CN106095196A - input module and terminal - Google Patents
input module and terminal Download PDFInfo
- Publication number
- CN106095196A CN106095196A CN201610676740.6A CN201610676740A CN106095196A CN 106095196 A CN106095196 A CN 106095196A CN 201610676740 A CN201610676740 A CN 201610676740A CN 106095196 A CN106095196 A CN 106095196A
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- CN
- China
- Prior art keywords
- input module
- location structure
- fingerprint chip
- packaging structure
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
- G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of input module and terminal.Input module includes stiffening plate, flexible PCB, fingerprint chip-packaging structure and fixed plate.Stiffening plate is formed with the first location structure.Flexible PCB is fixedly installed on stiffening plate.Fingerprint chip-packaging structure is fixedly installed on flexible PCB.Fixed plate is formed with the second location structure, the first location structure and the second location structure and coordinates to limit stiffening plate relative to fixed plate motion.In the input module of embodiment of the present invention, owing to the first location structure and the second location structure coordinate restriction stiffening plate to move relative to fixed plate, thus limit the motion of fingerprint chip-packaging structure, the beneficially installation process of fingerprint chip-packaging structure.
Description
Technical field
The present invention relates to field of terminal, particularly relate to a kind of input module and terminal.
Background technology
In correlation technique, some mobile phone includes fingerprint chip-packaging structure and touch panel.Touch panel offers through hole,
Fingerprint chip-packaging structure is arranged and in through-holes and is exposed by through hole.But, fingerprint chip-packaging structure is being installed to through hole
Time, fingerprint chip-packaging structure is it may happen that move and affect the installation process of fingerprint chip-packaging structure.
Summary of the invention
It is contemplated that at least solve one of technical problem present in prior art.To this end, the present invention provides a kind of defeated
Enter assembly and a kind of terminal.
The input module of embodiment of the present invention includes stiffening plate, flexible PCB, fingerprint chip-packaging structure and fixes
Plate.Stiffening plate is formed with the first location structure.Flexible PCB is fixedly installed on stiffening plate.Fingerprint chip-packaging structure is fixed
It is arranged on flexible PCB.Fixed plate is formed with the second location structure, the first location structure and the second location structure coordinate with
Limit stiffening plate to move relative to fixed plate.
In the input module of embodiment of the present invention, limit reinforcement owing to the first location structure and the second location structure coordinate
Plate moves relative to fixed plate, thus limit the motion of fingerprint chip-packaging structure, beneficially fingerprint chip-packaging structure
Installation process.
In some embodiments, the quantity of described first location structure is multiple, the quantity of described second location structure
Corresponding with the quantity of described first location structure.
In some embodiments, described stiffening plate includes installation portion and connects the connecting portion of described installation portion, described soft
Property circuit board is fixedly installed on described installation portion, and described connecting portion is formed with described first location structure.
In some embodiments, the quantity of described connecting portion is two, and two described connecting portions are connected to described
The two ends that installation portion is opposing, each described connecting portion is formed with described first location structure.
In some embodiments, described first location structure includes that projection, described second location structure are formed with and institute
Stating the hole clipping that projection coordinates, described projection is housed in described hole clipping.
In some embodiments, described first location structure is formed with hole clipping, and described second location structure includes and institute
Stating the projection that hole clipping coordinates, described projection is housed in described hole clipping.
In some embodiments, described fingerprint chip-packaging structure includes packaging body and is arranged in described packaging body
Fingerprint recognition chip, described fingerprint recognition chip is electrically connected with described flexible PCB.
In some embodiments, described packaging body includes bottom surface and connects the side of described bottom surface, described bottom surface and institute
The junction stating side is formed with depressed part.
In some embodiments, described packaging body includes the first encapsulation part and connects the second envelope of described first encapsulation part
Dress portion, described first encapsulation part includes that described bottom surface, described second encapsulation part include that described side, described fingerprint recognition chip set
Put in described first encapsulation part.
In some embodiments, described input module includes that case ring, described case ring include:
Rosette, described fingerprint chip-packaging structure is housed in described rosette；And
The support edge extended internally from the inwall of described rosette, described support edge is housed in described depressed part, described
Fingerprint chip-packaging structure is supported on described support edge.
In some embodiments, described case ring includes the outward extending flange of outer wall from described rosette.
The terminal of embodiment of the present invention includes the input module described in any of the above embodiment.
In the terminal of embodiment of the present invention, limit stiffening plate phase owing to the first location structure and the second location structure coordinate
Fixed plate is moved, thus limits the motion of fingerprint chip-packaging structure, the beneficially installation of fingerprint chip-packaging structure
Process.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become
Obtain substantially with easy to understand, wherein:
Fig. 1 is the floor map of the terminal of embodiment of the present invention；
Fig. 2 is the partial cutaway schematic view of the terminal of embodiment of the present invention；
Fig. 3 is the schematic perspective view of the case ring of embodiment of the present invention；
Fig. 4 is the generalized section of the case ring of embodiment of the present invention；
Fig. 5 is the floor map of the case ring of embodiment of the present invention；
Fig. 6 is the perspective exploded view of the case ring of embodiment of the present invention；
Fig. 7 is another perspective exploded view of the case ring of embodiment of the present invention；
Fig. 8 is the schematic perspective view of the fingerprint chip-packaging structure of embodiment of the present invention；
Fig. 9 is the generalized section of the fingerprint chip-packaging structure of embodiment of the present invention；
Figure 10 is the floor map of the fingerprint chip-packaging structure of embodiment of the present invention；
Figure 11 be Fig. 2 terminal along XI-XI to partial cutaway schematic view；
Figure 12 is the enlarged diagram of the terminal XII part of Figure 11.
Detailed description of the invention
Embodiments of the present invention are described below in detail, and the example of described embodiment is shown in the drawings, the most ad initio
Represent same or similar element to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " up time
Pin ", the orientation of the instruction such as " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of
Describe the present invention and simplification description rather than instruction or the device of hint indication or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, be therefore not considered as limiting the invention.Additionally, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic.
Thus, define " first ", the feature of " second " can express or implicitly include one or more described features.?
In description of the invention, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Can
Be mechanically connected, it is also possible to be electrical connection or can mutually communication；Can be to be joined directly together, it is also possible to by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.Ordinary skill for this area
For personnel, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
Can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by it
Other characterisation contact between.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include that fisrt feature immediately below second feature and obliquely downward, or is merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example for realizing the different structure of the present invention.In order to
Simplifying disclosure of the invention, hereinafter parts and setting to specific examples are described.Certainly, they are the most merely illustrative, and
And be not intended to limit the present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiment and/or arranging
Relation.Additionally, the various specific technique that the invention provides and the example of material, but those of ordinary skill in the art are permissible
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1 and Fig. 2, the input module 100 of embodiment of the present invention includes touch panel 10, case ring 20 and refers to
Stricture of vagina chip-packaging structure 30.
The input module 100 of embodiment of the present invention can be applicable to terminal 1000, terminal 1000 for example, mobile phone or flat board
The electronic installations such as computer.It is appreciated that terminal 1000 includes but not limited to the example of present embodiment.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposing with lower surface 14.Can manage
Solving, the appearance that upper surface 12 is input module 100 of touch panel 10, towards user.User can be enterprising at upper surface 12
Row gesture operation, such as, click on or slide to control terminal 1000 and realize corresponding function.
The material of touch panel 10 can be made up of light transmissive materials such as glass, pottery or sapphires.Due to touch panel 10
Due to the input part as terminal 1000, touch panel 10 is often subject to contacts such as colliding or scratch.Such as, user is by terminal
1000 when putting into pocket, and touch panel 10 may be scratched by the key in user's pocket and damage.
Therefore, the material of touch panel 10 can use the material that hardness is bigger, the most above-described sapphire material.
It is of course also possible to the upper surface 12 at touch panel 10 sets up cover sheet to prevent touch panel 10 to be scraped off.
Further, touch panel 10 includes viewing area 15 and non-display area 16.Normally, in touch panel 10
Between region be arranged on viewing area 15 around as viewing area 15, non-display area 16.Such as, non-display area 16 is arranged
Top side or bottom side in viewing area 15.
Owing to touch panel 10 is made up of light transmissive material, therefore, user can check terminal 1000 by viewing area 15
The content shown by screen.
So that terminal 1000 is more attractive in appearance, ink, ink can be sprayed at the lower surface 14 of non-display area 16
The color such as color for example, white, black or blueness, concrete condition can be arranged according to the actual requirements.Ink is possible not only to
Meet user's demand to the terminal 1000 of different colours, it is also possible to hide the structure within terminal 1000 to reach to beautify terminal
The effect of 1000.
It is appreciated that the shape of touch panel 10 can be according to the shape specific design of terminal 1000, for example, fillet square
Shape.
Further, touch panel 10 offers installing hole 17.In present embodiment, installing hole 17 is for running through upper surface 12
And the through hole of lower surface 14.In other embodiments, installing hole 17 can be formed in the blind hole of lower surface 14.
In present embodiment, installing hole 17 is in the oval bodily form.Certainly, in other embodiments, installing hole 17 can root
Take on a different shape according to real needs design, the most circular or oval shape.Therefore, the installing hole 17 of present embodiment
The example of shape is not considered as limiting the invention.
In some embodiments, case ring 20 wears installing hole 17, and fixing with touch panel 10 is connected.Fingerprint core
Chip package 30 is housed in case ring 20, and fixing with case ring 20 is connected.
Usually, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, in order to prevent installing hole 17
Interfere with receiver, it is preferred that installing hole 17 is opened in the bottom section of touch panel 10, thus be carrying of installing hole 17
For bigger design space.Further, in installing hole 17 is opened in the non-display area 16 of touch panel 10.
It is preferred that installing hole 17 is opened in the centre position of touch panel 10 bottom section so that touch panel 10 is in greatly
Cause symmetrical structure.So making terminal 1000 more attractive in appearance, two is user-friendly.
When installing hole 17 is through hole, manufacture input module 100 time, can first by case ring 20 from touch panel 10
Lower section loads installing hole 17, and then glue is clicked and entered in the gap between the inwall and case ring 20 of installing hole 17, so that case ring
20 fixing with touch panel 10 are connected.
Afterwards fingerprint chip-packaging structure 30 is loaded in case ring 20 from the top of touch panel 10, and utilize colloid solid
Surely fingerprint chip-packaging structure 30 and case ring 20 are connected.
When installing hole 17 is blind hole, first fingerprint chip-packaging structure 30 can be loaded in case ring 20, then band be referred to
The case ring 20 of stricture of vagina chip-packaging structure 30 loads in installing hole 17, and glue can be used to be adhesively fixed case ring 20 and touch panel
10。
Please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inwall 211 of self-chambering circlets 21 extends internally.
The support edge 22 of the case ring 20 of embodiment of the present invention can support and location fingerprint chip-packaging structure 30, from
And improve the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.
In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is loaded
Time in rosette 21, fingerprint chip-packaging structure 30 can be pressed from top to bottom, if the position of fingerprint chip-packaging structure 30
Can not move again, then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and is installed into precalculated position.
Being appreciated that rosette 21 is formed with accommodating hole 212, support edge 22 is positioned at accommodating hole 212.Accommodating hole 212 can
With in right cylinder shape, in other words, inwall 211 is linearly, in order to fingerprint chip-packaging structure 30 loads accommodating hole 212 rapidly
In.
Accommodating hole 212 and support edge 22 can be removed the material on part by the way of machining and be formed, it is also possible to
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And meet the requirement of strength of case ring 20, also there is corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20 is also
The other materials such as plastics can be used to make.
In some embodiments, further, in fingerprint chip-packaging structure 30 is housed in rosette 21 and be supported on
On support edge 22.
In some embodiments, support edge 22 is perpendicular to the inwall 211 of rosette 21.
So, support edge 22 is easily formed, and can reduce the manufacturing cost of rosette 21.It addition, when manufacturing input module
When 100, support edge 22 is horizontally situated, and the inwall 211 of rosette 21 is positioned at vertical position so that coordinate with support edge 22
The face of fingerprint chip-packaging structure 30 is horizontal plane, so can simplify the fingerprint chip-packaging structure being supported on support edge 22
The structure of 30.
In some embodiments, rosette 21 includes the first bottom surface 213 being connected with inwall 211,22 times, support edge
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, such as arrangement above, in rosette 21, bigger accommodation space can be formed, with
Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.
In other words, in the case of the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is less, thus
The thickness of input module 100 can be reduced, and then can be the thickness thinning offer design basis of terminal 1000.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connected with inwall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
So, guide ramp 2142 can guide the finger of user and enters smoothly in rosette 21 to carry out fingerprint recognition behaviour
Make, user can be improved and carry out the accuracy rate of fingerprint recognition operation.It is possible to further plate shinny in guide ramp 2142
Metal level (such as layers of chrome), so that rosette 21 is more attractive in appearance.
It is appreciated that guide ramp 2142, for ring surface, so can facilitate user, from all directions, finger is inserted decoration
To press fingerprint chip-packaging structure 30 in ring 21, thus carry out fingerprint recognition operation.
In some embodiments, support edge 22 is formed and dodges hole 222.
So, dodge hole 222 and be conducive to the cabling of the first flexible PCB 40 being connected with fingerprint chip-packaging structure 30
Layout.Such as, the first flexible PCB 40 can be through dodging hole 222 to be connected with fingerprint chip-packaging structure 30 (such as Fig. 2 institute
Show).
In some embodiments, dodge the rounded rectangle in hole 222, dodge the sidewall 2221 in hole 222 along dodging hole 222
Axial direction is formed with escape groove 2222, and escape groove 2222 connects with dodging hole 222.
Such as shown in Fig. 2, after the first flexible PCB 40 is connected with fingerprint chip-packaging structure 30, first to escape groove 2222
Direction extend, then bend roundabout.Therefore, escape groove 2222 is possible to prevent the first flexible PCB 40 to occur with sidewall 2221
Interfering, the beneficially first flexible PCB 40 connects up.
It is appreciated that the first flexible PCB 40 is electrically connected with fingerprint chip-packaging structure 30.
In some embodiments, fingerprint chip-packaging structure 30 is fixedly installed on the first flexible PCB 40.Such as,
Fingerprint chip-packaging structure 30 is adhesively fixed on the first flexible PCB 40 by viscose glue.
In some embodiments, case ring 20 includes the outward extending flange of outer wall 23 of self-chambering circlets 21.
So, flange 23 can be resisted against the lower surface 14 of touch panel 10, thus can increase case ring 20 and touch surface
The connection area of plate 10, improves case ring 20 reliability that be connected fixing with touch panel 10.
It addition, when being loaded in installing hole 17 by case ring 20 from the bottom up, flange 23 is resisted against touch panel 10 times
During surface 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduce the manufacturing cost of input module 100.
In some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 to prevent water from case ring 20
And the gap between installing hole 17 enters in terminal 1000, thus improves the waterproof effect of terminal 1000.
In the embodiment of Fig. 3-Fig. 5, flange 23 and rosette 21 are formed in one structure.And such as the reality of Fig. 6 and Fig. 7
Executing in mode, flange 23 and rosette 21 are split molding structure.Specifically, rosette 21 includes socket part 24, socket part 24
Connect support edge 22.Flange 23 is set on socket part 24.Flange 23 and rosette 21 split molding can reduce case ring 20
Manufacture difficulty so that produce in batches case ring 20 time, the concordance of each case ring 20 can be improved.
It is pointed out that in some embodiments, socket part 24 can offer and pass for the first flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connecting limit 241 and loading plate 242.Connect limit 241 and connect support edge 22 and loading plate
242, connect limit 241 and be approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connect limit 241.Connect limit 241 to offer
Via 24a.
Socket part 24 be hollow partly or entirely to house fingerprint chip-packaging structure 30.It should be noted that at certain
In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.
Referring to Fig. 3-Fig. 5, in some embodiments, flange 23 is perpendicular to the outer wall 215 of rosette 21.
So, case ring 20 manufacturing process is simple, it is also possible to increase the contact area being connected with touch panel 10.
In some embodiments, flange 23 includes the first protuberance 231 and connects the second protuberance 232 of the first protuberance 231,
First protuberance 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second protuberance 232,
It is convexly equipped in first 2311 and the second protuberance 232 for second 2312.
After case ring 20 loads installing hole 17, first 2311 and the second protuberance 232 are along the longitudinal direction of touch panel 10
Extending, second 2312 extends along touch panel 10 horizontal direction.
Owing to the accommodation space of touch panel 10 horizontal direction is relatively big, therefore, second 2312 is convexly equipped in first 2311
And second protuberance 232 can increase the connection area of flange 23 and touch panel 10.
It addition, the width of first 2311 and the second protuberance 232 is less, the non-display area of touch panel 10 can be avoided
The longitudinal length of 16 lengthens because of first 2311 and the width of the second protuberance 232, and reduces the area of viewing area 15 with tactile
Touch the area ratio of panel 10, and then affect the outward appearance of terminal 1000.
In some embodiments, the end face 231a of the first protuberance 231 and end face 232a of the second protuberance 232 is concordant, the
The thickness of one 2311 is more than the thickness of the second protuberance 232.
After being appreciated that case ring 20 loads installing hole 17, relative to first 2311, the second protuberance 232 is closer to aobvious
Show region 15.In other words, first 2311 is arranged away from viewing area 15, and the second protuberance 232 is arranged near viewing area 15.
Owing to the input module 100 part near the position of viewing area 15 is more, therefore, the thickness of the second protuberance 232
Relatively thin other parts that can avoid the second protuberance 232 and close viewing area 15 interfere (as shown in Figure 2).
As in figure 2 it is shown, case ring 20 exists with the second flexible PCB 50 and other parts of the screen being connected terminal 1000
There is overlapping part in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second protuberance 232 can avoid with
Second flexible PCB 50 and other parts interfere so that case ring 20 can be arranged closer to viewing area 15, decoration
Circle 20 even can partly or entirely be arranged in the viewing area 15 of touch panel 10, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, increase the ratio of the area of viewing area 15 and the area of touch panel 10.
In some embodiments, rosette 21 is in Long Circle, and the outer wall 215 of rosette 21 includes parallel two straight line
Section 2151 and two bending sections 2152 of two straightways 2151 of connection, first 2311 is disposed therein a straightway 2151
On, second 2312 is arranged on two bending sections 2152.
So, rosette 21 is more attractive in appearance.Specifically, transversely arranged (such as Fig. 1 along touch panel 10 of two bending sections 2152
In left and right to), two straightways 2151 arrange along the longitudinal direction (with the most vertical) of touch panel 10.
In some embodiments, the shape of second 2312 is closed with the matching form of bending section 2152.
Such as, the outline of second 2312 is also circular arc, and is substantially arranged concentrically with bending section 2152.So may be used
So that the structure of case ring 20 is compacter.
See also Fig. 8-Figure 10, in some embodiments, fingerprint chip-packaging structure 30 include packaging body 31 and
Fingerprint recognition chip 32.
Packaging body 31 includes the second bottom surface 311 and connects the side 312 of the second bottom surface 311, the second bottom surface 311 and side
The junction of 312 is formed with depressed part 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
In the fingerprint chip-packaging structure 30 of embodiment of the present invention, depressed part 33 can be with the support edge in case ring 20
22 coordinate, thus can location fingerprint chip-packaging structure 30, and then improve the efficiency of assembling of fingerprint chip-packaging structure 30.
It addition, depressed part 33 coordinates the thickness that can also reduce fingerprint chip-packaging structure 30 with support edge 22, be conducive to
Terminal 1000 miniaturization of employing fingerprint chip-packaging structure 30.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
The position of 32 correspondences.The signal of fingerprint recognition chip 32 identifies the fingerprint pattern of user through packaging body 31 with collection, by user
Fingerprint pattern mate with the fingerprint pattern prestored, if the match is successful, then unlock terminal 1000.
It is appreciated that the surface configuration of the fingerprint recognition chip 32 finger towards user has sensing pel array, to gather
The fingerprint pattern of user.Packaging body 31 encapsulates fingerprint recognition chip 32 can reduce sensor pixel array when gathering fingerprint pattern
Affected by other interference signals, to improve the accuracy rate identified.
It should be noted that depressed part 33 is used for coordinating with support edge 22 so that fingerprint chip-packaging structure 30 is by depression
Portion 33 is supported on support edge 22.
Depressed part 33 coordinates with support edge 33, and in other words, support edge 22 is housed in depressed part 33.
In the present embodiment, depressed part 33 structure ringwise, correspondingly, support edge 22 structure the most ringwise is so that caving in
Portion 33 can house support edge 22.
In other embodiments, depressed part 33 can be circumferentially-spaced with the junction of side 312 around the second bottom surface 311
The multiple depressed parts 33 arranged, correspondingly, support edge 22 is also around circumferentially spaced multiple support edges 22, multiple depressed parts
33 with multiple support edges 22 corresponding matching.
The such as quantity of depressed part 33 is 3, and adjacent two depressed parts 33 are around circumferentially-spaced 120 degree of settings, support edge 22
Quantity be also 3, and corresponding with 3 depressed parts in locations of structures.
It is pointed out that the shape of depressed part 33 and quantity are not limited to situation discussed above, if depressed part 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, and therefore, example described above is not
It is interpreted as limitation of the present invention.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package is tied
Structure 30 can also omit depressed part 33.
In some embodiments, packaging body 31 includes the first encapsulation part 313 and connects the second envelope of the first encapsulation part 313
Dress portion 314, the first encapsulation part 313 includes that the second bottom surface 311, the second encapsulation part 314 include side 312.
So, the first encapsulation part 313 is connected with the second encapsulation part 314 and can form depressed part 33.Packaging body 31 can pass through
Machine away the material on packaging body 31 thus form depressed part 33, it is also possible to connected by the first encapsulation part 313 and the second encapsulation part 314
Connect formation.
Being appreciated that to form depressed part 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 wears dodges hole 222, and the second encapsulation part 314 is supported on support edge
On 22.
In some embodiments, in fingerprint recognition chip 32 is arranged on the first encapsulation part 313.
So, the circuit junction of fingerprint recognition chip 32 easily exposes to be connected with the first flexible PCB 40.
In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big
Little cooperation.
In other words, the shape of fingerprint recognition chip 32 is similar or identical with the shape of the first encapsulation part 313, such as, and fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is cuboid or fillet cuboid.
The size being slightly larger in dimension than fingerprint recognition chip 32 of the first encapsulation part 313 is to realize encapsulation fingerprint recognition chip 32
Effect.Therefore, so so that the structure of fingerprint chip-packaging structure 30 is compacter.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
So, the first packaging body 31 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part
The shape of 313 and the form fit dodging hole 222, say, that dodge the most rounded cuboid of shape in hole 222.
In some embodiments, the second encapsulation part 314 includes the end face 3141 being connected with side 312, and fingerprint chip seals
Assembling structure 30 includes the covering plate 34 being fixed on the end face 3141 of the second encapsulation part 314.Such as, plate 34 is covered solid by colloid
It is scheduled on the end face 3141 of the second encapsulation part 314.
User is when carrying out fingerprint recognition operation, and finger can be pressed against on covering plate 34.Covering plate 34 can be with tamper seal
Dress body 31 is without damage, to improve the reliability of fingerprint chip-packaging structure 30.
Cover plate 34 due to be often subject to touching, therefore, cover plate 34 material that hardness is higher can be used to make, such as with
On the sapphire material mentioned.
In some embodiments, the shape of the form and dimension of plate 34 and the end face 3141 of the second encapsulation part 314 is covered
And size coordinates.
Such as, the shape of end face 3141 is Long Circle, covers the shape of plate 34 also in Long Circle.Cover the area of plate 34 slightly
Area more than the end face 3141 of the second encapsulation part 314.Therefore, cover plate 34 and second encapsulation part 314 can be completely covered.
In some embodiments, being provided with sealing member 60 between the second encapsulation part 314 and support edge 22, sealing member 60 is close
Seal the gap between the second encapsulation part 314 and support edge 22.Sealing member 60 is such as made (as shown in Figure 2) by silica gel.
So, sealing member 60 is possible to prevent the foreign body such as water and dust between fingerprint chip-packaging structure 30 and case ring 20
Gap enter in terminal 1000, improve the water proof and dust proof effect of terminal 1000.
In some embodiments, depressed part 33 includes the first face 331 and connects second face 332 in the first face 331, first
Face 331 is perpendicular to the second face 332.
So, depressed part 33 is easily formed, and the first face 331 is easily connected with support edge 22.First face 331 and second
332 vertically make packaging body 31 in step-like.
Specifically, sealing member 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the first face 331 and the rounded transition in the junction shape in the second face 332.
So, the defects such as crackle are less likely to occur in the junction in the first face 331 and the second face 332, and depressed part 33 holds
It is easily formed.
Referring to Fig. 2, Figure 10 and Figure 11, in some embodiments, input module 100 includes stiffening plate 70 and fixed plate
80.Stiffening plate 70 is formed with the first location structure 72.First flexible PCB 40 is fixedly installed on stiffening plate 70.Fixed plate 80
Being formed with the second location structure 82, the first location structure 72 coordinates with the second location structure 82 to limit stiffening plate 70 relative to solid
Determine plate 80 to move.
Accordingly, because the first location structure 72 coordinates restriction stiffening plate 70 relative to fixed plate 80 with the second location structure 82
Motion, thus limit the motion of fingerprint chip-packaging structure 30, the beneficially installation process of fingerprint chip-packaging structure 30.
Such as, after limiting the motion of fingerprint chip-packaging structure 30, can be to fingerprint chip-packaging structure 30 and case ring
Glue is clicked and entered in gap between 20, with fixed bonding fingerprint chip-packaging structure 30 and case ring 20, so that fingerprint chip
The position of encapsulating structure 30 is fixed.
Specifically, fingerprint chip-packaging structure 30 and stiffening plate 70 be separately positioned on that the first flexible PCB 40 is opposing two
On individual surface.Fixed plate 80 is arranged on stiffening plate 70 times.When assembling input module 100, fixed plate 80 can first be fixed on end
On end 1000, then by the stiffening plate 70 with fingerprint chip-packaging structure 30 by the first location structure 72 and the second location knot
Structure 82 coordinates to be installed to fixed plate 80.
In order to ensure the intensity of stiffening plate 70, stiffening plate 70 can be made up of metal material, such as rustless steel.
In some embodiments, the quantity of the first location structure 72 is multiple, the quantity of the second location structure 82 and the
The quantity of one location structure 72 is corresponding.
So, multiple first location structures 72 coordinate with multiple second location structures 82 and can limit stiffening plate 70 further
Motion, thus limit the motion of fingerprint chip-packaging structure 30.
In some embodiments, stiffening plate 70 includes installation portion 74 and connects the connecting portion 76 of installation portion 74, and first is soft
Property circuit board 40 is fixedly installed on installation portion 74, and connecting portion 76 is formed with the first location structure 72.
So, connecting portion 76 can stretch out the first flexible PCB 40, can avoid the formation of first on connecting portion 76 fixed
Bit architecture 72 interferes with the first flexible PCB 40.The structure it is preferred that installation portion 74 and connecting portion 76 are formed in one.
In some embodiments, the quantity of connecting portion 76 is two, and two connecting portions 76 are connected to installation portion 74
Opposing two ends, each connecting portion 76 is formed with the first location structure 72.
Connecting portion 76 at the opposing two ends of installation portion 74 forms the first location structure 72 so that the first location structure 72 with
After second location structure 82 coordinates, being more uniformly stressed of stiffening plate 70, improve that stiffening plate 70 is connected with fixed plate 80 can
By property.
In some embodiments, the first location structure 72 includes that projection 721, the second location structure 82 are formed with and projection
721 hole clippings 821 coordinated, projection 721 is housed in hole clipping 821.
So, the structure of the first location structure 72 and the simple in construction of the second location structure 82 so that stiffening plate 70 is with solid
Determine plate 80 to be easily formed, it is possible to decrease the manufacturing cost of input module 100.
It should be noted that as in the example of Figure 12, hole clipping 821 is through hole.And in other embodiments, hole clipping 821
It can be blind hole.
Being appreciated that in other embodiments, the first location structure 72 is formed with hole clipping, and the second location structure 82 includes
The projection coordinated with hole clipping, projection is housed in hole clipping.
In the description of this specification, reference term " embodiment ", " some embodiment ", " schematically implement
Mode ", " example ", the description of " concrete example " or " some examples " etc. mean to combine described embodiment or example describes
Specific features, structure, material or feature are contained at least one embodiment or the example of the present invention.In this specification
In, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
Without departing from these embodiments being carried out multiple change in the case of the principle of the present invention and objective, revise, replace and become
Type, the scope of the present invention is limited by claim and equivalent thereof.
Claims (12)
1. an input module, it is characterised in that including:
Stiffening plate, described stiffening plate is formed with the first location structure；
Flexible PCB, described flexible PCB is fixedly installed on described stiffening plate；
Fingerprint chip-packaging structure, described fingerprint chip-packaging structure is fixedly installed on described flexible PCB；And
Fixed plate, described fixed plate is formed with the second location structure, and described first location structure is joined with described second location structure
Close and move relative to described fixed plate with the described stiffening plate of restriction.
2. input module as claimed in claim 1, it is characterised in that the quantity of described first location structure is multiple, described
The quantity of the second location structure is corresponding with the quantity of described first location structure.
3. input module as claimed in claim 1, it is characterised in that described stiffening plate includes installation portion and connects described installation
The connecting portion in portion, described flexible PCB is fixedly installed on described installation portion, and described connecting portion is formed with described first location
Structure.
4. input module as claimed in claim 3, it is characterised in that the quantity of described connecting portion is two, two described companies
The portion of connecing is connected to the two ends that described installation portion is opposing, and each described connecting portion is formed with described first location structure.
5. input module as claimed in claim 1, it is characterised in that described first location structure includes projection, described second
Location structure is formed with the hole clipping coordinated with described projection, and described projection is housed in described hole clipping.
6. input module as claimed in claim 1, it is characterised in that described first location structure is formed with hole clipping, described the
Two location structures include the projection coordinated with described hole clipping, and described projection is housed in described hole clipping.
7. the input module as described in any one of claim 1-6, it is characterised in that described fingerprint chip-packaging structure includes envelope
Dress body and the fingerprint recognition chip being arranged in described packaging body, described fingerprint recognition chip electrically connects with described flexible PCB
Connect.
8. input module as claimed in claim 7, it is characterised in that described packaging body includes bottom surface and connects described bottom surface
Side, described bottom surface is formed with depressed part with the junction of described side.
9. input module as claimed in claim 8, it is characterised in that described packaging body includes the first encapsulation part and connects described
Second encapsulation part of the first encapsulation part, described first encapsulation part includes that described bottom surface, described second encapsulation part include described side,
Described fingerprint recognition chip is arranged in described first encapsulation part.
10. input module as claimed in claim 8, it is characterised in that described input module includes case ring, described case ring
Including:
Rosette, described fingerprint chip-packaging structure is housed in described rosette；And
The support edge extended internally from the inwall of described rosette, described support edge is housed in described depressed part, described fingerprint
Chip-packaging structure is supported on described support edge.
11. input modules as claimed in claim 10, it is characterised in that described case ring includes the outer wall from described rosette
Outward extending flange.
12. 1 kinds of terminals, it is characterised in that include the input module as described in any one of claim 1-11.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610676740.6A CN106095196B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
| CN201810743071.9A CN109145721B (en) | 2016-08-16 | 2016-08-16 | Terminal device |
| US15/627,287 US10248251B2 (en) | 2016-08-16 | 2017-06-19 | Method for manufacturing input assembly, input assembly and terminal |
| EP17177786.5A EP3285135B1 (en) | 2016-08-16 | 2017-06-26 | Method for manufacturing input assembly, input assembly and terminal |
| ES17177786T ES2710309T3 (en) | 2016-08-16 | 2017-06-26 | Method for manufacturing input set, input set and terminal |
| PCT/CN2017/090336 WO2018032880A1 (en) | 2016-08-16 | 2017-06-27 | Method for manufacturing input assembly, input assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610676740.6A CN106095196B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810743071.9A Division CN109145721B (en) | 2016-08-16 | 2016-08-16 | Terminal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106095196A true CN106095196A (en) | 2016-11-09 |
| CN106095196B CN106095196B (en) | 2018-09-07 |
Family
ID=58069442
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810743071.9A Active CN109145721B (en) | 2016-08-16 | 2016-08-16 | Terminal device |
| CN201610676740.6A Active CN106095196B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810743071.9A Active CN109145721B (en) | 2016-08-16 | 2016-08-16 | Terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN109145721B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109145721A (en) | 2019-01-04 |
| CN106095196B (en) | 2018-09-07 |
| CN109145721B (en) | 2020-07-03 |
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