Specific embodiment
Embodiments of the present invention are described below in detail, the example of the implementation method is shown in the drawings, wherein ad initio
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The implementation method for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention is described with simplified, must have specific orientation, Yi Te rather than the device or element for indicating or imply meaning
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.Additionally, term " first ", " second " are only used for
Description purpose, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " is meant that two or more, unless otherwise expressly limited specifically.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Company ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected;Can
Being to mechanically connect, or electrically connect or can mutually communicate;Can be joined directly together, it is also possible to by between intermediary
Connect connected, can be two element internals connection or two interaction relationships of element.For the ordinary skill of this area
For personnel, above-mentioned term concrete meaning in the present invention can be as the case may be understood.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to including the first and second features be not directly contact but by it
Between other characterisation contact.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different implementation methods or example is used for realizing different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting to specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various implementation methods itself not being indicated and/or being set
Relation.Additionally, the invention provides various specific technique and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 3 is referred to, the cover plate assembly 100 of embodiment of the present invention includes cover plate 10, case ring 20, fingerprint recognition
Module 30 and support chip 40.Case ring 20 is arranged in cover plate 10, and fingerprint identification module 30 is arranged in case ring 20, support chip
40 are fixedly connected with cover plate 10, and carry case ring 20.
Incorporated by reference to Fig. 4, the cover plate assembly 100 of embodiment of the present invention can be applied to electronic installation 200, electronic installation 200
The for example, electronic installation such as mobile phone, Intelligent worn device or panel computer 200.It is appreciated that electronic installation 200 includes but does not limit
In the example of present embodiment.
Specifically, Fig. 3 is referred to, cover plate 10 includes upper surface 11 and lower surface 12.It is appreciated that the upper surface of cover plate 10
11 is the appearance of cover plate assembly 100, towards user.User can carry out gesture operation on upper surface 11, for example click on or
Slide to control electronic installation 200 to realize corresponding function.
The material of cover plate 10 can be made up of light transmissive materials such as glass, ceramics or sapphires.Because cover plate 10 is due to conduct
The input part of electronic installation 200, cover plate 10 such as is often subject to collide or scratch at the contact.For example, user puts electronic installation 200
During inlet pocket, cover plate 10 may be scratched and damaged by the key in user's pocket.
Therefore, the material of cover plate 10 can be using the material of hardness is bigger, such as sapphire material above.Certainly,
Can set up protection board in the upper surface 11 of cover plate 10 to prevent cover plate 10 to be scraped off.
Because cover plate 10 is made up of light transmissive material, therefore, user can check the screen of electronic installation 200 by cover plate 10
Shown content.
It is appreciated that the shape of cover plate 10 can be according to the shape specific design of electronic installation 200, for example, fillet square
Shape.
Further, cover plate 10 offers installation through-hole 13.In present embodiment, installation through-hole 13 is through upper surface 11
And the through hole of lower surface 12.
In present embodiment, installation through-hole 13 is in the oval bodily form.Certainly, in other embodiments, installation through-hole 13 can
Taken on a different shape with according to real needs design, such as shape of circular or ellipse.Therefore, the installation of present embodiment is led to
The example of the shape in hole 13 is not considered as limiting the invention.
In some embodiments, case ring 20 is arranged in installation through-hole 13, and is fixedly connected with cover plate 10.Fingerprint
Identification module 30 is housed in case ring 20, and is fixedly connected with case ring 20.For example, fingerprint identification module 30 by colloid with
Case ring 20 is adhesively fixed together.
Usually, the receiver of electronic installation 200 is arranged on the top area of electronic installation 200.Therefore, in order to prevent peace
Dress through hole 13 is interfered with receiver, it is preferred that installation through-hole 13 is opened in the bottom section of cover plate 10, so that logical to install
The larger design space of offer in hole 13.In addition, installation through-hole 13 is opened in the centre position of the bottom section of cover plate 10 so that lid
The substantially symmetrical structure of plate 10.So so that electronic installation 200 is more attractive in appearance, two is user-friendly.
Also referring to Fig. 3, Fig. 7 and Fig. 8, in some embodiments, case ring 20 includes basic ring 21 and from basic ring 21
The support division 22 that stretches out of top, support division 22 includes the supporting surface 221 being connected with the lateral surface 211 of basic ring 21, supports
Face 221 is right angle or obtuse angle with the angle of the lateral surface 211 of basic ring 21, and supporting surface 221 is resisted against on cover plate 10, to limit decoration
Circle 20 is moved down relative to cover plate 10.
In this way, because case ring 20 can be resisted against on cover plate 10 by supporting surface 221, so that it is relative to limit case ring 20
Moved down in cover plate 10, be conducive to Consumer's Experience.
Specifically, the side wall 131 of installation through-hole 13 inclines with the intersection of upper surface 11 and is connected to form confined planes 14, limits
Plane 14 matches with supporting surface 221, and supporting surface 221 is resisted against on confined planes 14.
In this way, confined planes 14 can allow that case ring 20 is housed in installation through-hole 13, so that electronic installation
200 it is more attractive in appearance.
In some embodiments, support division 22 includes the guide ramp 222 opposite with supporting surface 221, guide ramp 222
The medial surface 212 of connection basic ring 21 is simultaneously downward-sloping towards the medial surface 212 of basic ring 21.
In this way, the finger that guide ramp 222 can guide user is smoothly interior to carry out fingerprint recognition operation into basic ring 21, can
Improving user carries out the accuracy rate of fingerprint recognition operation.It is possible to further plate shinny metal level in guide ramp 222
(such as layers of chrome), so that basic ring 21 is more attractive in appearance.
It is appreciated that guide ramp 222 is ring surface, can so facilitate user that finger is inserted into basic ring 21 from all directions
It is interior to press fingerprint identification module 30, so as to carry out fingerprint recognition operation.
In some embodiments, the lateral surface 211 of basic ring 21 is formed with along the circumferentially extending groove 215 of basic ring 21.
Further, cover plate assembly 100 includes being arranged on sealing ring 50 in groove 215, and sealing ring 50 seals the lateral surface 211 of basic ring 21
With the gap between installation through-hole 13.Sealing ring 50 is, for example, silica gel sealing ring.
In this way, groove 215 is conducive to fixed seal ring 50, so that sealing ring 50 can seal the lateral surface 211 of basic ring 21
There is the gap between installation through-hole 13, can so prevent water, dust and other impurities lateral surface 211 and installation through-hole from basic ring 21
Gap between 13 enters in electronic installation 200 and influences the normal work of electronic installation 200.
In some embodiments, case ring 20 includes the support that the bottom of the medial surface 212 from basic ring 21 extends internally
Side 23, further, fingerprint identification module 30 is supported on support edge 23.In this way, support edge 23 can support and location fingerprint
Identification module 30, so as to improve the efficiency of assembling of fingerprint identification module 30 and case ring 20.
In other words, fingerprint identification module 30 is supported on support edge 23.Fingerprint identification module 30 is loaded in basic ring 21
When, fingerprint identification module 30 can be from top to bottom pressed, if the position of fingerprint identification module 30 can not move again, then it represents that refer to
Line identification module 30 has been resisted against on support edge 23, and is installed into precalculated position.
It is appreciated that basic ring 21 is formed with centre bore 213, support edge 23 is located in centre bore 213.Centre bore 213 can be with
In right cylinder shape, in other words, the medial surface 212 of basic ring 21 is linearly, and center is rapidly loaded in order to fingerprint identification module 30
In hole 213.
The material that centre bore 213 and support edge 23 can be removed on part by way of machining is formed, it is also possible to
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
Can be made using other materials such as plastics.
In some embodiments, medial surface 212 of the support edge 23 perpendicular to basic ring 21.
In this way, support edge 23 is easily formed, the manufacturing cost of basic ring 21 can be reduced.In addition, when manufacture cover plate assembly 100
When, support edge 23 is horizontally situated, and the medial surface 212 of basic ring 21 is located at vertical position so that the finger coordinated with support edge 23
The face of line identification module 30 is horizontal plane, can so simplify the structure of the fingerprint identification module 30 being supported on support edge 23.
In some embodiments, basic ring 21 includes bottom surface 214, the lower surface of support edge 23 and the bottom surface 214 of basic ring 21
Concordantly.
In the basic ring 21 of equal height, such as arrangement above, larger accommodation space can be formed in basic ring 21, to ensure
Fingerprint identification module 30 can be housed in basic ring 21.
In other words, in the case where the thickness of fingerprint identification module 30 is constant, the height of basic ring 21 is smaller, such that it is able to drop
The thickness of low cover plate assembly 100, and then can be the thinning offer design basis of thickness of electronic installation 200.
Fig. 7 and Fig. 8 is referred to, in some embodiments, support edge 23 is formed with and is connected with the centre bore 213 of basic ring 21
Avoidance hole 231.
Incorporated by reference to Fig. 5 and Fig. 6, in this way, avoiding the flexible PCB 60 that hole 231 is conducive to being connected with fingerprint identification module 30
Cabling layout.For example, flexible PCB 60 can connect through hole 231 is avoided with fingerprint identification module 30.
In some embodiments, the rounded rectangle in hole 231 is avoided, the long side wall for avoiding hole 231 is offered and avoidance
The escape groove 232 of the connection of hole 231, escape groove 232 extends along the length direction for avoiding hole 231.
For example shown in Fig. 6, after flexible PCB 60 is connected with fingerprint identification module 30, first prolong to the direction of escape groove 232
Stretch, then bend roundabout.Therefore, escape groove 232 can prevent flexible PCB 60 from being interfered with the side wall for avoiding hole 231,
Flexible PCB 60 is conducive to connect up.
Referring to Fig. 5, in some embodiments, fingerprint identification module 30 includes packaging body 31 and fingerprint recognition core
Piece 32.
Specifically, when user carries out the operation of unlocked by fingerprint electronic installation 200, finger can be placed on and fingerprint recognition core
The corresponding position of piece 32.The signal of fingerprint recognition chip 32 passes through packaging body 31 to gather the fingerprint pattern of identifying user, will use
The fingerprint pattern at family is matched with the fingerprint pattern for prestoring, if the match is successful, unlocks electronic installation 200.
It is appreciated that fingerprint recognition chip 32 is provided with sensor pixel array towards the surface of the finger of user, to gather
The fingerprint pattern of user.The encapsulation fingerprint recognition of packaging body 31 chip 32 can reduce sensor pixel array when fingerprint pattern is gathered
Influenceed by other interference signals, to improve the accuracy rate of identification.
In some embodiments, the top surface of fingerprint identification module 30 is provided with cover plate 33.For example, cover plate 33 passes through
Colloid is fixed on the top surface of fingerprint identification module 30.
When fingerprint recognition operation is carried out, finger can be pressed against in cover plate 33 user.Cover plate 33 can be with tamper seal
Dress body 31 is without damage, to improve the reliability of fingerprint identification module 30.
Cover plate 33 due to be often subject to touching, therefore, the material that cover plate 33 can be used hardness higher is made, for example with
On the sapphire material that refers to.
In some embodiments, the shape of the top surface of the form and dimension of cover plate 33 and fingerprint identification module 30 and big
Small cooperation.
For example, the shape of the top surface of fingerprint identification module 30 is in Long Circle, the shape of cover plate 33 is also in Long Circle.Covering
Area of the area of plate 33 slightly larger than the top surface of fingerprint identification module 30.Therefore, cover plate 33 can be completely covered fingerprint recognition
Module 30.
Please be refering to Fig. 5 and Fig. 8, in some embodiments, support chip 40 includes the periphery of self installation through hole 13 to logical
The supporting part 41 that the center in hole extends, case ring 20 is arranged in installation through-hole 13 and is fixedly connected with supporting part 41.For example, dress
Decorative circle 20 is fixedly connected with supporting part 41 by Nian Jie mode.And for example, case ring 20 and supporting part 41 are by way of welding
It is fixedly connected.
In this way, because support chip 40 is fixedly connected with cover plate 10, and case ring 20 is fixedly connected with support chip 40, so that
Can prevent case ring 20 from being moved relative to cover plate 10, be conducive to user to press the fingerprint identification module 30 in case ring 20 to enter
Row fingerprint recognition is operated.
In some embodiments, support chip 40 includes the fixed part 42 of the lower surface 12 for being fixed on cover plate 10, fixed part
42 are fixedly connected with supporting part 41.
In other words, the periphery of installation through-hole 13 is first extended to outside the periphery of the self installation through hole 13 of support chip 40, then from peace
The periphery for filling through hole 13 extends to the center of installation through-hole 13.
The lower surface 12 that support chip 40 is fixed on cover plate 10 is conducive to support chip 40 to be fixedly connected with cover plate 10, for example, branch
Blade 40 can be fixed on the lower surface 12 of cover plate 10 by way of bonding.
In some embodiments, the fixed part 42 of support chip 40 is set around installation through-hole 13, and supporting part 41 is around installation
The circumferentially extending of through hole 13.In this way, supporting part 41 is larger with the area that case ring 20 is contacted, be conducive to the stable twelve Earthly Branches of case ring 20
Support is on supporting part 41.
In some embodiments, supporting part 41 forms raised the 43 of the protrusion of oriented case ring 20, and case ring 20 is resisted against
On raised 43.
In this way, raised 43 can increase the intensity of supporting part 41, when fingerprint identification module 30 is pressed, supporting part 41 is difficult
Deformation.In one example, support chip 40 is made up of sheet metal, and raised 43 is the die mould of support chip 40.It is convex in present embodiment
Play 43 and be scattered in multiple raised 43 around the circumferentially-spaced of supporting part 41, for example in fig .9, raised 43 are spaced apart into 2 projections
43。
Fig. 3 and Fig. 6 is referred to, in some embodiments, supporting part 41 is formed with perforation 411, and cover plate assembly 100 includes
Card 70, the bending of card 70 is formed with bayonet socket 71, and card 70 is fixedly connected with case ring 20, and passes through from the edge of perforation 411
The clamp standoff portion 41 of bayonet socket 71, is moved with limiting case ring 20 relative to support chip 40.
In this way, card 70 can prevent case ring 20 from moving, fingerprint identification module 30 is conducive to carry out fingerprint recognition.
In present embodiment, the quantity of card 70 is two, and two cards 70 are clamped in the length direction of perforation 411 respectively
Two ends.It is appreciated that in other embodiments, the quantity and clip position of card 70 can according to actual conditions it is specific and
It is fixed.
In one example, when cover plate assembly 100 is assembled, the lower surface that support chip 40 is fixed on cover plate 10 can be showed
12, the case ring 20 that then will be fixed with the card 70 before non-doubling is fitted into installation through-hole 13, and makes card 70 through perforation
411, by the doubling of card 70 after case ring 20 is supported on supporting part 41, so that card 70 forms bayonet socket 71 and clamp standoff
, finally be arranged on fingerprint identification module 30 in the basic ring 21 of case ring 20 by portion 41.
Figure 10 is referred to, present invention also offers a kind of display screen component 300, display screen component 300 includes implementation method
Cover plate assembly 100 and display screen 302, display screen 302 is arranged on the lower surface 12 of cover plate 10.
In the description of this specification, reference term " implementation method ", " some implementation methods ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine the implementation method or example describes
Specific features, structure, material or feature are contained at least one implementation method of the invention or example.In this specification
In, the schematic representation to above-mentioned term is not necessarily referring to identical implementation method or example.And, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in one or more any implementation methods or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These implementation methods can be carried out with various changes, modification, replacement in the case of not departing from principle of the invention and objective and become
Type, the scope of the present invention is limited by claim and its equivalent.