WO2009119828A1 - Récepteur/émetteur de données sans contact - Google Patents

Récepteur/émetteur de données sans contact Download PDF

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Publication number
WO2009119828A1
WO2009119828A1 PCT/JP2009/056352 JP2009056352W WO2009119828A1 WO 2009119828 A1 WO2009119828 A1 WO 2009119828A1 JP 2009056352 W JP2009056352 W JP 2009056352W WO 2009119828 A1 WO2009119828 A1 WO 2009119828A1
Authority
WO
WIPO (PCT)
Prior art keywords
inlet
base material
adhesive
resin
silicone rubber
Prior art date
Application number
PCT/JP2009/056352
Other languages
English (en)
Japanese (ja)
Inventor
英二 渋谷
健一 伊藤
孝一 渋谷
仁 加賀谷
芳宏 水谷
教博 大石
Original Assignee
トッパン・フォームズ株式会社
共和工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トッパン・フォームズ株式会社, 共和工業株式会社 filed Critical トッパン・フォームズ株式会社
Publication of WO2009119828A1 publication Critical patent/WO2009119828A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Definitions

  • the present invention relates to a non-contact type data receiver / transmitter that can receive information from the outside using electromagnetic waves as a medium, such as an information recording medium for RFID (Radio Frequency IDentification), and can transmit information to the outside.
  • a non-contact type data receiving / transmitting body excellent in weather resistance, heat resistance and flexibility, and further excellent in communication characteristics.
  • An IC tag which is an example of a non-contact type data receiving / transmitting body, includes an inlet including a base material, and an antenna and an IC chip that are provided on one surface and connected to each other.
  • the IC tag used in the 13.56 MHz band when an electromagnetic wave from the information writing / reading device is received, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and this IC Information in the chip is converted into a signal, and this signal is transmitted from the antenna of the IC tag.
  • a signal transmitted from the IC tag is received by the antenna of the information writing / reading device, sent to the data processing device via the controller, and data processing such as identification is performed.
  • the inlet is covered with a resin film made of silicone resin, polytetrafluoroethylene resin, etc., molded with resin, and packaged.
  • a resin film made of silicone resin, polytetrafluoroethylene resin, etc.
  • An IC tag has been proposed (see, for example, Patent Document 1).
  • an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged has been proposed (for example, see Patent Document 2).
  • the inlet is sandwiched between the resin films from both sides, and the resin film is melt bonded by heating and pressurizing with a pair of hot rolls. Therefore, when the resin film is bonded, excessive pressure or temperature is applied to the inlet, or the resin film contracts, so that the IC chip constituting the inlet may be damaged or deteriorated.
  • the base material which comprises an inlet also shrink
  • the silicone resin is not only difficult to adhere to other resins and metals, but in this packaged IC tag manufacturing method, the inlet and the resin film are bonded to each other. There is a problem of low adhesion. Therefore, when the bending of the IC tag is repeated, there is a possibility that the IC tag is peeled off at the interface between the inlet and the resin film.
  • the inlet when the inlet is molded only with a resin such as an epoxy resin, the IC chip and the antenna constituting the inlet are not only damaged or deteriorated due to shrinkage when the resin is cured, but the inlet is It is difficult to fix in a state parallel to a reference surface (for example, one of the outer surfaces of the package), and the communication characteristics of the antenna may be deteriorated.
  • a resin such as an epoxy resin
  • the present invention has been made in view of the above circumstances, and is excellent in chemical resistance, weather resistance, heat resistance and flexibility, and further, contactless data transmission / reception that prevents deterioration of communication characteristics generated in an antenna
  • the purpose is to provide a body.
  • a non-contact type data receiving / transmitting body comprises an inlet, an adhesive covering the inlet, and a first base material and a second base material sandwiching the inlet via the adhesive. It is a transmission / reception body.
  • the adhesive is made of liquid silicone rubber, and the first base material and the second base material are made of silicone rubber or vulcanized rubber.
  • the adhesive covering the inlet is made of liquid silicone rubber
  • the first base material and the second base material are made of silicone rubber or vulcanized rubber. Therefore, since the adhesive made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet and covers the outer surface of the inlet without any gaps, the degree of adhesion between the inlet and the adhesive, and the adhesive Adhesion degree with a 1st base material and a 2nd base material becomes high.
  • the non-contact type data transmitting / receiving body of the present invention can be peeled off at the interface between the inlet and the adhesive, and at the interface between the adhesive and the first base material and the second base material, even if the bending is repeated. There is no flexibility. Further, the non-contact type data transmitting / receiving body of the present invention has a high degree of adhesion between the inlet and the adhesive, and an adhesion between the adhesive, the first base material, and the second base material.
  • the inlet is fixed along one surface of the first base material and the one surface of the second base material, which serve as the reference surface, the communication characteristics of the antenna do not deteriorate.
  • FIG. 1A It is a top view which shows one Embodiment of the non-contact-type data transmission / reception body of this invention.
  • 1B is a cross-sectional view taken along the line AA of FIG. 1A, showing an embodiment of the contactless data receiving / transmitting body of the present invention.
  • SYMBOLS 10 Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Adhesive material, 13 ... 1st base material, 14 ... 2nd base material, 15 ... Adhesive material, 16 ... Base material, 17 ... IC chip, 18 ... Antenna, 19, 20 ... Radiation element, 21 ... Short-circuit part.
  • FIG. 1A and 1B are schematic views showing an embodiment of the contactless data receiving / transmitting body of the present invention.
  • FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A.
  • the non-contact type data transmitting / receiving body 10 of this embodiment includes an inlet 11, an adhesive 12 that covers the inlet 11, and a first base material 13 and a second base material that sandwich the inlet 11 via the adhesive material 12. 14.
  • the adhesive 12 is made of liquid silicone rubber
  • the first base material 13 and the second base material 14 are made of silicone rubber or vulcanized rubber.
  • the inlet 11 includes a base material 16, an IC chip 17, and an antenna 18.
  • the IC chip 17 and the antenna 18 are provided on one surface 16a of the substrate 16 and are electrically connected to each other.
  • the antenna 18 is made of various conductors, facing each other, and having a pair of radiating elements 19 and 20 each having a feeding point (a portion connected to the IC chip 17) on the facing side, and the radiating elements 19 and 20.
  • the length in the longitudinal direction of the antenna 18 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band ⁇ UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 18 and 19 is a length corresponding to a quarter wavelength.
  • the outer surface of the inlet 11 is covered with the adhesive 12 in a state where the inlet 11 is attached to one surface 13 a of the first base material 13 via the adhesive material 15. .
  • the surface of the base material 16 of the inlet 11 opposite to the surface on which the IC chip 17 is mounted is attached to one surface 13 a of the first base material 13.
  • the outer surface of the inlet 11 is coat
  • the second base material 14 is superposed on the laminated body composed of the inlet 11 and the first base material 13 via the adhesive 12.
  • the inlet 11, the first base material 13, and the second base material 14 are joined and integrated through the adhesive 12. Thereby, the inlet 11 is being fixed along one surface 13a of the 1st base material 13, and one surface 14a of the 2nd base material 14.
  • the thickness of the adhesive 12 is equal to or greater than the thickness capable of completely covering the outer surface of the inlet 11 and greater than the thickness capable of completely covering the IC chip 17 provided on the one surface 16a of the base material 16. is there.
  • liquid silicone rubber is used as the adhesive 12. This liquid silicone rubber is cured into a rubber-like shape by heating at room temperature or low temperature, and has a relatively fast curing rate.
  • the liquid silicone rubber may be any of various grades of liquid silicone rubber, but in order to prevent the IC chip 17 from deteriorating during curing, those having a curing temperature of room temperature to 40 ° C. are preferable.
  • Various grades manufactured by Toray Dow Corning are used. Examples of the product name include “SE9185”, “SE9186”, “SE9186L”, “SE9206L”, and the like.
  • liquid silicone rubber for example, various grades made by Momentive Performance Materials Japan GK are used.
  • Product names include, for example, “TSE392”, “TSE3925”, “TSE3940”, “TSE3941”, “TSE3945”, “TSE3946”, “XW11-B5320”, “XE11-A5133S”, “TSE3944”, “TSE3853- W ”,“ TSE3971 ”,“ TSE3976-B ”,“ TSE397 ”and the like.
  • the 1st base material 13 and the 2nd base material 14 are comprised from the silicone rubber or vulcanized rubber which has elasticity and flexibility, from the point which is excellent in a weather resistance, heat resistance, chemical resistance, flexibility, etc.
  • Silicone rubber is preferred.
  • the silicone rubber may be any of the millable types, for example, a heat vulcanization type silicone compound manufactured by Toray Dow Corning.
  • vulcanized rubber examples include natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene butadiene rubber (SBR), chloroprene rubber (CR), acrylonitrile butadiene rubber (NBR), and butyl rubber (IIR).
  • EPM Ethylene / propylene rubber
  • U Urethane rubber
  • CSM Chlorosulfonated polyethylene
  • CM Chlorinated polyethylene
  • ACM Acrylic rubber
  • CO, ECO Epiclodrine rubber
  • Fluoro rubber examples include vulcanized rubber such as (FKM).
  • the first base material 13 and the second base material 14 may be either colorless or colored, or may be either transparent or opaque, depending on the use of the non-contact type data receiving / transmitting body 10. And adjusted as appropriate.
  • the adhesive material 15 is not particularly limited, but an adhesive material that has both liquid and solid properties, is always wet, has low fluidity, and maintains its own shape.
  • examples of such an adhesive material include an acrylic resin, a polyurethane resin, an epoxy resin, a urethane resin, a natural rubber adhesive material, a synthetic rubber adhesive material, and a hot melt adhesive material.
  • the base material 16 of the inlet 11 includes at least a surface layer portion such as a woven fabric, a non-woven fabric, a mat, paper, or a combination thereof made of inorganic fibers such as glass fibers and alumina fibers, polyester fibers, polyamide fibers, and the like.
  • the IC chip 17 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 18. Anything applicable to RFID media such as an IC card can be used.
  • the antenna 18 is formed by screen printing in a predetermined pattern on one surface 16a of the base material 16 using polymer-type conductive ink, or by etching a conductive foil, or by metal plating. It will be.
  • polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
  • the polymer type conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 18 at 200 ° C. or less, for example, about 100 to 150 ° C.
  • the electric path of the coating film forming the antenna 18 is formed by the contact of the conductive fine particles forming the coating film with each other, and the resistance value of the coating film is on the order of 10 ⁇ 5 ⁇ ⁇ cm.
  • known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.
  • the photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved.
  • the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 mass of conductive fine particles.
  • % Or more and 10% by mass or more of a polyester resin that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, that is, a crosslinkable type or a crosslinkable / heatable type
  • a plastic combination type is preferably used.
  • Examples of the conductive foil forming the antenna 18 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil. Furthermore, examples of the metal plating that forms the antenna 18 include copper plating, silver plating, gold plating, and platinum plating.
  • the adhesive 12 covering the inlet 11 is made of liquid silicone rubber
  • the second substrate 14 is made of silicone rubber or vulcanized rubber. Therefore, the adhesive 12 made of liquid silicone rubber, which is a liquid before curing, follows the outer shape of the inlet 11 and covers the outer surface of the inlet 11 without any gaps. Therefore, the degree of adhesion between the inlet 11 and the adhesive 12, In addition, the degree of adhesion between the adhesive material 12, the first base material 13, and the second base material 14 is increased.
  • the inlet 11 covered with the liquid silicone rubber is sandwiched between the first base material 13 and the second base material 14 made of solid silicone rubber or vulcanized rubber having high affinity with the liquid silicone rubber, The degree of adhesion between the one base material 13 and the second base material 14 is increased. Therefore, the non-contact type data receiving / transmitting body 10 is peeled off at the interface between the inlet 11 and the adhesive material 12 and at the interface between the adhesive material 12 and the first base material 13 and the second base material 14 even if the bending is repeated. It is excellent in flexibility without causing any troubles.
  • the non-contact type data receiving / transmitting body 10 since the non-contact type data receiving / transmitting body 10 has a high degree of adhesion between the constituent members as described above, water, oil, chemicals and the like are prevented from entering the inlet 11 from the outside, and the chemical resistance and Excellent weather resistance. Furthermore, since the inlet 11 is fixed along the one surface 13a of the first base material 13 and the one surface 14a of the second base material 14 that serve as a reference surface, the communication characteristics of the antenna 18 may deteriorate. Absent.
  • non-contact type data receiving / transmitting body of the present invention is not limited to the non-contact type data receiving / transmitting body 10 described above.
  • a pair of attachment holes may be provided so as to penetrate in the thickness direction of the adhesive, the first base material, and the second base material and sandwich the inlet. This attachment hole is used for attaching a non-contact type data receiving / transmitting body to an article to be attached.
  • the non-contact type data receiving / transmitting body 10 in which the antenna 18 is a dipole antenna is illustrated, but the non-contact type data receiving / transmitting body of the present invention is not limited to this.
  • the antenna may be a monopole antenna, a cross dipole antenna, or the like.
  • print information for identifying the non-contact type data receiving / transmitting body, and other print information made up of arbitrary characters, patterns or images may be provided.
  • the first base material and the second base material are formed with a colorless and transparent material.
  • the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment is demonstrated.
  • the surface of the base material 16 of the inlet 11 on which the IC chip 17 is mounted is the upper surface (non-stick surface), and the inlet 11 is placed on one surface 13 a of the first base material 13 via the adhesive material 15.
  • liquid silicone rubber is applied to the outer surface of the inlet 11 on the first substrate 13. At this time, the application amount of the liquid silicone rubber is not less than an amount capable of completely covering the outer surface of the inlet 11, and the IC chip 17 mounted on the one surface 16a of the substrate 16 can be completely covered. Make it more than you can.
  • the second base material 14 is superposed on the laminate composed of the inlet 11 and the first base material 13 via liquid silicone rubber.
  • the composition composed of the inlet 11, the first base material 13, the second base material 14, and the liquid silicone rubber is allowed to stand at room temperature for about 30 minutes to 48 hours, or at 30 ° C. to 60 ° C.
  • the liquid silicone rubber is cured by heating for about 30 minutes to 24 hours and the solvent is volatilized to form the adhesive 12, thereby obtaining the non-contact type data transmitter / receiver 10 shown in FIG.
  • the non-contact type data receiving / transmitting body of the present invention can be applied to applications in which a metal article or an article containing moisture is directly attached in addition to a non-metallic substance.
  • non-contact type data receiving / transmitting body which is excellent in chemical resistance, weather resistance, heat resistance and flexibility and further prevents deterioration in communication characteristics generated in the antenna.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L’invention concerne un récepteur/émetteur de données sans contact (10) qui est pourvu : d’une entrée (11), d’un adhésif (12) qui revêt l’entrée, et d’un premier substrat (13) et d’un second substrat (14) qui prennent en sandwich l’entrée avec l’adhésif entre eux. L’adhésif comprend un caoutchouc de silicone liquide, et les premier et second substrats comprennent un caoutchouc de silicone ou un caoutchouc vulcanisé. Le récepteur/émetteur de données sans contact a une flexibilité et une résistance aux produits chimiques, aux intempéries et à la chaleur excellentes. Ainsi, il est possible d’empêcher une diminution des caractéristiques de communication d’une antenne.
PCT/JP2009/056352 2008-03-27 2009-03-27 Récepteur/émetteur de données sans contact WO2009119828A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008084815A JP2009238022A (ja) 2008-03-27 2008-03-27 非接触型データ受送信体
JP2008-084815 2008-03-27

Publications (1)

Publication Number Publication Date
WO2009119828A1 true WO2009119828A1 (fr) 2009-10-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/056352 WO2009119828A1 (fr) 2008-03-27 2009-03-27 Récepteur/émetteur de données sans contact

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JP (1) JP2009238022A (fr)
WO (1) WO2009119828A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4116880A1 (fr) 2021-07-10 2023-01-11 Yesitis Dispositif comprenant une étiquette rfid utilisable dans un four à micro-ondes et récipient ou emballage pourvu d'un tel dispositif

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013296A (ja) * 1996-03-25 1998-01-16 Internatl Business Mach Corp <Ibm> 無線トランスポンダ
JP2005056362A (ja) * 2003-08-07 2005-03-03 Seiko Precision Inc Ｉｃタグ
JP2006072804A (ja) * 2004-09-03 2006-03-16 Nippon Sheet Glass Co Ltd 電子タグ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2611574B2 (ja) * 1991-07-10 1997-05-21 凸版印刷株式会社 Ｉｃカード、ｉｃカード用モジュールおよびｉｃカードの製造方法
JP4427063B2 (ja) * 2004-11-16 2010-03-03 株式会社ハネックス データキャリア装着体及びその製造方法
JP2007042087A (ja) * 2005-07-04 2007-02-15 Hitachi Ltd Ｒｆｉｄタグ及びその製造方法
JP4704148B2 (ja) * 2005-08-25 2011-06-15 Ｋｄｄｉ株式会社 ユーザ認証システム、認証装置、端末装置及びコンピュータプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013296A (ja) * 1996-03-25 1998-01-16 Internatl Business Mach Corp <Ibm> 無線トランスポンダ
JP2005056362A (ja) * 2003-08-07 2005-03-03 Seiko Precision Inc Ｉｃタグ
JP2006072804A (ja) * 2004-09-03 2006-03-16 Nippon Sheet Glass Co Ltd 電子タグ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4116880A1 (fr) 2021-07-10 2023-01-11 Yesitis Dispositif comprenant une étiquette rfid utilisable dans un four à micro-ondes et récipient ou emballage pourvu d'un tel dispositif
FR3125149A1 (fr) * 2021-07-10 2023-01-13 Yesitis Dispositif comprenant une etiquette rfid utilisable au moins dans un four a micro-ondes et recipient ou emballage pourvu d’au moins un tel dispositif

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