CN205961204U - Fingerprint chip packaging structure and terminal - Google Patents
Fingerprint chip packaging structure and terminal Download PDFInfo
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- CN205961204U CN205961204U CN201620889023.7U CN201620889023U CN205961204U CN 205961204 U CN205961204 U CN 205961204U CN 201620889023 U CN201620889023 U CN 201620889023U CN 205961204 U CN205961204 U CN 205961204U
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- packaging structure
- fingerprint
- fingerprint chip
- chip
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Abstract
The utility model discloses a fingerprint chip packaging structure and terminal. Fingerprint chip packaging structure includes packaging body and fingerprint identification chip. The packaging body includes the bottom surface and connects the side of bottom surface that be formed with the depressed part with the junction of side. The fingerprint identification chip sets up in the packaging body. The utility model discloses embodiment's fingerprint chip packaging structure, the depressed part can cooperate with the support limit of decorating in the circle to fingerprint chip packaging structure can be fixed a position, and then fingerprint chip packaging structure's assembly efficiency has been improved. In addition, depressed part and the thickness that supports limit cooperation can also reducing fingerprint chip packaging structure, the terminal miniaturization that is favorable to using fingerprint chip packaging structure.
Description
Technical field
This utility model is related to field of terminal, more particularly, to a kind of fingerprint chip-packaging structure and terminal.
Background technology
In the related, some mobile phones include fingerprint chip-packaging structure and case ring, and fingerprint chip-packaging structure sets
Put in case ring.Fingerprint chip-packaging structure includes fingerprint recognition chip and the packaging body for encapsulating fingerprint recognition chip.
But, at present, the structure of fingerprint chip-packaging structure is unfavorable for that location and installation, to case ring, therefore leads to fingerprint chip package
The efficiency of assembling of structure is relatively low.
Utility model content
This utility model is intended at least solve one of technical problem present in prior art.For this reason, this utility model carries
For a kind of fingerprint chip-packaging structure and a kind of terminal.
The fingerprint chip-packaging structure of this utility model embodiment includes packaging body and fingerprint recognition chip.Packaging body bag
The side including bottom surface and connecting bottom surface, bottom surface is formed with depressed part with the junction of side.Fingerprint recognition chip is arranged on encapsulation
In vivo.
The fingerprint chip-packaging structure of this utility model embodiment, depressed part can be joined with the support edge in case ring
Close, thus can location fingerprint chip-packaging structure, and then improve the efficiency of assembling of fingerprint chip-packaging structure.In addition, depression
Portion can also reduce the thickness of fingerprint chip-packaging structure with support edge cooperation, is conducive to the end of employing fingerprint chip-packaging structure
End miniaturization.
In some embodiments, the second envelope that described packaging body includes the first encapsulation part and connects described first encapsulation part
Dress portion, described first encapsulation part includes described bottom surface, and described second encapsulation part includes described side.
In some embodiments, described fingerprint recognition chip is arranged in described first encapsulation part.
In some embodiments, the shape of the form and dimension of described first encapsulation part and described fingerprint recognition chip and
Size coordinates.
In some embodiments, the rounded cuboid of shape of described first encapsulation part.
In some embodiments, described second encapsulation part includes the top surface being connected with described side, described fingerprint chip
Encapsulating structure includes fixing cover plate on the top surface.
In some embodiments, the form and dimension of described cover plate and the form and dimension of described top surface coordinate.
In some embodiments, the second face that described depressed part includes the first face and connects described first face, described the
Simultaneously perpendicular to described second face.
In some embodiments, the rounded transition in the junction shape in described first face and described second face.
The terminal of this utility model embodiment includes the fingerprint chip-packaging structure described in any of the above embodiment.
The terminal of this utility model embodiment, depressed part can be coordinated with the support edge in case ring, thus can position
Fingerprint chip-packaging structure, and then improve the efficiency of assembling of fingerprint chip-packaging structure.In addition, depressed part is coordinated with support edge
The thickness of fingerprint chip-packaging structure can also be reduced, be conducive to the terminal miniaturization of employing fingerprint chip-packaging structure.
Additional aspect of the present utility model and advantage will be set forth in part in the description, partly will be from explained below
In become obvious, or recognized by practice of the present utility model.
Brief description
Above-mentioned and/or additional aspect of the present utility model and advantage are from reference to the description to embodiment for the accompanying drawings below
Will be apparent from easy to understand, wherein:
Fig. 1 is the floor map of the terminal of this utility model embodiment;
Fig. 2 is the generalized section of the input module of this utility model embodiment;
Fig. 3 is the schematic perspective view of the case ring of this utility model embodiment;
Fig. 4 is the generalized section of the case ring of this utility model embodiment;
Fig. 5 is the floor map of the case ring of this utility model embodiment;
Fig. 6 is the perspective exploded view of the case ring of this utility model embodiment;
Fig. 7 is another perspective exploded view of the case ring of this utility model embodiment;
Fig. 8 is the schematic perspective view of the fingerprint chip-packaging structure of this utility model embodiment;
Fig. 9 is the generalized section of the fingerprint chip-packaging structure of this utility model embodiment;
Figure 10 is the floor map of the fingerprint chip-packaging structure of this utility model embodiment.
Specific embodiment
Embodiment of the present utility model is described below in detail, the example of described embodiment is shown in the drawings, wherein
The element that same or similar label represents same or similar element or has same or like function from start to finish.Lead to below
It is exemplary for crossing the embodiment being described with reference to the drawings, and is only used for explaining this utility model, and it is not intended that to this practicality
New restriction.
In description of the present utility model it is to be understood that term " " center ", " longitudinal ", " horizontal ", " length ", " width
Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ",
The orientation of instruction such as " clockwise ", " counterclockwise " or position relationship are based on orientation shown in the drawings or position relationship, be only for
It is easy to describe this utility model and simplifies description, rather than the device of instruction or hint indication or element must have specifically
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or imply relative importance or implying the technology indicated by indicating
The quantity of feature.Thus, define " first ", the feature of " second " can be expressed or implicitly include one or more
Described feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " being connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or integratedly
Connect;Can be to be mechanically connected or electrically connect or can mutually communicate;Can be to be joined directly together it is also possible to pass through
Between medium be indirectly connected to, can be the connection of two element internals or the interaction relationship of two elements.For this area
For those of ordinary skill, concrete meaning in this utility model for the above-mentioned term can be understood as the case may be.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
D score can include the first and second feature directly contacts it is also possible to include the first and second features not to be directly contact but logical
Cross the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or to be merely representative of fisrt feature level height be higher than second feature.First is special
Levy second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples is described.Certainly, they are only
Example, and purpose does not lie in restriction this utility model.Additionally, this utility model can in different examples repeat reference numerals
And/or reference letter, this repeat to be for purposes of simplicity and clarity, itself do not indicate discussed various embodiment
And/or the relation between setting.Additionally, the example of the various specific technique that provides of this utility model and material, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Refer to Fig. 1 and Fig. 2, the input module 100 of this utility model embodiment includes touch panel 10, case ring 20
And fingerprint chip-packaging structure 30.
The input module 100 of this utility model embodiment can be applicable to terminal 1000, terminal 1000 be, for example, mobile phone or
The electronic installations such as panel computer.It is appreciated that terminal 1000 includes but is not limited to the example of present embodiment.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14.Can manage
Solution, the upper surface 12 of touch panel 10 is the appearance of input module 100, towards user.User can be enterprising in upper surface 12
Row gesture operation, for example, click on or slide and realize corresponding function with control terminal 1000.
The material of touch panel 10 can be made up of light transmissive materials such as glass, pottery or sapphires.Due to touch panel 10
Due to the input part as terminal 1000, touch panel 10 is often subject to the contact such as collide or scratch.For example, user is by terminal
1000 when putting into pocket, and touch panel 10 may be scratched by the key in user's pocket and damage.
Therefore, the material of touch panel 10 can adopt the material of hardness is bigger, for example above-described sapphire material.
It is of course also possible to the upper surface 12 in touch panel 10 sets up cover sheet to prevent touch panel 10 to be scraped off.
Further, touch panel 10 includes viewing area 15 and non-display area 16.Normally, in touch panel 10
Between region as viewing area 15, non-display area 16 is arranged on viewing area 15 around.For example, non-display area 16 is arranged
Top side or bottom side in viewing area 15.
Because touch panel 10 is made up of light transmissive material, therefore, user can check terminal 1000 by viewing area 15
The content shown by screen.
So that terminal 1000 is more attractive in appearance, ink, ink can be sprayed in the lower surface 14 of non-display area 16
Color be, for example, the colors such as white, black or blueness, concrete condition can be arranged according to the actual requirements.Ink not only can
Meet the demand of the terminal 1000 to different colours for the user, structure within terminal 1000 can also be covered to reach beautification terminal
1000 effect.
It is appreciated that the shape of touch panel 10 can be according to the shape specific design of terminal 1000, for example, fillet square
Shape.
Further, touch panel 10 offers installing hole 17.In present embodiment, installing hole 17 is to run through upper surface 12
And the through hole of lower surface 14.In other embodiments, installing hole 17 can be formed in the blind hole of lower surface 14.
In present embodiment, installing hole 17 is in the oval bodily form.Certainly, in other embodiments, installing hole 17 can root
Take on a different shape according to real needs design, for example circular or oval shape.Therefore, the installing hole 17 of present embodiment
The example of shape is it is not intended that to restriction of the present utility model.
In some embodiments, case ring 20 wears installing hole 17, and is fixedly connected with touch panel 10.Fingerprint core
Chip package 30 is housed in case ring 20, and is fixedly connected with case ring 20.
Usually, the receiver of terminal 1000 is arranged on the top area of terminal 1000.Therefore, in order to prevent installing hole 17
Interfere with receiver, it is preferred that installing hole 17 is opened in the bottom section of touch panel 10, thus carrying for installing hole 17
For larger design space.Further, installing hole 17 is opened in the non-display area 16 of touch panel 10.
It is preferred that installing hole 17 is opened in the centre position of touch panel 10 bottom section so that touch panel 10 is in big
Cause symmetrical structure.So make terminal 1000 more attractive in appearance, two is user-friendly.
When installing hole 17 be through hole when, manufacture input module 100 when, can first by case ring 20 from touch panel 10
Lower section loads installing hole 17, and then glue is clicked and entered in the gap between the inwall and case ring 20 of installing hole 17, so that case ring
20 are fixedly connected with touch panel 10.
Afterwards fingerprint chip-packaging structure 30 is loaded in case ring 20 from the top of touch panel 10, and solid using colloid
Surely fingerprint chip-packaging structure 30 and case ring 20 are connected.
When installing hole 17 is blind hole, first fingerprint chip-packaging structure 30 can be loaded in case ring 20, then band be referred to
The case ring 20 of stricture of vagina chip-packaging structure 30 loads in installing hole 17, can be adhesively fixed case ring 20 and touch panel using glue
10.
Please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inwall 211 of self-chambering circlets 21 extends internally.
The support edge 22 of the case ring 20 of this utility model embodiment can support and location fingerprint chip-packaging structure
30, thus improving the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.
In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is loaded
When in rosette 21, fingerprint chip-packaging structure 30 can be pressed from top to bottom, if the position of fingerprint chip-packaging structure 30
Can not move again then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and be installed into precalculated position.
It is appreciated that rosette 21 is formed with accommodating hole 212, support edge 22 is located in accommodating hole 212.Accommodating hole 212 can
So that in right cylinder shape, in other words, inwall 211 is linearly, rapidly loads accommodating hole 212 in order to fingerprint chip-packaging structure 30
Interior.
The material that accommodating hole 212 and support edge 22 can be removed on part by way of machining formed it is also possible to
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also there is corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
Can be made using other materials such as plastics.
In some embodiments, support edge 22 is perpendicular to the inwall 211 of rosette 21.
So, support edge 22 is easily formed, and can reduce the manufacturing cost of rosette 21.In addition, when manufacture input module
When 100, support edge 22 is horizontally situated, the inwall 211 of rosette 21 be located at vertical position so that with support edge 22 cooperation
The face of fingerprint chip-packaging structure 30 is horizontal plane, so can simplify the fingerprint chip-packaging structure being supported on support edge 22
30 structure.
In some embodiments, rosette 21 includes the first bottom surface 213 being connected with inwall 211, under support edge 22
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, such as arrangement above, larger accommodation space can be formed in rosette 21, with
Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.
In other words, in the case that the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is less, thus
The thickness of input module 100 can be reduced, and then can be the thickness of terminal 1000 thinning offer design basis.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connected with inwall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
So, guide ramp 2142 can guide the finger of user and smoothly enter in rosette 21 to carry out fingerprint recognition behaviour
Make, the accuracy rate that user carries out fingerprint recognition operation can be improved.Shinny it is possible to further plate in guide ramp 2142
Metal level (such as layers of chrome), so that rosette 21 is more attractive in appearance.
It is appreciated that guide ramp 2142 is ring surface, so can facilitate user, from all directions, finger is inserted decoration
To press fingerprint chip-packaging structure 30 in ring 21, thus carrying out fingerprint recognition operation.
In some embodiments, support edge 22 is formed with avoidance hole 222.
So, avoid the cabling of the fingerprint flexible PCB 40 that hole 222 is conducive to being connected with fingerprint chip-packaging structure 30
Layout.For example, fingerprint flexible PCB 40 can pass through and avoid hole 222 to be connected with fingerprint chip-packaging structure 30 (as Fig. 2 institute
Show).
In some embodiments, avoid the rounded rectangle in hole 222, the side wall 2221 avoiding hole 222 is along avoidance hole 222
Axial direction is formed with escape groove 2222, and escape groove 2222 connects with avoiding hole 222.
For example shown in Fig. 2, after fingerprint flexible PCB 40 is connected with fingerprint chip-packaging structure 30, first to escape groove 2222
Direction extend, then bend roundabout.Therefore, escape groove 2222 can prevent fingerprint flexible PCB 40 from occurring with side wall 2221
Interfere, be conducive to fingerprint flexible PCB 40 to connect up.
In some embodiments, case ring 20 includes the flange 23 that the outer wall of self-chambering circlets 21 stretches out.
So, flange 23 can be resisted against the lower surface 14 of touch panel 10, thus case ring 20 and touch surface can be increased
The connection area of plate 10, improves the reliability that case ring 20 is fixedly connected with touch panel 10.
In addition, when loading case ring 20 in installing hole 17 from the bottom up, flange 23 is resisted against under touch panel 10
Then it represents that case ring 20 is already mounted to precalculated position during surface 14.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduce the manufacturing cost of input module 100.
In some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 to prevent water from case ring 20
Gap and installing hole 17 between enters in terminal 1000, thus improving the waterproof effect of terminal 1000.
In the embodiment of Fig. 3-Fig. 5, flange 23 and rosette 21 are formed in one structure.And the reality as Fig. 6 and Fig. 7
Apply in mode, flange 23 and rosette 21 are split molding structure.Specifically, rosette 21 includes socket part 24, socket part 24
Connect support edge 22.Flange 23 is set on socket part 24.Flange 23 and rosette 21 split molding can reduce case ring 20
Manufacture difficulty so that produce in batches case ring 20 when, the concordance of each case ring 20 can be improved.
It is pointed out that in some embodiments, socket part 24 can offer and pass through for fingerprint flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connecting side 241 and loading plate 242.Connect side 241 and connect support edge 22 and loading plate
242, connect side 241 and be approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connect side 241 to offer
Via 24a.
Socket part 24 is hollow with part or all of collecting fingerprint chip-packaging structure 30.It should be noted that at certain
In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.
Referring to Fig. 3-Fig. 5, in some embodiments, flange 23 is perpendicular to the outer wall 215 of rosette 21.
So, case ring 20 manufacturing process is simple, can also increase the contact area being connected with touch panel 10.
In some embodiments, the second protuberance 232 that flange 23 includes the first protuberance 231 and connects the first protuberance 231,
First protuberance 231 includes first 2311 and second 2312, and second 2312 connects first 2311 and the second protuberance 232,
It is convexly equipped in first 2311 and the second protuberance 232 for second 2312.
After case ring 20 loads installing hole 17, first 2311 and the second protuberance 232 are along the longitudinal direction of touch panel 10
Extend, second 2312 extends along touch panel 10 horizontal direction.
Because the accommodation space of touch panel 10 horizontal direction is larger, therefore, second 2312 is convexly equipped in first 2311
And second protuberance 232 can increase the connection area of flange 23 and touch panel 10.
In addition, the width of first 2311 and the second protuberance 232 is less, the non-display area of touch panel 10 can be avoided
16 longitudinal length lengthens because of the width of first 2311 and the second protuberance 232, and reduces the area of viewing area 15 and touch
Touch the area ratio of panel 10, and then affect the outward appearance of terminal 1000.
In some embodiments, the top surface 231a of the first protuberance 231 is concordant with the top surface 232a of the second protuberance 232, the
The thickness of one 2311 is more than the thickness of the second protuberance 232.
It is appreciated that after case ring 20 loads installing hole 17, with respect to first 2311, the second protuberance 232 is closer to aobvious
Show region 15.In other words, first 2311 is arranged away from viewing area 15, and the second protuberance 232 is arranged near viewing area 15.
Because the part at the position near viewing area 15 for the input module 100 is more, therefore, the thickness of the second protuberance 232
Relatively thin the second protuberance 232 can be avoided to interfere (as shown in Figure 2) with the other parts near viewing area 15.
As shown in Fig. 2 case ring 20 is existed with the screen flexible PCB 50 of the screen being connected terminal 1000 and other parts
There is overlapping part in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second protuberance 232 can avoid with
Screen flexible PCB 50 and other parts interfere so that case ring 20 can be arranged closer to viewing area 15, decoration
Circle 20 even can partly or entirely be arranged in the viewing area 15 of touch panel 10, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, increase the area of viewing area 15 and the ratio of the area of touch panel 10.
In some embodiments, rosette 21 is in Long Circle, and the outer wall 215 of rosette 21 includes parallel two straight line
Section 2151 and two bending sections 2152 connecting two straightways 2151, first 2311 is disposed therein a straightway 2151
On, second 2312 is arranged on two bending sections 2152.
So, rosette 21 is more attractive in appearance.Specifically, two bending sections 2152 along touch panel 10 transversely arranged (as Fig. 1
In left and right to), two straightways 2151 are along longitudinal direction (with the laterally vertical) arrangement of touch panel 10.
In some embodiments, the shape of second 2312 and the matching form of bending section 2152 close.
For example, the outline of second 2312 is also circular arc, and is substantially arranged concentrically with bending section 2152.So may be used
So that the structure of case ring 20 is compacter.
See also Fig. 8-Figure 10, in some embodiments, fingerprint chip-packaging structure 30 include packaging body 31 and
Fingerprint recognition chip 32.
Side 312, the second bottom surface 311 and side that packaging body 31 includes the second bottom surface 311 and connects the second bottom surface 311
312 junction is formed with depressed part 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
The fingerprint chip-packaging structure 30 of this utility model embodiment, depressed part 33 can with case ring 20 in support
Side 22 coordinates, thus can location fingerprint chip-packaging structure 30, and then improve the efficiency of assembling of fingerprint chip-packaging structure 30.
In addition, depressed part 33 can also reduce the thickness of fingerprint chip-packaging structure 30 with support edge 22 cooperation, be conducive to
Terminal 1000 miniaturization of employing fingerprint chip-packaging structure 30.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
32 corresponding positions.The signal of fingerprint recognition chip 32 passes through packaging body 31 to gather the fingerprint pattern of identifying user, by user
Fingerprint pattern mated with the fingerprint pattern prestoring, if the match is successful, unlock terminal 1000.
It is appreciated that the surface of the finger towards user for the fingerprint recognition chip 32 is provided with sensor pixel array, to gather
The fingerprint pattern of user.Packaging body 31 encapsulation fingerprint recognition chip 32 can reduce sensor pixel array when gathering fingerprint pattern
Affected by other interference signals, to improve the accuracy rate of identification.
It should be noted that depressed part 33 is used for coordinating with support edge 22 so that fingerprint chip-packaging structure 30 passes through depression
Portion 33 is supported on support edge 22.
Depressed part 33 is coordinated with support edge 33, and in other words, support edge 22 is housed in depressed part 33.
In the present embodiment, depressed part 33 ringwise structure, correspondingly, support edge 22 also ringwise structure so that depression
Portion 33 can house support edge 22.
In other embodiments, depressed part 33 can be circumferentially-spaced with the junction of side 312 around the second bottom surface 311
Multiple depressed parts 33 of setting, correspondingly, support edge 22 is also around circumferentially spaced multiple support edges 22, multiple depressed parts
33 with multiple support edges 22 corresponding matching.
The quantity of such as depressed part 33 is 3, and two neighboring depressed part 33 is arranged around circumferentially-spaced 120 degree, support edge 22
Quantity be also 3, and corresponding with 3 depressed parts in locations of structures.
It is pointed out that the shape of depressed part 33 and quantity are not limited to situation discussed above, if depressed part 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, and therefore, example described above is not
It is interpreted as to restriction of the present utility model.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package is tied
Structure 30 can also omit depressed part 33.
In some embodiments, the second envelope that packaging body 31 includes the first encapsulation part 313 and connects the first encapsulation part 313
Dress portion 314, the first encapsulation part 313 includes the second bottom surface 311, and the second encapsulation part 314 includes side 312.
So, the first encapsulation part 313 is connected with the second encapsulation part 314 and can form depressed part 33.Packaging body 31 can pass through
Machine away the material on packaging body 31 thus forming depressed part 33 it is also possible to be connected by the first encapsulation part 313 and the second encapsulation part 314
Connect and formed.
It is appreciated that in order to form depressed part 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 is arranged in avoidance hole 222, and the second encapsulation part 314 is supported on
On support side 22.
In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.
So, the circuit junction of fingerprint recognition chip 32 is easily exposed to be connected with fingerprint flexible PCB 40.
In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big
Little cooperation.
In other words, the shape of fingerprint recognition chip 32 is similar or identical with the shape of the first encapsulation part 313, for example, fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or fillet cuboid.
First encapsulation part 313 be slightly larger in dimension than the size of fingerprint recognition chip 32 to realize encapsulating fingerprint recognition chip 32
Effect.Therefore, so so that the structure of fingerprint chip-packaging structure 30 is compacter.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
So, the first packaging body 31 and fingerprint recognition chip 32 can preferably coordinate.Further, the first encapsulation part
313 shape is with the form fit avoiding hole 222 that is to say, that avoiding the shape also rounded cuboid in hole 222.
In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connected with side 312, and fingerprint chip seals
Assembling structure 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 passes through colloid admittedly
It is scheduled on the top surface 3141 of the second encapsulation part 314.
When carrying out fingerprint recognition operation, finger can be pressed against in cover plate 34 user.Cover plate 34 can be with tamper seal
Dress body 31 is without damage, the reliability to improve fingerprint chip-packaging structure 30.
Cover plate 34 due to be often subject to touch, therefore, cover plate 34 can be made using the higher material of hardness, for example with
On the sapphire material that refers to.
In some embodiments, the shape of the top surface 3141 of the form and dimension of cover plate 34 and the second encapsulation part 314
And size cooperation.
For example, the shape of top surface 3141 is in Long Circle, and the shape of cover plate 34 is also in Long Circle.The area of cover plate 34 is slightly
Area more than the top surface 3141 of the second encapsulation part 314.Therefore, cover plate 34 can be completely covered the second encapsulation part 314.
In some embodiments, it is provided with sealing member 60 between the second encapsulation part 314 and support edge 22, sealing member 60 is close
Seal the gap between the second encapsulation part 314 and support edge 22.Sealing member 60 for example makes (as shown in Figure 2) by silica gel.
So, sealing member 60 can prevent the foreign bodies such as water and dust between fingerprint chip-packaging structure 30 and case ring 20
Gap enter terminal 1000 in, improve the water proof and dust proof effect of terminal 1000.
In some embodiments, the second face 332 that depressed part 33 includes the first face 331 and connects the first face 331, first
Face 331 is perpendicular to the second face 332.
So, depressed part 33 is easily formed, and the first face 331 is easily connected with support edge 22.First face 331 and the second face
332 vertically make packaging body 31 be in step-like.
Specifically, sealing member 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the rounded transition in the junction shape in the first face 331 and the second face 332.
So, the defects such as crackle are less likely to occur for the junction in the first face 331 and the second face 332, and depressed part 33 holds
Easily formed.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically enforcement
The description of mode ", " example ", " specific example " or " some examples " etc. means to describe with reference to described embodiment or example
Specific features, structure, material or feature are contained at least one embodiment of the present utility model or example.In this explanation
In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, the concrete spy of description
Levy, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
While there has been shown and described that embodiment of the present utility model, those of ordinary skill in the art can manage
Solution:These embodiments can be carried out in the case of without departing from principle of the present utility model and objective multiple changes, modification,
Replace and modification, scope of the present utility model is limited by claim and its equivalent.
Claims (11)
1. a kind of fingerprint chip-packaging structure is it is characterised in that include:
Packaging body, the side that described packaging body includes bottom surface and connects described bottom surface, the junction of described bottom surface and described side
It is formed with depressed part;And
It is arranged on the internal fingerprint recognition chip of described encapsulation.
2. fingerprint chip-packaging structure as claimed in claim 1 it is characterised in that described packaging body include the first encapsulation part and
Connect the second encapsulation part of described first encapsulation part, described first encapsulation part includes described bottom surface, described second encapsulation part includes
Described side.
3. fingerprint chip-packaging structure as claimed in claim 2 it is characterised in that described fingerprint recognition chip be arranged on described
In first encapsulation part.
4. fingerprint chip-packaging structure as claimed in claim 3 is it is characterised in that the form and dimension of described first encapsulation part
Form and dimension cooperation with described fingerprint recognition chip.
5. fingerprint chip-packaging structure as claimed in claim 2 is it is characterised in that the shape of described first encapsulation part is rounded
Cuboid.
6. fingerprint chip-packaging structure as claimed in claim 2 is it is characterised in that described second encapsulation part includes and described side
The top surface that face connects, described fingerprint chip-packaging structure includes fixing cover plate on the top surface.
7. fingerprint chip-packaging structure as claimed in claim 6 is it is characterised in that described cover plate is fixed on institute by viscose glue
State on top surface.
8. fingerprint chip-packaging structure as claimed in claim 6 is it is characterised in that the form and dimension of described cover plate and institute
State the form and dimension cooperation of top surface.
9. the fingerprint chip-packaging structure as described in any one of claim 1-8 is it is characterised in that described depressed part includes first
Face and the second face connecting described first face, described first face is perpendicular to described second face.
10. fingerprint chip-packaging structure as claimed in claim 9 is it is characterised in that described first face and described second face
The rounded transition in junction shape.
A kind of 11. terminals are it is characterised in that include the fingerprint chip-packaging structure as described in any one of claim 1-10.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620889023.7U CN205961204U (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging structure and terminal |
US15/627,733 US10565426B2 (en) | 2016-08-16 | 2017-06-20 | Fingerprint chip package structure, input assembly and terminal |
EP17178047.1A EP3285136A1 (en) | 2016-08-16 | 2017-06-27 | Fingerprint chip package structure, input assembly and terminal |
PCT/CN2017/090338 WO2018032882A1 (en) | 2016-08-16 | 2017-06-27 | Fingerprint chip package structure, input assembly and terminal |
US15/974,789 US10289892B2 (en) | 2016-08-16 | 2018-05-09 | Fingerprint chip package structure and terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620889023.7U CN205961204U (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging structure and terminal |
Publications (1)
Publication Number | Publication Date |
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CN205961204U true CN205961204U (en) | 2017-02-15 |
Family
ID=57975409
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CN201620889023.7U Expired - Fee Related CN205961204U (en) | 2016-08-16 | 2016-08-16 | Fingerprint chip packaging structure and terminal |
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CN (1) | CN205961204U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018032882A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
-
2016
- 2016-08-16 CN CN201620889023.7U patent/CN205961204U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018032882A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
US10565426B2 (en) | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 |