WO2009119828A1 - Non-contact data receiver/transmitter - Google Patents

Non-contact data receiver/transmitter Download PDF

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Publication number
WO2009119828A1
WO2009119828A1 PCT/JP2009/056352 JP2009056352W WO2009119828A1 WO 2009119828 A1 WO2009119828 A1 WO 2009119828A1 JP 2009056352 W JP2009056352 W JP 2009056352W WO 2009119828 A1 WO2009119828 A1 WO 2009119828A1
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WO
WIPO (PCT)
Prior art keywords
inlet
base material
adhesive
resin
silicone rubber
Prior art date
Application number
PCT/JP2009/056352
Other languages
French (fr)
Japanese (ja)
Inventor
英二 渋谷
健一 伊藤
孝一 渋谷
仁 加賀谷
芳宏 水谷
教博 大石
Original Assignee
トッパン・フォームズ株式会社
共和工業株式会社
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Publication date
Application filed by トッパン・フォームズ株式会社, 共和工業株式会社 filed Critical トッパン・フォームズ株式会社
Publication of WO2009119828A1 publication Critical patent/WO2009119828A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Definitions

  • the present invention relates to a non-contact type data receiver / transmitter that can receive information from the outside using electromagnetic waves as a medium, such as an information recording medium for RFID (Radio Frequency IDentification), and can transmit information to the outside.
  • a non-contact type data receiving / transmitting body excellent in weather resistance, heat resistance and flexibility, and further excellent in communication characteristics.
  • An IC tag which is an example of a non-contact type data receiving / transmitting body, includes an inlet including a base material, and an antenna and an IC chip that are provided on one surface and connected to each other.
  • the IC tag used in the 13.56 MHz band when an electromagnetic wave from the information writing / reading device is received, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and this IC Information in the chip is converted into a signal, and this signal is transmitted from the antenna of the IC tag.
  • a signal transmitted from the IC tag is received by the antenna of the information writing / reading device, sent to the data processing device via the controller, and data processing such as identification is performed.
  • the inlet is covered with a resin film made of silicone resin, polytetrafluoroethylene resin, etc., molded with resin, and packaged.
  • a resin film made of silicone resin, polytetrafluoroethylene resin, etc.
  • An IC tag has been proposed (see, for example, Patent Document 1).
  • an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged has been proposed (for example, see Patent Document 2).
  • the inlet is sandwiched between the resin films from both sides, and the resin film is melt bonded by heating and pressurizing with a pair of hot rolls. Therefore, when the resin film is bonded, excessive pressure or temperature is applied to the inlet, or the resin film contracts, so that the IC chip constituting the inlet may be damaged or deteriorated.
  • the base material which comprises an inlet also shrink
  • the silicone resin is not only difficult to adhere to other resins and metals, but in this packaged IC tag manufacturing method, the inlet and the resin film are bonded to each other. There is a problem of low adhesion. Therefore, when the bending of the IC tag is repeated, there is a possibility that the IC tag is peeled off at the interface between the inlet and the resin film.
  • the inlet when the inlet is molded only with a resin such as an epoxy resin, the IC chip and the antenna constituting the inlet are not only damaged or deteriorated due to shrinkage when the resin is cured, but the inlet is It is difficult to fix in a state parallel to a reference surface (for example, one of the outer surfaces of the package), and the communication characteristics of the antenna may be deteriorated.
  • a resin such as an epoxy resin
  • the present invention has been made in view of the above circumstances, and is excellent in chemical resistance, weather resistance, heat resistance and flexibility, and further, contactless data transmission / reception that prevents deterioration of communication characteristics generated in an antenna
  • the purpose is to provide a body.
  • a non-contact type data receiving / transmitting body comprises an inlet, an adhesive covering the inlet, and a first base material and a second base material sandwiching the inlet via the adhesive. It is a transmission / reception body.
  • the adhesive is made of liquid silicone rubber, and the first base material and the second base material are made of silicone rubber or vulcanized rubber.
  • the adhesive covering the inlet is made of liquid silicone rubber
  • the first base material and the second base material are made of silicone rubber or vulcanized rubber. Therefore, since the adhesive made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet and covers the outer surface of the inlet without any gaps, the degree of adhesion between the inlet and the adhesive, and the adhesive Adhesion degree with a 1st base material and a 2nd base material becomes high.
  • the non-contact type data transmitting / receiving body of the present invention can be peeled off at the interface between the inlet and the adhesive, and at the interface between the adhesive and the first base material and the second base material, even if the bending is repeated. There is no flexibility. Further, the non-contact type data transmitting / receiving body of the present invention has a high degree of adhesion between the inlet and the adhesive, and an adhesion between the adhesive, the first base material, and the second base material.
  • the inlet is fixed along one surface of the first base material and the one surface of the second base material, which serve as the reference surface, the communication characteristics of the antenna do not deteriorate.
  • FIG. 1A It is a top view which shows one Embodiment of the non-contact-type data transmission / reception body of this invention.
  • 1B is a cross-sectional view taken along the line AA of FIG. 1A, showing an embodiment of the contactless data receiving / transmitting body of the present invention.
  • SYMBOLS 10 Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Adhesive material, 13 ... 1st base material, 14 ... 2nd base material, 15 ... Adhesive material, 16 ... Base material, 17 ... IC chip, 18 ... Antenna, 19, 20 ... Radiation element, 21 ... Short-circuit part.
  • FIG. 1A and 1B are schematic views showing an embodiment of the contactless data receiving / transmitting body of the present invention.
  • FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A.
  • the non-contact type data transmitting / receiving body 10 of this embodiment includes an inlet 11, an adhesive 12 that covers the inlet 11, and a first base material 13 and a second base material that sandwich the inlet 11 via the adhesive material 12. 14.
  • the adhesive 12 is made of liquid silicone rubber
  • the first base material 13 and the second base material 14 are made of silicone rubber or vulcanized rubber.
  • the inlet 11 includes a base material 16, an IC chip 17, and an antenna 18.
  • the IC chip 17 and the antenna 18 are provided on one surface 16a of the substrate 16 and are electrically connected to each other.
  • the antenna 18 is made of various conductors, facing each other, and having a pair of radiating elements 19 and 20 each having a feeding point (a portion connected to the IC chip 17) on the facing side, and the radiating elements 19 and 20.
  • the length in the longitudinal direction of the antenna 18 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band ⁇ UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 18 and 19 is a length corresponding to a quarter wavelength.
  • the outer surface of the inlet 11 is covered with the adhesive 12 in a state where the inlet 11 is attached to one surface 13 a of the first base material 13 via the adhesive material 15. .
  • the surface of the base material 16 of the inlet 11 opposite to the surface on which the IC chip 17 is mounted is attached to one surface 13 a of the first base material 13.
  • the outer surface of the inlet 11 is coat
  • the second base material 14 is superposed on the laminated body composed of the inlet 11 and the first base material 13 via the adhesive 12.
  • the inlet 11, the first base material 13, and the second base material 14 are joined and integrated through the adhesive 12. Thereby, the inlet 11 is being fixed along one surface 13a of the 1st base material 13, and one surface 14a of the 2nd base material 14.
  • the thickness of the adhesive 12 is equal to or greater than the thickness capable of completely covering the outer surface of the inlet 11 and greater than the thickness capable of completely covering the IC chip 17 provided on the one surface 16a of the base material 16. is there.
  • liquid silicone rubber is used as the adhesive 12. This liquid silicone rubber is cured into a rubber-like shape by heating at room temperature or low temperature, and has a relatively fast curing rate.
  • the liquid silicone rubber may be any of various grades of liquid silicone rubber, but in order to prevent the IC chip 17 from deteriorating during curing, those having a curing temperature of room temperature to 40 ° C. are preferable.
  • Various grades manufactured by Toray Dow Corning are used. Examples of the product name include “SE9185”, “SE9186”, “SE9186L”, “SE9206L”, and the like.
  • liquid silicone rubber for example, various grades made by Momentive Performance Materials Japan GK are used.
  • Product names include, for example, “TSE392”, “TSE3925”, “TSE3940”, “TSE3941”, “TSE3945”, “TSE3946”, “XW11-B5320”, “XE11-A5133S”, “TSE3944”, “TSE3853- W ”,“ TSE3971 ”,“ TSE3976-B ”,“ TSE397 ”and the like.
  • the 1st base material 13 and the 2nd base material 14 are comprised from the silicone rubber or vulcanized rubber which has elasticity and flexibility, from the point which is excellent in a weather resistance, heat resistance, chemical resistance, flexibility, etc.
  • Silicone rubber is preferred.
  • the silicone rubber may be any of the millable types, for example, a heat vulcanization type silicone compound manufactured by Toray Dow Corning.
  • vulcanized rubber examples include natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene butadiene rubber (SBR), chloroprene rubber (CR), acrylonitrile butadiene rubber (NBR), and butyl rubber (IIR).
  • EPM Ethylene / propylene rubber
  • U Urethane rubber
  • CSM Chlorosulfonated polyethylene
  • CM Chlorinated polyethylene
  • ACM Acrylic rubber
  • CO, ECO Epiclodrine rubber
  • Fluoro rubber examples include vulcanized rubber such as (FKM).
  • the first base material 13 and the second base material 14 may be either colorless or colored, or may be either transparent or opaque, depending on the use of the non-contact type data receiving / transmitting body 10. And adjusted as appropriate.
  • the adhesive material 15 is not particularly limited, but an adhesive material that has both liquid and solid properties, is always wet, has low fluidity, and maintains its own shape.
  • examples of such an adhesive material include an acrylic resin, a polyurethane resin, an epoxy resin, a urethane resin, a natural rubber adhesive material, a synthetic rubber adhesive material, and a hot melt adhesive material.
  • the base material 16 of the inlet 11 includes at least a surface layer portion such as a woven fabric, a non-woven fabric, a mat, paper, or a combination thereof made of inorganic fibers such as glass fibers and alumina fibers, polyester fibers, polyamide fibers, and the like.
  • the IC chip 17 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 18. Anything applicable to RFID media such as an IC card can be used.
  • the antenna 18 is formed by screen printing in a predetermined pattern on one surface 16a of the base material 16 using polymer-type conductive ink, or by etching a conductive foil, or by metal plating. It will be.
  • polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
  • the polymer type conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 18 at 200 ° C. or less, for example, about 100 to 150 ° C.
  • the electric path of the coating film forming the antenna 18 is formed by the contact of the conductive fine particles forming the coating film with each other, and the resistance value of the coating film is on the order of 10 ⁇ 5 ⁇ ⁇ cm.
  • known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.
  • the photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved.
  • the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 mass of conductive fine particles.
  • % Or more and 10% by mass or more of a polyester resin that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, that is, a crosslinkable type or a crosslinkable / heatable type
  • a plastic combination type is preferably used.
  • Examples of the conductive foil forming the antenna 18 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil. Furthermore, examples of the metal plating that forms the antenna 18 include copper plating, silver plating, gold plating, and platinum plating.
  • the adhesive 12 covering the inlet 11 is made of liquid silicone rubber
  • the second substrate 14 is made of silicone rubber or vulcanized rubber. Therefore, the adhesive 12 made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet 11 and covers the outer surface of the inlet 11 without any gaps. Therefore, the degree of adhesion between the inlet 11 and the adhesive 12, In addition, the degree of adhesion between the adhesive material 12, the first base material 13, and the second base material 14 is increased.
  • the inlet 11 covered with the liquid silicone rubber is sandwiched between the first base material 13 and the second base material 14 made of solid silicone rubber or vulcanized rubber having high affinity with the liquid silicone rubber, The degree of adhesion between the one base material 13 and the second base material 14 is increased. Therefore, the non-contact type data receiving / transmitting body 10 is peeled off at the interface between the inlet 11 and the adhesive material 12 and at the interface between the adhesive material 12 and the first base material 13 and the second base material 14 even if the bending is repeated. It is excellent in flexibility without causing any troubles.
  • the non-contact type data receiving / transmitting body 10 since the non-contact type data receiving / transmitting body 10 has a high degree of adhesion between the constituent members as described above, water, oil, chemicals and the like are prevented from entering the inlet 11 from the outside, and the chemical resistance and Excellent weather resistance. Furthermore, since the inlet 11 is fixed along the one surface 13a of the first base material 13 and the one surface 14a of the second base material 14 that serve as a reference surface, the communication characteristics of the antenna 18 may deteriorate. Absent.
  • non-contact type data receiving / transmitting body of the present invention is not limited to the non-contact type data receiving / transmitting body 10 described above.
  • a pair of attachment holes may be provided so as to penetrate in the thickness direction of the adhesive, the first base material, and the second base material and sandwich the inlet. This attachment hole is used for attaching a non-contact type data receiving / transmitting body to an article to be attached.
  • the non-contact type data receiving / transmitting body 10 in which the antenna 18 is a dipole antenna is illustrated, but the non-contact type data receiving / transmitting body of the present invention is not limited to this.
  • the antenna may be a monopole antenna, a cross dipole antenna, or the like.
  • print information for identifying the non-contact type data receiving / transmitting body, and other print information made up of arbitrary characters, patterns or images may be provided.
  • the first base material and the second base material are formed with a colorless and transparent material.
  • the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment is demonstrated.
  • the surface of the base material 16 of the inlet 11 on which the IC chip 17 is mounted is the upper surface (non-stick surface), and the inlet 11 is placed on one surface 13 a of the first base material 13 via the adhesive material 15.
  • liquid silicone rubber is applied to the outer surface of the inlet 11 on the first substrate 13. At this time, the application amount of the liquid silicone rubber is not less than an amount capable of completely covering the outer surface of the inlet 11, and the IC chip 17 mounted on the one surface 16a of the substrate 16 can be completely covered. Make it more than you can.
  • the second base material 14 is superposed on the laminate composed of the inlet 11 and the first base material 13 via liquid silicone rubber.
  • the composition composed of the inlet 11, the first base material 13, the second base material 14, and the liquid silicone rubber is allowed to stand at room temperature for about 30 minutes to 48 hours, or at 30 ° C. to 60 ° C.
  • the liquid silicone rubber is cured by heating for about 30 minutes to 24 hours and the solvent is volatilized to form the adhesive 12, thereby obtaining the non-contact type data transmitter / receiver 10 shown in FIG.
  • the non-contact type data receiving / transmitting body of the present invention can be applied to applications in which a metal article or an article containing moisture is directly attached in addition to a non-metallic substance.
  • non-contact type data receiving / transmitting body which is excellent in chemical resistance, weather resistance, heat resistance and flexibility and further prevents deterioration in communication characteristics generated in the antenna.

Abstract

Disclosed is a non-contact data receiver/transmitter (10) that is provided with: an inlet (11), an adhesive (12) that coats the inlet, and a first substrate (13) and a second substrate (14) that sandwich the inlet with the adhesive therebetween. The adhesive comprises a liquid silicone rubber, and the first and second substrates comprise a silicone rubber or a vulcanized rubber. The non-contact data receiver/transmitter has excellent flexibility and resistance to chemicals, weather, and heat. Thus, it is possible to prevent decreases in the communication characteristics of an antenna.

Description

非接触型データ受送信体Non-contact data transmitter / receiver
　本発明は、ＲＦＩＤ（Ｒａｄｉｏ　Ｆｒｅｑｕｅｎｃｙ　ＩＤｅｎｔｉｆｉｃａｔｉｏｎ）用途の情報記録メディアのように、電磁波を媒体として外部から情報を受信し、また外部に情報を送信できるようにした非接触型データ受送信体に関し、特に、耐候性、耐熱性および柔軟性に優れ、さらには、通信特性に優れる非接触型データ受送信体に関する。
　本願は、２００８年３月２７日に日本に出願された特願２００８－８４８１５号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a non-contact type data receiver / transmitter that can receive information from the outside using electromagnetic waves as a medium, such as an information recording medium for RFID (Radio Frequency IDentification), and can transmit information to the outside. In addition, the present invention relates to a non-contact type data receiving / transmitting body excellent in weather resistance, heat resistance and flexibility, and further excellent in communication characteristics.
This application claims priority based on Japanese Patent Application No. 2008-84815 for which it applied to Japan on March 27, 2008, and uses the content here.
　非接触型データ受送信体の一例であるＩＣタグは、基材と、その一方の面に設けられ互いに接続されたアンテナおよびＩＣチップとから構成されるインレットを備えている。１３．５６ＭＨｚ帯で使用するＩＣタグでは、情報書込／読出装置からの電磁波を受信すると共振作用によりアンテナに起電力が発生し、この起電力によりＩＣタグ内のＩＣチップが起動し、このＩＣチップ内の情報を信号化し、この信号がＩＣタグのアンテナから発信される。
　ＩＣタグから発信された信号は、情報書込／読出装置のアンテナで受信され、コントローラーを介してデータ処理装置へ送られ、識別などのデータ処理が行われる。 An IC tag, which is an example of a non-contact type data receiving / transmitting body, includes an inlet including a base material, and an antenna and an IC chip that are provided on one surface and connected to each other. In the IC tag used in the 13.56 MHz band, when an electromagnetic wave from the information writing / reading device is received, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and this IC Information in the chip is converted into a signal, and this signal is transmitted from the antenna of the IC tag.
A signal transmitted from the IC tag is received by the antenna of the information writing / reading device, sent to the data processing device via the controller, and data processing such as identification is performed.
　このようなＩＣタグを耐熱性、耐候性および柔軟性に優れたものとするために、インレットを、シリコーン樹脂やポリテトラフルオロエチレン樹脂などからなる樹脂フィルムによって被覆して樹脂でモールドし、パッケージ化したＩＣタグが提案されている（例えば、特許文献１参照）。
　また、インレットをエポキシ樹脂などの樹脂のみでモールドし、パッケージ化したＩＣタグが提案されている（例えば、特許文献２参照）。
特開２００２－２４７８３号公報 特開２００２－３１２７４７号公報 In order to make such an IC tag excellent in heat resistance, weather resistance and flexibility, the inlet is covered with a resin film made of silicone resin, polytetrafluoroethylene resin, etc., molded with resin, and packaged. An IC tag has been proposed (see, for example, Patent Document 1).
In addition, an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged has been proposed (for example, see Patent Document 2).
JP 2002-24783 A JP 2002-31747 A
　上記のような樹脂モールドでは、インレットを、その両面から樹脂フィルムで挟み、この樹脂フィルムを、一対の熱ロールで加熱、加圧することにより溶融接着している。そのため、樹脂フィルムの接着の際、インレットに過剰な圧力や温度が加えられたり、樹脂フィルムが収縮したりするので、インレットを構成するＩＣチップが破損や劣化することがある。
　また、加熱により、インレットを構成する基材も収縮して、アンテナの通信特性が低下するという問題がある。
　さらに、シリコーン樹脂は、他の樹脂や金属などと接着し難いばかりでなく、このパッケージ化したＩＣタグの製造方法では、インレットと樹脂フィルムとの接合は、固体同士の接合であるため、両者の密着度が低いという問題がある。したがって、このＩＣタグの曲げを繰り返すと、インレットと樹脂フィルムとの界面で剥離する可能性がある。 In the resin mold as described above, the inlet is sandwiched between the resin films from both sides, and the resin film is melt bonded by heating and pressurizing with a pair of hot rolls. Therefore, when the resin film is bonded, excessive pressure or temperature is applied to the inlet, or the resin film contracts, so that the IC chip constituting the inlet may be damaged or deteriorated.
Moreover, the base material which comprises an inlet also shrink | contracts by heating, and there exists a problem that the communication characteristic of an antenna falls.
Furthermore, the silicone resin is not only difficult to adhere to other resins and metals, but in this packaged IC tag manufacturing method, the inlet and the resin film are bonded to each other. There is a problem of low adhesion. Therefore, when the bending of the IC tag is repeated, there is a possibility that the IC tag is peeled off at the interface between the inlet and the resin film.
　また、インレットをエポキシ樹脂などの樹脂のみでモールドした場合、樹脂が硬化する際の収縮により、インレットを構成するＩＣチップやアンテナが破損したり、劣化するばかりでなく、モールド樹脂内において、インレットを基準面（例えば、パッケージの外面の１つ）に対して平行な状態で固定することが難しく、アンテナの通信特性が低下することがある。 In addition, when the inlet is molded only with a resin such as an epoxy resin, the IC chip and the antenna constituting the inlet are not only damaged or deteriorated due to shrinkage when the resin is cured, but the inlet is It is difficult to fix in a state parallel to a reference surface (for example, one of the outer surfaces of the package), and the communication characteristics of the antenna may be deteriorated.
　本発明は、上記事情に鑑みてなされたものであって、耐薬品性、耐候性、耐熱性および柔軟性に優れ、さらには、アンテナに生じる通信特性の低下を防止した非接触型データ受送信体を提供することを目的とする。 The present invention has been made in view of the above circumstances, and is excellent in chemical resistance, weather resistance, heat resistance and flexibility, and further, contactless data transmission / reception that prevents deterioration of communication characteristics generated in an antenna The purpose is to provide a body.
　本発明の非接触型データ受送信体は、インレットと、インレットを被覆する接着材と、接着材を介して前記インレットを挟む第一基材および第二基材と、を備えた非接触型データ受送信体である。また、前記接着材は液状シリコーンゴムからなり、前記第一基材および前記第二基材はシリコーンゴムまたは加硫ゴムからなる。 A non-contact type data receiving / transmitting body according to the present invention comprises an inlet, an adhesive covering the inlet, and a first base material and a second base material sandwiching the inlet via the adhesive. It is a transmission / reception body. The adhesive is made of liquid silicone rubber, and the first base material and the second base material are made of silicone rubber or vulcanized rubber.
　本発明の非接触型データ受送信体では、インレットを被覆する接着材が液状シリコーンゴムからなり、前記第一基材および前記第二基材がシリコーンゴムまたは加硫ゴムからなる。そのため、硬化前は液体である液状シリコーンゴムからなる接着材がインレットの外形形状に追従し、インレットの外面を隙間なく被覆しているから、インレットと接着材との密着度、並びに、接着材と第一基材および第二基材との密着度が高くなる。また、液状シリコーンゴムと親和性の高い固体のシリコーンゴムまたは加硫ゴムからなる第一基材および第二基材により、液状シリコーンゴムで被覆したインレットを挟み込むので、接着材と第一基材および第二基材との密着度が高くなる。したがって、本発明の非接触型データ受送信体は、曲げを繰り返しても、インレットと接着材との界面、並びに、接着材と第一基材および第二基材との界面で剥離することがなく、柔軟性に優れている。また、本発明の非接触型データ受送信体は、インレットと接着材との密着度、並びに、接着材と第一基材および第二基材との密着度が高い。そのため、外部からインレットに、水、油、薬品などが浸入することが防止され、耐薬品性および耐候性に優れている。さらに、インレットが、基準面となる第一基材の一方の面および第二基材の一方の面に沿って固定されているから、アンテナの通信特性が低下することがない。 In the contactless data transmitting / receiving body of the present invention, the adhesive covering the inlet is made of liquid silicone rubber, and the first base material and the second base material are made of silicone rubber or vulcanized rubber. Therefore, since the adhesive made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet and covers the outer surface of the inlet without any gaps, the degree of adhesion between the inlet and the adhesive, and the adhesive Adhesion degree with a 1st base material and a 2nd base material becomes high. In addition, since the inlet covered with the liquid silicone rubber is sandwiched between the first base material and the second base material made of solid silicone rubber or vulcanized rubber having high affinity with the liquid silicone rubber, the adhesive and the first base material and The degree of adhesion with the second substrate is increased. Therefore, the non-contact type data transmitting / receiving body of the present invention can be peeled off at the interface between the inlet and the adhesive, and at the interface between the adhesive and the first base material and the second base material, even if the bending is repeated. There is no flexibility. Further, the non-contact type data transmitting / receiving body of the present invention has a high degree of adhesion between the inlet and the adhesive, and an adhesion between the adhesive, the first base material, and the second base material. For this reason, water, oil, chemicals, and the like are prevented from entering the inlet from the outside, and the chemical resistance and weather resistance are excellent. Furthermore, since the inlet is fixed along one surface of the first base material and the one surface of the second base material, which serve as the reference surface, the communication characteristics of the antenna do not deteriorate.
本発明の非接触型データ受送信体の一実施形態を示す平面図である。It is a top view which shows one Embodiment of the non-contact-type data transmission / reception body of this invention. 本発明の非接触型データ受送信体の一実施形態を示す、図１ＡのＡ－Ａ線に沿う断面図である。1B is a cross-sectional view taken along the line AA of FIG. 1A, showing an embodiment of the contactless data receiving / transmitting body of the present invention.
符号の説明Explanation of symbols
１０・・・非接触型データ受送信体、１１・・・インレット、１２・・・接着材、１３・・・第一基材、１４・・・第二基材、１５・・・粘着材、１６・・・基材、１７・・・ＩＣチップ、１８・・・アンテナ、１９，２０・・・放射素子、２１・・・短絡部。 DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Adhesive material, 13 ... 1st base material, 14 ... 2nd base material, 15 ... Adhesive material, 16 ... Base material, 17 ... IC chip, 18 ... Antenna, 19, 20 ... Radiation element, 21 ... Short-circuit part.
　本発明の非接触型データ受送信体の最良の形態について説明する。
　なお、この形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。 The best mode of the contactless data receiving / transmitting body of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.
　図１Ａおよび図１Ｂは、本発明の非接触型データ受送信体の一実施形態を示す概略図であり、図１Ａは平面図、図１Ｂは図１ＡのＡ－Ａ線に沿う断面図である。
　この実施形態の非接触型データ受送信体１０は、インレット１１と、このインレット１１を被覆する接着材１２と、この接着材１２を介してインレット１１を挟む第一基材１３および第二基材１４とから概略構成されている。
　また、接着材１２は液状シリコーンゴムから構成され、第一基材１３および第二基材１４はシリコーンゴムまたは加硫ゴムから構成されている。 1A and 1B are schematic views showing an embodiment of the contactless data receiving / transmitting body of the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A. .
The non-contact type data transmitting / receiving body 10 of this embodiment includes an inlet 11, an adhesive 12 that covers the inlet 11, and a first base material 13 and a second base material that sandwich the inlet 11 via the adhesive material 12. 14.
The adhesive 12 is made of liquid silicone rubber, and the first base material 13 and the second base material 14 are made of silicone rubber or vulcanized rubber.
　インレット１１は、基材１６と、ＩＣチップ１７と、アンテナ１８とから概略構成されている。また、ＩＣチップ１７およびアンテナ１８は、基材１６の一方の面１６ａに設けられ、互いに電気的に接続されている。
　アンテナ１８は、各種導電体からなり、互いに対向し、その対向する側にそれぞれ給電点（ＩＣチップ１７と接続している部分）を有する一対の放射素子１９，２０と、放射素子１９，２０の給電点近傍を短絡する短絡部２１とからなるダイポールアンテナである。
　アンテナ１８の長手方向における長さは、非接触ＩＣカードなどの非接触ＩＣモジュールに利用できる極超短波帯〈ＵＨＦ〉やマイクロ波帯の電波帯の周波数（３００ＭＨｚ～３０ＧＨｚ）の１／２波長に相当する長さとなっている。すなわち、放射素子１８，１９の長手方向における長さは、１／４波長に相当する長さとなっている。 The inlet 11 includes a base material 16, an IC chip 17, and an antenna 18. The IC chip 17 and the antenna 18 are provided on one surface 16a of the substrate 16 and are electrically connected to each other.
The antenna 18 is made of various conductors, facing each other, and having a pair of radiating elements 19 and 20 each having a feeding point (a portion connected to the IC chip 17) on the facing side, and the radiating elements 19 and 20. This is a dipole antenna including a short-circuit portion 21 that short-circuits the vicinity of the feeding point.
The length in the longitudinal direction of the antenna 18 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 18 and 19 is a length corresponding to a quarter wavelength.
　非接触型データ受送信体１０では、インレット１１が、第一基材１３の一方の面１３ａに、粘着材１５を介して貼着された状態で、接着材１２によりその外面が被覆されている。このとき、インレット１１の基材１６におけるＩＣチップ１７が実装されている面と反対側の面が、第一基材１３の一方の面１３ａに貼着されている。そして、インレット１１の外面は、液状シリコーンゴムからなる接着材１２により、隙間なく（インレット１１と接着材１２の間に隙間なく）被覆されている。
　また、第二基材１４が、インレット１１と第一基材１３からなる積層体に、接着材１２を介して重ね合わせられている。さらに、インレット１１、第一基材１３および第二基材１４が、接着材１２を介して接合され、一体化されている。
　これにより、インレット１１が、第一基材１３の一方の面１３ａおよび第二基材１４の一方の面１４ａに沿って固定されている。 In the non-contact type data receiving / transmitting body 10, the outer surface of the inlet 11 is covered with the adhesive 12 in a state where the inlet 11 is attached to one surface 13 a of the first base material 13 via the adhesive material 15. . At this time, the surface of the base material 16 of the inlet 11 opposite to the surface on which the IC chip 17 is mounted is attached to one surface 13 a of the first base material 13. And the outer surface of the inlet 11 is coat | covered by the adhesive material 12 which consists of liquid silicone rubbers without a gap (no gap between the inlet 11 and the adhesive material 12).
Further, the second base material 14 is superposed on the laminated body composed of the inlet 11 and the first base material 13 via the adhesive 12. Further, the inlet 11, the first base material 13, and the second base material 14 are joined and integrated through the adhesive 12.
Thereby, the inlet 11 is being fixed along one surface 13a of the 1st base material 13, and one surface 14a of the 2nd base material 14. FIG.
　接着材１２の厚みは、インレット１１の外面を完全に被覆することができる厚み以上であるとともに、基材１６の一方の面１６ａに設けられたＩＣチップ１７を完全に覆うことができる厚み以上である。 The thickness of the adhesive 12 is equal to or greater than the thickness capable of completely covering the outer surface of the inlet 11 and greater than the thickness capable of completely covering the IC chip 17 provided on the one surface 16a of the base material 16. is there.
　接着材１２としては、液状シリコーンゴムが用いられる。この液状シリコーンゴムは、室温あるいは低温加熱により、ゴム状に硬化するものであり、硬化速度が比較的速いものである。
　液状シリコーンゴムとしては、液状シリコーンゴムの各種グレードの全般の何れでもよいが、硬化時にＩＣチップ１７が劣化するのを防止するために、硬化温度が室温以上、４０℃以下のものが好ましく、例えば、東レ・ダウコーニング社製の各種グレードのものが用いられる。製品名としては、例えば、「ＳＥ９１８５」、「ＳＥ９１８６」、「ＳＥ９１８６Ｌ」、「ＳＥ９２０６Ｌ」などが挙げられる。 As the adhesive 12, liquid silicone rubber is used. This liquid silicone rubber is cured into a rubber-like shape by heating at room temperature or low temperature, and has a relatively fast curing rate.
The liquid silicone rubber may be any of various grades of liquid silicone rubber, but in order to prevent the IC chip 17 from deteriorating during curing, those having a curing temperature of room temperature to 40 ° C. are preferable. Various grades manufactured by Toray Dow Corning are used. Examples of the product name include “SE9185”, “SE9186”, “SE9186L”, “SE9206L”, and the like.
　あるいは、このような液状シリコーンゴムとしては、例えば、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製の各種グレードのものが用いられる。製品名としては、例えば、「ＴＳＥ３９２」、「ＴＳＥ３９２５」、「ＴＳＥ３９４０」、「ＴＳＥ３９４１」、「ＴＳＥ３９４５」、「ＴＳＥ３９４６」、「ＸＷ１１-Ｂ５３２０」、「ＸＥ１１-Ａ５１３３Ｓ」、「ＴＳＥ３９４４」、「ＴＳＥ３８５３-Ｗ」、「ＴＳＥ３９７１」、「ＴＳＥ３９７６-Ｂ」、「ＴＳＥ３９７」などが挙げられる。 Alternatively, as such a liquid silicone rubber, for example, various grades made by Momentive Performance Materials Japan GK are used. Product names include, for example, “TSE392”, “TSE3925”, “TSE3940”, “TSE3941”, “TSE3945”, “TSE3946”, “XW11-B5320”, “XE11-A5133S”, “TSE3944”, “TSE3853- W ”,“ TSE3971 ”,“ TSE3976-B ”,“ TSE397 ”and the like.
　第一基材１３、第二基材１４は、弾性および可撓性を有するシリコーンゴムまたは加硫ゴムから構成されるが、耐候性、耐熱性、耐薬品性、柔軟性などに優れる点から、シリコーンゴムが好ましい。
　シリコーンゴムとしては、ミラブル型タイプの何れでもよく、例えば、東レ・ダウコーニング社製の熱加硫型のシリコーンコンパウンドが用いられる。製品名としては、「ＳＨ８３１Ｕ」、「ＳＨ８４１Ｕ」、「ＳＨ８５１Ｕ」、「ＳＨ８６１Ｕ」、「ＳＨ８７１Ｕ」、「ＳＨ８８１Ｕ」、「ＳＨ３５Ｕ」、「ＳＨ５５ＵＡ」、「ＳＨ７５ＵＮ」、「ＳＥ４７０５Ｕ」、「ＳＥ４７０６Ｕ」、「ＳＥ１１８５Ｕ」、「ＳＥ１１８６Ｕ」、「ＳＥ１１８７Ｕ」、「ＳＨ５０２Ｕ　Ａ／Ｂ」、「ＤＹ３２－１００５Ｕ」、「ＤＹ３２－１０００Ｕ」、「ＤＹ３２－５０１３Ｕ」、「ＤＹ３２－６０１４Ｕ」、「ＤＹ３２－７０４０Ｕ」、「ＤＹ３２－８０１３Ｕ」、「ＳＨ７４５Ｕ」、「ＳＨ７４６Ｕ」、「ＳＨ７４７Ｕ」などが挙げられる。
　加硫ゴムとしては、例えば、天然ゴム（ＮＲ）、イソプレンゴム（ＩＲ）、ブタジエンゴム（ＢＲ）、スチレンブタジエンゴム（ＳＢＲ）、クロロプレンゴム（ＣＲ）、アクリロニトリルブタジエンゴム（ＮＢＲ）、ブチルゴム（ＩＩＲ）、エチレン・プロピレンゴム（ＥＰＭ、ＥＰＤＭ）、ウレタンゴム（Ｕ）、クロロスルホン化ポリエチレン（ＣＳＭ）、塩素化ポリエチレン（ＣＭ）、アクリルゴム（ＡＣＭ）、エピクロドリンゴム（ＣＯ、ＥＣＯ）、フッ素ゴム（ＦＫＭ）などのゴムを加硫したものが挙げられる。
　また、第一基材１３、第二基材１４は、無色あるいは有色のいずれであっても、また、透明あるいは不透明のいずれであってもよく、非接触型データ受送信体１０の用途に応じて、適宜調整される。 Although the 1st base material 13 and the 2nd base material 14 are comprised from the silicone rubber or vulcanized rubber which has elasticity and flexibility, from the point which is excellent in a weather resistance, heat resistance, chemical resistance, flexibility, etc., Silicone rubber is preferred.
The silicone rubber may be any of the millable types, for example, a heat vulcanization type silicone compound manufactured by Toray Dow Corning. Product names include “SH831U”, “SH841U”, “SH851U”, “SH861U”, “SH871U”, “SH881U”, “SH35U”, “SH55UA”, “SH75UN”, “SE4705U”, “SE4706U”, “SE4706U” SE1185U, SE1186U, SE1187U, SH502U A / B, DY32-1005U, DY32-1000U, DY32-5013U, DY32-6014U, DY32-7040U, DY32 -8013U "," SH745U "," SH746U "," SH747U ", and the like.
Examples of vulcanized rubber include natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene butadiene rubber (SBR), chloroprene rubber (CR), acrylonitrile butadiene rubber (NBR), and butyl rubber (IIR). , Ethylene / propylene rubber (EPM, EPDM), Urethane rubber (U), Chlorosulfonated polyethylene (CSM), Chlorinated polyethylene (CM), Acrylic rubber (ACM), Epiclodrine rubber (CO, ECO), Fluoro rubber Examples include vulcanized rubber such as (FKM).
Further, the first base material 13 and the second base material 14 may be either colorless or colored, or may be either transparent or opaque, depending on the use of the non-contact type data receiving / transmitting body 10. And adjusted as appropriate.
　粘着材１５としては、特に限定されないが、液体と固体の両方の性質を有し、常に濡れた状態にあり、流動性が低く、それ自体の形状を保持する粘着材が用いられる。このような粘着材としては、アクリル樹脂、ポリウレタン樹脂、エポキシ樹脂、ウレタン樹脂、天然ゴム系粘着材、合成ゴム系粘着材、ホットメルト粘着材などが挙げられる。 The adhesive material 15 is not particularly limited, but an adhesive material that has both liquid and solid properties, is always wet, has low fluidity, and maintains its own shape. Examples of such an adhesive material include an acrylic resin, a polyurethane resin, an epoxy resin, a urethane resin, a natural rubber adhesive material, a synthetic rubber adhesive material, and a hot melt adhesive material.
　インレット１１の基材１６としては、その少なくとも表層部には、ガラス繊維、アルミナ繊維などの無機繊維からなる織布、不織布、マット、紙などまたはこれらを組み合わせたもの、ポリエステル繊維、ポリアミド繊維などの有機繊維からなる織布、不織布、マット、紙などまたはこれらを組み合わせたものや、あるいはこれらに樹脂ワニスを含浸させて成形した被覆部材や、ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリオレフィン系樹脂基材、ポリイミド系樹脂基材、エチレン－ビニルアルコール共重合体基材、ポリビニルアルコール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリカーボネート系樹脂基材、アクリロニトリルブタジエンスチレン共重合系樹脂基材、ポリエーテルスルホン系樹脂基材、（ガラス）エポキシ樹脂基材などのプラスチック基材や、あるいはこれらにマット処理、コロナ放電処理、プラズマ処理、紫外線照射処理、電子線照射処理、フレームプラズマ処理、オゾン処理、または各種易接着処理などの表面処理を施したものなどの公知のものから選択して用いられる。これらの中でも、ポリエチレンテレフタレートまたはポリイミドからなる電気絶縁性のフィルムまたはシートが好適に用いられる。 The base material 16 of the inlet 11 includes at least a surface layer portion such as a woven fabric, a non-woven fabric, a mat, paper, or a combination thereof made of inorganic fibers such as glass fibers and alumina fibers, polyester fibers, polyamide fibers, and the like. Woven fabrics made of organic fibers, nonwoven fabrics, mats, paper, etc., or combinations thereof, or coated members formed by impregnating them with resin varnish, polyamide resin base materials, polyester resin base materials, polyolefin base materials Resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate Resin base material, acrylonitrile butadiene styrene copolymer resin base material Plastic base materials such as polyethersulfone resin base materials, (glass) epoxy resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing. Or it selects from well-known things, such as what gave surface treatments, such as various easily bonding processes, and is used. Among these, an electrically insulating film or sheet made of polyethylene terephthalate or polyimide is preferably used.
　ＩＣチップ１７としては、特に限定されず、アンテナ１８を介して非接触状態にて情報の書き込みおよび読み出しが可能なものであれば、非接触型ＩＣタグや非接触型ＩＣラベル、あるいは非接触型ＩＣカードなどのＲＦＩＤメディアに適用可能なものであればいかなるものでも用いられる。 The IC chip 17 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 18. Anything applicable to RFID media such as an IC card can be used.
　アンテナ１８は、基材１６の一方の面１６ａにポリマー型導電インクを用いて所定のパターン状にスクリーン印刷により形成されてなるものか、もしくは、導電性箔をエッチングしてなるもの、金属メッキしてなるものである。 The antenna 18 is formed by screen printing in a predetermined pattern on one surface 16a of the base material 16 using polymer-type conductive ink, or by etching a conductive foil, or by metal plating. It will be.
　ポリマー型導電インクとしては、例えば、銀粉末、金粉末、白金粉末、アルミニウム粉末、パラジウム粉末、ロジウム粉末、カーボン粉末（カーボンブラック、カーボンナノチューブなど）などの導電微粒子が樹脂組成物に配合されたものが挙げられる。 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
　樹脂組成物として熱硬化型樹脂を用いれば、ポリマー型導電インクは、２００℃以下、例えば１００～１５０℃程度でアンテナ１８をなす塗膜を形成することができる熱硬化型となる。アンテナ１８をなす塗膜の電気の流れる経路は、塗膜をなす導電微粒子が互いに接触することによる形成され、この塗膜の抵抗値は１０-5Ω・ｃｍオーダーである。
　また、本発明におけるポリマー型導電インクとしては、熱硬化型の他にも、光硬化型、浸透乾燥型、溶剤揮発型といった公知のものが用いられる。 When a thermosetting resin is used as the resin composition, the polymer type conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 18 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric path of the coating film forming the antenna 18 is formed by the contact of the conductive fine particles forming the coating film with each other, and the resistance value of the coating film is on the order of 10 −5 Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.
　光硬化型のポリマー型導電インクは、光硬化性樹脂を樹脂組成物に含むものであり、硬化時間が短いので、製造効率を向上させることができる。光硬化型のポリマー型導電インクとしては、例えば、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性樹脂（特にポリエステルとイソシアネートによる架橋系樹脂など）とのブレンド樹脂組成物に、導電微粒子が６０質量％以上配合され、ポリエステル樹脂が１０質量％以上配合されたもの、すなわち、溶剤揮発型かあるいは架橋／熱可塑併用型（ただし熱可塑型が５０質量％以上である）のものや、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性樹脂（特にポリエステルとイソシアネートによる架橋系樹脂など）とのブレンド樹脂組成物に、ポリエステル樹脂が１０質量％以上配合されたもの、すなわち、架橋型かあるいは架橋／熱可塑併用型のものなどが好適に用いられる。 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 mass of conductive fine particles. % Or more and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, that is, a crosslinkable type or a crosslinkable / heatable type A plastic combination type is preferably used.
　また、アンテナ１８をなす導電性箔としては、銅箔、銀箔、金箔、白金箔、アルミニウム箔などが挙げられる。
　さらに、アンテナ１８をなす金属メッキとしては、銅メッキ、銀メッキ、金メッキ、白金メッキなどが挙げられる。 Examples of the conductive foil forming the antenna 18 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 18 include copper plating, silver plating, gold plating, and platinum plating.
　この実施形態の非接触型データ受送信体１０では、上記の通り、インレット１１を被覆する接着材１２が液状シリコーンゴムからなり、この接着材１２を介してインレット１１を挟む第一基材１３および第二基材１４がシリコーンゴムまたは加硫ゴムからなる。そのため、硬化前は液体である液状シリコーンゴムからなる接着材１２がインレット１１の外形形状に追従し、インレット１１の外面を隙間なく被覆しているから、インレット１１と接着材１２との密着度、並びに、接着材１２と第一基材１３および第二基材１４との密着度が高くなる。また、液状シリコーンゴムと親和性の高い固体のシリコーンゴムまたは加硫ゴムからなる第一基材１３および第二基材１４により、液状シリコーンゴムで被覆したインレット１１を挟み込むので、接着材１２と第一基材１３および第二基材１４との密着度が高くなる。したがって、非接触型データ受送信体１０は、曲げを繰り返しても、インレット１１と接着材１２との界面、並びに、接着材１２と第一基材１３および第二基材１４との界面で剥離するという不具合が生じることがなく、柔軟性に優れている。また、非接触型データ受送信体１０は、前記のように構成部材間の密着度が高いから、外部からインレット１１に、水、油、薬品などが浸入することが防止され、耐薬品性および耐候性に優れている。さらに、インレット１１が、基準面となる第一基材１３の一方の面１３ａおよび第二基材１４の一方の面１４ａに沿って固定されているから、アンテナ１８の通信特性が低下することがない。 In the non-contact type data receiving / transmitting body 10 of this embodiment, as described above, the adhesive 12 covering the inlet 11 is made of liquid silicone rubber, and the first base material 13 sandwiching the inlet 11 via the adhesive 12 and The second substrate 14 is made of silicone rubber or vulcanized rubber. Therefore, the adhesive 12 made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet 11 and covers the outer surface of the inlet 11 without any gaps. Therefore, the degree of adhesion between the inlet 11 and the adhesive 12, In addition, the degree of adhesion between the adhesive material 12, the first base material 13, and the second base material 14 is increased. In addition, since the inlet 11 covered with the liquid silicone rubber is sandwiched between the first base material 13 and the second base material 14 made of solid silicone rubber or vulcanized rubber having high affinity with the liquid silicone rubber, The degree of adhesion between the one base material 13 and the second base material 14 is increased. Therefore, the non-contact type data receiving / transmitting body 10 is peeled off at the interface between the inlet 11 and the adhesive material 12 and at the interface between the adhesive material 12 and the first base material 13 and the second base material 14 even if the bending is repeated. It is excellent in flexibility without causing any troubles. In addition, since the non-contact type data receiving / transmitting body 10 has a high degree of adhesion between the constituent members as described above, water, oil, chemicals and the like are prevented from entering the inlet 11 from the outside, and the chemical resistance and Excellent weather resistance. Furthermore, since the inlet 11 is fixed along the one surface 13a of the first base material 13 and the one surface 14a of the second base material 14 that serve as a reference surface, the communication characteristics of the antenna 18 may deteriorate. Absent.
　なお、本発明の非接触型データ受送信体は、上記の非接触型データ受送信体１０に限定されない。本発明の非接触型データ受送信体にあっては、接着材、第一基材および第二基材の厚み方向に貫通し、インレットを挟んで一対の取付孔が設けられてもよい。この取付孔は、取り付け対象となる物品に非接触型データ受送信体を取り付けるために用いられる。 Note that the non-contact type data receiving / transmitting body of the present invention is not limited to the non-contact type data receiving / transmitting body 10 described above. In the non-contact type data transmitting / receiving body of the present invention, a pair of attachment holes may be provided so as to penetrate in the thickness direction of the adhesive, the first base material, and the second base material and sandwich the inlet. This attachment hole is used for attaching a non-contact type data receiving / transmitting body to an article to be attached.
　また、この実施形態では、アンテナ１８がダイポールアンテナである非接触型データ受送信体１０を例示したが、本発明の非接触型データ受送信体はこれに限定されない。本発明の非接触型データ受送信体にあっては、アンテナがモノポールアンテナ、クロスダイポールアンテナなどであってもよい。 In this embodiment, the non-contact type data receiving / transmitting body 10 in which the antenna 18 is a dipole antenna is illustrated, but the non-contact type data receiving / transmitting body of the present invention is not limited to this. In the contactless data receiving / transmitting body of the present invention, the antenna may be a monopole antenna, a cross dipole antenna, or the like.
　また、本発明の非接触型データ受送信体にあっては、第一基材のインレットと接する面あるいはそれとは反対の面、および／または、第二基材のインレットと接する面あるいはそれとは反対の面に、非接触型データ受送信体を識別するための印刷情報、その他、任意の文字、模様または画像などからなる印刷情報を設けてもよい。
　さらに、本発明の非接触型データ受送信体にあっては、第一基材とインレットとの間、および／または、第二基材とインレットとの間に、インレットに接続（実装）した表示素子を設けてもよい。
　このように、第一基材のインレットと接する面、および／または、第二基材のインレットと接する面に印刷情報を設ける場合、あるいは、第一基材とインレットとの間、および／または、第二基材とインレットとの間に、インレットに接続（実装）した表示素子を設ける場合、第一基材、第二基材を無色透明の材料で形成することが好ましい。 Further, in the non-contact type data transmitting / receiving body of the present invention, the surface contacting the inlet of the first substrate or the surface opposite to it and / or the surface contacting the inlet of the second substrate or opposite to it. On this surface, print information for identifying the non-contact type data receiving / transmitting body, and other print information made up of arbitrary characters, patterns or images may be provided.
Furthermore, in the non-contact type data transmitting / receiving body of the present invention, the display connected (mounted) to the inlet between the first base material and the inlet and / or between the second base material and the inlet. An element may be provided.
Thus, when providing printing information on the surface of the first substrate that contacts the inlet and / or the surface of the second substrate that contacts the inlet, or between the first substrate and the inlet, and / or When providing the display element connected (mounted) to the inlet between the second base material and the inlet, it is preferable to form the first base material and the second base material with a colorless and transparent material.
　次に、図１Ａおよび図１Ｂを参照して、この実施形態の非接触型データ受送信体の製造方法について説明する。
　まず、インレット１１の基材１６におけるＩＣチップ１７が実装されている面を上面（非貼着面）とし、第一基材１３の一方の面１３ａに、インレット１１を、粘着材１５を介して貼着する。次いで、第一基材１３上のインレット１１の外面に、液状シリコーンゴムを塗布する。このとき、液状シリコーンゴムの塗布量を、インレット１１の外面を完全に被覆することができる量以上であるとともに、基材１６の一方の面１６ａに実装されたＩＣチップ１７を完全に覆うことができる量以上とする。
　次いで、インレット１１と第一基材１３からなる積層体に、第二基材１４を、液状シリコーンゴムを介して重ね合わせる。
　次いで、インレット１１、第一基材１３、第二基材１４および液状シリコーンゴムから構成される構成物を、室温にて３０分～４８時間程度放置するか、あるいは、３０℃～６０℃にて３０分～２４時間程度加熱し、溶媒を揮発させることにより液状シリコーンゴムを硬化させて、接着材１２を形成し、図１に示す非接触型データ受送信体１０を得る。
　なお、本発明の非接触型データ受送信体は、非金属物質の他に、金属物品や水分を含む物品を直接貼付する用途にも適用できる。 Next, with reference to FIG. 1A and FIG. 1B, the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment is demonstrated.
First, the surface of the base material 16 of the inlet 11 on which the IC chip 17 is mounted is the upper surface (non-stick surface), and the inlet 11 is placed on one surface 13 a of the first base material 13 via the adhesive material 15. Adhere. Next, liquid silicone rubber is applied to the outer surface of the inlet 11 on the first substrate 13. At this time, the application amount of the liquid silicone rubber is not less than an amount capable of completely covering the outer surface of the inlet 11, and the IC chip 17 mounted on the one surface 16a of the substrate 16 can be completely covered. Make it more than you can.
Next, the second base material 14 is superposed on the laminate composed of the inlet 11 and the first base material 13 via liquid silicone rubber.
Next, the composition composed of the inlet 11, the first base material 13, the second base material 14, and the liquid silicone rubber is allowed to stand at room temperature for about 30 minutes to 48 hours, or at 30 ° C. to 60 ° C. The liquid silicone rubber is cured by heating for about 30 minutes to 24 hours and the solvent is volatilized to form the adhesive 12, thereby obtaining the non-contact type data transmitter / receiver 10 shown in FIG.
In addition, the non-contact type data receiving / transmitting body of the present invention can be applied to applications in which a metal article or an article containing moisture is directly attached in addition to a non-metallic substance.
　本発明によれば、耐薬品性、耐候性、耐熱性および柔軟性に優れ、さらには、アンテナに生じる通信特性の低下を防止した非接触型データ受送信体を提供することができる。 According to the present invention, it is possible to provide a non-contact type data receiving / transmitting body which is excellent in chemical resistance, weather resistance, heat resistance and flexibility and further prevents deterioration in communication characteristics generated in the antenna.

Claims (1)

  1. 　インレットと、インレットを被覆する接着材と、接着材を介して前記インレットを挟む第一基材および第二基材と、を備えた非接触型データ受送信体であって、
    　前記接着材は液状シリコーンゴムからなり、前記第一基材および前記第二基材はシリコーンゴムまたは加硫ゴムからなる非接触型データ受送信体。     A non-contact type data receiving / transmitting body comprising an inlet, an adhesive covering the inlet, and a first base material and a second base material sandwiching the inlet via the adhesive,
    The contact material is made of liquid silicone rubber, and the first base material and the second base material are made of silicone rubber or vulcanized rubber.
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