CN206133504U - Input group spare and terminal - Google Patents

Abstract

The utility model discloses an input group spare and terminal. Input group spare includes stiffening plate, flexible circuit board, fingerprint chip packaging structure and fixed plate. The stiffening plate is formed with a location structure. The flexible circuit board is fixed to be set up on the stiffening plate. Fingerprint chip packaging structure is fixed to be set up on the flexible circuit board. The fixed plate is formed with the 2nd location structure, and a location structure and the cooperation of the 2nd location structure are moved for the fixed plate with the restriction stiffening plate. The utility model discloses in embodiment's the input group spare, because a location structure and the 2nd location structure cooperation restriction stiffening plate move for the fixed plate to restrict fingerprint chip packaging structure's motion, be favorable to fingerprint chip packaging structure's installation.

Description

Input module and terminal

Technical field

This utility model is related to field of terminal, more particularly to a kind of input module and terminal.

Background technology

In correlation technique, some mobile phones include fingerprint chip-packaging structure and touch panel.Touch panel offers through hole, Fingerprint chip-packaging structure is arranged and exposed in through-holes and by through hole.However, installing fingerprint chip-packaging structure to through hole When, fingerprint chip-packaging structure is it may happen that move and the installation process of impact fingerprint chip-packaging structure.

Utility model content

This utility model is intended at least solve one of technical problem present in prior art.For this purpose, this utility model is carried For a kind of input module and a kind of terminal.

The input module of this utility model embodiment include stiffening plate, flexible PCB, fingerprint chip-packaging structure and Fixed plate.Stiffening plate is formed with the first location structure.Flexible PCB is fixedly installed on stiffening plate.Fingerprint chip-packaging structure It is fixedly installed on flexible PCB.Fixed plate is formed with the second location structure, and the first location structure is matched somebody with somebody with the second location structure Close and moved relative to fixed plate with limiting stiffening plate.

In the input module of this utility model embodiment, limit because the first location structure and the second location structure coordinate Stiffening plate is moved relative to fixed plate, so as to limit the motion of fingerprint chip-packaging structure, is conducive to fingerprint chip package to tie The installation process of structure.

In some embodiments, the quantity of first location structure is multiple, the quantity of second location structure It is corresponding with the quantity of first location structure.

In some embodiments, the stiffening plate includes the connecting portion of installation portion and the connection installation portion, described soft Property circuit board is fixedly installed on the installation portion, and the connecting portion is formed with first location structure.

In some embodiments, the quantity of the connecting portion is two, and two connecting portions are connected to described The opposite two ends of installation portion, each described connecting portion is formed with first location structure.

In some embodiments, first location structure includes projection, and second location structure is formed with and institute The hole clipping of projection cooperation is stated, the projection is housed in the hole clipping.

In some embodiments, first location structure is formed with hole clipping, and second location structure includes and institute The projection of hole clipping cooperation is stated, the projection is housed in the hole clipping.

In some embodiments, the fingerprint chip-packaging structure include packaging body and be arranged on it is described encapsulation it is internal Fingerprint recognition chip, the fingerprint recognition chip is electrically connected with the flexible PCB.

In some embodiments, the packaging body includes bottom surface and connects the side of the bottom surface, the bottom surface and institute The junction for stating side is formed with depressed part.

In some embodiments, the packaging body includes the first encapsulation part and connects the second envelope of first encapsulation part Dress portion, first encapsulation part includes the bottom surface, and second encapsulation part includes the side, and the fingerprint recognition chip sets Put in first encapsulation part.

In some embodiments, the input module includes case ring, and the case ring includes：

Rosette, the fingerprint chip-packaging structure is housed in the rosette；And

From the support edge that the inwall of the rosette extends internally, the support edge is housed in the depressed part, described Fingerprint chip-packaging structure is supported on the support edge.

In some embodiments, the case ring includes the flange stretched out from the outer wall of the rosette.

The terminal of this utility model embodiment includes the input module described in any of the above embodiment.

In the terminal of this utility model embodiment, because the first location structure and the second location structure coordinate reinforcement is limited Plate is moved relative to fixed plate, so as to limit the motion of fingerprint chip-packaging structure, is conducive to fingerprint chip-packaging structure Installation process.

Additional aspect of the present utility model and advantage will be set forth in part in the description, partly will be from explained below In become obvious, or by it is of the present utility model practice recognize.

Description of the drawings

Of the present utility model above-mentioned and/or additional aspect and advantage are from the description with reference to accompanying drawings below to embodiment Will be apparent from it is easy to understand, wherein：

Fig. 1 is the floor map of the terminal of this utility model embodiment；

Fig. 2 is the partial cutaway schematic view of the terminal of this utility model embodiment；

Fig. 3 is the schematic perspective view of the case ring of this utility model embodiment；

Fig. 4 is the generalized section of the case ring of this utility model embodiment；

Fig. 5 is the floor map of the case ring of this utility model embodiment；

Fig. 6 is the perspective exploded view of the case ring of this utility model embodiment；

Fig. 7 is another perspective exploded view of the case ring of this utility model embodiment；

Fig. 8 is the schematic perspective view of the fingerprint chip-packaging structure of this utility model embodiment；

Fig. 9 is the generalized section of the fingerprint chip-packaging structure of this utility model embodiment；

Figure 10 is the floor map of the fingerprint chip-packaging structure of this utility model embodiment；

Figure 11 be Fig. 2 terminal along XI-XI to partial cutaway schematic view；

Figure 12 is the enlarged diagram of the terminal XII part of Figure 11.

Specific embodiment

Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein From start to finish same or similar label represents same or similar element or the element with same or like function.Lead to below It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining this utility model, and it is not intended that to this practicality New restriction.

In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for Be easy to describe this utility model and simplify description, rather than indicate or imply indication device or element must have it is specific Orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " first ", " second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific Limit.

In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " peace Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integratedly Connection；Can be mechanically connected, or electrically connect or can mutually communicate；Can be joined directly together, it is also possible to by Between medium be indirectly connected to, can be connection or the interaction relationship of two elements of two element internals.For this area For those of ordinary skill, concrete meaning of the above-mentioned term in this utility model can be as the case may be understood.

In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it D score can include the first and second feature directly contacts, it is also possible to not be directly contact including the first and second features but logical The other characterisation contact crossed between them.And, fisrt feature second feature " on ", " top " and " above " include the One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.First is special Levy second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only Represent that fisrt feature level height is less than second feature.

Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model. In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only Example, and purpose does not lie in restriction this utility model.Additionally, this utility model can in different examples repeat reference numerals And/or reference letter, this repetition is for purposes of simplicity and clarity, itself not indicate discussed various embodiments And/or the relation between arranging.Additionally, the example of the various specific technique that provides of this utility model and material, but this Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.

Fig. 1 and Fig. 2 is referred to, the input module 100 of this utility model embodiment includes touch panel 10, case ring 20 And fingerprint chip-packaging structure 30.

The input module 100 of this utility model embodiment can be applicable to terminal 1000, terminal 1000 be, for example, mobile phone or The electronic installations such as panel computer.It is appreciated that terminal 1000 includes but is not limited to the example of present embodiment.

Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14.Can manage Solution, the upper surface 12 of touch panel 10 is the appearance of input module 100, towards user.User can be enterprising in upper surface 12 Row gesture operation, for example, click on or slide and realize corresponding function with control terminal 1000.

The material of touch panel 10 can be made up of light transmissive materials such as glass, ceramics or sapphires.Due to touch panel 10 Due to as the input part of terminal 1000, the contact such as touch panel 10 is often subject to collide or scratch.For example, user is by terminal 1000 when being put into pocket, and touch panel 10 may be scratched by the key in user's pocket and damaged.

Therefore, the material of touch panel 10 can adopt the material of hardness is bigger, such as above-described sapphire material. It is of course also possible to the upper surface 12 in touch panel 10 sets up cover sheet to prevent touch panel 10 to be scraped off.

Further, touch panel 10 includes viewing area 15 and non-display area 16.Normally, in touch panel 10 Between region as viewing area 15, non-display area 16 is arranged on around viewing area 15.For example, non-display area 16 is arranged In the top side or bottom side of viewing area 15.

Because touch panel 10 is made up of light transmissive material, therefore, user can check terminal 1000 by viewing area 15 Screen shown by content.

In order that terminal 1000 is more attractive in appearance, ink, ink can be sprayed in the lower surface 14 of non-display area 16 Color be, for example, the colors such as white, black or blueness, concrete condition can be arranged according to the actual requirements.Ink not only can Meet demand of the user to the terminal 1000 of different colours, the structure inside terminal 1000 can also be covered to reach beautification terminal 1000 effect.

It is appreciated that the shape of touch panel 10 can be according to the shape specific design of terminal 1000, for example, fillet square Shape.

Further, touch panel 10 offers installing hole 17.In present embodiment, installing hole 17 is through upper surface 12 And the through hole of lower surface 14.In other embodiments, installing hole 17 can be formed in the blind hole of lower surface 14.

In present embodiment, installing hole 17 is in the oval bodily form.Certainly, in other embodiments, installing hole 17 can be with root Take on a different shape according to real needs design, for example the shape of circular or ellipse.Therefore, the installing hole 17 of present embodiment The example of shape is it is not intended that to restriction of the present utility model.

In some embodiments, case ring 20 wears installing hole 17, and is fixedly connected with touch panel 10.Fingerprint core Chip package 30 is housed in case ring 20, and is fixedly connected with case ring 20.

Usually, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, in order to prevent installing hole 17 Interfere with receiver, it is preferred that installing hole 17 is opened in the bottom section of touch panel 10, so as to carrying for installing hole 17 For larger design space.Further, installing hole 17 is opened in the non-display area 16 of touch panel 10.

It is preferred that installing hole 17 is opened in the centre position of the bottom section of touch panel 10 so that touch panel 10 is in big Cause symmetrical structure.So so that terminal 1000 is more attractive in appearance, two is user-friendly.

When installing hole 17 is through hole, when input module 100 is manufactured, can be first by case ring 20 from touch panel 10 Lower section loads installing hole 17, and then glue is clicked and entered in the gap between the inwall and case ring 20 of installing hole 17, so that case ring 20 are fixedly connected with touch panel 10.

Fingerprint chip-packaging structure 30 is loaded in case ring 20 from the top of touch panel 10 afterwards, and it is solid using colloid Surely fingerprint chip-packaging structure 30 and case ring 20 are connected.

When installing hole 17 is blind hole, first fingerprint chip-packaging structure 30 can be loaded in case ring 20, then refer on band The case ring 20 of stricture of vagina chip-packaging structure 30 loads in installing hole 17, can be adhesively fixed case ring 20 and touch panel using glue 10。

Please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22 The inwall 211 of self-chambering circlets 21 extends internally.

The support edge 22 of the case ring 20 of this utility model embodiment can support and location fingerprint chip-packaging structure 30, so as to improve the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.

In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is loaded When in rosette 21, fingerprint chip-packaging structure 30 can be from top to bottom pressed, if the position of fingerprint chip-packaging structure 30 Can not again move, then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and be installed into precalculated position.

It is appreciated that rosette 21 is formed with accommodating hole 212, support edge 22 is located in accommodating hole 212.Accommodating hole 212 can So that in right cylinder shape, in other words, inwall 211 is linearly, and in order to fingerprint chip-packaging structure 30 accommodating hole 212 is rapidly loaded It is interior.

The material that accommodating hole 212 and support edge 22 can be removed on part by way of machining is formed, it is also possible to Formed by modes such as castings.

In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from And meet the intensity requirement of case ring 20, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20 Can be made using other materials such as plastics.

In some embodiments, further, fingerprint chip-packaging structure 30 is housed in rosette 21 and is supported on On support edge 22.

In some embodiments, inwall 211 of the support edge 22 perpendicular to rosette 21.

Thus, support edge 22 is easily formed, the manufacturing cost of rosette 21 can be reduced.In addition, when manufacture input module When 100, support edge 22 is horizontally situated, and the inwall 211 of rosette 21 is located at vertical position so that with the cooperation of support edge 22 The face of fingerprint chip-packaging structure 30 is horizontal plane, can so simplify the fingerprint chip-packaging structure being supported on support edge 22 30 structure.

In some embodiments, rosette 21 includes the first bottom surface 213 being connected with inwall 211, under support edge 22 Surface 221 is concordant with the first bottom surface 213.

In the rosette 21 of equal height, as larger accommodation space can be formed in arrangement above, rosette 21, with Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.

In other words, in the case where the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is less, so as to The thickness of input module 100 can be reduced, and then can be the thinning offer design basis of thickness of terminal 1000.

In some embodiments, rosette 21 includes roof 214.Roof 214 is connected with inwall 211.Roof 214 includes Towards the guide ramp 2142 in case ring 20.

Thus, the finger that guide ramp 2142 can guide user is smoothly interior to carry out fingerprint recognition behaviour into rosette 21 Make, can improve user carries out the accuracy rate of fingerprint recognition operation.It is shinny it is possible to further plate in guide ramp 2142 Metal level (such as layers of chrome), so that rosette 21 is more attractive in appearance.

It is appreciated that guide ramp 2142 is ring surface, can so facilitate user that finger is inserted into decoration from all directions To press fingerprint chip-packaging structure 30 in ring 21, so as to carry out fingerprint recognition operation.

In some embodiments, support edge 22 is formed with avoidance hole 222.

Thus, avoiding the cabling of the first flexible PCB 40 that hole 222 is conducive to being connected with fingerprint chip-packaging structure 30 Layout.For example, the first flexible PCB 40 can pass through and avoid hole 222 to be connected with fingerprint chip-packaging structure 30 (such as Fig. 2 institutes Show).

In some embodiments, the rounded rectangle in hole 222 is avoided, avoids the side wall 2221 in hole 222 along avoidance hole 222 Axial direction is formed with escape groove 2222, and escape groove 2222 is connected with hole 222 is avoided.

For example shown in Fig. 2, after the first flexible PCB 40 is connected with fingerprint chip-packaging structure 30, first to escape groove 2222 Direction extend, then bend roundabout.Therefore, escape groove 2222 can prevent the first flexible PCB 40 from occurring with side wall 2221 Interfere, be conducive to the first flexible PCB 40 to connect up.

It is appreciated that the first flexible PCB 40 is electrically connected with fingerprint chip-packaging structure 30.

In some embodiments, fingerprint chip-packaging structure 30 is fixedly installed on the first flexible PCB 40.For example, Fingerprint chip-packaging structure 30 is adhesively fixed on the first flexible PCB 40 by viscose glue.

In some embodiments, case ring 20 includes the flange 23 that the outer wall of self-chambering circlets 21 stretches out.

Thus, flange 23 can be resisted against the lower surface 14 of touch panel 10, so as to case ring 20 and touch surface can be increased The connection area of plate 10, improves the reliability that case ring 20 is fixedly connected with touch panel 10.

In addition, when from the bottom up case ring 20 is loaded in installing hole 17, flange 23 is resisted against under touch panel 10 During surface 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100 Efficiency of assembling, reduce the manufacturing cost of input module 100.

In some embodiments, diaphragm seal can be arranged between flange 23 and lower surface 14 to prevent water from case ring 20 Enter in terminal 1000, so as to improve the waterproof effect of terminal 1000 with the gap between installing hole 17.

In the embodiment of Fig. 3-Fig. 5, flange 23 and rosette 21 are formed in one structure.And such as the reality of Fig. 6 and Fig. 7 In applying mode, flange 23 is split molding structure with rosette 21.Specifically, rosette 21 includes socket part 24, socket part 24 Connection support edge 22.Flange 23 is set on socket part 24.Flange 23 can reduce case ring 20 with the split molding of rosette 21 Manufacture difficulty so that produce in batches case ring 20 when, the concordance of each case ring 20 can be improved.

It is pointed out that in some embodiments, socket part 24 can offer and be passed through for the first flexible PCB 40 Via 24a.

Specifically, socket part 24 includes connection side 241 and loading plate 242.Connection side 241 connection support edge 22 and loading plate 242, connection side 241 is approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connection side 241 offers Via 24a.

Socket part 24 is hollow partly or entirely to house fingerprint chip-packaging structure 30.It should be noted that at certain In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.

Referring to Fig. 3-Fig. 5, in some embodiments, outer wall 215 of the flange 23 perpendicular to rosette 21.

Thus, the manufacturing process of case ring 20 is simple, the contact area being connected with touch panel 10 can also be increased.

In some embodiments, flange 23 includes the second convex portion 232 of the first convex portion 231 of the first convex portion 231 and connection, First convex portion 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second convex portion 232, It is convexly equipped in first 2311 and the second convex portion 232 for second 2312.

Case ring 20 loads after installing hole 17, the longitudinal direction of first 2311 and the second convex portion 232 along touch panel 10 Extend, second 2312 extends along the horizontal direction of touch panel 10.

Due to the accommodation space of the horizontal direction of touch panel 10 it is larger, therefore, second 2312 is convexly equipped in first 2311 And second convex portion 232 can increase the connection area of flange 23 and touch panel 10.

In addition, the width of first 2311 and the second convex portion 232 is less, the non-display area of touch panel 10 can be avoided 16 longitudinal length is lengthened because of the width of first 2311 and the second convex portion 232, and is reduced the area of viewing area 15 and touched The area ratio of panel 10 is touched, and then affects the outward appearance of terminal 1000.

In some embodiments, the top surface 231a of the first convex portion 231 is concordant with the top surface 232a of the second convex portion 232, the Thickness of the thickness of one 2311 more than the second convex portion 232.

It is appreciated that case ring 20 loads after installing hole 17, relative to first 2311, the second convex portion 232 is closer to aobvious Show region 15.In other words, first 2311 is arranged away from viewing area 15, and the second convex portion 232 is arranged near viewing area 15.

Due to part of the input module 100 near the position of viewing area 15 it is more, therefore, the thickness of the second convex portion 232 It is relatively thin that the second convex portion 232 can be avoided to interfere (as shown in Figure 2) with the other parts near viewing area 15.

As shown in Fig. 2 case ring 20 exists with second flexible PCB 50 and other parts of the screen for being connected terminal 1000 There is the part for overlapping in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second convex portion 232 can avoid with Second flexible PCB 50 and other parts are interfered so that case ring 20 can be arranged closer to viewing area 15, decoration Circle 20 even can be partly or entirely arranged in the viewing area 15 of touch panel 10, to reduce the area of non-display area 16 With the ratio of the area of touch panel 10, increase the ratio of the area of the area and touch panel 10 of viewing area 15.

In some embodiments, rosette 21 is in Long Circle, and the outer wall 215 of rosette 21 includes two parallel straight lines Two bending sections 2152 of two straightways 2151 of section 2151 and connection, first 2311 is disposed therein a straightway 2151 On, second 2312 is arranged on two bending sections 2152.

Thus, rosette 21 is more attractive in appearance.Specifically, two bending sections 2152 are along the transversely arranged (such as Fig. 1 of touch panel 10 In left and right to), two straightways 2151 are arranged along the longitudinal direction (with laterally vertical) of touch panel 10.

In some embodiments, the shape of second 2312 is closed with the matching form of bending section 2152.

For example, the outline of second 2312 is also circular arc, and is substantially arranged concentrically with bending section 2152.So may be used So that the structure of case ring 20 is compacter.

See also Fig. 8-Figure 10, in some embodiments, fingerprint chip-packaging structure 30 include packaging body 31 and Fingerprint recognition chip 32.

Packaging body 31 includes the side 312 of the second bottom surface 311 of the second bottom surface 311 and connection, the second bottom surface 311 and side 312 junction is formed with depressed part 33.Fingerprint recognition chip 32 is arranged in packaging body 31.

In the fingerprint chip-packaging structure 30 of this utility model embodiment, depressed part 33 can with case ring 20 in Support side 22 coordinate, so as to can location fingerprint chip-packaging structure 30, and then improve fingerprint chip-packaging structure 30 assembling effect Rate.

In addition, depressed part 33 coordinates the thickness that can also reduce fingerprint chip-packaging structure 30 with support edge 22, be conducive to The miniaturization of terminal 1000 of employing fingerprint chip-packaging structure 30.

Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip 32 corresponding positions.The signal of fingerprint recognition chip 32 passes through packaging body 31 to gather the fingerprint pattern of identifying user, by user Fingerprint pattern matched with the fingerprint pattern for prestoring, if the match is successful, unlock terminal 1000.

It is appreciated that fingerprint recognition chip 32 is provided with sensor pixel array towards the surface of the finger of user, to gather The fingerprint pattern of user.The encapsulation fingerprint recognition of packaging body 31 chip 32 can reduce sensor pixel array when fingerprint pattern is gathered Affected by other interference signals, to improve the accuracy rate of identification.

It should be noted that depressed part 33 is used to coordinate with support edge 22 so that fingerprint chip-packaging structure 30 is by depression Portion 33 is supported on support edge 22.

Depressed part 33 coordinates with support edge 33, and in other words, support edge 22 is housed in depressed part 33.

In the present embodiment, the structure in a ring of depressed part 33, correspondingly, support edge 22 also in a ring structure so that depression Portion 33 can house support edge 22.

In other embodiments, depressed part 33 can be circumferentially-spaced with the junction of side 312 around the second bottom surface 311 The multiple depressed parts 33 for arranging, correspondingly, support edge 22 is also around circumferentially spaced multiple support edges 22, multiple depressed parts 33 with the corresponding matching of multiple support edges 22.

Such as quantity of depressed part 33 is 3, and two neighboring depressed part 33 is around circumferentially-spaced 120 degree settings, support edge 22 Quantity be also 3, it is and corresponding with 3 depressed parts in locations of structures.

It is pointed out that the shape of depressed part 33 and quantity are not limited to situation discussed above, if depressed part 33 with Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, therefore, example described above is not It is interpreted as to restriction of the present utility model.

Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package knot Structure 30 can also omit depressed part 33.

In some embodiments, packaging body 31 includes the second envelope of the first encapsulation part 313 of the first encapsulation part 313 and connection Dress portion 314, the first encapsulation part 313 includes the second bottom surface 311, and the second encapsulation part 314 includes side 312.

Thus, the first encapsulation part 313 is connected with the second encapsulation part 314 can form depressed part 33.Packaging body 31 can pass through The material on packaging body 31 is machined away so as to form depressed part 33, it is also possible to connected with the second encapsulation part 314 by the first encapsulation part 313 Connect to be formed.

It is appreciated that in order to form depressed part 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314 Cross-sectional area.

In some embodiments, the first encapsulation part 313 wears avoidance hole 222, and the second encapsulation part 314 is supported on support edge On 22.

In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.

Thus, the circuit junction of fingerprint recognition chip 32 easily exposes to be connected with the first flexible PCB 40.

In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big Little cooperation.

In other words, the shape of fingerprint recognition chip 32 is similar or identical with the shape of the first encapsulation part 313, for example, fingerprint Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or fillet cuboid.

The size for being slightly larger in dimension than fingerprint recognition chip 32 of the first encapsulation part 313 is realizing encapsulating fingerprint recognition chip 32 Effect.Therefore, can so cause the structure of fingerprint chip-packaging structure 30 compacter.

In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.

Thus, the first packaging body 31 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part 313 shape and the form fit for avoiding hole 222, that is to say, that avoid the shape in hole 222 also rounded cuboid.

In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connected with side 312, fingerprint chip envelope Assembling structure 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 is solid by colloid It is scheduled on the top surface 3141 of the second encapsulation part 314.

When fingerprint recognition operation is carried out, finger can be pressed against in cover plate 34 user.Cover plate 34 can be with tamper seal Dress body 31 is without damage, to improve the reliability of fingerprint chip-packaging structure 30.

Cover plate 34 due to be often subject to touching, therefore, cover plate 34 can be made using the higher material of hardness, for example with On the sapphire material that refers to.

In some embodiments, the shape of the top surface 3141 of the form and dimension of cover plate 34 and the second encapsulation part 314 And size coordinates.

For example, the shape of top surface 3141 is in Long Circle, and the shape of cover plate 34 is also in Long Circle.The area of cover plate 34 is omited More than the area of the top surface 3141 of the second encapsulation part 314.Therefore, cover plate 34 can be completely covered the second encapsulation part 314.

In some embodiments, sealing member 60 is provided between the second encapsulation part 314 and support edge 22, sealing member 60 is close The gap sealed between the second encapsulation part 314 and support edge 22.Sealing member 60 is for example made up (as shown in Figure 2) of silica gel.

Thus, sealing member 60 can prevent the foreign bodies such as water and dust between fingerprint chip-packaging structure 30 and case ring 20 Gap enter terminal 1000 in, improve the water proof and dust proof effect of terminal 1000.

In some embodiments, depressed part 33 include the first face 331 and connection the first face 331 the second face 332, first Face 331 is perpendicular to the second face 332.

Thus, depressed part 33 is easily formed, the first face 331 is easily connected with support edge 22.First face 331 and the second face 332 vertically cause packaging body 31 in step-like.

Specifically, sealing member 60 is arranged between the first face 331 and support edge 22.

In some embodiments, the rounded transition shape in the junction in the first face 331 and the second face 332.

Thus, the defects such as crackle are less likely to occur for the junction in the first face 331 and the second face 332, and depressed part 33 holds Easily formed.

Fig. 2, Figure 10 and Figure 11 are referred to, in some embodiments, input module 100 includes stiffening plate 70 and fixed plate 80.Stiffening plate 70 is formed with the first location structure 72.First flexible PCB 40 is fixedly installed on stiffening plate 70.Fixed plate 80 The second location structure 82 is formed with, the first location structure 72 and the second location structure 82 coordinate to limit stiffening plate 70 relative to solid Fixed board 80 is moved.

Therefore, because the first location structure 72 and the second location structure 82 coordinate limits stiffening plate 70 relative to fixed plate 80 Motion, so as to limit the motion of fingerprint chip-packaging structure 30, is conducive to the installation process of fingerprint chip-packaging structure 30.

For example, after limiting the motion of fingerprint chip-packaging structure 30, can be to fingerprint chip-packaging structure 30 and case ring Glue is clicked and entered in gap between 20, with fixed bonding fingerprint chip-packaging structure 30 and case ring 20, so that fingerprint chip The position of encapsulating structure 30 is fixed.

Specifically, fingerprint chip-packaging structure 30 and stiffening plate 70 are separately positioned on opposite two of the first flexible PCB 40 On individual surface.Fixed plate 80 is arranged under stiffening plate 70.When input module 100 is assembled, fixed plate 80 can first be fixed on end On end 1000, then by the stiffening plate 70 with fingerprint chip-packaging structure 30 by the first location structure 72 and the second positioning knot The cooperation of structure 82 is attached in fixed plate 80.

In order to ensure the intensity of stiffening plate 70, stiffening plate 70 can be made up of metal material, such as rustless steel.

In some embodiments, the quantity of the first location structure 72 is for multiple, the quantity of the second location structure 82 and the The quantity correspondence of one location structure 72.

Thus, multiple first location structures 72 coordinate with multiple second location structures 82 can further limit stiffening plate 70 Motion, so as to limit the motion of fingerprint chip-packaging structure 30.

In some embodiments, stiffening plate 70 includes the connecting portion 76 of installation portion 74 and connection installation portion 74, and first is soft Property circuit board 40 is fixedly installed on installation portion 74, and connecting portion 76 is formed with the first location structure 72.

Thus, connecting portion 76 can stretch out the first flexible PCB 40, first can avoided the formation of on connecting portion 76 is determined Bit architecture 72 is interfered with the first flexible PCB 40.The structure it is preferred that installation portion 74 and connecting portion 76 are formed in one.

In some embodiments, the quantity of connecting portion 76 is two, and two connecting portions 76 are connected to installation portion 74 Opposite two ends, each connecting portion 76 is formed with the first location structure 72.

Connecting portion 76 at the opposite two ends of installation portion 74 forms the first location structure 72 so that the first location structure 72 with After second location structure 82 coordinates, stiffening plate 70 is more uniformly stressed, and improve that stiffening plate 70 is connected with fixed plate 80 can By property.

In some embodiments, the first location structure 72 includes projection 721, and the second location structure 82 is formed with and projection 721 hole clippings 821 for coordinating, projection 721 is housed in hole clipping 821.

Thus, the simple structure of the structure of the first location structure 72 and the second location structure 82 so that stiffening plate 70 with it is solid Fixed board 80 is easily formed, it is possible to decrease the manufacturing cost of input module 100.

It should be noted that as in the example of Figure 12, hole clipping 821 is through hole.And in other embodiments, hole clipping 821 It can be blind hole.

It is appreciated that in other embodiments, the first location structure 72 is formed with hole clipping, and the second location structure 82 includes The projection coordinated with hole clipping, projection is housed in hole clipping.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically enforcement The description of mode ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or example describes Specific features, structure, material or feature are contained at least one embodiment of the present utility model or example.In this explanation In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, the concrete spy of description Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.

While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage Solution：These embodiments can be carried out in the case of without departing from principle of the present utility model and objective various changes, modification, Replace and modification, scope of the present utility model is limited by claim and its equivalent.

Claims (12)

1. a kind of input module, it is characterised in that include：

Stiffening plate, the stiffening plate is formed with the first location structure；

Flexible PCB, the flexible PCB is fixedly installed on the stiffening plate；

Fingerprint chip-packaging structure, the fingerprint chip-packaging structure is fixedly installed on the flexible PCB；And

Fixed plate, the fixed plate is formed with the second location structure, and first location structure is matched somebody with somebody with second location structure Conjunction is moved with limiting the stiffening plate relative to the fixed plate.

2. input module as claimed in claim 1, it is characterised in that the quantity of first location structure be it is multiple, it is described The quantity of the second location structure is corresponding with the quantity of first location structure.

3. input module as claimed in claim 1, it is characterised in that the stiffening plate includes installation portion and connects the installation The connecting portion in portion, the flexible PCB is fixedly installed on the installation portion, and the connecting portion is formed with first positioning Structure.

4. input module as claimed in claim 3, it is characterised in that the quantity of the connecting portion is two, two companies Socket part is connected to the opposite two ends of the installation portion, and each described connecting portion is formed with first location structure.

5. input module as claimed in claim 1, it is characterised in that first location structure includes projection, described second Location structure is formed with the hole clipping coordinated with the projection, and the projection is housed in the hole clipping.

6. input module as claimed in claim 1, it is characterised in that first location structure is formed with hole clipping, described Two location structures include the projection coordinated with the hole clipping, and the projection is housed in the hole clipping.

7. the input module as described in any one of claim 1-6, it is characterised in that the fingerprint chip-packaging structure includes envelope Fill body and be arranged on the internal fingerprint recognition chip of the encapsulation, the fingerprint recognition chip electrically connects with the flexible PCB Connect.

8. input module as claimed in claim 7, it is characterised in that the packaging body includes bottom surface and connects the bottom surface Side, the bottom surface is formed with depressed part with the junction of the side.

9. input module as claimed in claim 8, it is characterised in that the packaging body includes that the first encapsulation part and connection are described Second encapsulation part of the first encapsulation part, first encapsulation part includes the bottom surface, and second encapsulation part includes the side, The fingerprint recognition chip is arranged in first encapsulation part.

10. input module as claimed in claim 8, it is characterised in that the input module includes case ring, the case ring Including：

Rosette, the fingerprint chip-packaging structure is housed in the rosette；And

From the support edge that the inwall of the rosette extends internally, the support edge is housed in the depressed part, the fingerprint Chip-packaging structure is supported on the support edge.

11. input modules as claimed in claim 10, it is characterised in that the case ring includes the outer wall from the rosette The flange for stretching out.

12. a kind of terminals, it is characterised in that include the input module as described in any one of claim 1-11.