an electronic tag such as Patent Document 1, since chemical resistance is low, even in a corrosive environment or an environment using an organic solvent, even if the entire inlet is covered with PPS resin, Cannot be used for a long time. For example, when an electronic tag that covers the entire inlet with PPS resin as described above is used as an electronic tag for a laundry to be dry-cleaned, the lifetime is normally about 100 times. The reason is that an antenna or an IC chip cannot be sufficiently protected because an object sandwiched between a pair of upper and lower plastics or a pair of upper and lower papers is easily affected by acid, alkali and organic solvent.
(D) In the case of the electronic tag of Patent Document 2, since it is a glass-encapsulated type, the structure is complicated and the manufacture is not easy. The reason for this is that in the case of a glass-encapsulated type such as the electronic tag of Patent Document 2, a loop-shaped small antenna having a structure different from the inlet such as the electronic tag of Patent Document 1 is prepared. This is because a process of fixing both ends of the glass tube after fixing the IC chip to the glass tube and inserting the small antenna into the glass tube is necessary. Moreover, in order to protect the IC chip from the high temperature at the time of the fusion, it is necessary to fill the glass tube with a protective liquid such as silicon oil, so that the structure is further complicated.
JP 2004-180217 A JP 2003-17514 A

  The present invention was invented to solve the problems as described in the above items (a) to (d) in conventional electronic tags such as the electronic tags of Patent Documents 1 and 2, It is an object to provide an electronic tag that is excellent in at least chemical resistance among heat resistance, heat resistance and chemical resistance, has a relatively simple structure, and is relatively easy to manufacture.

  The present invention relates to an electronic tag in which an antenna line and an IC chip electrically connected to the antenna line are sandwiched between first and second glass plates that are directly or indirectly stacked on each other. Is.

According to the first aspect of the present invention, there is provided a recess for accommodating an IC chip provided on the inner surface of at least one of the first and second glass plates, and the above-described recess accommodated in the recess. An IC chip, and the antenna wire provided on the inner surface of at least one of the first and second glass plates, and the inner surface of the first glass plate and the inner surface of the second glass plate The side surface is bonded by an adhesive. Specifically, this first mode is illustrated as the first embodiment shown in FIGS. 1A and 1B. In the said 1st aspect of this invention, it is preferable that the said adhesive agent contains an epoxy silane or its hydrolysis polycondensate as an essential component. The epoxy silane may be a silane compound represented by the general formula RSix ₃ or the general formula RR'SiX ₂ . Here, R is an organic group having an epoxy bond, R ′ is an organic group having no epoxy bond, and X is a hydrolyzable group or a hydrolyzable atom. The silane compound can be used as an adhesive by hydrolytic polycondensation. In addition, the adhesive does not necessarily have to completely disappear after curing, but it is preferable that the adhesive is a substance close to an inorganic substance and has heat resistance and moisture resistance close to those of the inorganic substance. In this case, in order to improve the adhesion between the inner surface of the first glass plate and the inner surface of the second glass plate, it is preferable to cure the adhesive by heating the laminate of both. .

As a specific composition of the adhesive,
(A) Epoxysilane or its hydrolysis polycondensate: 3 to 60% by weight,
(B) Bisphenol type epoxy resin having a viscosity of 2,000 to 5,000 mPa · s: 5 to 90% by weight,
(C) Novolac type epoxy resin: 5 to 35% by weight,
(D) Curing agent comprising amines: 3 to 30% by weight, and (E) Water and / or alcohol: 0 to 0 with respect to the number of moles of the hydrolyzable group or hydrolyzable atom of the epoxysilane. .75 times,
Can be illustrated.

  In the first aspect of the present invention, the antenna wire is preferably formed by printing a conductive paint. In this case, silver paste, ink containing metal powder, or the like can be used as the conductive paint.

  According to a second aspect, the present invention includes a film-like resin substrate on which the antenna wire and the IC chip electrically connected to the antenna wire are respectively mounted. The film-like resin substrate is sandwiched between the first and second glass plates by bonding both side surfaces to the inner side surfaces of the first and second glass plates with an adhesive. In this case, it is preferable to use an adhesive having a relatively high elasticity and a relatively high heat resistance, such as a silicone adhesive. Specifically, this second mode is illustrated as the second embodiment shown in FIGS. 2A and 2B. In the second aspect of the present invention, in order to improve the adhesion between the pair of glass plates and the film-like resin substrate, by heating these three laminates under a load, It is preferable to cure the adhesive.

  According to a third aspect of the present invention, the antenna line includes the IC chip electrically connected to the antenna line, and an intermediate film, and includes the first and second glass plates. The antenna wires and the IC chip are sandwiched between the first and second glass plates by the side surfaces being bonded to both side surfaces of the intermediate film by the adhesive force of the intermediate film itself. Specifically, this third aspect is exemplified as the third embodiment shown in FIGS. 3A, 3B and 3C. In the said 3rd aspect of this invention, in order to improve the adhesiveness of a pair of said glass plate and the said intermediate film, it is preferable to heat these three laminated bodies in the state which applied the load.

The frequency of electromagnetic waves used for RFID includes not only two types of 13.56 MHz and 2.45 GHz but also UHF band (860 to 960 MHz), and can also be used at other frequencies. In addition, typical dimensions of the electronic tag for the above two types of frequencies are as follows:
(1) For 13.56 MHz: 45 × 30 × 1.4 mm
(2) For 2.45 GHz: 60 × 10 × 1.4 mm
It is. Thus, the vertical and horizontal dimensions of the glass plates used in the present invention may also typically be about 45 × about 30 mm and about 60 × about 10 mm. Moreover, it is a typical value that the thickness per glass plate is 0.3 to 1.0 mm. However, the present invention can also be applied to electronic tags that are larger or smaller than the dimensions described in the above items (1) and (2). And in the case of a large-sized electronic tag, the thickness per glass plate may be about 3.0 mm.

  The glass plate used in the present invention is not necessarily transparent. For example, the glass plate may be ground glass by treating the inner side surface and / or the outer side surface of the plate glass with a frosted glass. Moreover, you may use the tempered glass plate strengthened by the chemical strengthening method or the physical strengthening method by rapid cooling of the surface.

  The glass plate used in the present invention does not necessarily need to be a flat glass as exemplified in the first to third examples described later. For example, it is possible to provide an electronic tag configured by attaching a single glass plate with a required curvature to a glass product having a curved surface such as a glass bottle or a glass test tube.

  To describe this point specifically, the method of storing sperm in a frozen state is generally stored in liquid nitrogen and stored in liquid nitrogen. In order to identify the contents, an electronic tag is attached to the glass tube. And can be managed by the RFID system. In such a case, the antenna wire and the IC chip may be sandwiched between two glass plates having a curved surface matching the outer peripheral curved surface of the glass tube and different from the glass tube. Can be used as one of the pair of sandwiching surfaces. If comprised in this way, since an electronic tag and the glass tube as a storage container will be completely integrated, it is possible to provide a highly reliable storage method as an identification means for long-term storage. it can. Such a method can be used in a high temperature environment as well.

  According to the present invention, since the antenna wire and the IC chip are sandwiched between a pair of glass plates having excellent weather resistance, heat resistance, and chemical resistance, at least one of weather resistance, heat resistance, and chemical resistance is selected. An electronic tag having excellent chemical properties and a relatively simple structure can be manufactured relatively easily.

  In addition, according to the invention described in claims 2 to 4, it is possible to obtain an electronic tag that has excellent heat resistance and can withstand a cryogenic environment.

  According to the invention described in claim 5, since an existing inlet can be used, an electronic tag that is easier to manufacture can be obtained.

  Furthermore, according to the invention described in claim 6, the laminated glass structure composed of a pair of glass plates and an intermediate film is subjected to special treatment such as ultraviolet reflection and / or absorption treatment, thereby further improving weather resistance. An electronic tag suitable for outdoor use can be obtained.

  Next, the electronic tags according to the first to third embodiments to which the present invention is applied are represented by “(1) First Example”, “(2) Second Example”, “(3) Third Example”. The description will be made with reference to the drawings, divided into "Examples".

(1) First Example As shown in FIGS. 1A and 1B, an electronic tag 1 according to the first example includes an upper (ie, one) glass plate 2 and a lower (ie, the other) glass. A plate 3, an antenna wire 4 as a small antenna, and an IC chip 5 having a memory function are provided. The pair of glass plates 2 and 3 may be made of any one of soda lime glass and Pyrex (registered trademark) glass.

  As illustrated, the antenna line 4 may include an inner loop antenna 4a and an outer loop antenna 4b disposed substantially concentrically with the inner loop antenna 4a on the outer peripheral side of the inner loop antenna 4a. . The inner loop antenna 4a and the outer loop antenna 4b may each be composed of a plurality of loop conductors 6 formed substantially concentrically with each other as shown in the figure.

  Each of the plurality of loop-shaped conductors 6 may be substantially rectangular as illustrated. The plurality of loop conductors 6 can be formed by directly printing a conductive paint on the inner surface of the lower and / or upper glass plates 3 and 2. As such a conductive paint, a silver paste for glass or the like, an ink containing metal powder, or the like can be used, and a silver paste is particularly preferable. This silver paste may be obtained by dispersing silver powder in an organic solvent, and is excellent in ultraviolet resistance and water resistance. However, a plurality of loop-shaped conductors 6 formed substantially concentrically with each other are made of thin metal wires such as copper, and then the plurality of loop-shaped conductors 6 are formed on the lower and / or upper glass plates 3 and 2. It may be placed on the inner surface, or may be adhered to the inner surface with an adhesive containing epoxy silane or hydrolyzed polycondensate as described below. Each of the inner and outer loop antennas 4a and 4b may be formed by sequentially connecting a plurality of loop conductors 6 in a coil shape.

  The antenna line 4 may further include connection conductors 8 a and 8 b for connecting the inner and outer loop antennas 4 a and 4 b to the IC chip 5. These connection conductors 8 a and 8 b can be formed in the same manner as the loop conductor 6. In this case, in order to prevent the connection conductors 8a and 8b from coming into direct contact with the loop-shaped conductor 6, a heat-resistant insulating paste (not shown) is applied in advance to the jumper portions of the connection conductors 8a and 8b. Thus, a part of the connection conductors 8a and 8b can be a jumper wire.

  In mounting the IC chip 5 in which the memory in which information is recorded is mounted, the recess 7 is formed on a part of the inner side surface of the one glass plate 3 by spot facing (in other words, cutting). Then, almost all of the IC chip 5 was accommodated in the recess 7. The size of the recess 7 may be substantially the same as or slightly larger than that of the IC chip 5. Next, the upper glass plate 2 was laminated on the lower glass plate 3 and bonded together. This bonding was performed using an adhesive containing epoxy silane or a hydrolyzed polycondensate as an essential component. In this case, almost all of the IC chip 5 is accommodated in the recess 7 and the thickness of the antenna wire 4 such as the loop conductor 6 is thin, so that the inner surface of the upper glass plate 2 and the lower glass plate 3 The adhesive was almost completely filled in the gap with the inner surface of the film. For this reason, there is substantially no air gap (in other words, an air layer) between the inner side surface of the upper glass plate 2 and the inner side surface of the lower glass plate 3. Moreover, the said adhesive became a substance close | similar to an inorganic substance after hardening.

  A known chip-on-glass (COG) technology can be used for mounting the IC chip. In this COG technology, an IC chip 5 whose connection terminals are conductive bumps such as gold can be used. Then, the IC chip 5 and the connection conductors 8a and 8b are electrically connected by pressing the conductive bumps on the surfaces of the connection conductors 8a and 8b on the glass plates 2 and 3, respectively. In order to pressure-bond the conductive bumps and the connection conductors 8a and 8b, a binder in which conductive beads (in which an insulating coating is provided outside the conductive microspheres) is dispersed in a resin having fluidity, The IC chip 5 is bonded onto the connection conductors 8a and 8b. The binder itself is insulative, but by pressing the IC chip 5 against the connection conductors 8a and 8b, the insulating coating on the surface of the conductive beads sandwiched between the conductive bumps and the connection conductors 8a and 8b is broken. End up. For this reason, since only the pressed portion of the binder is in a conductive state, the IC chip 5 and the connection conductors 8a and 8b are electrically connected through the conductive beads.

As said adhesive agent, the adhesive composition obtained by mixing the main ingredient and hardening | curing agent which respectively illustrate a component by the ratio of 10: 1, and heating at 100 degreeC for 1 hour can be used. In this case, the main agent is, for example,
(A) 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane: 9% by weight
(B) Bisphenol F type epoxy resin: 68% by weight, and (c) Novolac type epoxy resin: 23% by weight,
It may consist of The curing agent is, for example,
(D) 2-ethyl-4-methylimidazole: 62% by weight, and (e) imidazole: 38% by weight (0.68 g),
It may consist of

  In using the adhesive composition, the adhesive composition is dropped on the inner side surfaces of the lower or upper glass plates 3 and 2, and then the upper or lower glass is immediately applied to the dropped inner side surface. The inner surfaces of the plates 2 and 3 are overlapped, and the adhesive composition is sandwiched between the two glass plates 2 and 3 in a stretched state. Then, the adhesive composition may be cured by heating at 200 ° C. for 15 minutes. This adhesive has sufficient weather resistance because its adhesive strength does not decrease even at a high temperature and high humidity test of 85 ° C., 85% RH (relative humidity) and 500 hours.

  Since the electronic tag 1 in the first embodiment shown in FIGS. 1A and 1B obtained as described above is covered with a pair of glass plates 2 and 3 and is isolated and protected from the external environment. In addition to having chemical resistance, all the constituent materials are made of inorganic materials or materials close to inorganic materials, so that the heat resistance is the heat resistance temperature of the IC chip 5 (up to 200 ° C as a guarantee of normal operation). However, it is temporarily not broken up to 400 ° C.). Moreover, it has been confirmed that it can withstand an environment of liquid nitrogen at −193 ° C. even at low temperatures.

(2) Second Example As shown in FIGS. 2A and 2B, the electronic tag 1 in the second example includes an upper glass plate 2, a lower glass plate 3, and an existing inlet 11. Yes. In FIG. 2A and FIG. 2B, parts common to those in FIG. 1A and FIG. 1B are denoted by the same reference numerals, and description thereof is omitted as necessary.

  The pair of glass plates 2 and 3 may be made of any one of soda lime glass and Pyrex (registered trademark) glass, respectively. The existing inlet 11 may be one in which the antenna wire 4 and the IC chip 5 are mounted on a film-like resin substrate 12 as an inlet substrate made of a PET film. Specifically, the antenna wire 4 may be formed on at least one surface of the film-like resin substrate 12 in the same manner as in the first embodiment. Further, the IC chip 5 may be bonded to at least one surface of the film-like resin substrate 12 with at least one kind of adhesive such as a silicone adhesive or an epoxy adhesive.

  In order to sandwich and enclose the inlet 11 between the upper and lower glass plates 2 and 3, an adhesive was filled between the inner surface of one of the upper and lower glass plates 2 and 3 and the inlet 11. As this adhesive, a room temperature vulcanizable silicone adhesive having a heat resistance in a temperature range of −40 ° C. to 180 ° C. was used, but it has a relatively high elasticity and a relatively high heat resistance after curing. If so, another adhesive may be used.

At the same time, the same adhesive was filled in the inner surfaces of the other glass plates 2 and 3. As a result, the upper glass plate 2 and the lower glass plate 3 were bonded together. In this bonded state, as shown in FIG. 2B, the upper and lower silicone adhesive layers 13, 14 are between the upper glass plate 2 and the inlet 11, and between the inlet 11 and the lower glass plate 3. And was formed respectively. In this case, the thickness of the silicone adhesive layer 14 on the surface side (ie, the lower side) on which the antenna wire 4 and the IC chip 5 of the inlet 11 are respectively mounted is set to the thickness of the silicone adhesive layer 13 on the other side (ie, the upper side). Can be larger. However, in FIG. 2B, the thicknesses of the upper and lower silicone adhesive layers 13 and 14 are exaggerated. Next, the laminate in the state shown in FIG. 2B composed of the pair of glass plates 2 and 3 and the inlet 11 is placed in a heating furnace and then heated at about 100 ° C. for about 1 hour under a load of about 10 kg / cm ^2. Thus, the silicone adhesive constituting the upper and lower silicone adhesive layers 13 and 14 was cured.

  Since the electronic tag 1 in the second embodiment shown in FIGS. 2A and 2B obtained as described above is covered with a pair of glass plates 2 and 3 and is isolated and protected from the external environment. Has chemical resistance. Further, the heat resistance (for example, up to 180 ° C.) of the existing inlet 11 (in other words, the existing heat-resistant tag) can be approximately the same level of heat resistance (for example, up to 180 ° C.). And since the existing inlet 11 can be used, manufacture is further easier. Further, since the cured silicone adhesive constituting the upper and lower silicone adhesive layers 13 and 14 has elasticity, it is between the pair of glass plates 2 and 3 and the inlet 11 (in other words, The upper and lower silicone adhesive layers 13, 14) have elasticity, so that the inlet 11 is not easily damaged by vibration or the like.

(3) Third Example As shown in FIGS. 3A, 3B, and 3C, the electronic tag 1 in the third example includes an upper glass plate 2, a lower glass plate 3, and an intermediate film 15. It has a laminated glass structure. 3A, FIG. 3B, and FIG. 3C, the same code | symbol is attached | subjected to FIG. 1A and FIG. 1B and a common part, and the description is abbreviate | omitted as needed.

  The pair of glass plates 2 and 3 may be made of any one of soda lime glass and Pyrex (registered trademark) glass, respectively. The intermediate film 15 may be made of any one of PVB (polyvinyl butyral), polyurethane resin, and the like, and is particularly preferably made of PVB.

  Similarly to the case of the film-like resin substrate 12 in the second embodiment shown in FIGS. 2A and 2B, the antenna wire 4 and the IC chip 5 may be mounted on the intermediate film 15, respectively. Specifically, the antenna wire 4 may be formed on at least one surface of the intermediate film 15 in the same manner as in the first embodiment, and in particular, it is made of a thin copper wire. Preferably there is. In addition, the IC chip 5 may be placed or temporarily bonded to at least one surface of the intermediate film 15. The electrical connection between the antenna line 4 and the IC chip 5 can be performed using the described chip-on-glass (COG) technology. Also in this case, as in the case of the first embodiment shown in FIGS. 1A and 1B, a recess for accommodating an IC chip is formed in advance on the inner surface of the lower and / or upper glass plates 3 and 2. be able to.

The upper and lower glass plates 2 and 3 are bonded from the state shown in FIG. 3C to the state shown in FIG. 3B by sandwiching the intermediate film 15 on which the antenna wire 4 and the IC chip 5 are mounted. As in the case of the well-known laminated glass structure, this bonding is shown in FIG. 3B comprising upper and lower glass plates 2 and 3 and an intermediate film 15 on which the antenna wire 4 and the IC chip 5 are mounted. The upper and lower glass plates on both surfaces of the intermediate film 15 are heated at about 140 ° C. for about 20 minutes in a state where a load of about 10 to 15 kg / cm ² is applied after the laminated body in the state is put into a heating furnace. 2 and 3 may be firmly adhered by the adhesive force of the intermediate film 15 itself, and part or all of the antenna wire 4 and the IC chip 5 may be embedded in the intermediate film 15.

  The electronic tag 1 in the third embodiment shown in FIG. 3A and FIG. 3B obtained as described above is covered and protected by the pair of glass plates 2 and 3 from the outside environment. The pair of glass plates 2 and 3 are bonded to each other with an intermediate film 15 on which the antenna wire 4 and the IC chip 5 are respectively mounted. Therefore, in the electronic tag 1 of the third embodiment shown in FIGS. 3A, 3B and 3C as described above, the heat resistance of the intermediate film 15 is as low as, for example, 100 ° C. or less. However, by applying a special treatment such as ultraviolet ray reflection and / or absorption treatment to the laminated glass structure composed of the pair of glass plates 2 and 3 and the intermediate film 15, it is suitable for outdoor use.

It is a top view in the state where illustration of the upper glass board of the electronic tag in the 1st example to which the present invention was applied was omitted. (Example 1) It is sectional drawing along the II line | wire of FIG. 1A. (Example 1) It is a bottom view in the state where illustration of a lower glass board and a lower adhesive layer was omitted of an electronic tag in the 2nd example to which the present invention was applied. (Example 2) It is sectional drawing similar to FIG. 1B along the II-II line | wire of FIG. 2A. (Example 2) It is a bottom view in the state where illustration of a lower glass board was omitted of an electronic tag in the 3rd example to which the present invention is applied. Example 3 FIG. 3B is a cross-sectional view similar to FIG. 1B along the line III-III in FIG. 3A. Example 3 It is sectional drawing in the state before lamination | stacking of the electronic tag shown to FIG. 3B. Example 3

Explanation of symbols

1 electronic tag 2 upper glass plate (first glass plate)
3 Lower glass plate (second glass plate)
4 Antenna wire 5 IC chip 7 IC chip housing recess 12 Film-like resin substrate 15 Intermediate film

Claims (6)

  An electronic tag, wherein an antenna line and an IC chip electrically connected to the antenna line are sandwiched between first and second glass plates stacked on each other. An indentation for accommodating an IC chip provided on the inner surface of at least one of the first and second glass plates, the IC chip accommodated in the indentation, and the first and second glasses The antenna wire provided on the inner surface of at least one of the plates,
The electronic tag according to claim 1, wherein an inner surface of the first glass plate and an inner surface of the second glass plate are bonded with an adhesive.   The electronic tag according to claim 2, wherein the adhesive contains epoxy silane or a hydrolyzed polycondensate thereof as an essential component.   3. The electronic tag according to claim 2, wherein the antenna line is formed by printing a conductive paint. A film-like resin substrate on which the antenna wire and the IC chip electrically connected to the antenna wire are respectively mounted;
The film-like resin substrate is sandwiched between the first and second glass plates by bonding both side surfaces of the film-like resin substrate to the inner surfaces of the first and second glass plates with an adhesive. The electronic tag according to claim 1, wherein: The antenna wire, the IC chip electrically connected to the antenna wire, and an intermediate film,
The antenna wires and the IC chip are connected to the first and second glass plates by bonding the inner surfaces of the first and second glass plates to both side surfaces of the intermediate film by the adhesive force of the intermediate film itself. The electronic tag according to claim 1, wherein the electronic tag is sandwiched between glass plates.

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