CN206743310U - Case ring, cover plate assembly and electronic installation - Google Patents

Abstract

The utility model discloses a kind of case ring, cover plate assembly and electronic installation.Case ring includes basic ring and support division.Basic ring has centre bore.Support division stretches out from the top of basic ring.Support division includes the supporting surface being connected with the lateral surface of basic ring；The touch surface being connected with the medial surface of centre bore, touch surface are opposite with support division；With connection supporting surface and the bonding plane of touch surface, the lateral surface of bonding plane, supporting surface and basic ring is used to form the gap entered for colloid with the medial surface of the installation through-hole of the cover plate of electronic installation.In the case ring of the utility model embodiment, cover plate assembly and electronic installation, because case ring is formed with bonding plane so that colloid can enter in the gap between case ring and cover plate from the upper surface of cover plate and the top of case ring, and dispensing process is convenient and simple.

Description

Case ring, cover plate assembly and electronic installation

Technical field

It the utility model is related to field of electronic devices, more particularly to a kind of case ring, cover plate assembly and electronic installation.

Background technology

In the related art, case ring is provided with the cover plate of the electronic installation such as mobile phone, it is used for decorative ring to be passed in collecting fingerprint Sensor.Therefore, how to fix case ring by better simply mode turns into the problem of to be solved on the cover board.

Utility model content

The utility model embodiment provides a kind of case ring, a kind of cover plate assembly and a kind of electronic installation.

The case ring of the utility model embodiment includes basic ring and support division.The basic ring has centre bore.It is described to support Portion is held from the top of the basic ring to stretch out.Support division includes the supporting surface being connected with the lateral surface of the basic ring；With it is described The touch surface of the medial surface connection of centre bore, the touch surface are opposite with the support division；With connect the supporting surface and described The bonding plane of touch surface, the lateral surface of the bonding plane, the supporting surface and the basic ring are used to the cover plate with electronic installation Installation through-hole medial surface formed for colloid enter gap.

In some embodiments, the angle between the lateral surface of the supporting surface and the basic ring is right angle or obtuse angle.

In some embodiments, the touch surface is towards in the centre bore and inclined-plane that tilts down.

In some embodiments, the case ring includes the support chip to be extended internally from the medial surface of the centre bore, The upper surface of the support chip is provided with multiple projections, circumferentially-spaced distribution of the multiple projection around the basic ring.

In some embodiments, the height of the projection is more than or equal to 0.05mm.

In some embodiments, waterproof seal is provided with the lateral surface of the basic ring, the waterproof seal encloses Around the basic ring, the waterproof seal is structure as a whole with the case ring.

In some embodiments, the lateral surface of the basic ring is formed with the circumferentially extending groove along the basic ring, institute Waterproof seal is stated partly to be housed in the groove.

The cover plate assembly of the utility model embodiment includes cover plate and the case ring of any of the above embodiment, the lid Plate offers installation through-hole, and the case ring is arranged in the installation through-hole.The bonding plane, the supporting surface and the base The lateral surface of ring forms gap with the medial surface of the installation through-hole, and the bonding case ring and institute are provided with the gap State the colloid of cover plate.

In some embodiments, the medial surface of the installation through-hole includes：

First face relative with the lateral surface of the basic ring, first face connect the lower surface of the cover plate, and described the Simultaneously the lateral surface with the basic ring forms the first gap；

The second face being connected with first face, second face is relative with the supporting surface, second face with it is described Supporting surface is formed with the second gap；With

The 3rd face of second face and the upper surface of the cover plate is connected, the 3rd face is relative with the bonding plane, 3rd face is with the bonding plane formed with third space；

The colloid is provided with first gap, second gap and the third space.

In some embodiments, the width of the third space is more than or equal to 0.03mm.

In some embodiments, the cover plate assembly includes the fingerprint identification module being housed in the centre bore.

The electronic installation of the utility model embodiment includes the cover plate assembly of any of the above embodiment.

In the case ring of the utility model embodiment, cover plate assembly and electronic installation, because case ring is formed with bonding Face so that colloid can enter in the gap between case ring and cover plate from the upper surface of cover plate and the top of case ring, dispensing Process is convenient and simple.

Additional aspect and advantage of the present utility model will be set forth in part in the description, partly by from following description In become obvious, or by it is of the present utility model practice recognize.

Brief description of the drawings

In description of the of the present utility model above-mentioned and/or additional aspect and advantage from combination accompanying drawings below to embodiment It will be apparent and be readily appreciated that, wherein：

Fig. 1 is the floor map of the cover plate assembly of the utility model embodiment；

Fig. 2 be Fig. 1 cover plate assembly II-II to partial cutaway schematic view；

Fig. 3 is the partial schematic diagram of the cover plate assembly of the utility model embodiment；

Fig. 4 is the schematic perspective view of the electronic installation of the utility model embodiment；

Fig. 5 is another partial schematic diagram of the cover plate assembly of the utility model embodiment；

Fig. 6 is the diagrammatic cross-section of the case ring of the utility model embodiment；

Fig. 7 is the schematic perspective view of the case ring of the utility model embodiment；

Fig. 8 is the floor map of the case ring of the utility model embodiment；

Fig. 9 is the schematic flow sheet of the preparation method of the cover plate assembly of the utility model embodiment.

Main element symbol description：

Cover plate assembly 100, electronic installation 200；

Cover plate 10, upper surface 11, lower surface 12, installation through-hole 13, the medial surface 131 of installation through-hole 13, the first face 132, Second face 133, the 3rd face 134, gap 41, the first gap 411, the second gap 412, third space 413；

Case ring 20, basic ring 21, the lateral surface 211 of basic ring, the medial surface 212 of centre bore, centre bore 213, bottom surface 214, Groove 215, support division 22, supporting surface 221, touch surface 222, bonding plane 223, support chip 23, the upper surface 232 of support chip, branch The lower surface 234 of blade, avoid holes 231, projection 24；

Fingerprint identification module 30, packaging body 31, fingerprint recognition chip 32, cover plate 33；

Colloid 40；

Waterproof grommet 50；

Flexible PCB 60.

Embodiment

Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality New limitation.

In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for Be easy to describe the utility model and simplify to describe, rather than instruction or imply signified device or element must have it is specific Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ", " second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific Limit.

, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly Connection；It can be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be in Between medium be indirectly connected, can be connection or the interaction relationship of two elements of two element internals.For this area For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.

In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only Represent that fisrt feature level height is less than second feature.

Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model. In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.

Fig. 1-Fig. 3 is referred to, the cover plate assembly 100 of the utility model embodiment includes cover plate 10, case ring 20 and referred to Line identification module 30.Case ring 20 is arranged in cover plate 10, and fingerprint identification module 30 is arranged in case ring 20.

Incorporated by reference to Fig. 4, the cover plate assembly 100 of the utility model embodiment can be applied to electronic installation 200, electronic installation 200 be, for example, the electronic installations such as mobile phone, Intelligent worn device or tablet personal computer.It is appreciated that electronic installation 200 includes but unlimited In the example of present embodiment.

Specifically, referring to Fig. 2, cover plate 10 includes upper surface 11 and lower surface 12.It is appreciated that the upper surface of cover plate 10 11 be the appearance of cover plate assembly 100, towards user.User can carry out gesture operation on upper surface 11, for example, click on or Slide to control electronic installation 200 to realize corresponding function.

Cover plate 10 can be made up of light transmissive materials such as glass, plastics, ceramics or sapphires.Because cover plate 10 is due to as electricity The input part of sub-device 200, cover plate 10 are often subject to collide or the contact such as scratch.For example, electronic installation 200 is put into by user During pocket, cover plate 10 may be scratched and damaged by the key in user's pocket.

Therefore, the material of cover plate 10 can use the larger material of hardness, such as sapphire material.It is of course also possible to Protection board is set up to prevent cover plate 10 to be scraped off in the upper surface 11 of cover plate 10.

Because cover plate 10 is made up of light transmissive material, therefore, user can check the screen of electronic installation 200 by cover plate 10 Shown content.

It is appreciated that the shape of cover plate 10 can be according to the shape specific design of electronic installation 200, for example, fillet square Shape.

Further, cover plate 10 offers installation through-hole 13.In present embodiment, installation through-hole 13 is through cover plate 10 Upper surface 11 and the through hole of the lower surface of cover plate 10 12.

In present embodiment, installation through-hole 13 is in the oval bodily form.Certainly, in other embodiments, installation through-hole 13 can To take on a different shape, such as circular or ellipse shape.Therefore, the example of the shape of the installation through-hole 13 of present embodiment It is not intended that to limitation of the present utility model.

In some embodiments, case ring 20 is arranged in installation through-hole 13, and is fixedly connected with cover plate 10.

Usually, the receiver of electronic installation 200 is arranged on the top area of electronic installation 200.Therefore, in order to prevent from pacifying Dress through hole 13 interferes with receiver, it is preferred that installation through-hole 13 is opened in the bottom section of cover plate 10, so as to lead to for installation Hole 13 provides larger design space.In addition, installation through-hole 13 is opened in the centre position of the bottom section of cover plate 10 so that lid The substantially symmetrical structure of plate 10.So so that electronic installation 200 is more attractive in appearance, two is user-friendly.

Incorporated by reference to Fig. 3 and Fig. 6, the case ring 20 of the utility model embodiment includes basic ring 21 and support division 22.Basic ring 21 have centre bore 213.Support division 22 stretches out from the top of basic ring 21.

Support division 22 includes supporting surface 221, touch surface 222 and bonding plane 223.The lateral surface of supporting surface 221 and basic ring 21 211 connections.Touch surface 222 connects and opposite with supporting surface 221 with the medial surface 212 of centre bore 213.The connection of bonding plane 223 is supported Hold face 221 and touch surface 222.The lateral surface 211 of bonding plane 223, supporting surface 221 and basic ring 21 is used to and installation through-hole 13 Medial surface 131 forms the gap 41 entered for colloid 40.

Therefore, in the cover plate assembly 100 of the utility model embodiment, case ring 20 is arranged in installation through-hole 13, is glued The lateral surface 211 of junction 223, supporting surface 221 and basic ring 21 forms gap 41, gap with the medial surface 131 of installation through-hole 13 The colloid 40 of bonding case ring 20 and cover plate 10 is provided with 41.

In this way, in the case ring 40, cover plate assembly 100 and electronic installation 200 of the utility model embodiment, due to dress Decorative circle 40 is formed with bonding plane 223 so that colloid 40 can enter dress from the upper surface 11 of cover plate 10 and the top of case ring 20 In gap 41 between decorative circle 20 and cover plate 10, dispensing process is convenient and simple.

In addition, case ring 20 can be resisted against on cover plate 10 by supporting surface 221 and colloid 40, so as to limit case ring 20 Moved down relative to cover plate 10, be advantageous to Consumer's Experience.

Specifically, in present embodiment, basic ring 21 is in the oval bodily form.Certainly, in other embodiments, basic ring 21 can be with Take on a different shape, such as the shape such as circular or ellipse.Therefore, the example of the shape of the basic ring 21 of present embodiment can not manage Solve as to limitation of the present utility model.

Centre bore 213 can be in right cylinder shape, and in other words, the medial surface 212 of centre bore 213 is in plane, in order to which fingerprint is known Other module 30 rapidly loads in centre bore 213.

The material that centre bore 213 and support chip 23 can be removed on part by way of machining is formed, can also It is integrally formed by modes such as castings.

In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20 The other materials such as plastics can be used to be made.

Referring to Fig. 3, in some embodiments, the medial surface 131 of installation through-hole 13 includes the first face 132, the Two faces 133 and the 3rd face 134.First face 132 is relative with the lateral surface 211 of basic ring 21 and the lower surface 12 of connecting cover plate 10.The Simultaneously 132 form the first gap 411 with the lateral surface 211 of basic ring 21.Second face 133 is connected with the first face 132 and and supporting surface 221 is relative.Second face 133 is with supporting surface 211 formed with the second gap 412.3rd face 134 connects the second face 133 and cover plate 10 Upper surface 11 and relative with bonding plane 223.3rd face 134 is with bonding plane 223 formed with third space 413.First gap 411st, it is provided with colloid 40 in the second gap 412 and third space 413.

In this way, the shape of the medial surface 131 of installation through-hole 13 and the shape of case ring 20 match so that cover plate 10 and decoration Fit structure between circle 20 is compacter.

In some embodiments, the width W of third space 413 is more than or equal to 0.03mm.

In this way, the width W of third space 413 can cause colloid 40 to smoothly enter case ring 20 and installation through-hole 13 In gap 41 between medial surface 131, and colloid 40 can be caused to be bonded case ring 20 and cover plate 10 securely.

In some embodiments, the included angle A between the second face 133 and the 3rd face 134 is right angle or obtuse angle.So cause Supporting surface 221 can be resisted against on the second face 133.Because the second face 133 and supporting surface 221 are relative, the 3rd face 134 and bonding plane 223 is relative.Therefore, the included angle B (see Fig. 6) between the supporting surface 221 and bonding plane 223 of case ring 20 is also right angle or obtuse angle.

In the example of fig. 3, the included angle A between the second face 133 and the 3rd face 134 in obtuse angle, in the example of hgure 5, Included angle A between two faces 133 and the 3rd face 134 is rectangular.

Fig. 3 and Fig. 6 is referred to, in some embodiments, the folder between the lateral surface 211 of supporting surface 221 and basic ring 21 Angle C is right angle or obtuse angle.So cause, the shape of basic ring 21 matches with the shape of installation through-hole 131, so that supporting surface 211 can be resisted against on the second face 133.

In some embodiments, touch surface 222 is towards the inclined-plane that centre bore 213 is interior and tilts down.

In this way, the finger that touch surface 222 can guide user smoothly enters in case ring 20 to carry out fingerprint recognition operation, can Improve the accuracy rate that user carries out fingerprint recognition operation.It is possible to further plate shinny metal level in touch surface 222 (such as layers of chrome), so that case ring 20 is more attractive in appearance.

It is appreciated that touch surface 222 is ring surface, it can so facilitate user that finger is inserted into case ring 20 from all directions It is interior to press fingerprint identification module 30, so as to carry out fingerprint recognition operation.

Also referring to Fig. 3, Fig. 6 and Fig. 7, in some embodiments, case ring 20 includes support chip 23.Support chip 23 Extended internally from the medial surface 212 of centre bore 213.The upper surface 232 of support chip 23 is provided with multiple projections 24, multiple projections 24 Around the circumferentially-spaced distribution of basic ring 21.

In this way, fingerprint identification module 30 can be housed in centre bore 213, and is supported on multiple projections 24, projection 24 can To ensure the thickness of the viscose glue between the upper surface 232 of support chip 23 and fingerprint identification module 30, so that fingerprint identification module 30 It is be bonded with case ring 20 firm, so as to prevent fingerprint identification module 30 from being come off from case ring 20.

In some embodiments, the height H of projection 24 is more than or equal to 0.05mm, i.e. H >=0.05mm.For example, H is 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.2mm, 0.3mm equidimension.

In this way, the height H of projection 24 can ensure the upper table of fingerprint identification module 30 and support chip 23 in range above The thickness of viscose glue between face 232, so that fingerprint identification module 30 and the fixation of case ring 20.

Incorporated by reference to Fig. 7, in some embodiments, multiple projections 24 connect the medial surface 212 of centre bore 213.It is in this way, convex Block 24 easily by support chip 23 remove material formed.

In some embodiments, the opposite both sides of centre bore 213 are respectively arranged with least one projection 24.Such as Fig. 7 Example in, the upper side and lower side of centre bore 213 is respectively arranged with two projections 24.Certainly, in one example, centre bore 213 left side and right side can set a projection 24 respectively.

Fig. 3 and Fig. 6 is referred to, in some embodiments, waterproof seal is provided with the lateral surface 211 of basic ring 21 50, waterproof seal 50 surrounds basic ring 21, and waterproof seal 50 is structure as a whole with case ring 20.

In this way, because waterproof seal 50 and case ring 20 are structure as a whole, dress of the waterproof seal 50 in case ring 20 Various pieces deflection is more consistent during matching somebody with somebody, and can effectively seal against the medial surface 131 and dress of the installation through-hole 13 of cover plate 10 Gap between decorative circle 20, ensure that waterproof seal.It so can further prevent water, dust and other impurities from basic ring 21 Gap between lateral surface 211 and installation through-hole 13 enters in electronic installation 200 and influences the normal work of electronic installation 200.

Such as silica gel waterproof seal of waterproof seal 50, in one example, the forming process of waterproof seal 50 is such as Under, liquid repellent glue is first set on the lateral surface 211 of basic ring 21, and liquid repellent glue is surrounded basic ring 21, solidification liquid is prevented So as to forming the waterproof seal 50 being structure as a whole with case ring 20 after glue.

In some embodiments, the upper surface 232 of support chip 23 and the medial surface 212 of centre bore 213 are vertical.

In this way, support chip 23 is easily formed, the manufacturing cost of case ring 20 can be reduced.In addition, when manufacture cover plate assembly When 100, support chip 23 is horizontally situated, and the medial surface 212 of centre bore 213 is located at vertical position so that be bonded with support chip 23 The face of the fingerprint identification module 30 of cooperation is horizontal plane, can so simplify the fingerprint identification module 30 being supported on support chip 23 Structure.

In some embodiments, basic ring 21 includes bottom surface 214, and bottom surface 214 is connected with the lateral surface 211 of basic ring 21, branch The lower surface 234 of blade 23 is concordant with the bottom surface 214 of basic ring 21.

In the basic ring 21 of equal height, such as arrangement above, larger accommodation space can be formed in basic ring 21, to ensure Fingerprint identification module 30 can be housed in basic ring 21.In other words, in the case where the thickness of fingerprint identification module 30 is constant, base The height of ring 21 is smaller, so as to reduce the thickness of cover plate assembly 100, and then can be thinned for the thickness of electronic installation 200 Design basis is provided.

In some embodiments, the avoid holes 231 that support chip 23 connects formed with the centre bore 213 with basic ring 21.

Incorporated by reference to Fig. 2, in this way, the flexible PCB 60 that avoid holes 231 are advantageous to be connected with fingerprint identification module 30 is walked Line is laid out.For example, flexible PCB 60 can pass through avoid holes 231 to be connected with fingerprint identification module 30.

In some embodiments, the lateral surface 211 of basic ring 21 is formed with the circumferentially extending groove 215 along basic ring 21, Waterproof seal 50 is partly housed in groove 215.

In this way, groove 215 is advantageous to increase the connection area of waterproof seal 50 and case ring 20, be advantageous to waterproof sealing Part 50 is better secured on case ring 20.Meanwhile groove 215 is arranged in the making of case ring 20 so that liquid repellent Glue is easier to be arranged on the lateral surface 211 of case ring 20.

Incorporated by reference to Fig. 2, in some embodiments, fingerprint identification module 30 is housed in centre bore 213.Specifically, refer to Line identification module 30 includes packaging body 31 and fingerprint recognition chip 32, and packaging body 31 encapsulates fingerprint recognition chip 32.

Specifically, when user carries out the operation of unlocked by fingerprint electronic installation 200, finger can be placed on and fingerprint recognition core Position corresponding to piece 32.The signal of fingerprint recognition chip 32, to gather the fingerprint pattern of identification user, will be used through packaging body 31 The fingerprint pattern at family is matched with the fingerprint pattern to prestore, if the match is successful, unlocks electronic installation 200.

It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, with collection The fingerprint pattern of user.Packaging body 31, which encapsulates fingerprint recognition chip 32, can reduce sensor pixel array when gathering fingerprint pattern Influenceed by other interference signals, to improve the accuracy rate of identification.

In some embodiments, the top surface of fingerprint identification module 30 is provided with cover plate 33.For example, cover plate 33 passes through Colloid is fixed on the top surface of fingerprint identification module 30.

When carrying out fingerprint recognition operation, finger can be pressed against in cover plate 33 user.Cover plate 33 can be with tamper seal It is without damage to fill body 31, to improve the reliability of fingerprint identification module 30.

Cover plate 33 is touched due to being often subject to, and therefore, the material that cover plate 33 can be used hardness higher is made, such as with On the sapphire material that refers to.

In some embodiments, the shape of the top surface of the form and dimension of cover plate 33 and fingerprint identification module 30 and big Small cooperation.

For example, the shape of the top surface of fingerprint identification module 30 is in Long Circle, the shape of cover plate 33 is also in Long Circle.Covering Area of the area of plate 33 slightly larger than the top surface of fingerprint identification module 30.Therefore, fingerprint recognition can be completely covered in cover plate 33 Module 30.

Referring to Fig. 9, the preparation method of the cover plate assembly 100 of the utility model embodiment includes step：

S10, there is provided the case ring 20 of any of the above embodiment；

S20, there is provided cover plate 10, cover plate 10 offer installation through-hole 131；

S30, case ring 20 is fitted into installation through-hole 131, and makes the outside of bonding plane 223, supporting surface 221 and basic ring 21 Face 211 forms gap 41 with the medial surface 131 of installation through-hole 13；With

S40, colloid 40 is set in gap 41 and colloid 40 is bonded case ring 20 and cover plate 10.

In the preparation method of the utility model embodiment, because case ring 20 is formed with bonding plane 223 so that colloid 40 It can enter from the upper surface 11 of cover plate 10 and the top of case ring 20 in the gap 41 between case ring 20 and cover plate 10, dispensing Process is convenient and simple.

Specifically, in step s 40, the colloid of liquid can be clicked and entered into gap 41 from the upper surface 11 of cover plate 10, treats liquid After the colloid solidification of state, colloid 40 can be bonded case ring 20 and cover plate 10 securely.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description Specific features, structure, material or feature are contained at least one embodiment or example of the present utility model.In this explanation In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.

While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage Solution：A variety of to the progress of these embodiments can change in the case where not departing from principle and objective of the present utility model, change, Replace and modification, the scope of the utility model are limited by claim and its equivalent.

Claims (13)

1. A kind of 1. case ring, it is characterised in that including：

   Basic ring, the basic ring have centre bore；With

   The support division to stretch out from the top of the basic ring, the support division include：

   The supporting surface being connected with the lateral surface of the basic ring；

   The touch surface being connected with the medial surface of the centre bore, the touch surface are opposite with the support division；With

   Connect the supporting surface and the bonding plane of the touch surface, the outside of the bonding plane, the supporting surface and the basic ring Face is used to form the gap entered for colloid with the medial surface of the installation through-hole of the cover plate of electronic installation.
2. 2. case ring as claimed in claim 1, it is characterised in that the folder between the lateral surface of the supporting surface and the basic ring Angle is right angle or obtuse angle.
3. 3. case ring as claimed in claim 1, it is characterised in that the touch surface is towards in the centre bore and dipping down Oblique inclined-plane.
4. 4. case ring as claimed in claim 1, it is characterised in that the case ring include from the inner side of the centre bore towards The support chip of interior extension, the upper surface of the support chip are provided with multiple projections, circumference of the multiple projection around the basic ring It is spaced apart.
5. 5. case ring as claimed in claim 4, it is characterised in that the height of the projection is more than or equal to 0.05mm.
6. 6. case ring as claimed in claim 1, it is characterised in that waterproof seal is provided with the lateral surface of the basic ring, The waterproof seal surrounds the basic ring, and the waterproof seal is structure as a whole with the case ring.
7. 7. case ring as claimed in claim 6, it is characterised in that the lateral surface of the basic ring is formed with the week along the basic ring To the groove of extension, the waterproof seal is partly housed in the groove.
8. A kind of 8. cover plate assembly, it is characterised in that including：

   Case ring described in claim 1-7 any one；With

   Cover plate, the cover plate offer installation through-hole, and the case ring is arranged in the installation through-hole, the bonding plane, institute The lateral surface for stating supporting surface and the basic ring forms gap with the medial surface of the installation through-hole, is provided with the gap viscous Connect the colloid of the case ring and the cover plate.
9. 9. cover plate assembly as claimed in claim 8, it is characterised in that the medial surface of the installation through-hole includes：

   First face relative with the lateral surface of the basic ring, first face connect the lower surface of the cover plate, first face The first gap is formed with the lateral surface of the basic ring；

   The second face being connected with first face, second face is relative with the supporting surface, and second face supports with described Face is formed with the second gap；With

   The 3rd face of second face and the upper surface of the cover plate is connected, the 3rd face is relative with the bonding plane, described 3rd face is with the bonding plane formed with third space；

   The colloid is provided with first gap, second gap and the third space.
10. 10. cover plate assembly as claimed in claim 9, it is characterised in that the width of the third space is more than or equal to 0.03mm。
11. 11. cover plate assembly as claimed in claim 9, it is characterised in that the angle between second face and the 3rd face For right angle or obtuse angle.
12. 12. cover plate assembly as claimed in claim 9, it is characterised in that the cover plate assembly includes being housed in the centre bore In fingerprint identification module.
13. 13. a kind of electronic installation, it is characterised in that including the cover plate assembly described in claim 8-12 any one.