CN107786694A - Fingerprint recognition module and its assemble method, housing unit and electronic installation - Google Patents

Fingerprint recognition module and its assemble method, housing unit and electronic installation Download PDF

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Publication number
CN107786694A
CN107786694A CN201711050615.5A CN201711050615A CN107786694A CN 107786694 A CN107786694 A CN 107786694A CN 201711050615 A CN201711050615 A CN 201711050615A CN 107786694 A CN107786694 A CN 107786694A
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CN
China
Prior art keywords
fingerprint recognition
rosette
plate
receiving space
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711050615.5A
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Chinese (zh)
Inventor
张文真
苏建斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711050615.5A priority Critical patent/CN107786694A/en
Publication of CN107786694A publication Critical patent/CN107786694A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

The invention discloses a kind of fingerprint recognition module and its assemble method, housing unit and electronic installation.Fingerprint recognition module includes rosette, fingerprint sensor and supporting plate.Rosette includes side wall and the receiving space surrounded by side wall.Fingerprint sensor includes fingerprint recognition chip, flexible PCB and the stiffening plate being fixedly connected.Flexible PCB is arranged between fingerprint recognition chip and stiffening plate, and fingerprint recognition chip and stiffening plate are housed in receiving space.Supporting plate is located in receiving space, and supporting plate is fixedly connected with fingerprint recognition chip, and supporting plate is fixedly connected with rosette.Fingerprint recognition chip, stiffening plate and the supporting plate of fingerprint recognition module are housed in receiving space, and in the use and transportation of fingerprint recognition module, stiffening plate and supporting plate are not easily susceptible to impact, and improve the reliability of fingerprint recognition module work.

Description

Fingerprint recognition module and its assemble method, housing unit and electronic installation
Technical field
The present invention relates to fingerprint identification technology field, more specifically, is related to a kind of fingerprint recognition module and its assembling side Method, housing unit and electronic installation.
Background technology
In the related art, the chip of the fingerprint recognition module of mobile phone is arranged in case ring, and passes through flexible PCB Chip is connected with mainboard, flexible PCB also needs to connect a stiffening plate, so that flexible PCB is not easy to be damaged, however, During the using and transport of fingerprint recognition module, the impact that stiffening plate is subject to is transmitted as readily to flexible PCB and chip On, and reduce the reliability of fingerprint recognition module work.
The content of the invention
Embodiment of the present invention provides a kind of fingerprint recognition module and its assemble method, housing unit and electronic installation.
The fingerprint recognition module of embodiment of the present invention includes:
Rosette, the rosette include side wall and the receiving space surrounded by the side wall;
Fingerprint sensor, the fingerprint sensor include fingerprint recognition chip, flexible PCB and the reinforcement being fixedly connected Plate, the flexible PCB are arranged between the fingerprint recognition chip and the stiffening plate, the fingerprint recognition chip and institute Stiffening plate is stated to be housed in the receiving space;With
Supporting plate, the supporting plate are located in the receiving space, the supporting plate and the fingerprint recognition chip, described Supporting plate is fixedly connected with the rosette.
In some embodiments, the rosette includes opposite upper surface and lower surface, and the receiving space is located at Between the upper surface and the lower surface, the supporting plate includes plate body and the through hole through the plate body, the flexible electrical Road plate and the stiffening plate are located in the through hole, and the stiffening plate fingerprint recognition chip is close to the lower surface, institute Stiffening plate is stated to flush with the lower surface.
In some embodiments, the rosette also includes the escape groove being opened on the lower surface, the avoidance Groove connects the receiving space, and the flexible PCB passes through the escape groove.
In some embodiments, the plate body opens up jagged, the flexibility in position corresponding with the escape groove Circuit board passes through the escape groove after passing through the breach from the receiving space.
In some embodiments, the supporting plate also include from the plate body protrusion limit chunk, it is described limit chunk with The fingerprint recognition chip leans so as to form gap between the fingerprint recognition chip and the plate body, the supporting plate with The fingerprint recognition chip is connected by viscose glue, and the viscose glue is housed in the gap.
In some embodiments, the supporting plate is connected with the rosette by way of welding.
In some embodiments, the upper surface is formed with guide ramp, and the guide ramp is by the rosette Outer peripheral edge is to the receiving space sunken inside.
In some embodiments, the rosette also includes prolonging from the side wall along the direction away from the receiving space The spacing ring stretched.
The housing unit of embodiment of the present invention includes:
Housing, the housing is formed with installation through-hole;With
Fingerprint recognition module described in any of the above-described embodiment, the rosette is through the installation through-hole and is arranged on On the housing.
The electronic installation of embodiment of the present invention includes:
Housing unit described in above-mentioned embodiment;With
Mainboard, the mainboard electrically connect with the flexible PCB.
The assemble method of the fingerprint recognition module of embodiment of the present invention includes:
Rosette is provided, the rosette includes side wall and the receiving space surrounded by the side wall;
Stiffening plate, flexible PCB and fingerprint recognition chip are connected to form fingerprint sensor, the flexible PCB position Between the fingerprint recognition chip and the stiffening plate;
Connecting cover plate and the fingerprint recognition chip, the fingerprint recognition chip are located at the cover plate and the flexible circuit Between plate;
The rosette is set on cover plate and the fingerprint sensor, the cover plate fingerprint sensor is advanced Enter the receiving space, the stiffening plate is housed in the receiving space with the fingerprint recognition chip;
Supporting plate is connected to the side opposite with the cover plate of the fingerprint recognition chip, the supporting plate is located at institute State in receiving space;With
It is fixedly connected with the supporting plate and the rosette.
In the fingerprint recognition module of embodiment of the present invention, housing unit and electronic installation, fingerprint recognition chip, stiffening plate It is housed in supporting plate in receiving space, in the use and transportation of fingerprint recognition module, stiffening plate and supporting plate are not It is vulnerable to impact, improves the reliability of fingerprint recognition module work.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein:
Fig. 1 is the floor map of the electronic installation of embodiment of the present invention;
Fig. 2 is schematic cross-section of the electronic installation along II-II lines shown in Fig. 1;
Fig. 3 is the enlarged diagram of III parts in Fig. 2;
Fig. 4 is the schematic perspective view of the fingerprint recognition module of embodiment of the present invention;
Fig. 5 is the rosette of embodiment of the present invention and the assembling schematic diagram of supporting plate;
Fig. 6 is the rosette of embodiment of the present invention and the assembling schematic diagram of supporting plate;
Fig. 7 is the assembling schematic diagram of the fingerprint recognition module of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described further below in conjunction with accompanying drawing.Same or similar label is from beginning in accompanying drawing To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Fig. 1-3 are referred to, the electronic installation 1000 of embodiment of the present invention includes housing unit 100 and mainboard 200.Housing Component 100 includes housing 20 and fingerprint recognition module 10.Housing 20 is formed with installation through-hole 22.
Fingerprint recognition module 10 includes rosette 12, fingerprint sensor 14 and supporting plate 15.Rosette 12 is logical through installation Hole 22 and installation on the housing 20.Rosette 12 includes side wall 121 and the receiving space 122 surrounded by side wall 121.Fingerprint sensing Device 14 includes fingerprint recognition chip 142, flexible PCB 144 and the stiffening plate 146 being fixedly connected.Flexible PCB 144 is set Between fingerprint recognition chip 142 and stiffening plate 146, fingerprint recognition chip 142 and stiffening plate 146 are housed in receiving space In 122.Supporting plate 15 is located in receiving space 122, and supporting plate 15 is fixedly connected with fingerprint recognition chip 142, supporting plate 15 with Rosette 12 is fixedly connected.
Mainboard 200 electrically connects with flexible PCB 144.
In the electronic installation 1000 of embodiment of the present invention, fingerprint recognition chip 142, stiffening plate 146 and supporting plate 15 are equal It is housed in receiving space 122, in the use and transportation of fingerprint recognition module 10, stiffening plate 146 and supporting plate 15 are not It is vulnerable to impact, improves the reliability of the work of fingerprint recognition module 10.
Referring to Fig. 1, specifically, electronic installation 1000 includes housing unit 100 and mainboard 200.Housing unit 100 includes Housing 20 and fingerprint recognition module 10.Electronic installation 1000 can be mobile phone, tablet personal computer, automatic teller machine, gate etc., electronic installation 1000 can gather the finger print information of user by fingerprint recognition module 10, further to verify the identity of user and corresponding power Limit etc..Embodiment of the present invention illustrates so that electronic installation 1000 is mobile phone as an example, it will be understood that the tool of electronic installation 1000 Body form can be other, be not limited thereto.Housing 20 can be a part for the shell of electronic installation 1000, such as housing 20 can be fore shell, rear shell or the side shell of electronic installation 1000, and in embodiments of the present invention, housing 20 is the rear shell of mobile phone, after Shell is opposite with the display screen of mobile phone, and fingerprint recognition module 10 is rearmounted fingerprint recognition module, after fingerprint recognition module 10 is arranged on On shell, not influence the arrangement of display screen, the screen accounting of mobile phone is improved.Fig. 2 and Fig. 3 are referred to, installation is offered on housing 20 Through hole 22, specifically, housing 20 include outer surface 24 and inner surface 26, and installation through-hole 22 runs through outer surface 24 and inner surface 26, Its outer surface 24 is the face that outward appearance of the electronic installation 1000 in normal use can see.Fingerprint recognition module 10 is arranged on In installation through-hole 22, user can know the particular location of fingerprint recognition module 10 by installation through-hole 22.Installation through-hole 22 Shape can be circle, rectangle, ellipse, track type etc..
Fig. 2-4 are referred to, fingerprint recognition module 10 includes rosette 12, fingerprint sensor 14 and supporting plate 15.Rosette 12 pass through installation through-hole 22 and install on the housing 20.Rosette 12 includes side wall 121 and the receiving space surrounded by side wall 121 122.Specifically, the global shape of rosette 12 is identical with the shape of installation through-hole 22, when rosette 12 is installed on the housing 20, The side wall 121 of rosette 12 is fitted with the inwall of installation through-hole 22 to prevent the dust in the external world from entering electricity out of installation through-hole 22 Sub-device 1000.
Fingerprint sensor 14 includes fingerprint recognition chip 142, flexible PCB 144 and the stiffening plate 146 being fixedly connected.Refer to The particular type of line sensor 14 can be capacitive fingerprint sensing device, optical fingerprint sensor, ultrasonic fingerprint sensor etc., Corresponding, fingerprint recognition chip 142 can also be capacitance type fingerprint identification chip, optical finger print identification chip, ultrasonic fingerprint Identification chip etc., in one example, fingerprint recognition chip 142 are land grid array (Land Grid Array, LGA) Fingerprint recognition chip 142.One end of flexible PCB 144 electrically connects with fingerprint recognition chip 142, and the other end can be connected to electricity On the mainboard of sub-device 1000, the finger print information that fingerprint recognition chip 142 gathers can be transferred to master by flexible PCB 144 On plate 200, further to be handled by the treatment element on mainboard 200, in certain embodiments, flexible PCB 144 The drive signal for the treatment of element can also be transferred to fingerprint recognition chip 142, for example, driving fingerprint identification chip 142 launch light, The drive signal of ultrasonic wave etc..
Because the intensity of flexible PCB 144 is relatively low, during installation and use, curling, deformation etc. are easily produced Defect, flexible PCB 144 can be covered on stiffening plate 146 to protect flexible PCB 144.Specifically, stiffening plate 146 The side opposite with fingerprint recognition chip 142 of flexible PCB 144 is arranged on, stiffening plate 146 can be by materials such as stainless steels It is made.Stiffening plate 146 is housed in receiving space 122, and for stiffening plate 146 by the protection of rosette 12, stiffening plate 146 will not be from Receiving space 122 is projecting inward, and stiffening plate 146 is not easily susceptible to the impact in the external world, avoids impact from being delivered to flexible PCB 144 and refer to On line identification chip 142.
Supporting plate 15 is fixedly connected with fingerprint recognition chip 142, and specifically, supporting plate 15 can be with flexible PCB 144 On the same face of fingerprint recognition chip 142, supporting plate 15 can be installed around stiffening plate 146.Supporting plate 15 simultaneously It is fixedly connected with rosette 12, supporting plate 15 causes the relative position of fingerprint recognition chip 142 and rosette 12 to fix, and avoids referring to Line identification chip 142 collapses under the pressing of user, while avoids fingerprint sensor 14 from deviating from from receiving space 122.
In the electronic installation 1000 of embodiment of the present invention, fingerprint recognition chip 142, stiffening plate 146 and supporting plate 15 are equal It is housed in receiving space 122, in the use and transportation of fingerprint recognition module 10, stiffening plate 146 and supporting plate 15 are not It is vulnerable to impact, improves the reliability of the work of fingerprint recognition module 10.
Fig. 2, Fig. 3 and Fig. 5 are referred to, in some embodiments, rosette 12 includes opposite upper surface 123 and lower end Face 124.Between upper surface 123 and lower surface 124, supporting plate 15 includes plate body 152 and through plate body receiving space 122 152 through hole 154, flexible PCB 144 and stiffening plate 146 are located in through hole 154.Stiffening plate 146 is compared with fingerprint recognition chip 142 Close to lower surface 124.Stiffening plate 146 flushes with lower surface 124.
The upper surface 123 of rosette 12 can flush with the outer surface 24 of housing 20, can also be formed with upper surface 123 Guide ramp 1232, guide ramp 1232 is from the outer peripheral edge of rosette 12 to the sunken inside of receiving space 122.When the finger of user is pressed When being pressed in guide ramp 1232, the finger that guide ramp 1232 can guide user enters in receiving space 122, to improve user Carry out the accuracy rate of fingerprint recognition operation.Further, shinny metal level (such as chromium can be plated in guide ramp 1232 Layer) so that rosette 12 is more attractive.The lower surface 124 of rosette 12 is concordant with stiffening plate 146, that is to say, that stiffening plate 146 The edge of receiving space 122 can be located just at, in this way, stiffening plate 146 can preferably be protected by rosette 12, will not Increase the integral thickness of fingerprint recognition module 10, while stiffening plate 146 will not take excessive receiving space 122, in order to Fingerprint recognition chip 142 and flexible PCB 144 are housed in receiving space 122.
Formed with through hole 154, through hole 154 is interior to be can be used for housing flexible PCB 144 and stiffening plate 146, plate body plate body 152 152 periphery can be used for being fixedly connected with rosette 12.In some embodiments, supporting plate 15 passes through welding with rosette 12 Mode connect, improve the reliability that is connected with rosette 12 of supporting plate 15, prevent fingerprint recognition chip 142 from receiving space Deviate from 122.Specifically, plate body 152 is connected with rosette 12 by way of welding, and the material of plate body 152 can be stainless Steel etc., in order to be welded with rosette 12.More specifically, solder joint is formed between the outer wall and rosette 12 of plate body 152.
Also referring to Fig. 4 and Fig. 6, in some embodiments, rosette 12 also includes being opened on lower surface 124 Escape groove 125, escape groove 125 connect receiving space 122, and flexible PCB 144 passes through escape groove 125.
As described above, flexible PCB 144 needs to electrically connect fingerprint recognition chip 142 and treatment element, escape groove 125 with Receiving space 122 connects, and flexible PCB 144 can pass through escape groove 125, and one end enters in receiving space 122 knows with fingerprint Other chip 142 is connected, and the other end is located at outside receiving space 122 to be connected with treatment element.Further, 10 groups of fingerprint recognition module After the completion of dress, filling with sealant, fluid sealant it can on the one hand prevent the dust in the external world, steam etc. by keeping away in escape groove 125 Groove 125 is allowed to enter receiving space 122, on the other hand the relative position available for fixing flexible circuit board 144 in escape groove 125 Put, flexible PCB 144 will not be swung in escape groove 125.
Also referring to Fig. 4 and Fig. 6, in some embodiments, plate body 15 opens up with 125 corresponding position of escape groove Jagged 156, flexible PCB 144 passes through escape groove 125 after passing through breach 156 from receiving space 122.
Breach 156 is easy to flexible PCB 144 from the cabling of receiving space 122 to escape groove 125.It is further possible to After fingerprint recognition module 10 is completed, the filling with sealant in breach 156, with fixing flexible circuit board 144 in breach 156 Interior relative position.
Fig. 3 and Fig. 5 are referred to, in some embodiments, supporting plate 12 also includes limit chunk 158.Chunk 158 is limited from plate Body 152 protrudes, and limit chunk 158 leans with fingerprint recognition chip 142, so that shape between fingerprint recognition chip 142 and plate body 152 Into gap.Supporting plate 15 is connected with fingerprint recognition chip 142 by viscose glue 16, and viscose glue 16 is housed in gap.
Limit the height in the gap that chunk 158 can be used between limitation fingerprint recognition chip 142 and plate body 152 so that gap It is interior to accommodate enough viscose glues 16, improve the reliability connected between fingerprint recognition chip 142 and supporting plate 15.Limit chunk 158 quantity can be multiple, and the protrusion height of multiple limit chunks 158 can be with equal, and multiple limit chunks 158 are in plate body 152 On can be equidistantly distributed.
Fig. 3 and Fig. 4 are referred to, in some embodiments, fingerprint recognition module 10 also includes cover plate 18.Cover plate 18 is fixed In the side opposite with flexible PCB 144 of fingerprint recognition chip 142.
Cover plate 18 can be made up of materials such as glass, ceramics, resins, and cover plate 18 can pass through with fingerprint recognition chip 142 Chip adhesive film (die attach film, DAF) bonds, and further to fix fingerprint recognition chip 142, user can use hand Refer to close or touch cover plate 18 so that fingerprint recognition chip 142 gathers the finger print information of user.The outer wall of cover plate 18 can be with dress The side wall 121 of circlets 12 leans, it is possible to further can be between the side wall 121 of rosette 12 in the outer wall of cover plate 18 Space in filling with sealant, to avoid the water in the external world from entering in receiving space 122, improve the water proofing property of fingerprint recognition module 10 Energy.
Fig. 3 and Fig. 4 are referred to, in some embodiments, rosette 12 is also included from side wall 121 along away from receiving space The spacing ring 127 of 122 direction extension.
Spacing ring 127 can be resisted against on the inner surface 26 of housing 20, and spacing ring 127 is located at outside installation through-hole 22, spacing Ring 127 prevents rosette 12 from deviating from out of housing 20.Further, spacing ring 127 can be bonded on inner surface 26, to improve The waterproof and dustproof performance of electronic installation 1000.
Incorporated by reference to Fig. 7, the assemble method of the fingerprint recognition module 10 of embodiment of the present invention includes:
Rosette 12 is provided, rosette 12 includes side wall 121 and the receiving space 122 surrounded by side wall 121;
Stiffening plate 146, flexible PCB 144 and fingerprint recognition chip 142 are connected to form fingerprint sensor 14, flexible electrical Road plate 144 is between fingerprint recognition chip 142 and stiffening plate 146;
Connecting cover plate 18 and fingerprint recognition chip 142, fingerprint recognition chip 142 are located at cover plate 18 and flexible PCB 144 Between;
Rosette 12 is set on cover plate 18 and fingerprint sensor 14, cover plate 18 is introduced into collecting compared with fingerprint sensor 14 Space 122, stiffening plate 146 are housed in receiving space 122 with fingerprint recognition chip 142;
Supporting plate 15 is connected to the side opposite with cover plate 18 of fingerprint recognition chip 142, supporting plate 15 is positioned at collecting In space 122;With
It is fixedly connected with supporting plate 15 and rosette 12.
Specifically, when rosette 12 is set on cover plate 18 and fingerprint sensor 14, cover plate 18 is introduced into receiving space In 122, direction installation of the cover plate 18 along lower surface 124 towards upper surface 123, when mounted by flexible PCB 144 and decoration The escape groove 125 of ring 12 is aligned.Because the size of flexible PCB 144 may be larger, in installation fingerprint sensor 14 to collecting When in space 122, flexible PCB 144 is difficult to pass completely through receiving space 122, the fingerprint recognition module of embodiment of the present invention In 10 assemble method, flexible PCB 144 need not pass completely through the receiving space 122 surrounded by side wall 121, flexible circuit Plate 144 is easily installed.
When installing supporting plate 15, first rosette 12 can be inverted, that is, the lower surface 124 of rosette 12 is located at The top of upper surface 123 is placed, and can coat viscose glue on fingerprint recognition chip 142 or on the plate body 152 of supporting plate 15 16, and limit chunk 158 is offseted with fingerprint recognition chip 142.Certainly, it is right by breach 156 and escape groove 125 now to also need to Standard, to avoid supporting plate 15 from being interfered with flexible PCB 144.Further, branch can be fixedly connected with by way of welding Fagging 15 and rosette 12.
After assembling fingerprint recognition module 10, then fingerprint recognition module 10 is installed on housing 20 to form housing unit 100, specifically, fingerprint recognition module 10 is arranged in installation through-hole 22 along from inner surface 26 towards the direction of outer surface 24, Spacing ring 127 is combined with inner surface 26 simultaneously.
In the description of this specification, reference term " some embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or specific features, structure, material or the feature of example description are contained at least one embodiment or example of the present invention. In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, description Specific features, structure, material or feature can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changed, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (11)

  1. A kind of 1. fingerprint recognition module, it is characterised in that including:
    Rosette, the rosette include side wall and the receiving space surrounded by the side wall;
    Fingerprint sensor, the fingerprint sensor include fingerprint recognition chip, flexible PCB and the stiffening plate being fixedly connected, institute State flexible PCB to be arranged between the fingerprint recognition chip and the stiffening plate, the fingerprint recognition chip and the reinforcement Plate is housed in the receiving space;With
    Supporting plate, the supporting plate are located in the receiving space, the supporting plate and the fingerprint recognition chip, the support Plate is fixedly connected with the rosette.
  2. 2. fingerprint recognition module according to claim 1, it is characterised in that the rosette include opposite upper surface and Lower surface, between the upper surface and the lower surface, the supporting plate includes plate body and through institute the receiving space The through hole of plate body is stated, the flexible PCB and the stiffening plate are located in the through hole, and the stiffening plate fingerprint is known Other chip flushes close to the lower surface, the stiffening plate with the lower surface.
  3. 3. fingerprint recognition module according to claim 2, it is characterised in that the rosette also include be opened in it is described under Escape groove on end face, the escape groove connect the receiving space, and the flexible PCB passes through the escape groove.
  4. 4. fingerprint recognition module according to claim 3, it is characterised in that the plate body is corresponding with the escape groove Position open up it is jagged, the flexible PCB from the receiving space pass through the breach after pass through the escape groove.
  5. 5. fingerprint recognition module according to claim 2, it is characterised in that the supporting plate also includes convex from the plate body The limit chunk gone out, limit chunk and the fingerprint recognition chip lean so that the fingerprint recognition chip and the plate body it Between form gap, the supporting plate is connected with the fingerprint recognition chip by viscose glue, and the viscose glue is housed in the gap.
  6. 6. fingerprint recognition module according to claim 2, it is characterised in that the supporting plate passes through weldering with the rosette The mode connect connects.
  7. 7. fingerprint recognition module according to claim 2, it is characterised in that the upper surface is formed with guide ramp, institute Guide ramp is stated from the outer peripheral edge of the rosette to the receiving space sunken inside.
  8. 8. fingerprint recognition module according to claim 1, it is characterised in that the rosette is also included from the side wall edge The spacing ring that direction away from the receiving space extends.
  9. A kind of 9. housing unit, it is characterised in that including:
    Housing, the housing is formed with installation through-hole;With
    Fingerprint recognition module described in claim 1-8 any one, the rosette is through the installation through-hole and is arranged on On the housing.
  10. A kind of 10. electronic installation, it is characterised in that including:
    Housing unit described in claim 9;With
    Mainboard, the mainboard electrically connect with the flexible PCB.
  11. A kind of 11. assemble method of fingerprint recognition module, it is characterised in that including:
    Rosette is provided, the rosette includes side wall and the receiving space surrounded by the side wall;
    Stiffening plate, flexible PCB and fingerprint recognition chip are connected to form fingerprint sensor, the flexible PCB is located at institute State between fingerprint recognition chip and the stiffening plate;
    Connecting cover plate and the fingerprint recognition chip, the fingerprint recognition chip be located at the cover plate and the flexible PCB it Between;
    The rosette is set on cover plate and the fingerprint sensor, the cover plate fingerprint sensor is introduced into institute Receiving space is stated, the stiffening plate is housed in the receiving space with the fingerprint recognition chip;
    Supporting plate is connected to the side opposite with the cover plate of the fingerprint recognition chip, the supporting plate is located at the receipts Hold in space;With
    It is fixedly connected with the supporting plate and the rosette.
CN201711050615.5A 2017-10-31 2017-10-31 Fingerprint recognition module and its assemble method, housing unit and electronic installation Pending CN107786694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711050615.5A CN107786694A (en) 2017-10-31 2017-10-31 Fingerprint recognition module and its assemble method, housing unit and electronic installation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711050615.5A CN107786694A (en) 2017-10-31 2017-10-31 Fingerprint recognition module and its assemble method, housing unit and electronic installation

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Publication Number Publication Date
CN107786694A true CN107786694A (en) 2018-03-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108875571A (en) * 2018-05-10 2018-11-23 Oppo广东移动通信有限公司 Fingerprint recognition module group assembling method, fingerprint recognition mould group and electronic device
CN113687688A (en) * 2021-08-20 2021-11-23 联宝(合肥)电子科技有限公司 Fingerprint identification assembly, keyboard and electronic device
CN113746959A (en) * 2020-05-29 2021-12-03 青岛海信移动通信技术股份有限公司 Electronic equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317249B1 (en) * 2013-07-11 2013-10-10 (주)드림텍 Method of manufacturing fingerprint recognition home key with improved structure of tightly contacting between fingerprint recognition sensor and mold and fingerprint recognition home key thereof
CN103400181A (en) * 2013-07-24 2013-11-20 江苏恒成高科信息科技有限公司 Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof
CN105825165A (en) * 2015-11-20 2016-08-03 维沃移动通信有限公司 Fingerprint identification module, terminal device and assembling method
CN106850886A (en) * 2017-01-20 2017-06-13 广东欧珀移动通信有限公司 A kind of mobile terminal
CN106951880A (en) * 2017-03-30 2017-07-14 苏州迈瑞微电子有限公司 Sense module packaging method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317249B1 (en) * 2013-07-11 2013-10-10 (주)드림텍 Method of manufacturing fingerprint recognition home key with improved structure of tightly contacting between fingerprint recognition sensor and mold and fingerprint recognition home key thereof
CN103400181A (en) * 2013-07-24 2013-11-20 江苏恒成高科信息科技有限公司 Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof
CN105825165A (en) * 2015-11-20 2016-08-03 维沃移动通信有限公司 Fingerprint identification module, terminal device and assembling method
CN106850886A (en) * 2017-01-20 2017-06-13 广东欧珀移动通信有限公司 A kind of mobile terminal
CN106951880A (en) * 2017-03-30 2017-07-14 苏州迈瑞微电子有限公司 Sense module packaging method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108875571A (en) * 2018-05-10 2018-11-23 Oppo广东移动通信有限公司 Fingerprint recognition module group assembling method, fingerprint recognition mould group and electronic device
CN113746959A (en) * 2020-05-29 2021-12-03 青岛海信移动通信技术股份有限公司 Electronic equipment
CN113687688A (en) * 2021-08-20 2021-11-23 联宝(合肥)电子科技有限公司 Fingerprint identification assembly, keyboard and electronic device
CN113687688B (en) * 2021-08-20 2024-05-17 联宝(合肥)电子科技有限公司 Fingerprint identification subassembly, keyboard and electron device

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