CN103400181B - Finger print reading sensor IC-card and method for packing thereof - Google Patents
Finger print reading sensor IC-card and method for packing thereof Download PDFInfo
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- CN103400181B CN103400181B CN201310315473.6A CN201310315473A CN103400181B CN 103400181 B CN103400181 B CN 103400181B CN 201310315473 A CN201310315473 A CN 201310315473A CN 103400181 B CN103400181 B CN 103400181B
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Abstract
The present invention relates to a kind of IC-card and method for packing thereof, especially a kind of finger print reading sensor IC-card and method for packing thereof, belong to the technical field of sensor IC-card.According to technical scheme provided by the invention, described finger print reading sensor IC-card, comprises fingerprint sensor IC chip; The front of described fingerprint sensor IC chip is provided with film substrate, and the back side of fingerprint sensor IC chip is provided with stiffening plate; Film substrate is provided with the first window of through described film substrate, and the first window of film substrate is corresponding with the fingerprint sensing portion on fingerprint sensor IC chip, and fingerprint sensing portion is exposed by first window; Being electrically connected for the data processing circuit identified and process finger print data of the sensor control circuit of fingerprint sensor IC chip and the rear surface regions of film substrate.The present invention is simple and compact for structure, and packaging technology is simple, and manufacturing and encapsulation cost is low, and wide accommodation is safe and reliable.
Description
Technical field
The present invention relates to a kind of IC-card and method for packing thereof, especially a kind of finger print reading sensor IC-card and method for packing thereof, belong to the technical field of sensor IC-card.
Background technology
In recent years, the IC-card carrying IC ﹙ Ji Cheng electricity road ﹚ chip, compared with magnetic stripe card, increases owing to having information capacity, features such as security enhancing and popularizing rapidly.Particularly, passed the non-contact IC card of the information that connects by electromagnetic wave, be applied to subway, the public transport fields such as bus, convenience significantly improves.
Described IC-card needs to be close so that carry and hold with the card size (long 85.6mm, wide 54mm, thick 0.76mm) of ISO international standard as much as possible.When ensureing international standard card size, in order to by the microprocessor of high-performance high speed with use electromagnetic wave to pass to connect the necessary antenna of non-contact IC card of information and transformer etc. and be arranged within very thin IC-card, IC chip needs also constantly developing and improveing so far.
On the one hand, as finger print reading sensor IC-card, engage easily to allow stacked finger print reading sensor IC chip on silicon and film substrate, the film substrate back side configures the lead-in wire (pad) be connected with sensor IC chip, for this reason, propose projection ((through electrode)) the silicon through hole leading to the back side from surface) scheme.
In the manufacture method of existing finger print reading sensor IC-card, first in order to accommodate fingerprint sensor IC chip to greatest extent on silicon, with minimal gap lamination multiple fingerprint sensor IC chip, on the wafer made, in order to strengthen antistatic effect, coating process is done to the surface of each fingerprint sensor IC chip, each fingerprint sensor IC chip cuts off from wafer, also the dicing operation of one single chip is claimed, the pin pad of fingerprint sensor IC chip and the film substrate of outsourcing to be continued the bonding operation in position with metal wire, in order to protect superfine little metal wire and fragile bonded part, by the operation of the cementing agent encapsulation such as epoxy resin, sensors sides also has same encapsulation process technique.
But, the manufacture method of above-mentioned indication, manufacturing process is complicated, cost is high, and when the silicon wafer of limited areal manufactures multiple fingerprint sensor IC chip, in order to realize maximum output, sensor IC chip area is more little more favourable, but the method need increase the area of lead-in wire, also certainly will expand the area of fingerprint sensor IC chip, thus reduce the difficult points such as the receipts amount of sensor IC chip.
In addition, also comprise the method with wire bond in existing manufacture method, in order to allow tension lametta not have too large tension force, necessity keeps certain height sealant loop to be wrapped the same.The encapsulation of the fingerprint sensor IC chip that the method makes, can exceed the thickness 0.76mm that IC-card limits.
From the viewpoint of intensity, the bond area of sensor IC chip is less, and cohesive strength is lower, can cause the phenomenon of stripping in IC-card manufacturing process.
In addition, the thickness of sensor IC chip that can carry in the IC-card that thickness 0.76mm limits must be thinner than this thickness, more reduces its antagonistic intensity to physical external force to more thin the sensor IC chip on lamination silicon chip.
Equally, the IC-card carried with, is in the danger destroyed by quiet electrical discharge, and in order to read fingerprint, the sensor IC chip be directly touched by the finger is dangerous especially.Particularly be loaded on the control circuit in sensor IC chip laminate surface, electric discharge destroyed fragile especially.
There is the problem of forging fingerprint in finger print identifying, for providing many services, have the IC-card of high additive value in safety, has to take necessary countermeasure.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of finger print reading sensor IC-card and method for packing thereof, it is simple and compact for structure, and packaging technology is simple, and manufacturing and encapsulation cost is low, and wide accommodation is safe and reliable.
According to technical scheme provided by the invention, described finger print reading sensor IC-card, comprises fingerprint sensor IC chip; The front of described fingerprint sensor IC chip is provided with film substrate, and the back side of fingerprint sensor IC chip is provided with stiffening plate; Film substrate is provided with the first window of through described film substrate, and the first window of film substrate is corresponding with the fingerprint sensing portion on fingerprint sensor IC chip, and fingerprint sensing portion is exposed by first window; Being electrically connected for the data processing circuit identified and process finger print data of the sensor control circuit of fingerprint sensor IC chip and the rear surface regions of film substrate.
The front of described film substrate is provided with surface film, and the back side of stiffening plate is provided with bottom surface film, and described surface film, film substrate, stiffening plate and bottom surface film bonding is fixing; Surface film is provided with the Second Window of through described surface film, and described Second Window is corresponding with first window, and Second Window is connected with first window, and the fingerprint sensing portion of fingerprint sensor IC chip is exposed by first window and Second Window.
The back side of described fingerprint sensor IC chip and film substrate reinforces tack coat by first and bonds fixing, and fingerprint sensor IC chip and stiffening plate are reinforced tack coat by second and bondd fixing.
Described fingerprint sensing portion is positioned at the center of fingerprint sensor IC chip, and sensor control circuit is positioned at the first end of fingerprint sensor IC chip, and the second end of fingerprint sensor IC chip arranges finger detecting sensor; The first end of fingerprint sensor IC chip is also provided with chip and connects pin, and finger detecting sensor, fingerprint sensing portion, chip connect pin and be all electrically connected with sensor control circuit;
Described chip connection pin is connected pin with the first substrate of film substrate rear surface regions and is electrically connected, and the second substrate that rear surface regions is also arranged for being connected with outside by data processing circuit connects pin; The back side of film substrate is also provided with the electrodes conduct module for discharging, and after fingerprint sensor IC chip and film substrate are connected and fixed, electrodes conduct module can cover described sensor control circuit.
Described rear surface regions is also provided with storer for storing fingerprint characteristic data and fingerprint representation data and/or the antenna needed for non-contact type communication and modulation circuit.
The front of described film substrate is provided with conductive electrode, and described conductive electrode is exposed by Second Window, and conductive electrode is electrically connected with the data processing circuit on rear surface regions by the through electrode on film substrate.
Described conductive electrode is the rectangle with described first window and Second Window form fit, and conductive electrode is positioned at the outside of first window.
A method for packing for finger print reading sensor IC-card, described method for packing comprises the steps:
A, provide fingerprint sensor IC chip and film substrate, and the first window of through described film substrate is set on film substrate, the rear surface regions of film substrate arranges the data processing circuit for identifying and process finger print data;
B, fingerprint sensor IC chip attach is fixed on the back side of film substrate, the chip of fingerprint sensor IC chip connects pin and is connected pin with the first substrate of rear surface regions and is electrically connected, and is electrically connected with data processing circuit to make sensor control circuit; The fingerprint sensing portion of fingerprint sensor IC chip is exposed by first window;
C, at the fixing stiffening plate of the back side of fingerprint sensor IC chip bonding.
Also comprise steps d, surface film is set in the front of film substrate, described surface film arranges the Second Window that distribute corresponding to first window, arrange bottom surface film at the back side of stiffening plate, described surface film, film substrate, stiffening plate and bottom surface film bond fixing mutually.
The front of described film substrate is provided with conductive electrode, and described conductive electrode is exposed by Second Window, and conductive electrode is electrically connected with the data processing circuit on rear surface regions by the through electrode on film substrate; The back side of film substrate is also provided with the electrodes conduct module for discharging, and after fingerprint sensor IC chip and film substrate are connected and fixed, electrodes conduct module can cover described sensor control circuit.
Advantage of the present invention: the front of fingerprint sensor IC chip is connected with film substrate, the back side of fingerprint sensor IC chip is connected with stiffening plate, forms the core board of IC-card, first window on film substrate and the Second Window be positioned at above film substrate can make to point detecting sensor and fingerprint sensing portion exposes, and conductive electrode is set in Second Window, by conductive electrode energy and finger contact, the biological of finger is judged by the permitivity and static capacity that measure contact, the data processing circuit of sensor control circuit and rear surface regions completes the process of fingerprint recognition and finger print data, thus the finger print reading sensor IC-card formed can be made to meet the card size of ISO international standard, simple and compact for structure, packaging technology is simple, manufacturing and encapsulation cost is low, wide accommodation, safe and reliable.
Accompanying drawing explanation
Fig. 1 is explosive view of the present invention.
Fig. 2 is the structural representation of fingerprint sensor IC chip of the present invention.
Fig. 3 is the structural representation that fingerprint sensor IC chip of the present invention coordinates with film substrate.
Fig. 4 is the exploded view before fingerprint sensor IC chip of the present invention and film substrate are connected and fixed.
Fig. 5 be in Fig. 4 between fingerprint sensor IC chip and film substrate by first reinforce tack coat bond fixing after structural representation.
Fig. 6 is the exploded view before fingerprint sensor IC chip of the present invention, film substrate and stiffening plate are fixed.
Fig. 7 be in Fig. 6 fingerprint sensor IC chip, film substrate and stiffening plate bonding fixing after structural representation.
Fig. 8 is the exploded view of surface film of the present invention, film substrate, fingerprint sensor IC chip.
Description of reference numerals: 1-stiffening plate, 11-fingerprint sensor IC chip, 12-points detecting sensor, 13-fingerprint sensing portion, 14-chip connects pin, 15-sensor control circuit, 21-film substrate, 22-first window, 23-first substrate connects pin, 24-rear surface regions, 25-second substrate connects pin, 26-electrodes conduct module, 27-conductive electrode, 28-through electrode, 31-surface film, 32-Second Window, 33-bottom surface film, 41a-first reinforces tack coat and 41b-second reinforces tack coat.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As illustrated in figures 1 and 8: in order to slim finger print reading sensor IC-card can be obtained, the present invention includes fingerprint sensor IC chip 11; The front of described fingerprint sensor IC chip 11 is provided with film substrate 21, and the back side of fingerprint sensor IC chip 11 is provided with stiffening plate 1; Film substrate 21 is provided with the first window 22 of through described film substrate 21, and the first window 22 of film substrate 21 is corresponding with the fingerprint sensing portion 13 on fingerprint sensor IC chip 11, and fingerprint sensing portion 13 is exposed by first window 22; Being electrically connected for the data processing circuit identified and process finger print data of the sensor control circuit 15 of fingerprint sensor IC chip 11 and the rear surface regions 24 of film substrate 21.
Particularly, in the embodiment of the present invention, fingerprint sensor IC chip 11, film substrate 21 and stiffening plate 1 form the core substrate of IC-card, and stiffening plate 1 can adopt metal or compound substance to make.
As shown in Figure 4, Figure 5, Figure 6 and Figure 7: described fingerprint sensor IC chip 11 is reinforced tack coat 41a with the back side of film substrate 21 by first and bondd fixing, and fingerprint sensor IC chip 11 is reinforced tack coat 41b with stiffening plate 1 by second and bondd fixing.
Coat such as epoxy cementing agent in fingerprint sensor IC chip 11 side, be connected with film substrate 21, obtain the first reinforcing tack coat 41a, reinforce the side of tack coat 41a to fingerprint sensor IC chip 11 by first and protect.In the specific implementation, by regulating the firm time of cementing agent, also cementing agent is dripped at the back side of fingerprint sensor IC chip 11 before above-mentioned cementing agent sclerosis, push open very thin in cementing agent to not be mixed into bubble, by the stiffening plates such as metal 1 and fingerprint sensor IC chip 11 back side bonding 1, after described step process, strengthen the effect of fingerprint sensor IC chip 11 external force resistance, and can seal side completely.
Now, fingerprint sensor IC chip 11 and stiffening plate 1 are reinforced tack coat 41b by second and are bondd and fix, thus on the side surface of fingerprint sensor IC chip 11 by one more firmly sealant protect; The set time of above-mentioned cementing agent, can be accomplished by the ratio cooperation of adjusting component or the temperature that controls environment.Stiffening plate 1 can be considered by materials such as stainless steels (thick about 0.1mm).
The front of described film substrate 21 is provided with surface film 31, and the back side of stiffening plate 1 is provided with bottom surface film 33, and described surface film 31, film substrate 21, stiffening plate 1 and bottom surface film 33 bonding is fixing; Surface film 31 is provided with the Second Window 32 of through described surface film 31, described Second Window 32 is corresponding with first window 22, and Second Window 32 is connected with first window 22, the fingerprint sensing portion 13 of fingerprint sensor IC chip 11 is exposed by first window 22 and Second Window 32.
Particularly; above-mentioned core board is clipped between surface film 31 and bottom surface film 33; can be protected the core board of above-mentioned formation by surface film 31 and bottom surface film 33; surface film 31 and bottom surface film 33 adopt thermoplastic resin or paper to make; surface film 31 and film substrate 21 bond fixing; bond between stiffening plate 1 and bottom surface film 33 fixing; simultaneously; also adopt between surface film 31 and bottom surface film 33 to bond between cementing agent fixing, the reliability used after guaranteeing to form whole fingerprint sensor IC-card.Film substrate 21 have employed the materials such as polyimide resin (thickness is about 0.03mm), glass epoxy resin (thickness is about 0.1mm) and polyester (thickness is about 0.05mm).
As shown in Figures 2 and 3: described fingerprint sensing portion 13 is positioned at the center of fingerprint sensor IC chip 11, sensor control circuit 15 is positioned at the first end of fingerprint sensor IC chip 11, and the second end of fingerprint sensor IC chip 11 arranges finger detecting sensor 12; The first end of fingerprint sensor IC chip 11 is also provided with chip and connects pin 14, and finger detecting sensor 12, fingerprint sensing portion 13, chip connect pin 14 and be all electrically connected with sensor control circuit 15;
Wherein, finger detecting sensor 12 can be used for detecting finger touch and being confirmed whether it is a biosome part, fingerprint sensing portion 13 can obtain fingerprint image, sensor control circuit 15 can by the analog signal figure of input, and realize the control of signal input and output, connect pin 14 by chip can realize and outside electrical connection, then realize connecting the power supply of whole fingerprint sensor IC chip 11.Electric conductivity when finger is placed on fingerprint sensor IC chip 11, owing to pointing, the switch of finger detecting sensor 12 can close, thus finger detecting sensor 12 can send 4 ADC signals of finger sense signal, drives the fingerprint fetch program to read finger print data from fingerprint sensing portion 13 after sensor control circuit 15 receives signal, at once.In the embodiment of the present invention, it is long that the size that can control fingerprint sensor IC chip 11 is about 8.5mm() × 11mm(is wide), on the silicon wafer of 6 inches, the fingerprint sensor IC chip 11 of about about 130 can be manufactured.The said structure of fingerprint sensor IC chip 11 is identical with the structure of existing fingerprint sensor, no longer describes in detail herein.
Described chip connection pin 14 is connected pin 23 with the first substrate of film substrate 21 rear surface regions 24 and is electrically connected, and rear surface regions 24 also arranges the second substrate be used for data processing circuit is connected with outside and connects pin 25; The back side of film substrate 21 is also provided with the electrodes conduct module 26 for discharging, and after fingerprint sensor IC chip 11 and film substrate 21 are connected and fixed, electrodes conduct module 26 can cover described sensor control circuit 15.
In the embodiment of the present invention, electrodes conduct module 26 is positioned at the back side of film substrate 21, and be positioned at the outer ring of first window 22, electrodes conduct module 26 covers on the sensor control circuit 15 that fingerprint sensor IC chip 11 is the most easily discharged and punctures, by electrodes conduct module 26 ground connection, thus the destruction preventing electrostatic to fingerprint sensor IC chip 11 can be provided.First window 22 is rectangular, and electrodes conduct module 26 is also rectangular.
In the embodiment of the present invention, after sensor control circuit 15 is connected with the data processing circuit of rear surface regions 24, the circuit forming whole finger print reading sensor IC-card connects, and concrete circuit matching relationship can be the technical scheme recorded in " the loading the IC-card of finger print identifying function " of CN103164728A with reference to publication number.Described rear surface regions 24 is also provided with storer for storing fingerprint characteristic data and fingerprint representation data and/or the antenna needed for non-contact type communication and modulation circuit.
Overleaf in region 24, except there being finger print identifying necessary high-performance data treatment circuit (described data processing circuit comprises process chip), and store the storer of fingerprint characteristic data and fingerprint representation data, also have the external connection pins (for above-mentioned second substrate connects pin 25) of contact-type IC-card, the antenna needed for non-contact IC card and communication control unit thereof can carry.
Overleaf in region 24, for contact-type IC-card, can arrange on above-mentioned core core substrate wired circuit module or on other substrates and be connected by pin interface with outside, for second substrate connects pin 25 in the embodiment of the present invention.For non-contact IC card, above above-mentioned wired circuit module or other substrates can arrange Anneta module and modulation circuit, or the hybrid card that contact-type IC chip and non-contact type IC chip take into account can be made.
Further, the circuit part of above-mentioned necessity is made on other substrates, and other substrate necessity are configured in the same face with the part side of film substrate 21, are energized mutually.The CPU of finger print identifying process necessity and reservoir etc., so-called finger print identifying function part, is equipped on other substrates above-mentioned or film substrate 21.
On film substrate 21, in the Second Window 22 that setting allows the position of the fingerprint sensing portion 13 of above-mentioned fingerprint sensor IC chip 11 and finger detecting sensor 12 expose.
The front of described film substrate 21 is provided with conductive electrode 27, and described conductive electrode 27 is exposed by Second Window 32, and conductive electrode 27 is electrically connected with the data processing circuit on rear surface regions 24 by the through electrode 28 on film substrate 21.
Described conductive electrode 27 is the rectangle with described first window 22 and Second Window 32 form fit, and conductive electrode 27 is positioned at the outside of first window 22.
The outer ring of the first window 22 of film substrate 21 arranges the conductive electrode 27 that tested finger can directly contact, in addition, by adjusting the Second Window 32 of surface film 31, to expose a part for conductive electrode 27, when making to make IC-card, finger can directly touch conductive electrode 27.Described conductive electrode 27 has the electric conductivity of Copper Foil etc., in order to prevent surface deterioration can be gold-plated.Conductive electrode 27 is connected with the part side of film substrate 21 by through electrode 28, and with the signal wire on core core substrate in succession.Such as, detected by the specific inductive capacity and electric capacity measuring contact object from signal wire, judge whether the object contacted is live in pointing or the prosthetic finger (such as referring to the vacation of silica gel and mephenesin Carbamate film production) beyond biosome.
A method for packing for finger print reading sensor IC-card, described method for packing comprises the steps:
A, provide fingerprint sensor IC chip 11 and film substrate 21, and the first window 22 of through described film substrate 21 is set on film substrate 21, the rear surface regions 24 of film substrate 21 arranges the data processing circuit for identifying and process finger print data;
B, fingerprint sensor IC chip 11 bonding is fixed on the back side of film substrate 21, the chip connection pin 14 of fingerprint sensor IC chip 11 is connected pin 23 with the first substrate of rear surface regions 24 and is electrically connected, and is electrically connected with data processing circuit to make sensor control circuit 15; The fingerprint sensing portion 13 of fingerprint sensor IC chip 11 is exposed by first window 22;
C, at the fixing stiffening plate 1 of the back side of fingerprint sensor IC chip 11 bonding.
Also comprise steps d, surface film 31 is set in the front of film substrate 21, described surface film 31 arranges the Second Window that distribute corresponding to first window 22, arrange bottom surface film 33 at the back side of stiffening plate 1, described surface film 31, film substrate 21, stiffening plate 1 and bottom surface film 33 mutually bonding are fixing.
In the embodiment of the present invention, provide film substrate 21, and on film substrate 21, wired circuit is set as required, and weld electronic unit above, for when heating after preventing, above-mentioned electronic unit moves, bond with high-temperature agglomerant.Finally the chip of the fingerprint sensor IC chip 11 cut down is connected pin 14 and be connected pin 23 overlap heat bonding together with the first substrate on film substrate 21.Meanwhile, composition surface between can be coated with in advance and spread solder and add hot pressing again, also can to bond at relatively low temperatures compacting with anisotropic conductive film or anisotropically conducting adhesive or with soldering paste.The cohesive strength of both pins 23 is connected because adhesive surface is little not with first substrate because chip connects pin 14, epoxy cementing agent can also be coated with in fingerprint sensor IC chip 11 side, while both connections strong, be coated with this cementing agent and can play sealing fingerprint sensor IC chip.
The front of described film substrate 21 is provided with conductive electrode 27, and described conductive electrode 27 is exposed by Second Window 32, and conductive electrode 27 is electrically connected with the data processing circuit on rear surface regions 24 by the through electrode 28 on film substrate 21; The back side of film substrate 21 is also provided with the electrodes conduct module 26 for discharging, and after fingerprint sensor IC chip 11 and film substrate 21 are connected and fixed, electrodes conduct module 26 can cover described sensor control circuit 15.
In the embodiment of the present invention, when adopting above-mentioned encapsulating structure, the thickness of fingerprint sensor IC chip 11 is about 0.2mm, the thickness of film substrate 21 is about 0.1mm, surface layer film 31 and bottom film 33(are containing bonding film) thickness all about 0.15mm, therefore the thickness that the finger print reading sensor IC-card formed can be made is about 0.7mm, and this thickness is in the scope of extensively universal ISO international standard 0.76mm.Meanwhile, the Area comparison of this fingerprint sensor IC chip 11 is little, can increase the receipts amount on one piece of silicon wafer.
The front of fingerprint sensor IC chip 11 of the present invention is connected with film substrate 21, and the back side of fingerprint sensor IC chip 11 is connected with stiffening plate 1, forms the core board of IC-card, first window on film substrate 21 22 and the Second Window 32 be positioned at above film substrate 21 can make to point detecting sensor 12 and fingerprint sensing portion 13 exposes, and conductive electrode 27 is set in Second Window 32, by conductive electrode 27 energy and finger contact, the biological of finger is judged by the permitivity and static capacity that measure contact, sensor control circuit 15 completes the process of fingerprint recognition and finger print data with the data processing circuit of rear surface regions 24, thus the finger print reading sensor IC-card formed can be made to meet the card size of ISO international standard, and form slim IC-card, simple and compact for structure, packaging technology is simple, manufacturing and encapsulation cost is low, wide accommodation, safe and reliable.
Claims (8)
1. a finger print reading sensor IC-card, comprises fingerprint sensor IC chip (11); It is characterized in that: the front of described fingerprint sensor IC chip (11) is provided with film substrate (21), the back side of fingerprint sensor IC chip (11) is provided with stiffening plate (1); Film substrate (21) is provided with the first window (22) of through described film substrate (21), the first window (22) of film substrate (21) is corresponding with the fingerprint sensing portion (13) on fingerprint sensor IC chip (11), and fingerprint sensing portion (13) are exposed by first window (22); Being electrically connected for the data processing circuit identified and process finger print data of the sensor control circuit (15) of fingerprint sensor IC chip (11) and the rear surface regions (24) of film substrate (21);
Described fingerprint sensing portion (13) is positioned at the center of fingerprint sensor IC chip (11), sensor control circuit (15) is positioned at the first end of fingerprint sensor IC chip (11), and the second end of fingerprint sensor IC chip (11) arranges finger detecting sensor (12); The first end of fingerprint sensor IC chip (11) is also provided with chip and connects pin (14), and finger detecting sensor (12), fingerprint sensing portion (13), chip connect pin (14) and be all electrically connected with sensor control circuit (15);
Described chip connection pin (14) is connected pin (23) with the first substrate of film substrate (21) rear surface regions (24) and is electrically connected, and rear surface regions (24) also arrange the second substrate be used for data processing circuit is connected with outside and connect pin (25); The back side of film substrate (21) is also provided with the electrodes conduct module (26) for discharging, and after fingerprint sensor IC chip (11) and film substrate (21) are connected and fixed, electrodes conduct module (26) can cover described sensor control circuit (15).
2. finger print reading sensor IC-card according to claim 1, it is characterized in that: the front of described film substrate (21) is provided with surface film (31), the back side of stiffening plate (1) is provided with bottom surface film (33), and described surface film (31), film substrate (21), stiffening plate (1) and bottom surface film (33) bonding is fixing; Surface film (31) is provided with the Second Window (32) of through described surface film (31), described Second Window (32) is corresponding with first window (22), and Second Window (32) is connected with first window (22), the fingerprint sensing portion (13) of fingerprint sensor IC chip (11) is exposed by first window (22) and Second Window (32).
3. finger print reading sensor IC-card according to claim 1, it is characterized in that: described fingerprint sensor IC chip (11) is reinforced tack coat (41a) with the back side of film substrate (21) by first and bondd fixing, and fingerprint sensor IC chip (11) is reinforced tack coat (41b) with stiffening plate (1) by second and bondd fixing.
4. finger print reading sensor IC-card according to claim 1, is characterized in that: described rear surface regions (24) are also provided with storer for storing fingerprint characteristic data and fingerprint representation data and/or the antenna needed for non-contact type communication and modulation circuit.
5. finger print reading sensor IC-card according to claim 2, it is characterized in that: the front of described film substrate (21) is provided with conductive electrode (27), described conductive electrode (27) is exposed by Second Window (32), and conductive electrode (27) is electrically connected with the data processing circuit on rear surface regions (24) by the through electrode (28) on film substrate (21).
6. finger print reading sensor IC-card according to claim 5, it is characterized in that: described conductive electrode (27) is the rectangle with described first window (22) and Second Window (32) form fit, and conductive electrode (27) is positioned at the outside of first window (22).
7. a method for packing for finger print reading sensor IC-card, is characterized in that, described method for packing comprises the steps:
(a), fingerprint sensor IC chip (11) and film substrate (21) are provided, and the first window (22) of through described film substrate (21) is set on film substrate (21), at the upper data processing circuit arranged for identifying and process finger print data in the rear surface regions (24) of film substrate (21);
(b), fingerprint sensor IC chip (11) bonding is fixed on the back side of film substrate (21), chip connection pin (14) of fingerprint sensor IC chip (11) is connected pin (23) with the first substrate of rear surface regions (24) and is electrically connected, and is electrically connected with data processing circuit to make sensor control circuit (15); The fingerprint sensing portion (13) of fingerprint sensor IC chip (11) is exposed by first window (22);
(c), at the fixing stiffening plate (1) of the back side of fingerprint sensor IC chip (11) bonding;
The front of described film substrate (21) is provided with conductive electrode (27), described conductive electrode (27) is exposed by Second Window (32), and conductive electrode (27) is electrically connected with the data processing circuit on rear surface regions (24) by the through electrode (28) on film substrate (21); The back side of film substrate (21) is also provided with the electrodes conduct module (26) for discharging, and after fingerprint sensor IC chip (11) and film substrate (21) are connected and fixed, electrodes conduct module (26) can cover described sensor control circuit (15).
8. the method for packing of finger print reading sensor IC-card according to claim 7, it is characterized in that, also comprise step (d), surface film (31) is set in the front of film substrate (21), described surface film (31) arranges the Second Window that distribute corresponding to first window (22), arrange bottom surface film (33) at the back side of stiffening plate (1), described surface film (31), film substrate (21), stiffening plate (1) and bottom surface film (33) mutually bonding are fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310315473.6A CN103400181B (en) | 2013-07-24 | 2013-07-24 | Finger print reading sensor IC-card and method for packing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310315473.6A CN103400181B (en) | 2013-07-24 | 2013-07-24 | Finger print reading sensor IC-card and method for packing thereof |
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| Publication Number | Publication Date |
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| CN103400181A CN103400181A (en) | 2013-11-20 |
| CN103400181B true CN103400181B (en) | 2016-01-20 |
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| CN201310315473.6A Expired - Fee Related CN103400181B (en) | 2013-07-24 | 2013-07-24 | Finger print reading sensor IC-card and method for packing thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9792516B2 (en) | 2016-01-26 | 2017-10-17 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103699881A (en) * | 2013-12-13 | 2014-04-02 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN103793688B (en) * | 2014-01-23 | 2017-04-19 | 深圳市汇顶科技股份有限公司 | Biometric feature recognition device and electronic equipment |
| CN103793691A (en) * | 2014-01-28 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal with same |
| EP2983108A3 (en) * | 2014-08-05 | 2016-07-13 | LG Innotek Co., Ltd. | Fingerprint sensor and touch device including the same |
| US9773153B1 (en) * | 2016-03-24 | 2017-09-26 | Fingerprint Cards Ab | Fingerprint sensor module |
| CN105981030A (en) * | 2016-04-12 | 2016-09-28 | 深圳信炜科技有限公司 | Electronic equipment |
| CN105938545A (en) * | 2016-04-13 | 2016-09-14 | 深圳芯邦科技股份有限公司 | Fingerprint identification module group |
| CN107423657A (en) * | 2016-05-23 | 2017-12-01 | 茂丞科技股份有限公司 | Identification of fingerprint encapsulation unit and its manufacture method |
| CN107017234A (en) * | 2017-03-31 | 2017-08-04 | 西安易朴通讯技术有限公司 | A kind of electronic equipment |
| SE1750836A1 (en) * | 2017-06-28 | 2018-12-29 | Fingerprint Cards Ab | Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module |
| FR3069081B1 (en) * | 2017-07-17 | 2021-08-20 | Safran Identity & Security | ELECTRONIC CARD INCLUDING A FOOTPRINT SENSOR AND METHOD FOR MANUFACTURING SUCH A CARD |
| CN109711229B (en) * | 2017-10-26 | 2021-12-21 | 中芯国际集成电路制造(上海)有限公司 | Fingerprint identification chip, manufacturing method thereof and electronic device |
| CN107786694A (en) * | 2017-10-31 | 2018-03-09 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and its assemble method, housing unit and electronic installation |
| CN109035463A (en) * | 2018-06-20 | 2018-12-18 | 广东粤讯科技开发有限公司 | AiOCC system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084167Y (en) * | 2007-08-29 | 2008-07-09 | 飞信半导体股份有限公司 | An encapsulation structure and an encapsulation substrate for a thin-type sliding fingerprint identifier |
| CN101226947A (en) * | 2007-01-15 | 2008-07-23 | 南茂科技股份有限公司 | Thin membrane encapsulation structure of fingerprint identifying device |
| CN101226586A (en) * | 2007-01-17 | 2008-07-23 | 南茂科技股份有限公司 | Film packaging construction of fingerprint identification device |
| CN203366350U (en) * | 2013-07-24 | 2013-12-25 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor ic card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3684233B2 (en) * | 2002-05-14 | 2005-08-17 | キヤノン株式会社 | Fingerprint input device and manufacturing method thereof |
-
2013
- 2013-07-24 CN CN201310315473.6A patent/CN103400181B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226947A (en) * | 2007-01-15 | 2008-07-23 | 南茂科技股份有限公司 | Thin membrane encapsulation structure of fingerprint identifying device |
| CN101226586A (en) * | 2007-01-17 | 2008-07-23 | 南茂科技股份有限公司 | Film packaging construction of fingerprint identification device |
| CN201084167Y (en) * | 2007-08-29 | 2008-07-09 | 飞信半导体股份有限公司 | An encapsulation structure and an encapsulation substrate for a thin-type sliding fingerprint identifier |
| CN203366350U (en) * | 2013-07-24 | 2013-12-25 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor ic card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9792516B2 (en) | 2016-01-26 | 2017-10-17 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
| US10055664B2 (en) | 2016-01-26 | 2018-08-21 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
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|---|---|
| CN103400181A (en) | 2013-11-20 |
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