WO2008105133A1 - Ic tag and process for producing the same - Google Patents

Ic tag and process for producing the same Download PDF

Info

Publication number
WO2008105133A1
WO2008105133A1 PCT/JP2007/075065 JP2007075065W WO2008105133A1 WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1 JP 2007075065 W JP2007075065 W JP 2007075065W WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
inlet
tag
laminate
elastic layer
Prior art date
Application number
PCT/JP2007/075065
Other languages
French (fr)
Japanese (ja)
Inventor
Wakahiro Kawai
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Publication of WO2008105133A1 publication Critical patent/WO2008105133A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Abstract

[PROBLEMS] To provide an IC tag that excels in resistances to heat and water, having a strength against mechanical stress load from outside. [MEANS FOR SOLVING PROBLEMS] Inlet laminate (130) having inlet (110) and, superimposed on one major surface thereof, elastic layer (120) of a rubber material is provided. The inlet laminate (130) is disposed in an accommodation part of resin-made tray (140), and a liquid resin is caused to flow in over the elastic layer (120). The resin is hardened so that the surrounding area of the inlet laminate (130) is covered by the resin-made tray (140) and sealing resin (150) to thereby attain hermetic sealing thereof.
PCT/JP2007/075065 2007-02-28 2007-12-27 Ic tag and process for producing the same WO2008105133A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007048973A JP2008210344A (en) 2007-02-28 2007-02-28 Ic tag and manufacturing method therefor
JP2007-048973 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105133A1 true WO2008105133A1 (en) 2008-09-04

Family

ID=39720976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075065 WO2008105133A1 (en) 2007-02-28 2007-12-27 Ic tag and process for producing the same

Country Status (2)

Country Link
JP (1) JP2008210344A (en)
WO (1) WO2008105133A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3035248A4 (en) * 2013-08-15 2016-08-03 Fujitsu Ltd Rfid tag and method for manufacturing same
EP2472438A4 (en) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Non-contact communication medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5427401B2 (en) * 2008-12-19 2014-02-26 株式会社ユニバーサルエンターテインメント ID tag built-in game media
JP2016053874A (en) * 2014-09-04 2016-04-14 アールエフ・テクノロジー株式会社 Rfid tag, management system and method for manufacturing rfid tag
JP6658607B2 (en) 2017-02-22 2020-03-04 オムロン株式会社 Product manufacturing method, exterior parts and antenna pattern selection device
JP6750591B2 (en) 2017-10-05 2020-09-02 カシオ計算機株式会社 Insert molding method and insert molding part

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (en) * 1997-09-26 1999-04-13 Toshiba Chem Corp Non-contact type data carrier package
JP2000099675A (en) * 1998-09-25 2000-04-07 Toshiba Corp Radio information storage medium
JP2001229358A (en) * 2000-02-18 2001-08-24 Ripuro:Kk Information storage module and article like shoes using it
JP2005100114A (en) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd Ic tag for installation on floor face
JP2005096423A (en) * 2003-08-29 2005-04-14 Omron Corp Method for joining wireless ic tag, article with wireless ic tag and vehicle
JP2007018487A (en) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ic tag

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237351A (en) * 2000-02-22 2001-08-31 Hitachi Maxell Ltd Semiconductor device
JP4274867B2 (en) * 2003-08-06 2009-06-10 リンテック株式会社 IC tag
JP2006031599A (en) * 2004-07-21 2006-02-02 Toppan Forms Co Ltd Semiconductor device and production method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (en) * 1997-09-26 1999-04-13 Toshiba Chem Corp Non-contact type data carrier package
JP2000099675A (en) * 1998-09-25 2000-04-07 Toshiba Corp Radio information storage medium
JP2001229358A (en) * 2000-02-18 2001-08-24 Ripuro:Kk Information storage module and article like shoes using it
JP2005096423A (en) * 2003-08-29 2005-04-14 Omron Corp Method for joining wireless ic tag, article with wireless ic tag and vehicle
JP2005100114A (en) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd Ic tag for installation on floor face
JP2007018487A (en) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ic tag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2472438A4 (en) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Non-contact communication medium
EP3035248A4 (en) * 2013-08-15 2016-08-03 Fujitsu Ltd Rfid tag and method for manufacturing same
US9740976B2 (en) 2013-08-15 2017-08-22 Fujitsu Limited RFID tag and manufacturing method thereof

Also Published As

Publication number Publication date
JP2008210344A (en) 2008-09-11

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