JP2008210344A - Ic tag and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag having superior heat resistance and water resistance and having strength with respect to mechanical stress loads from the outside. <P>SOLUTION: A method for manufacturing IC tag includes the steps of: forming an inlet laminate 130 with an elastic layer 120 of a rubber material laminated on one side of an inlet 110; placing the inlet laminate 130 in a housing part of a resin tray 140; and pouring liquid resin in, over the elastic layer 120; and then hardening the poured-in resin to cover the circumference of the inlet laminate 130; and sealing the resin tray 140 and a sealing resin 150. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC tag that can be read in a non-contact manner using an induction electromagnetic field or radio wave, and more particularly, to an IC tag having excellent heat resistance and water resistance and strength against external mechanical stress load, and a method for manufacturing the same. .

  In order to promote the automation of physical distribution, it is important to make machine-readable the contents of slips attached to individual articles. Conventionally, for this purpose, a bar code label corresponding to the contents is attached to each slip. However, in order to read a bar code label using a so-called bar code reader, it is necessary to make a certain distance and directional relationship between the two with a very high accuracy, and in order to facilitate physical distribution. It was an obstacle. Furthermore, the amount of information that can be entered into the barcode is small, and the distribution management range is limited to a narrow area.

  In recent years, IC tags that can be read in a non-contact manner using an induction electromagnetic field or radio waves have been used. According to this IC tag, since an induction electromagnetic field or radio wave is used as a reading medium, data in the IC chip can be reliably read without being restricted in distance and direction during reading.

  Also, in factory logistics such as FA, articles are often exposed to high-temperature drying ovens, water washing, etc., and depending on the application, articles may be placed outdoors where they are exposed to wind and rain, etc. In some cases, a strong mechanical external force is applied to the tag. In order to use the IC tag for distribution or the like, a measure for protecting the IC chip from such an environmental load is required. Conventionally, as a measure against this, the following method has been adopted.

  As shown in FIG. 3, the first method uses an electronic component holding film 310 in which an electronic component consisting of an antenna and an IC chip is held on a film, and PET, PVC or the like is formed on both sides of the electronic component holding film 310. The resin films 320 and 330 are laminated and sealed. According to the IC tag 300 manufactured in this way, the water resistance can be improved. However, protecting the IC chip on the electronic component holding film 310 from an external mechanical stress load is a thin film. Resin alone is not enough.

  The second method is a method disclosed in Patent Document 1, and as shown in FIG. 4, an electronic component holding film 410 is disposed in a housing portion of a resin-made molding tray 420, and a liquid resin is placed therein. The resin layer 430 is formed by pouring and embedding to form an integral structure. According to the IC tag 400 manufactured in this way, since the resin layer 430 can be thickened, protection from mechanical stress is ensured, and the entire electronic component holding film 410 is hermetically sealed, resulting in high water resistance. Sex is also obtained. However, since the IC chip is subjected to a mechanical load due to shrinkage at the time of curing or heat shrinkage at the time of use of the resin layer 430 that is in close contact with the electronic component holding film 410, the manufacturing yield is lowered or the heat resistance is lowered. There's a problem.

  The third method is a method disclosed in Patent Document 2, and as shown in FIG. 5 (a), both surfaces of the electronic component holding film 510 are buffer materials 520 and 530 made of a urethane-based resin having stress relaxation properties. Cover the surface layers 540 and 550 made of thermoplastic ABS resin or the like on the surfaces of the cushioning materials 520 and 530 as shown in FIG. Thus, the electronic component holding film 510 is sealed with resin surface layers 540 and 550. According to the IC tag 500 manufactured in this way, the buffer materials 520 and 530 protect the electronic component holding film 510 from the stress load during the heat compression molding of (b), and the buffer materials 520 and 530 are used. By suppressing the generation of internal stress remaining in the electronic component holding film 510 due to an external force load, damage to the IC chip can be prevented. However, the stress load due to thermal contraction of the buffer materials 520 and 530 themselves covering both surfaces of the electronic component holding film 510 is unavoidable, and the IC tag 500 is deformed and damaged by the uneven stress of the buffer materials 520 and 530 on both surfaces. Therefore, the problem that the heat resistance is lowered cannot be solved.

  In addition, when the liquid resin is cast on the surface of the electronic component holding film 510 as shown in FIG. 4, only the cushioning material 520 on the surface side is heated, so that the above-described stress is not affected. There is a problem that the IC tag 500 is damaged due to the uniformity, the manufacturing yield is lowered, and the thickness of the entire product is increased.

  In addition, as a method for preventing thermal shrinkage at the time of curing or use of the resin, a method of mixing a glass fiber or the like with the resin or a method of using a heat resistant resin having a small thermal shrinkage such as PPS can be considered. Since the molding pressure becomes high, there is a high risk of damaging the IC during molding, and the latter method has a problem that the material cost is high.

JP 2006-95153 A

JP 2005-55975 A

  The present invention has been made to solve such a conventional problem, and the object thereof is excellent in heat resistance and water resistance, and has strength against external mechanical stress load. An IC tag is to be provided at a low manufacturing cost.

  In order to achieve the above object, an IC tag according to the present invention holds an antenna for non-contact data communication by an induction electromagnetic field or radio wave and an electronic component comprising an IC chip for recording authentication information on a film. An electronic component holding film is provided, and an elastic layer having elasticity is laminated on at least one surface of the electronic component holding film, and the periphery of the electronic component holding film is covered with a resin.

  The IC tag having the above configuration can be manufactured as follows. That is, an IC tag manufacturing method according to the present invention includes an electronic component holding device that holds an antenna for non-contact data communication by an induction electromagnetic field or radio wave and an electronic component comprising an IC chip for recording authentication information on a film. A step of using a film and laminating an elastic layer having elasticity on at least one side of the electronic component holding film; and a step of arranging the electronic component holding film on which the elastic layer is laminated in a storage portion of a resin tray. And a step of pouring a liquid resin into the housing portion of the resin tray, curing the resin, and covering the periphery of the electronic component holding film with the resin.

  Here, a rubber material having appropriate elasticity and durability can be used for the elastic layer. Examples of such rubber materials include silicon rubber (SR), fluoro rubber (FR), butyl rubber (IIR), chlorosulfonated polyethylene rubber (CSM: Hypalon (trade name, manufactured by DuPont)), ethylene propylene diene rubber ( EPDM) and the like.

  Moreover, as a material of the said resin-made trays, resin, such as a polypropylene (PP), a polycarbonate (PC), a polyamide (PA), ABS, can be used, for example. Among these, in particular, when importance is attached to heat resistance, it is preferable to use PP or a mixture of PP with an appropriate amount of glass fiber or calcium carbonate. As the liquid resin, any of the resins listed above and others can be selected and used as long as the adhesiveness with the resin tray is good.

  According to the present invention, the following effects can be obtained.

  Since the periphery of the electronic component holding film is covered with resin and completely shielded from the outside air, the water resistance and moisture resistance of the IC tag can be obtained. Further, since this resin acts as a buffer against mechanical stress from the outside, the IC chip mounted on the electronic component holding film can be protected from damage due to external force.

  Since the elastic layer laminated on the electronic component holding film has moderate elasticity, it absorbs the stress caused by pouring liquid resin and the deformation caused by shrinkage when the resin hardens, and the electronic component holding film The stress load on the IC chip mounted on is reduced. In addition, the elastic layer and the external resin shrink or expand when used or change in ambient temperature and humidity, but the elastic layer acts as a buffer material against the stress load at this time, and the IC chip Since the stress load on the IC tag is reduced, the heat resistance of the IC tag is improved.

  When a liquid resin is poured, the elastic layer reduces stress and thermal load on the electronic component holding film, so the resin injection pressure is increased and the injection time is shortened to prevent the formation of bubbles and cavities. Therefore, the processing time can be shortened and the manufacturing cost can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a configuration example of an IC tag according to the present invention, and FIG. 2 is an explanatory view showing a manufacturing process of the IC tag.

  As shown in FIG. 1, the IC tag 100 of this embodiment includes an electronic component holding film (hereinafter referred to as “inlet”) 110. Here, the inlet means an antenna in which an antenna that performs non-contact data communication with an induction electromagnetic field or radio wave and an electronic component including an IC chip that records authentication information are mounted on a support. In this embodiment, an antenna is formed by a metal foil pattern on a resin film 111, and a terminal of an IC chip 112 composed of a transmission / reception circuit, a memory or the like is connected to the metal foil pattern to constitute a conductor circuit board 113. ing.

  Further, an elastic layer (a heat-resistant and elastic rubber material in this embodiment) 120 is formed on the surface side of the inlet 110, and the outer peripheral surface of the inlet laminate 130 on which the elastic layer 120 is formed is made of resin. It has a structure in which the tray 140 and the sealing resin 150 are covered and sealed with a resin. Hereinafter, the manufacturing process of the IC tag 100 of the present embodiment will be described with reference to FIG.

  As shown in FIG. 2, the IC tag 100 of the present embodiment includes a process A for forming the elastic layer 120 on the surface of the inlet 110 described below, and the inlet laminate 130 is disposed in the storage portion of the resin tray 140. It is manufactured through a process B and a process C in which the periphery of the inlet laminate 130 is sealed with a sealing resin 150.

<< Process A >>
First, in step A, as shown in FIG. 2A, the surface of the inlet 110 on which the IC chip 112 is mounted and protruded is elastically made of a rubber material made of, for example, vulcanized silicon rubber (SR). Layer 120 is formed. Here, first, an adhesive layer is formed on the surface of the film 111 in order to improve the adhesiveness with silicon rubber or the like. A rubber material made of vulcanized silicon rubber is laminated or applied at about 1 to 2 times the thickness of the IC chip 112.

  The rubber material is laminated by, for example, stacking unvulcanized silicon rubber once processed into a sheet shape on the film 111 and passing it through a roller, or is laminated on the film 111 by a laminating method. At this time, a roller or a flat plate relatively harder than unvulcanized rubber is disposed on the surface of the inlet 110 where the conductor circuit board 113 is disposed, so that the convex portion where the IC chip 112 is mounted can be plastically deformed. The conductive circuit board 113 is held flat by being absorbed by the unvulcanized rubber material.

  Next, a vulcanization process for imparting elasticity and durability to the unvulcanized rubber material is performed. This step is carried out by applying a pressure of about 25 atm and a high temperature of about 180 ° C. to the unvulcanized rubber material. At this time, the same high pressure and high temperature as above are also applied to the inlet 110, but the unvulcanized rubber which is laminated on the surface and can be plastically deformed is used as a buffer material against pressure and heat during vulcanization. The IC chip 112 in the inlet 110 is protected from damage.

  By this process, the unvulcanized rubber becomes an elastic layer 120 made of vulcanized rubber having increased elasticity and durability, and acts as a layer that absorbs external force, and the IC chip 112 in the inlet 110 is sealed with a resin sealing process described later. Alternatively, it is possible to protect against stress load accompanying the expansion and contraction of the resin during use. In this embodiment, the elastic layer 120 is formed by laminating the rubber material on the surface of the inlet 110 where the IC chip 112 is mounted and protruding, but according to this embodiment, the conductor circuit board 113 is flattened. Since it is vulcanized and cured while being fixed, there is an advantage that disconnection of the electrode part of the IC chip 112 due to the deformation of the conductor circuit board 113 which is a cause of malfunction of the IC tag 100 can be prevented.

  In this embodiment, silicon rubber is used for the elastic layer 120 in consideration of heat resistance. However, fluorine rubber (FR) having similar characteristics can be used, and butyl rubber (IIR) can also be used. ), Chlorosulfonated polyethylene rubber (CSM: Hypalon (trade name) manufactured by DuPont), ethylene propylene diene rubber (EPDM), and the like can be selected and used depending on the application.

<< Process B >>
Next, in the process B, as shown in FIG. 2B, the elastic layer in the inlet 110 is placed in the storage portion of the resin tray 140 formed by molding the inlet laminated body 130 including the inlet 110 and the elastic layer 120 in a separate process. The surface on which the 120 is not laminated is arranged facing the bottom side of the storage unit. Therefore, the elastic layer 120 is disposed on the side in contact with the sealing resin 150 in Step C described later.

  Various materials such as polypropylene (PP), polycarbonate (PC), polyamide (PA), ABS, and the like can be used as the material of the tray 140. However, when heat resistance is important, for example, PP or It is preferable to use PP mixed with glass fiber, calcium carbonate or the like in an amount of about 5 to 20 Vol%.

<< Process C >>
Finally, in step C, as shown in FIG. 2C, the liquid 140 is heated and softened to a predetermined temperature on the storage portion of the tray 140 in which the inlet laminate 130 is disposed, that is, the elastic layer 120 made of a rubber material. A sealing resin 150 is formed by pouring resin and curing it.

  For the pouring of the liquid resin, the tray 140 in the state of the above-mentioned step B is placed in a molding die. For example, a liquid PP material having the same quality as the tray 140 and heated and softened at about 120 to 150 ° C. This is performed by injecting into the storage portion at a predetermined pressure for a predetermined time. The pressure and time at this time are set to optimum values that suppress the generation of bubbles and cavities when the resin is poured, but the elastic layer 120 made of a rubber material on the inlet 110 causes the pressure and pressure to the inlet 110 when the resin is poured. Heat load can be reduced. Therefore, it is possible to flexibly select high load conditions such as increasing the pouring pressure or shortening the injection time in order to prevent the generation of bubbles and cavities, and the degree of freedom in material selection is high and the processing time is shortened. As a result, the manufacturing cost can be reduced.

  In this embodiment, the same material as that of the tray 140 is used as the sealing resin 150. However, various materials can be selected as long as the adhesiveness with the material of the tray 140 is good.

  As described above, in the IC tag 100 of this embodiment, the inlet laminated body 130 in which the elastic layer 120 made of a rubber material is laminated on at least one surface of the inlet 110 is formed, and the inlet laminated body 130 is formed on the resin tray 140. The liquid resin is poured onto the elastic layer 120, the resin is then cured, and the periphery of the inlet laminate 130 is covered with the resin tray 140 and the sealing resin 150 and sealed. It has become. For this reason, since the inlet 110 is completely shielded from the outside air by the resin tray 140 and the sealing resin 150, the water resistance and moisture resistance of the IC tag 100 can be obtained. In addition, since these resins function as a buffer material for mechanical stress from the outside, the IC chip 112 in the inlet 110 is protected from damage due to external force.

  Further, according to the IC tag 100 of the present embodiment, the rubber material on the surface of the inlet 110 has elasticity. Therefore, the stress caused when the liquid resin is poured and the deformation due to the curing shrinkage when the resin is cured from the liquid state are absorbed by the elastic layer 120 made of rubber, and another material is bonded to the back surface of the inlet 110. Since it is not deformed and is free to be deformed, the stress load on the IC chip 112 is reduced and the manufacturing yield is improved.

  Furthermore, when molding the sealing resin 150, the injection pressure of the molten resin can be set high, the manufacturing conditions can be set or the degree of freedom in material selection can be greatly improved, and the IC tag 100 can be manufactured at low cost. .

  Note that the elastic layer 120 on the surface of the sealing resin 150 and the inlet 110 contracts or expands due to changes in ambient temperature and humidity even during use. However, the elastic layer 120 is also configured against the stress load at this time. Since the rubber material acts as a cushioning material and the back surface of the inlet 110 is a surface that can be freely deformed as described above, the stress load on the IC chip 112 is reduced and the heat resistance of the IC tag 100 is improved.

Sectional drawing which shows the structural example of the IC tag which concerns on this invention. Explanatory drawing which shows the manufacturing process of the IC tag which concerns on this invention. Sectional drawing which shows the example of 1 structure of the conventional IC tag. Sectional drawing which shows the other structural example of the conventional IC tag. Explanatory drawing which shows the manufacturing process of the conventional IC tag.

Explanation of symbols

100 IC tag 110 Electronic component holding film (inlet)
DESCRIPTION OF SYMBOLS 111 Film 112 IC chip 113 Conductor circuit board 120 Elastic layer 130 Inlet laminated body 140 Resin tray 150 Sealing resin

Claims (3)

On the film, an electronic component holding film holding an antenna for non-contact data communication by an induction electromagnetic field or radio wave and an electronic component made of an IC chip for recording authentication information is provided.
An IC tag, wherein an elastic layer having elasticity is laminated on at least one surface of the electronic component holding film, and the periphery of the electronic component holding film is covered with a resin.   2. The IC tag according to claim 1, wherein the elastic layer is made of a rubber material selected from silicon rubber, fluorine rubber, butyl rubber, chlorosulfonated polyethylene rubber, and ethylene propylene diene rubber. On the film, use an electronic component holding film that holds an antenna that performs non-contact data communication with an induction electromagnetic field or radio wave, and an electronic component that consists of an IC chip that records authentication information.
Laminating an elastic layer having elasticity on at least one side of the electronic component holding film;
Placing the electronic component holding film on which the elastic layer is laminated in a storage part of a resin tray; and
A method of manufacturing an IC tag, comprising: pouring a liquid resin into a housing portion of the resin tray, curing the resin, and covering the periphery of the electronic component holding film with the resin.

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