CN105938545A - Fingerprint identification module group - Google Patents
Fingerprint identification module group Download PDFInfo
- Publication number
- CN105938545A CN105938545A CN201610227601.5A CN201610227601A CN105938545A CN 105938545 A CN105938545 A CN 105938545A CN 201610227601 A CN201610227601 A CN 201610227601A CN 105938545 A CN105938545 A CN 105938545A
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- CN
- China
- Prior art keywords
- fingerprint recognition
- panel
- chip
- recognition module
- logic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The invention discloses a fingerprint identification module group comprising a panel, at least one high-voltage process chip, and at least one common logic process chip. The overall area of the panel is used as a fingerprint identification area. The at least one high-voltage process chip is arranged on the panel and is formed by a high-voltage circuit. And the at least one common logic process chip is arranged on the panel and is formed by a logic circuit. With the fingerprint identification module group, the process cost is reduced.
Description
Technical field
The present invention relates to fingerprint identification technology field, particularly relate to a kind of fingerprint recognition module.
Background technology
At present, fingerprint recognition module be entirely by one chips realize, thus bring several seriously
Problem, such as chip area are big, and cost is high；And high pressure all used by logic circuit and high-tension circuit
Technique realizes, and process costs cannot optimize；Motility is low, it is impossible to according to fingerprint recognition region
Flexible shapes arrangement and adjustment；Encapsulation needs the many pin foot scheme taked costly, cabling
Connect difficulty；Central processor CPU and sensor are placed on same chips, it is impossible to according to side
The position needing adjustment sensor of case.
Owing to whole fingerprint identification process is realized by a chips, whole chip all uses high-pressure process
Realize, process costs too expensive.
Summary of the invention
It is an object of the invention to provide a kind of fingerprint recognition module, to realize reducing process costs.
For solving above-mentioned technical problem, the present invention provides a kind of fingerprint recognition module, including:
Whole area is as the panel in fingerprint recognition region；
At least one arranges the high-pressure process chip being made up of high-tension circuit on the panel；
At least one arranges the General Logic technique being made up of logic circuit on the panel
Chip.
Preferably, described panel be shaped as ellipse.
Preferably, the number of described panel is three, and three described panel-level connect formation three
Individual different fingerprint recognition region.
Preferably, the shape of described three panels is respectively square, rectangle and square.
Preferably, described high-pressure process chip is sensor chip.
Preferably, described General Logic processing chip is processor cpu chip.
Preferably, described high-pressure process chip is positioned at the front of described panel, described General Logic
Processing chip is positioned at the back side of described panel.
A kind of fingerprint recognition module provided by the present invention, including: whole area is known as fingerprint
The panel in other region；At least one arranges the high pressure being made up of high-tension circuit on the panel
Processing chip；At least one arranges the General Logic being made up of logic circuit on the panel
Processing chip.Visible, panel is provided with at least one high-pressure process chip and at least one
General Logic processing chip, i.e. fingerprint recognition region there is multiple chips, by panel and many cores
Sheet constitutes whole fingerprint recognition module, and high-tension circuit part is realized by high-pressure process chip, patrols
Collect circuit part to be realized by General Logic processing chip, i.e. high-tension circuit in fingerprint recognition module
Employing high-pressure process realizes, and the logic circuit in fingerprint recognition module uses General Logic technique real
Existing, play high-pressure process and the advantage of low voltage logic technique the most respectively, reduce process costs,
I.e. the present invention use two or multiple chips to form fingerprint recognition module, the circuit of high-pressure section
Realizing with high-pressure process chip, the circuit of logical gate General Logic processing chip realizes, can
To reduce process costs.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below
The accompanying drawing used required in embodiment or description of the prior art will be briefly described, aobvious and
Easily insight, the accompanying drawing in describing below is only embodiments of the invention, common for this area
From the point of view of technical staff, on the premise of not paying creative work, it is also possible to attached according to provide
Figure obtains other accompanying drawing.
Fig. 1 is the top view of a kind of fingerprint recognition module provided by the present invention；
Fig. 2 is the top view of another fingerprint recognition module provided by the present invention；
Fig. 3 is the sectional view of another fingerprint recognition module provided by the present invention.
Detailed description of the invention
The core of the present invention is to provide a kind of fingerprint recognition module, to realize reducing process costs.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with this
Accompanying drawing in inventive embodiments, carries out clear, complete to the technical scheme in the embodiment of the present invention
Ground describe, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
Make the every other embodiment obtained under creative work premise, broadly fall into present invention protection
Scope.
Refer to the top view that Fig. 1, Fig. 1 are a kind of fingerprint recognition module provided by the present invention,
This fingerprint recognition module includes:
Whole area is as the panel 11 in fingerprint recognition region；
At least one high-pressure process chip 12 being made up of high-tension circuit being arranged on panel 11；
The General Logic technique core that what at least one was arranged on panel 11 be made up of logic circuit
Sheet 13.
High-pressure process chip in Fig. 1 has three, and the General Logic processing chip in Fig. 1 has three
Individual, certainly, the number of high-pressure process chip or General Logic processing chip can freely be arranged,
Can be one or more.
Visible, in this fingerprint recognition module, panel is provided with at least one high-pressure process core
Sheet and at least one General Logic processing chip, i.e. fingerprint recognition region there is multiple chips, by
Panel and multiple chips constitute whole fingerprint recognition module, and high-tension circuit part is by high-pressure process
Chip realizes, and logic circuitry portions is realized by General Logic processing chip, i.e. fingerprint recognition module
In high-tension circuit use high-pressure process to realize, logic circuit in fingerprint recognition module uses general
Logical logic process realizes, and plays high-pressure process and the advantage of low voltage logic technique, fall the most respectively
Low process costs, the i.e. present invention use two or multiple chips to form fingerprint recognition module, high
The circuit of laminate section high-pressure process chip realizes, the circuit of logical gate General Logic technique
Chip realizes, and can reduce process costs.
Concrete, panel be shaped as ellipse.In Fig. 1, panel is shaped as ellipse.Face
Multiple chips it is provided with on plate, because being to constitute whole fingerprint recognition module by multiple chips,
High-pressure section is realized by high-pressure process chip, and logic circuitry portions is real by General Logic processing chip
Existing, play high pressure and the advantage of low voltage logic technique respectively, reduce process costs.Further, adopt
Constitute whole fingerprint recognition module with multiple chips rather than use in prior art and can only adopt
Fingerprint recognition module is constituted with a chip, thus can according to fingerprint recognition region not
Similar shape places different chip number and position, the unlimited shape increasing fingerprint recognition region flexibly
Shape and the flexibility ratio of area, i.e. can freely arrange shape and the area in fingerprint recognition region.?
In Fig. 1, panel be shaped as ellipse, the area in fingerprint recognition region is set to ellipse,
It is made up of whole fingerprint recognition module multiple chips in fingerprint recognition region.
Concrete, the number of panel is three, three panel-level connect formed three different
Fingerprint recognition region.Refer to Fig. 2, Fig. 2 is another fingerprint recognition provided by the present invention
The top view of module, in Fig. 2, panel has 3, and panel 21, panel 22 and panel 23 are mutual
Being connected to form whole fingerprint recognition module, each panel is a fingerprint recognition region, the most whole
Individual fingerprint recognition module has three fingerprint recognition regions, is achieved in that have different fingerprint identification area
The fingerprint recognition module in the most multiple fingerprint recognition region, territory, allows a fingerprint recognition module have not
Same the most multiple fingerprint recognition region, fingerprint recognition region, it is achieved many fingerprint identification area are freely set
Territory.
In Fig. 2, the shape of three panels respectively square, rectangle and square, i.e. three
Individual fingerprint recognition region be shaped as square, rectangle and square, the high pressure on panel 21
Processing chip 12 has three, and the General Logic processing chip 13 on panel 21 has three, panel
High-pressure process chip 12 on 22 has two, the General Logic processing chip 13 on panel 22
Having two, the high-pressure process chip 12 on panel 23 has three, the General Logic on panel 23
Processing chip 13 has three, certainly, and the high-pressure process chip in each panel or General Logic
The number of processing chip can freely be arranged, and can be one or more.
Concrete, the high-pressure process chip in fingerprint recognition module is sensor chip, commonly patrols
Collecting processing chip is central processor CPU chip.Wherein, sensor and central processing unit be not by
Same processing chip realizes, high-pressure process chip realize the function of sensor, high-pressure process
Chip is sensor chip, General Logic processing chip realize the merit of central processor CPU
Energy sensor, General Logic processing chip is central processor CPU chip, the number of sensor
May be configured as multiple, i.e. have the little chip of multiple sensor, the number of central processing unit can be arranged
It is one, uses a chips to realize central processing unit, use multiple chips to form multiple biography
Sensor.Certainly, central processor CPU and sensor can be realized by different process chip respectively,
The number of sensor and central processing unit is not fixing, for central processor CPU chip and
Sensor chip, can arrange various different number and the permutation and combination of distribution, and is not limited to
Central processor and the division of sensor both functions, it is also possible to comprise other difference in functionality chips
Division.
Concrete, high-pressure process chip is positioned at the front of panel, and General Logic processing chip is positioned at
The back side of panel.Refer to Fig. 3, Fig. 3 is another fingerprint recognition mould provided by the present invention
The sectional view of group, high-pressure process chip 12 is positioned at the front of panel 11, General Logic technique core
Sheet 13 is positioned at the back side of panel 11, and i.e. one chips is placed on front, and a chips is placed on
The back side.Certainly, multiple chips can be individually positioned in panel front or the back side, or multiple difference
Position, can freely set.
Owing to prior art only constituting post identification module with a chips, complete fingerprint and know
Not, chip can be only placed at the fixed positions such as front or the back side of panel, and single-chip can only be adopted
Encapsulation scheme with super many pin foot.Whole chip will realize with high-pressure process, process costs
Expensive.Further, chip identification region can only realize comparing the single shape of concentration, fingerprint recognition
The degree of freedom in region is limited.And, chip can be only placed at the fixed bits such as front or the back side of panel
Putting, the degree of freedom of fingerprint recognition is limited.It addition, single-chip can only use the envelope of super many pin foot
Dress scheme, cost intensive, single-chip pin foot is many, causes cabling difficulty.
In the present invention, fingerprint recognition module is realized by multiple chips, and high-pressure section is by high-pressure process
Chip realize, logic circuitry portions is realized by General Logic processing chip, respectively play high pressure and
The advantage of low voltage logic technique, reduces process costs；And it is possible to according to fingerprint recognition region
Difformity place different chip number and position flexibly, the unlimited fingerprint recognition region that increases sets
The flexibility ratio of meter；And, central processor CPU and sensor can be by different processing chips
Realizing, sensor chip is placed on fingerprint recognition region, and the signal data sampled passes central authorities back
Processor cpu chip is unified does calculation process, can use one or many central processing units
Cpu chip, uses from the sensor chip combination collocation of different numbers respectively；Can also be to finger
Fingerprint recognition region on stricture of vagina identification module arranges various difformity, different fingerprint identification area
Territory；The multiple chips constituted on fingerprint recognition module can be individually positioned in panel front or the back side,
Or multiple diverse location；Multiple chips can use different packing forms, and segment chip can be adopted
Use lower-cost packing forms, reduce the cost of whole chip package.
To sum up, a kind of fingerprint recognition module provided by the present invention, including: whole area conduct
The panel in fingerprint recognition region；At least one height being made up of high-tension circuit being arranged on panel
Pressure processing chip；At least one General Logic work being made up of logic circuit being arranged on panel
Skill chip.Visible, panel is provided with at least one high-pressure process chip and at least one is general
Logical logic process chip, i.e. fingerprint recognition region there is multiple chips, by panel and multiple chips
Constituting whole fingerprint recognition module, high-tension circuit part is realized by high-pressure process chip, logic
Circuit part is realized by General Logic processing chip, i.e. high-tension circuit in fingerprint recognition module is adopted
Realizing with high-pressure process, the logic circuit in fingerprint recognition module uses General Logic technique to realize,
Play high-pressure process and the advantage of low voltage logic technique the most respectively, reduce process costs, i.e. originally
Invention employing two or multiple chips form fingerprint recognition module, and the circuit of high-pressure section is high
Pressure processing chip realizes, and the circuit of logical gate General Logic processing chip realizes, and can drop
Low process costs.
Above a kind of fingerprint recognition module provided by the present invention is described in detail.Herein
In apply specific case principle and the embodiment of the present invention be set forth, above enforcement
The explanation of example is only intended to help to understand method and the core concept thereof of the present invention.It should be pointed out that,
For those skilled in the art, under the premise without departing from the principles of the invention,
The present invention can also be carried out some improvement and modification, these improve and modification also falls into the present invention
In scope of the claims.
Claims (7)
1. a fingerprint recognition module, it is characterised in that including:
Whole area is as the panel in fingerprint recognition region；
At least one arranges the high-pressure process chip being made up of high-tension circuit on the panel；
At least one arranges the General Logic technique being made up of logic circuit on the panel
Chip.
2. fingerprint recognition module as claimed in claim 1, it is characterised in that described panel
Be shaped as ellipse.
3. fingerprint recognition module as claimed in claim 1, it is characterised in that described panel
Number be three, three described panel-level connect and form three different fingerprint recognition regions.
4. fingerprint recognition module as claimed in claim 3, it is characterised in that described three
The shape of panel is respectively square, rectangle and square.
5. fingerprint recognition module as claimed in claim 1, it is characterised in that described high pressure
Processing chip is sensor chip.
6. fingerprint recognition module as claimed in claim 5, it is characterised in that described commonly
Logic process chip is processor cpu chip.
7. fingerprint recognition module as claimed in claim 1, it is characterised in that described high pressure
Processing chip is positioned at the front of described panel, and described General Logic processing chip is positioned at described panel
The back side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610227601.5A CN105938545A (en) | 2016-04-13 | 2016-04-13 | Fingerprint identification module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610227601.5A CN105938545A (en) | 2016-04-13 | 2016-04-13 | Fingerprint identification module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105938545A true CN105938545A (en) | 2016-09-14 |
Family
ID=57151994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610227601.5A Pending CN105938545A (en) | 2016-04-13 | 2016-04-13 | Fingerprint identification module group |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020016698A (en) * | 2000-08-26 | 2002-03-06 | 김장수 | Locking system of finger print cognition |
| CN102138147A (en) * | 2008-09-01 | 2011-07-27 | Idex公司 | Surface sensor |
| CN103400181A (en) * | 2013-07-24 | 2013-11-20 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof |
| CN204044840U (en) * | 2014-08-26 | 2014-12-24 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module |
| CN105138206A (en) * | 2015-09-23 | 2015-12-09 | 深圳信炜科技有限公司 | Capacitive sensing device and electronic equipment |
| CN105404881A (en) * | 2015-12-25 | 2016-03-16 | 成都费恩格尔微电子技术有限公司 | Fingerprint sensor assembly and preparation method thereof |
| CN105447434A (en) * | 2014-09-26 | 2016-03-30 | 上海思立微电子科技有限公司 | Current-mode fingerprint identification sensor |
-
2016
- 2016-04-13 CN CN201610227601.5A patent/CN105938545A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020016698A (en) * | 2000-08-26 | 2002-03-06 | 김장수 | Locking system of finger print cognition |
| CN102138147A (en) * | 2008-09-01 | 2011-07-27 | Idex公司 | Surface sensor |
| CN103400181A (en) * | 2013-07-24 | 2013-11-20 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor IC (Integrated Circuit) card and packaging method thereof |
| CN204044840U (en) * | 2014-08-26 | 2014-12-24 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module |
| CN105447434A (en) * | 2014-09-26 | 2016-03-30 | 上海思立微电子科技有限公司 | Current-mode fingerprint identification sensor |
| CN105138206A (en) * | 2015-09-23 | 2015-12-09 | 深圳信炜科技有限公司 | Capacitive sensing device and electronic equipment |
| CN105404881A (en) * | 2015-12-25 | 2016-03-16 | 成都费恩格尔微电子技术有限公司 | Fingerprint sensor assembly and preparation method thereof |
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Application publication date: 20160914 |
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| RJ01 | Rejection of invention patent application after publication |