CN103400181A - Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof - Google Patents
Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof Download PDFInfo
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- CN103400181A CN103400181A CN2013103154736A CN201310315473A CN103400181A CN 103400181 A CN103400181 A CN 103400181A CN 2013103154736 A CN2013103154736 A CN 2013103154736A CN 201310315473 A CN201310315473 A CN 201310315473A CN 103400181 A CN103400181 A CN 103400181A
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Abstract
The invention relates to an IC (Integrated Circuit) card and a packaging method thereof, in particular to a fingerprint reading sensor IC card and a packaging method thereof, and belongs to the technical field of sensor IC cards. According to the technical scheme provided by the invention, the fingerprint reading sensor IC card comprises a fingerprint sensor IC chip, wherein a thin-film substrate is arranged on the front face of the fingerprint sensor IC chip; a reinforcing plate is arranged on the rear face of the fingerprint sensor IC chip; the thin-film substrate is provided with a first window penetrating through the thin-film substrate; the first window of the thin-film substrate corresponds to a fingerprint sensing part on the fingerprint sensor IC chip; the fingerprint sensing part is exposed from the first window ; a sensor control circuit of the fingerprint sensor IC chip is electrically connected with a data processing circuit which is arranged on the rear face region of the thin-film substrate and is used for identifying and processing fingerprint data. The fingerprint reading sensor IC card provided by the invention is simple and compact in structure, simple in packaging process, low in manufacturing and packaging cost, wide in application range, and safe and reliable.
Description
Technical field
The present invention relates to a kind of IC-card and method for packing thereof, especially a kind of fingerprint read sensor IC-card and method for packing thereof, belong to the technical field of sensor IC-card.
Background technology
In recent years, the IC-card that carries IC ﹙ Ji Chengdian road ﹚ chip is compared with the magnetic stripe card, increases characteristics such as security enhancing and universal rapidly owing to having information capacity.Particularly, pass the non-contact IC card of the information of connecing by electromagnetic wave, be applied to subway, the public transport fields such as bus, convenience significantly improves.
Described IC-card needs to be close so that carry and hold with the card size (long 85.6mm, wide 54mm, thick 0.76mm) of ISO international standard as much as possible.In the situation that guarantee the international standard card size, for the microprocessor that high-performance is high-speed with use electromagnetic wave to pass within the necessary antenna of non-contact IC card of the information that connects and transformer etc. are arranged at very thin IC-card, the IC chip needs also constantly developing and improveing so far.
On the one hand, as fingerprint read sensor IC-card, in order to allow the fingerprint read sensor IC chip and the film substrate that are layered on silicon wafer engage easily, configure the lead-in wire (pad) of the use that is connected with the sensor IC chip on the film substrate back side, for this reason, proposed to lead to from surface projection ((through electrode)) the silicon through hole at the back side) scheme.
in the manufacture method of existing fingerprint read sensor IC-card, at first in order to accommodate to greatest extent fingerprint sensor IC chip on silicon wafer, with a plurality of fingerprint sensor IC of minimal gap lamination chip, on the wafer of making, in order to strengthen antistatic effect, coating is done on the surface of each fingerprint sensor IC chip to be processed, each fingerprint sensor IC chip cuts off from wafer, the dicing operation that also claims one single chip, with metal wire with the film substrate of the pin pad of fingerprint sensor IC chip and the outsourcing bonding operation in position that continues, in order to protect superfine little metal wire and fragile bonded part, operation with the encapsulation of the cementing agents such as epoxy resin, sensors sides also has same encapsulation process technique.
But, the manufacture method of above-mentioned indication, manufacturing process is complicated, cost is high, and when the silicon wafer of limited area is made a plurality of fingerprint sensor IC chips, in order to realize maximum output, the sensor IC chip area is more little more favourable, but the method need increase the area of lead-in wire, also certainly will enlarge the area of fingerprint sensor IC chip, thereby reduces the difficult points such as receipts amount of sensor IC chip.
In addition, also comprise the method with wire bond in existing manufacture method, in order to allow the tension lametta that too large tension force is not arranged, the certain height of necessary maintenance is wrapped loop the same with sealant.The encapsulation of the fingerprint sensor IC chip that the method is made, can surpass the thickness 0.76mm that IC-card limits.
From the aspect of intensity, the bond area of sensor IC chip is less, and cohesive strength is lower, can cause the phenomenon of peeling off in IC-card manufacturing process.
In addition, the thickness of the sensor IC chip that can carry in the IC-card of thickness 0.76mm restriction must be thinner than this thickness, more thin its antagonistic intensity to physical external force that more weakened the sensor IC chip on the lamination silicon chip.
Equally, the IC-card of carrying, be in the danger that is destroyed by the discharge of static gas, and is for fetching finger mark, directly dangerous especially by the sensor IC chip of finger contact.Particularly be loaded on the control circuit on sensor IC chip layer pressure surface, destroy fragile especially for discharge.
The problem of finger print identifying existentially forgeable fingerprint on safety,, for many services is provided, have the IC-card of high additive value, has to take necessary countermeasure.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of fingerprint read sensor IC-card and method for packing thereof are provided, it is simple and compact for structure, and packaging technology is simple, and the manufacturing and encapsulation cost is low, and wide accommodation is safe and reliable.
According to technical scheme provided by the invention, described fingerprint read sensor IC-card, comprise fingerprint sensor IC chip; The front of described fingerprint sensor IC chip is provided with film substrate, and the back side of fingerprint sensor IC chip is provided with stiffening plate; Film substrate is provided with the first window that connects described film substrate, and the first window of film substrate is corresponding with the fingerprint sensing section on fingerprint sensor IC chip, and fingerprint sensing section exposes by first window; The sensor control circuit of fingerprint sensor IC chip is electrically connected to the data processing circuit that is used for identification and processing finger print data in the zone, the back side of film substrate.
The front of described film substrate is provided with surface film, and the back side of stiffening plate is provided with the bottom surface film, and described surface film, film substrate, stiffening plate and bottom surface film bonding are fixing; Surface film is provided with the Second Window that connects described surface film, and described Second Window is corresponding with first window, and Second Window is connected with first window, and the fingerprint sensing section of fingerprint sensor IC chip exposes by first window and Second Window.
The back side of described fingerprint sensor IC chip and film substrate is fixing by the first reinforcing tack coat bonding, and fingerprint sensor IC chip and stiffening plate are reinforced tack coat by second and bondd fixing.
Described fingerprint sensing section is positioned at the center of fingerprint sensor IC chip, and sensor control circuit is positioned at the first end of fingerprint sensor IC chip, and the second end of fingerprint sensor IC chip arranges the finger detecting sensor; The first end of fingerprint sensor IC chip also is provided with chip and connects pin, and finger detecting sensor, fingerprint sensing section, chip connect pin and all with sensor control circuit, be electrically connected to;
Described chip connects pin and is connected the pin electrical connection with the first substrate in zone, the film substrate back side, and zone, the back side also is provided for data processing circuit and the outside second substrate that is connected are connected pin; The back side of film substrate also is provided with the electrodes conduct module for discharge, and after fingerprint sensor IC chip and film substrate were connected and fixed, the electrodes conduct module can cover described sensor control circuit.
Zone, the described back side also is provided with for the storer of storage fingerprint characteristic data and fingerprint portrait data and/or antenna and the modulation circuit that non-contact type signal post needs.
The front of described film substrate is provided with conductive electrode, and described conductive electrode exposes by Second Window, and conductive electrode is electrically connected to the data processing circuit on zone, the back side by the through electrode on film substrate.
Described conductive electrode is and the rectangle of described first window and Second Window form fit that conductive electrode is positioned at the outside of first window.
A kind of method for packing of fingerprint read sensor IC-card, described method for packing comprises the steps:
A, provide fingerprint sensor IC chip and film substrate, and the first window that connects described film substrate is set on film substrate, be provided for identifying and processing the data processing circuit of finger print data on the zone, the back side of film substrate;
B, fingerprint sensor IC chip attach is fixed in the back side of film substrate, the chip of fingerprint sensor IC chip connects pin and is connected the pin electrical connection with the first substrate in zone, the back side, so that sensor control circuit is electrically connected to data processing circuit; The fingerprint sensing section of fingerprint sensor IC chip exposes by first window;
C, at the fixing stiffening plate of the back side of fingerprint sensor IC chip bonding.
Also comprise steps d, in the front of film substrate, surface film be set, the Second Window of described surface film setting distribution corresponding to first window, at the back side of stiffening plate, the bottom surface film is set, described surface film, film substrate, stiffening plate and bottom surface film bond fixing mutually.
The front of described film substrate is provided with conductive electrode, and described conductive electrode exposes by Second Window, and conductive electrode is electrically connected to the data processing circuit on zone, the back side by the through electrode on film substrate; The back side of film substrate also is provided with the electrodes conduct module for discharge, and after fingerprint sensor IC chip and film substrate were connected and fixed, the electrodes conduct module can cover described sensor control circuit.
advantage of the present invention: the front of fingerprint sensor IC chip is connected with film substrate, and the back side of fingerprint sensor IC chip is connected with stiffening plate, forms the core board of IC-card, first window on film substrate can make finger detecting sensor and fingerprint sensing section expose with the Second Window that is positioned at the film substrate top, and conductive electrode is set in Second Window, by conductive electrode energy and finger contact, judge the biological of finger by permitivity and the static capacity of measuring contact, the data processing circuit in sensor control circuit and zone, the back side is completed the processing of fingerprint recognition and finger print data, thereby the fingerprint read sensor IC-card that can make formation meets the card size of ISO international standard, simple and compact for structure, packaging technology is simple, the manufacturing and encapsulation cost is low, wide accommodation, safe and reliable.
Description of drawings
Fig. 1 is explosive view of the present invention.
Fig. 2 is the structural representation of fingerprint sensor IC chip of the present invention.
Fig. 3 is the structural representation that fingerprint sensor IC chip of the present invention coordinates with film substrate.
Fig. 4 is the exploded view before fingerprint sensor IC chip of the present invention and film substrate are connected and fixed.
Fig. 5 reinforces the structural representation of tack coat bonding after fixing by first between fingerprint sensor IC chip and film substrate in Fig. 4.
Fig. 6 is the fixing front exploded view of fingerprint sensor IC chip of the present invention, film substrate and stiffening plate.
Fig. 7 is the structural representation after fingerprint sensor IC chip in Fig. 6, film substrate and stiffening plate bonding are fixed.
Fig. 8 is the exploded view of surface film of the present invention, film substrate, fingerprint sensor IC chip.
description of reference numerals: 1-stiffening plate, 11-fingerprint sensor IC chip, 12-points detecting sensor, 13-fingerprint sensing section, the 14-chip connects pin, the 15-sensor control circuit, the 21-film substrate, the 22-first window, the 23-first substrate connects pin, zone, the 24-back side, the 25-second substrate connects pin, 26-electrodes conduct module, the 27-conductive electrode, the 28-through electrode, the 31-surface film, the 32-Second Window, 33-bottom surface film, 41a-first reinforces tack coat and 41b-second reinforces tack coat.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
As Fig. 1 and shown in Figure 8:, in order to access slim fingerprint read sensor IC-card, the present invention includes fingerprint sensor IC chip 11; The front of described fingerprint sensor IC chip 11 is provided with film substrate 21, and the back side of fingerprint sensor IC chip 11 is provided with stiffening plate 1; Film substrate 21 is provided with the first window 22 that connects described film substrate 21, and the first window 22 of film substrate 21 is corresponding with the fingerprint sensing section 13 on fingerprint sensor IC chip 11, and fingerprint sensing section 13 exposes by first window 22; The sensor control circuit 15 of fingerprint sensor IC chip 11 is electrically connected to the data processing circuit that is used for identification and processing finger print data in the zone, the back side 24 of film substrate 21.
Particularly, in the embodiment of the present invention, fingerprint sensor IC chip 11, film substrate 21 and stiffening plate 1 form the core substrate of IC-card, and stiffening plate 1 can adopt metal or compound substance to make.
As Fig. 4, Fig. 5, Fig. 6 and shown in Figure 7: as described in to reinforce tack coat 41a bonding by first fixing the back side of fingerprint sensor IC chip 11 and film substrate 21, it is fixing that fingerprint sensor IC chip 11 and stiffening plate 1 are reinforced tack coat 41b bonding by second.
Coat such as epoxy is cementing agent in fingerprint sensor IC chip 11 sides, with film substrate 21, be connected, obtain first and reinforce tack coat 41a, reinforce tack coat 41a by first the side of fingerprint sensor IC chip 11 is protected.In the specific implementation, by regulating the firm time of cementing agent, also drip cementing agent at the back side of fingerprint sensor IC chip 11 before above-mentioned cementing agent sclerosis, in order not sneak into bubble with very thin pushing open in cementing agent, with the stiffening plates such as metal 1 and fingerprint sensor IC chip 11 back sides bonding 1, after described step process, strengthen the effect of fingerprint sensor IC chip 11 external force resistances, and seal side fully.
At this moment, it is fixing that fingerprint sensor IC chip 11 and stiffening plate 1 are reinforced tack coat 41b bonding by second, thus on the side surface of fingerprint sensor IC chip 11 by one more firmly sealant protecting; The set time of above-mentioned cementing agent, can accomplish by the ratio cooperation of adjusting component or the temperature that controls environment.Stiffening plate 1 can be considered with materials such as stainless steels (thick approximately 0.1mm).
The front of described film substrate 21 is provided with surface film 31, and the back side of stiffening plate 1 is provided with bottom surface film 33, and described surface film 31, film substrate 21, stiffening plate 1 and bottom surface film 33 bondings are fixing; Surface film 31 is provided with the Second Window 32 that connects described surface film 31, described Second Window 32 is corresponding with first window 22, and Second Window 32 is connected with first window 22, and the fingerprint sensing section 13 of fingerprint sensor IC chip 11 exposes by first window 22 and Second Window 32.
Particularly; above-mentioned core board is clipped between surface film 31 and bottom surface film 33; can protect the core board of above-mentioned formation by surface film 31 and bottom surface film 33; surface film 31 and bottom surface film 33 adopt thermoplastic resin or paper to make; surface film 31 is fixing with film substrate 21 bondings; 33 bondings of stiffening plate 1 and bottom surface film are fixing; simultaneously; 33 of surface film 31 and bottom surface films also adopt bonding between cementing agent to fix, and guarantee to form the reliability of using after whole fingerprint sensor IC-card.Film substrate 21 has adopted the materials such as polyimide resin (thickness is about 0.03mm), glass epoxy resin (thickness is about 0.1mm) and polyester (thickness is about 0.05mm).
As shown in Figures 2 and 3: described fingerprint sensing section 13 is positioned at the center of fingerprint sensor IC chip 11, and sensor control circuit 15 is positioned at the first end of fingerprint sensor IC chip 11, and the second end of fingerprint sensor IC chip 11 arranges finger detecting sensor 12; The first end of fingerprint sensor IC chip 11 also is provided with chip and connects pin 14, and finger detecting sensor 12, fingerprint sensing section 13, chip connect pin 14 and all with sensor control circuit 15, be electrically connected to;
Wherein, finger detecting sensor 12 can and be confirmed whether for detection of finger touch it is a biosome part, fingerprint sensing section 13 can obtain fingerprint image, the analog signal figure that sensor control circuit 15 can will be inputted, and realize the control of signal input and output, connect pin 14 by chip and can realize and outside being electrically connected to, then realize the power supply of whole fingerprint sensor IC chip 11 is connected.When finger is placed on fingerprint sensor IC chip 11, due to the electric conductivity of pointing, the switch of finger detecting sensor 12 can close, thereby finger detecting sensor 12 can be sent 4 ADC signals of finger perceptual signal, after sensor control circuit 15 is received signal, at once drive the fingerprint fetch program from fingerprint sensing section 13 fetching finger mark data.In the embodiment of the present invention, the size that can control fingerprint sensor IC chip 11 is about 8.5mm(length) * 11mm(is wide), on the silicon wafer of 6 inches, can make the approximately fingerprint sensor IC chip 11 of 130 left and right.The said structure of fingerprint sensor IC chip 11 is identical with the structure of existing fingerprint sensor, no longer describes in detail herein.
Described chip connects pin 14 and is connected pin 23 electrical connections with the first substrate in film substrate 21 zones, the back side 24, and zone, the back side 24 also is provided for data processing circuit and the outside second substrate that is connected are connected pin 25; The back side of film substrate 21 also is provided with the electrodes conduct module 26 for discharge, and after fingerprint sensor IC chip 11 was connected and fixed with film substrate 21, electrodes conduct module 26 can cover described sensor control circuit 15.
In the embodiment of the present invention, electrodes conduct module 26 is positioned at the back side of film substrate 21, and be positioned at the outer ring of first window 22, electrodes conduct module 26 covers on fingerprint sensor IC chip 11 and the most easily is discharged on the sensor control circuit 15 that punctures,, by electrodes conduct module 26 ground connection, thereby can provide, prevent the destruction of static to fingerprint sensor IC chip 11.First window 22 is rectangular, and electrodes conduct module 26 is also rectangular.
In the embodiment of the present invention, sensor control circuit 15 is with after the data processing circuit in zone, the back side 24 is connected, the circuit that forms whole fingerprint read sensor IC-card connects, and concrete circuit matching relationship can be the technical scheme of putting down in writing in CN103164728A " loading the IC-card of finger print identifying function " with reference to publication number.Zone, the described back side 24 also is provided with for the storer of storage fingerprint characteristic data and fingerprint portrait data and/or antenna and the modulation circuit that non-contact type signal post needs.
Overleaf in zone 24, except the necessary high-performance data treatment circuit of finger print identifying (described data processing circuit comprises process chip) is arranged, and the storer of storage fingerprint characteristic data and fingerprint portrait data, also have the outside of contact-type IC-card to connect pin (being that above-mentioned second substrate connects pin 25), the antenna that non-contact IC card is required and communication control unit thereof can carry.
In zone 24,, for the contact-type IC-card, can arrange on above-mentioned core core substrate wired circuit module or on other substrates with outside the connection and use pin interface overleaf, connect pin 25 for second substrate in the embodiment of the present invention.For non-contact IC card, can above above-mentioned wired circuit module or on other substrates, Anneta module and modulation circuit be set, perhaps can make the hybrid card that contact-type IC chip and non-contact type IC chip are taken into account.
Also have, the circuit part of above-mentioned necessity is made on other substrates, and other substrate necessity are configured in the same face with the part side of film substrate 21, energising mutually.Finger print identifying is processed necessary CPU and reservoir etc., and so-called finger print identifying function part, be equipped on above-mentioned other substrates or film substrate 21.
On film substrate 21, arrange and to allow in the Second Window 22 that the position of the fingerprint sensing section 13 of above-mentioned fingerprint sensor IC chip 11 and finger detecting sensor 12 exposes.
The front of described film substrate 21 is provided with conductive electrode 27, and described conductive electrode 27 exposes by Second Window 32, and conductive electrode 27 is electrically connected to the data processing circuit on zone, the back side 24 by the through electrode 28 on film substrate 21.
Described conductive electrode 27 is and the rectangle of described first window 22 and Second Window 32 form fit that conductive electrode 27 is positioned at the outside of first window 22.
The outer ring of the first window 22 of film substrate 21 arranges the conductive electrode 27 that tested finger can directly contact, in addition,, by adjusting the Second Window 32 of surface film 31,, to expose the part of conductive electrode 27, make finger while making IC-card can directly touch conductive electrode 27.Described conductive electrode 27 has the electric conductivity of Copper Foil etc., can be gold-plated in order to prevent surface deterioration.Conductive electrode 27 is connected with the part side of film substrate 21 by through electrode 28, and with the core core substrate on signal wire in succession.Such as, detect by specific inductive capacity and the electric capacity that measurement contacts object from signal wire, whether the object that judgement contacts is live finger or biosome prosthetic finger (such as the vacation with silica gel and mephenesin Carbamate film production refers to) in addition.
A kind of method for packing of fingerprint read sensor IC-card, described method for packing comprises the steps:
A, provide fingerprint sensor IC chip 11 and film substrate 21, and the first window 22 that connects described film substrate 21 is set on film substrate 21, be provided for identifying and processing the data processing circuit of finger print data on the zone, the back side 24 of film substrate 21;
B, fingerprint sensor IC chip 11 bonding is fixed in the back side of film substrate 21, the chip of fingerprint sensor IC chip 11 connects pin 14 and is connected pin 23 electrical connections with the first substrate in zone, the back side 24, so that sensor control circuit 15 is electrically connected to data processing circuit; The fingerprint sensing section 13 of fingerprint sensor IC chip 11 exposes by first window 22;
C, at the fixing stiffening plate 1 of the back side of fingerprint sensor IC chip 11 bonding.
Also comprise steps d, in the front of film substrate 21, surface film 31 be set, described surface film 31 arranges the Second Window with the corresponding distribution of first window 22, at the back side of stiffening plate 1, bottom surface film 33 is set, bonding is fixing mutually for described surface film 31, film substrate 21, stiffening plate 1 and bottom surface film 33.
In the embodiment of the present invention, provide film substrate 21, and on film substrate 21, wired circuit be set as required, and weld electronic unit in the above, for after preventing during heat treated above-mentioned electronic unit move, bond with high-temperature agglomerant.First substrate on the chip of the fingerprint sensor IC chip 11 that will cut down finally connects pin 14 and film substrate is connected connects the overlapping heat bonding together of pin 23.Meanwhile, be coated with in advance on can the composition surface of between and spread scolder and add again hot pressing, also can use anisotropic conductive film or anisotropically conducting adhesive or the compacting that bonds with soldering paste at lower temperature.Be connected both cohesive strengths of pin 23 with first substrate inadequate because adhesive surface is little because chip connects pin 14, can also be coated with epoxy in fingerprint sensor IC chip 11 sides is cementing agent, in strong both connections, be coated with this cementing agent and can play sealing fingerprint sensor IC chip.
The front of described film substrate 21 is provided with conductive electrode 27, and described conductive electrode 27 exposes by Second Window 32, and conductive electrode 27 is electrically connected to the data processing circuit on zone, the back side 24 by the through electrode 28 on film substrate 21; The back side of film substrate 21 also is provided with the electrodes conduct module 26 for discharge, and after fingerprint sensor IC chip 11 was connected and fixed with film substrate 21, electrodes conduct module 26 can cover described sensor control circuit 15.
In the embodiment of the present invention, while adopting above-mentioned encapsulating structure, the thickness of fingerprint sensor IC chip 11 is 0.2mm approximately, the thickness of film substrate 21 is 0.1mm approximately, surface layer film 31 contains the bonding film with bottom film 33() the equal about 0.15mm of thickness, therefore the thickness that the fingerprint read sensor IC-card that forms can be made is 0.7mm approximately, and this thickness is in the scope of extensively universal ISO international standard 0.76mm.Simultaneously, the Area comparison of this fingerprint sensor IC chip 11 is little, can increase one piece of receipts amount on silicon wafer.
the front of fingerprint sensor IC chip 11 of the present invention is connected with film substrate 21, and the back side of fingerprint sensor IC chip 11 is connected with stiffening plate 1, forms the core board of IC-card, first window 22 on film substrate 21 can make finger detecting sensor 12 and fingerprint sensing section 13 expose with the Second Window 32 that is positioned at film substrate 21 tops, and at the interior conductive electrode 27 that arranges of Second Window 32, by conductive electrode 27 energy and finger contacts, judge the biological of finger by permitivity and the static capacity of measuring contact, the data processing circuit in sensor control circuit 15 and zone, the back side 24 is completed the processing of fingerprint recognition and finger print data, thereby the fingerprint read sensor IC-card that can make formation meets the card size of ISO international standard, and form slim IC-card, simple and compact for structure, packaging technology is simple, the manufacturing and encapsulation cost is low, wide accommodation, safe and reliable.
Claims (10)
1. a fingerprint read sensor IC-card, comprise fingerprint sensor IC chip (11); It is characterized in that: the front of described fingerprint sensor IC chip (11) is provided with film substrate (21), and the back side of fingerprint sensor IC chip (11) is provided with stiffening plate (1); Film substrate (21) is provided with the first window (22) that connects described film substrate (21), the first window (22) of film substrate (21) is corresponding with the fingerprint sensing section (13) on fingerprint sensor IC chip (11), and fingerprint sensing section (13) exposes by first window (22); The sensor control circuit (15) of fingerprint sensor IC chip (11) is electrically connected to the data processing circuit that is used for identification and processing finger print data in zone, the back side of film substrate (21) (24).
2. fingerprint read sensor IC-card according to claim 1, it is characterized in that: the front of described film substrate (21) is provided with surface film (31), the back side of stiffening plate (1) is provided with bottom surface film (33), and described surface film (31), film substrate (21), stiffening plate (1) and bottom surface film (33) bonding are fixing; Surface film (31) is provided with the Second Window (32) that connects described surface film (31), described Second Window (32) is corresponding with first window (22), and Second Window (32) is connected with first window (22), and the fingerprint sensing section (13) of fingerprint sensor IC chip (11) exposes by first window (22) and Second Window (32).
3. fingerprint read sensor IC-card according to claim 1, it is characterized in that: described fingerprint sensor IC chip (11) is fixing by the first reinforcing tack coat (41a) bonding with the back side of film substrate (21), and fingerprint sensor IC chip (11) is fixing by the second reinforcing tack coat (41b) bonding with stiffening plate (1).
4. fingerprint read sensor IC-card according to claim 1, it is characterized in that: described fingerprint sensing section (13) is positioned at the center of fingerprint sensor IC chip (11), sensor control circuit (15) is positioned at the first end of fingerprint sensor IC chip (11), and the second end of fingerprint sensor IC chip (11) arranges finger detecting sensor (12); The first end of fingerprint sensor IC chip (11) also is provided with chip and connects pin (14), and finger detecting sensor (12), fingerprint sensing section (13), chip connect pin (14) and all with sensor control circuit (15), be electrically connected to;
Described chip connects pin (14) and is connected pin (23) electrical connection with the first substrate in zone, film substrate (21) back side (24), and zone, the back side (24) also is provided for data processing circuit is connected pin (25) with the outside second substrate that is connected; The back side of film substrate (21) also is provided with the electrodes conduct module (26) for discharge, and after fingerprint sensor IC chip (11) was connected and fixed with film substrate (21), electrodes conduct module (26) can cover described sensor control circuit (15).
5. fingerprint read sensor IC-card according to claim 1 is characterized in that: described zone, the back side (24) also is provided with for the storer of storage fingerprint characteristic data and fingerprint portrait data and/or antenna and the modulation circuit that non-contact type signal post needs.
6. fingerprint read sensor IC-card according to claim 2, it is characterized in that: the front of described film substrate (21) is provided with conductive electrode (27), described conductive electrode (27) exposes by Second Window (32), and conductive electrode (27) is electrically connected to the data processing circuit on zone, the back side (24) by the through electrode (28) on film substrate (21).
7. fingerprint read sensor IC-card according to claim 6, it is characterized in that: described conductive electrode (27) is the rectangle with described first window (22) and Second Window (32) form fit, and conductive electrode (27) is positioned at the outside of first window (22).
8. the method for packing of a fingerprint read sensor IC-card, is characterized in that, described method for packing comprises the steps:
(a), provide fingerprint sensor IC chip (11) and film substrate (21), and the first window (22) that connects described film substrate (21) is set on film substrate (21), be provided for identifying and processing the data processing circuit of finger print data on the zone, the back side (24) of film substrate (21);
(b), fingerprint sensor IC chip (11) bonding is fixed in the back side of film substrate (21), the chip of fingerprint sensor IC chip (11) connects pin (14) and is connected pin (23) electrical connection with the first substrate in zone, the back side (24), so that sensor control circuit (15) is electrically connected to data processing circuit; The fingerprint sensing section (13) of fingerprint sensor IC chip (11) exposes by first window (22);
(c), at the fixing stiffening plate (1) of the back side of fingerprint sensor IC chip (11) bonding.
9. the method for packing of fingerprint read sensor IC-card according to claim 8, it is characterized in that, also comprise step (d), in the front of film substrate (21), surface film (31) be set, described surface film (31) arranges the Second Window with the corresponding distribution of first window (22), at the back side of stiffening plate (1), bottom surface film (33) is set, described surface film (31), film substrate (21), stiffening plate (1) and bottom surface film (33) bonding mutually are fixing.
10. the method for packing of fingerprint read sensor IC-card according to claim 9, it is characterized in that: the front of described film substrate (21) is provided with conductive electrode (27), described conductive electrode (27) exposes by Second Window (32), and conductive electrode (27) is electrically connected to the data processing circuit on zone, the back side (24) by the through electrode (28) on film substrate (21); The back side of film substrate (21) also is provided with the electrodes conduct module (26) for discharge, and after fingerprint sensor IC chip (11) was connected and fixed with film substrate (21), electrodes conduct module (26) can cover described sensor control circuit (15).
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| CN201310315473.6A CN103400181B (en) | 2013-07-24 | 2013-07-24 | Finger print reading sensor IC-card and method for packing thereof |
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| CN201310315473.6A CN103400181B (en) | 2013-07-24 | 2013-07-24 | Finger print reading sensor IC-card and method for packing thereof |
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| CN103400181A true CN103400181A (en) | 2013-11-20 |
| CN103400181B CN103400181B (en) | 2016-01-20 |
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| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN103793691A (en) * | 2014-01-28 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal with same |
| CN103793688A (en) * | 2014-01-23 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Biometric feature recognition device and electronic equipment |
| CN105335694A (en) * | 2014-08-05 | 2016-02-17 | Lg伊诺特有限公司 | Fingerprint sensor and touch device including the same |
| CN105938545A (en) * | 2016-04-13 | 2016-09-14 | 深圳芯邦科技股份有限公司 | Fingerprint identification module group |
| CN107017234A (en) * | 2017-03-31 | 2017-08-04 | 西安易朴通讯技术有限公司 | A kind of electronic equipment |
| CN107229897A (en) * | 2016-03-24 | 2017-10-03 | 指纹卡有限公司 | Fingerprint sensor module |
| WO2017177386A1 (en) * | 2016-04-12 | 2017-10-19 | 深圳信炜科技有限公司 | Electronic device |
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| CN107786694A (en) * | 2017-10-31 | 2018-03-09 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and its assemble method, housing unit and electronic installation |
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| CN109271835A (en) * | 2017-07-17 | 2019-01-25 | 法国伊第米亚身份与安全公司 | Electron plate and its manufacturing method with fingerprint capturer |
| CN109711229A (en) * | 2017-10-26 | 2019-05-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of fingerprint recognition chip and its manufacturing method and electronic device |
| CN110785764A (en) * | 2017-06-28 | 2020-02-11 | 指纹卡有限公司 | Fingerprint sensor module including antenna and method of manufacturing fingerprint sensor module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030215117A1 (en) * | 2002-05-14 | 2003-11-20 | Canon Kabushiki Kaisha | Fingerprint entering apparatus and method for manufacturing fingerprint entering apparatus |
| CN201084167Y (en) * | 2007-08-29 | 2008-07-09 | 飞信半导体股份有限公司 | An encapsulation structure and an encapsulation substrate for a thin-type sliding fingerprint identifier |
| CN101226586A (en) * | 2007-01-17 | 2008-07-23 | 南茂科技股份有限公司 | Film packaging construction of fingerprint identification device |
| CN101226947A (en) * | 2007-01-15 | 2008-07-23 | 南茂科技股份有限公司 | Thin membrane encapsulation structure of fingerprint identifying device |
| CN203366350U (en) * | 2013-07-24 | 2013-12-25 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor ic card |
-
2013
- 2013-07-24 CN CN201310315473.6A patent/CN103400181B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030215117A1 (en) * | 2002-05-14 | 2003-11-20 | Canon Kabushiki Kaisha | Fingerprint entering apparatus and method for manufacturing fingerprint entering apparatus |
| CN101226947A (en) * | 2007-01-15 | 2008-07-23 | 南茂科技股份有限公司 | Thin membrane encapsulation structure of fingerprint identifying device |
| CN101226586A (en) * | 2007-01-17 | 2008-07-23 | 南茂科技股份有限公司 | Film packaging construction of fingerprint identification device |
| CN201084167Y (en) * | 2007-08-29 | 2008-07-09 | 飞信半导体股份有限公司 | An encapsulation structure and an encapsulation substrate for a thin-type sliding fingerprint identifier |
| CN203366350U (en) * | 2013-07-24 | 2013-12-25 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor ic card |
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|---|---|---|---|---|
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| WO2015085786A1 (en) * | 2013-12-13 | 2015-06-18 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device and mobile terminal |
| CN103793688A (en) * | 2014-01-23 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Biometric feature recognition device and electronic equipment |
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| US9971923B2 (en) | 2014-01-28 | 2018-05-15 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification device and mobile terminal having same |
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| CN107229897A (en) * | 2016-03-24 | 2017-10-03 | 指纹卡有限公司 | Fingerprint sensor module |
| WO2017177386A1 (en) * | 2016-04-12 | 2017-10-19 | 深圳信炜科技有限公司 | Electronic device |
| CN105938545A (en) * | 2016-04-13 | 2016-09-14 | 深圳芯邦科技股份有限公司 | Fingerprint identification module group |
| CN107423657A (en) * | 2016-05-23 | 2017-12-01 | 茂丞科技股份有限公司 | Identification of fingerprint encapsulation unit and its manufacture method |
| CN107017234A (en) * | 2017-03-31 | 2017-08-04 | 西安易朴通讯技术有限公司 | A kind of electronic equipment |
| CN110785764A (en) * | 2017-06-28 | 2020-02-11 | 指纹卡有限公司 | Fingerprint sensor module including antenna and method of manufacturing fingerprint sensor module |
| CN109271835A (en) * | 2017-07-17 | 2019-01-25 | 法国伊第米亚身份与安全公司 | Electron plate and its manufacturing method with fingerprint capturer |
| CN109271835B (en) * | 2017-07-17 | 2024-03-26 | 法国伊第米亚身份与安全公司 | Electronic board with fingerprint collector and manufacturing method thereof |
| CN109711229A (en) * | 2017-10-26 | 2019-05-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of fingerprint recognition chip and its manufacturing method and electronic device |
| CN109711229B (en) * | 2017-10-26 | 2021-12-21 | 中芯国际集成电路制造(上海)有限公司 | Fingerprint identification chip, manufacturing method thereof and electronic device |
| CN107786694A (en) * | 2017-10-31 | 2018-03-09 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and its assemble method, housing unit and electronic installation |
| CN109035463A (en) * | 2018-06-20 | 2018-12-18 | 广东粤讯科技开发有限公司 | AiOCC system |
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