JP5427401B2 - ID tag built-in game media - Google Patents

Description

  The present invention relates to a flat game medium such as a coin or a token used in a casino hall or the like and incorporating an ID tag.

  In the casino hall, in order to automatically identify game media such as coins and tokens used by the player, a flat-plate game media having an ID tag built therein is used. For example, an ID reading device is provided in the betting area of the gaming machine, the ID tag inside the gaming medium placed on the betting area is read, and the identification information of the read ID tag is used to The number of bets can be automatically recognized, and when coins from other casino holes are mixed, this can be recognized immediately.

As a conventional example of such a flat-plate-shaped ID tag built-in game medium, for example, one described in Japanese Patent Application Laid-Open No. 2008-33716 (Patent Document 1) is known. The coin described in Patent Document 1 is configured such that an ID tag is placed on a substrate made of a resin material having a large elastic coefficient inside the coin. When the trigger signal is output from the reading device, the identification information of the internal ID tag is transmitted, and the identification information of the coin can be received on the reading device side.
JP 2008-33716 A

  The above-mentioned flat-shaped ID tag built-in type game media are piled up, or when the player excited about the game hits the betting area, the ID tag built in the game media is Many damages can occur.

  Therefore, in the coin incorporating the ID tag in Patent Document 1, since the ID tag inside the coin is provided on the substrate made of a resin material having a large elastic coefficient, the ID tag is damaged when subjected to an external impact. There was a drawback that it was easy to do.

  The present invention has been made in order to solve such a conventional problem, and an object of the present invention is to incorporate an ID tag that can mitigate an external impact and prevent damage to the ID tag. It is to provide a game medium.

In order to achieve the above-mentioned object, the invention according to claim 1 of the present application includes an ID tag storing ID information, a first resin material covering the periphery of the ID tag, and the first resin material. A second resin material having a large elastic modulus and covering the periphery of the first resin material to form a flat plate shape, and coating the periphery of the first resin material with a heat-resistant resin film Then, the second resin material is coated .

  In the invention of claim 1, the periphery of the ID tag is covered with a first resin material such as an elastomer resin or a silicone resin, and the periphery of the first resin material is a second resin such as an ABS resin. Overlaid with material. Since the second resin material has a relatively larger elastic coefficient than the first resin material, the deformation of the game medium itself when receiving an impact from the outside of the game medium is reduced, and the impact resistance is improved. As a result, damage to the ID tag inside the game medium can be prevented. Further, since the first resin material has a relatively smaller elastic coefficient than the second resin material, when an impact is applied from the outside of the game medium, the impact transmitted to the ID tag inside the game medium is not. It is relaxed by the first resin material. Therefore, even when a large number of game media are stacked or a game media is struck, damage to the ID tag can be prevented. The flat plate shape includes various forms such as a coin shape and a bill shape.

The invention according to claim 2 is characterized in that an ID tag storing ID information , a first resin material covering the periphery of the ID tag, an elastic coefficient larger than that of the first resin material, and And a second resin material covering the periphery of the first resin material to form a flat plate shape, and the ID tag is formed by mounting an IC chip and an antenna on a film substrate. Is provided with a flexible sheet so as to cover the IC chip and the antenna, and the IC chip and the antenna have the largest surface among the surfaces constituting the planar molded body. It is provided on the same plane parallel to

In the invention of claim 2 , since the IC chip and the antenna constituting the ID tag are provided on the same plane parallel to the main surface having the largest area among the faces constituting the planar molded body, the impact is applied from the outside. It is possible to prevent the IC chip and the antenna from coming into contact with each other due to a shearing stress or the like generated when. Therefore, when an impact is applied from the outside of the game medium, damage to the ID tag provided inside the game medium can be prevented. In addition, since the ID tag is provided on the film substrate, when an impact is applied from outside the game medium, the stress generated by the impact is dispersed and absorbed by the film substrate, and the stress applied to the ID tag is relieved. The ID tag provided inside the game medium can be prevented from being damaged. In addition, since the ID tag is supported on the film substrate, it is possible to prevent excessive stress from being applied to the ID tag when the first resin material is injected around the ID tag, thereby preventing damage to the ID tag. can do.

According to a third aspect of the present invention, a molded intermediate is obtained by insert molding the ID tag with the first resin material, and the obtained molded intermediate is insert molded with the second resin material. The flat plate-shaped molded body is manufactured by the method described above .

In the invention of claim 3 , an ID tag is insert-molded with a first resin material to obtain a molded intermediate, and the resulting molded intermediate is further insert-molded with a second resin material to form a flat plate shape. Since the molded body is manufactured, it is possible to manufacture a game medium having no seam on the outer periphery. In the case where a seam exists in the game medium, when an impact is applied from the outside, stress concentrates on the seam portion and is easily damaged. Therefore, by eliminating this seam, it is possible to increase the unity and make it difficult to damage the game medium itself. Furthermore, in a conventional game medium manufactured without using insert molding, it is necessary to fix the rib inside the game medium in order to position the ID tag, and the center of gravity of the ID tag when an impact is applied from the outside. May cause damage to the ID tag between the positioning ribs, but the rib itself is unnecessary in the invention of claim 2 using insert molding, so that the center of gravity of the ID tag is from the outside. Even when the ID tag is displaced by an impact, damage to the ID tag can be prevented.

The invention described in claim 4 is characterized in that the IC chip and the antenna are integrally formed .

In the invention of claim 4 , since the IC chip and the antenna are integrally formed, it is possible to prevent the occurrence of defective failure due to contact deterioration between the IC chip and the antenna or mechanical stress. Therefore, when an impact is applied from the outside of the game medium, damage to the ID tag provided inside the game medium can be prevented. In addition, by integrally molding the IC chip and the antenna, it is possible to prevent an excessive stress from being applied between the IC chip and the antenna when the first resin material is injected around the ID tag. Tag damage can be prevented.

  The ID tag built-in type game medium according to the present invention has an ID tag covered with a first resin material, and the first resin material is covered with a second resin material. It is a flat plate shape. And since the second resin material has a larger elastic coefficient than the first resin material, when an impact is applied from the outside of the game medium, the impact is mitigated by the first resin material, and the game medium enters the game medium. Damage to the provided ID tag can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially broken perspective view showing a configuration of an ID tag built-in game medium (hereinafter simply referred to as “game medium”) according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view.

  As shown in FIG. 1 and FIG. 2, the game medium 1 is provided with an ID tag 11 therein, the periphery of which is covered with a first resin material 12, and the periphery of the first resin material 12 is the first. 2 resin material 13. And the whole has comprised the circular flat plate shape.

  As shown in FIG. 3 to be described later, the ID tag 11 includes an IC chip 21 and an antenna coil 22 for communicating with a reader / writer module 41 provided outside. The IC chip 21 and the antenna coil 22 are provided so as to be integrated with the silicon wafer, and have, for example, a rectangular shape with a side of about 2.5 [mm].

  As the first resin material 12, for example, a material such as an elastomer resin, a silicone resin, or an elastic rubber is used. Then, the periphery of the ID tag 11 is covered with the first resin material 12 to form a molded intermediate body 61 having a circular flat plate shape.

  The second resin material 13 is, for example, an ABS resin (acrylonitrile-butadiene-styrene resin), polyethylene, polystyrene, polyester, polycarbonate, acrylic, polyphenylene sulfide (PPS), polypropylene, polyamide, polyarmalloy, engineering plastic, or the like. A resin material having a larger elastic coefficient than that of the resin material 12 is used. And the circumference | surroundings of the shaping | molding intermediate body 61 are covered with the 2nd resin material 13, and the game medium 1 which makes | forms a circular flat plate shape is formed. In addition, the 1st resin material 12 and the 2nd resin material 13 can be formed by insert molding so that it may mention later.

  Here, the elastic modulus is a physical quantity representing the difficulty of deformation, and can be indicated by a longitudinal elastic modulus (indicated by symbol E) or a transverse elastic coefficient (indicated by symbol G).

The longitudinal elastic modulus E (also referred to as “Young's modulus”) is a value defined by “E = σ / ε” where σ is a normal stress applied to the material and ε is a strain generated in the material. For example, the longitudinal elastic modulus of the elastic rubber used as the first resin material 12 is about 1.5 to 5.0 × 10 ⁻⁴ [Pa], and the longitudinal elasticity of polyethylene used as the second resin material 13. The coefficient is about 0.4 to 1.3 × 10 ⁹ [Pa].

  Accordingly, by using, for example, elastic rubber as the first resin material 12 and using, for example, polyethylene as the second resin material 13, the periphery of the ID tag 11 is relatively longer than the second resin material 13. The molding intermediate 61 is formed by being covered with the first resin material 12 having a small elastic modulus, and the longitudinal elastic modulus is relatively larger around the molding intermediate 61 than the first resin material 12. The game medium 1 according to the present embodiment is formed by being covered with the second resin material 13.

The transverse elastic modulus G (also referred to as “slip elastic modulus” or “rigidity modulus”) is a value defined by “G = E / 2 (1 + γ)” using the longitudinal elastic modulus E and the Poisson's ratio γ. is there. For example, the elastic modulus of the elastic rubber used as the first resin material 12 is about ^{5 to} 15 × 10 ⁻⁵ [Pa], and the elastic modulus of polyethylene used as the second resin material 13 is 2 About 6 × 10 ⁸ [Pa].

  Therefore, for example, elastic rubber is used as the first resin material 12 and polyethylene is used as the second resin material 13, so that the periphery of the ID tag 11 is relatively lateral than the second resin material 13. A molding intermediate 61 is formed by being covered with the first resin material 12 having a small elastic coefficient, and the periphery of the molding intermediate 61 is relatively larger in lateral elasticity than the first resin material 12. The game medium 1 according to the present embodiment is formed by being covered with the second resin material 13.

  Therefore, when an impact is applied from the surroundings of the game medium 1, the impact acts directly on the second resin material 13 that is less likely to be deformed than the first resin material 12, so that the game medium 1 is less deformed. Since the first resin material 12 that can be deformed more easily than the second resin material 13 is provided around the ID tag 11, the second resin material 13 passes through the first resin material 12. Thus, the impact transmitted to the ID tag 11 is alleviated and damage to the ID tag 11 can be prevented.

  FIG. 3 is a circuit diagram showing the configuration of the ID tag 11 and the reader / writer module 41 that communicates with the ID tag 11. As shown in FIG. 3, the ID tag 11 is composed of an IC chip 21 and an antenna coil 22, and is formed integrally on a single silicon wafer. The IC chip 21 includes a memory 31 that stores identification information of the game medium 1 on which the IC chip 21 is mounted, and a control circuit 32. The identification information stored in the memory 31 includes a unique ID of the game medium 1, money amount information, casino hall information for specifying a casino hall in which the game medium 1 is used, and the like.

  The ID tag 11 is stored in the memory 31 when the reader / writer module 41, which is an external device, is placed close to the ID tag 11 and receives a reading request signal for identification information transmitted from the reader / writer module 41. The identification information is transmitted to the outside via the antenna coil 22.

  The reader / writer module 41 includes a reader / writer controller 42, a reader / writer transceiver 43, and an antenna coil 44, and can read the identification information stored in the ID tag 11 in a non-contact manner. That is, the reader / writer module 41 can automatically recognize the bet amount and the number of bets by reading the identification information of the ID tag 11 provided on the game medium 1, and coins in other casino holes can be recognized. If mixed, this can be recognized immediately.

  Next, a method for manufacturing the game medium 1 described above will be described. In the present embodiment, the molding intermediate 61 is formed by insert molding the ID tag 11 with the first resin material 12 in the first insert molding step. Further, the periphery of the molded intermediate body 61 is coated with a heat-resistant resin film, and then the molded intermediate body 61 is insert-molded with the second resin material 13 in the second insert molding step to produce a plate-shaped molded body. . That is, the ID tag 11 is insert-molded with the first resin material 12 to obtain a molding intermediate 61, and the obtained molding intermediate 61 is insert-molded with the second resin material 13 to form a flat plate shape. The game medium 1 which is a body is manufactured. In the present embodiment, as an injection molding apparatus that performs the first insert molding process and the second insert molding process, for example, “Miki Seisakusho M-100A-TS” is used.

  Injection molding is a processing method for resin or the like, in which a resin heated to a softening temperature is pressed into a mold by applying an injection pressure to fill the mold. Similar to metal mold casting, but casting is filled at a low pressure in a relatively low viscosity liquid state above the melting point of the metal, whereas injection molding is molded at a relatively low temperature and high pressure . In the case of a thermoplastic resin, the resin is melted at a high temperature and placed in a low temperature mold to be solidified. Generally, it is heated to a temperature 50 to 150 ° C. higher than the melting point or glass transition temperature of the resin. This is to reduce the viscosity specific to the polymer. Thermoplastic resins have the advantage of being able to be molded in a relatively fast cycle, but have a drawback of requiring high speed and high pressure filling due to their high resin viscosity.

  FIG. 4 is a flowchart showing a processing procedure of the first insert molding process, FIG. 5 is an explanatory diagram schematically showing the first insert molding process, and FIG. 6 is a flowchart showing a procedure of the second insert molding process. FIG. 7 is an explanatory view schematically showing the second insert molding step, and the processing procedure of the first insert molding step and the second insert molding step will be described with reference to FIGS. First, the first insert molding step will be described with reference to the flowchart shown in FIG. 4 and the explanatory view shown in FIG.

  FIG. 5A is an explanatory view schematically showing the above-described injection molding apparatus. As shown in this figure, this injection molding apparatus is provided with a core 72 on the upper surface of a fixed plate 71, and further, a fixed plate. A first die 74 having a “U” cross section is provided on the lower surface of the movable plate 73 provided above 71, and is disposed opposite to the core 72. The movable plate 73 can be moved in the vertical direction by a drive mechanism (not shown). Further, the first mold 74 is provided with an injection machine 75 that melts the first resin material 12 and injects it into the cavity of the first mold 74. Further, two support pins 76 for supporting the ID tag 11 are provided on the bottom surface of the core 72. In addition, the injection machine 75 is abbreviate | omitted in FIG.5 (b)-(d).

  First, as an initial operation before executing the first insert molding step, preliminary drying of the injection molding apparatus is performed. For example, the entire injection molding apparatus is dried at 80 ° C. for 4 hours. Thereafter, the temperature of the injector 75 is raised to about 230 ° C.

  In step S11 of FIG. 4, mold opening is executed. That is, as shown in FIG. 5 (b), the movable plate 73 is raised to bring the first mold 74 away from the core 72.

  In step S12, the ID tag 11 is set on the two support pins 76 provided on the bottom surface of the core 72, as shown in FIG.

  In step S13, the movable plate 73 is lowered and clamped as shown in FIG.

  In step S <b> 14, the first resin material 12 is injected into the cavity of the first mold 74 by the injector 75.

  For example, when the above-described elastic rubber is used as the first resin, the first resin is injected into the cavity from the injection machine 75 at an injection molding temperature of 100 to 125 [° C.]. At this time, since the IC chip 21 and the antenna coil 22 provided on the ID tag 11 are formed integrally with one silicon wafer, the IC chip 21 and the antenna are also formed even when the first resin material 12 is injected. An excessive force is not applied between the coils 22, and damage to the ID tag 11 can be prevented.

  In step S15, the first mold 74 is cooled, and the movable plate 73 is raised as shown in FIG. Then, the molding intermediate 61 covered with the first resin material 12 formed on the core 72 is taken out. As a result, as shown in FIG. 5E, a molding intermediate 61 in which the ID tag 11 is insert-molded with the first resin material 12 is formed.

  Next, the periphery of the molding intermediate 61 is coated with a heat resistant resin film. In this step, the molding intermediate 61 is coated and fired around the molding intermediate 61 using a film such as a thermoplastic polyimide resin having a melting point of about 390 ° C., for example.

  As the first resin material 12, silicon rubber, fluorine rubber (FR), butyl rubber (IIR), chlorosulfonated polyethylene rubber (CSM: Hypalon (DuPont), which has a high temperature durability and a melting point of about 300 ° C. It is preferable to use a resin having an injection molding temperature higher than that of the second resin material 13, such as manufactured product name)) and ethylene propylene diene rubber (EPDM). By using these, this coating step can be omitted.

  Next, the second insert molding step will be described with reference to the flowchart shown in FIG. 6 and the explanatory view shown in FIG.

  Fig.7 (a) is explanatory drawing which shows typically the structure of the injection molding apparatus used at a 2nd insert molding process. As shown in FIG. 7A, the injection molding apparatus has a core 92 provided on the upper surface of the fixed plate 91, and a cross-sectional “U” shape on the lower surface of the movable plate 93 provided above the fixed plate 91. A second mold 94 is provided, and is disposed opposite to the core 92. The movable plate 93 can be moved in the vertical direction by a drive mechanism (not shown). Similarly to the injection machine 75 shown in FIG. 5A described above, the second mold 94 is injected with the second resin material 13 melted and injected into the cavity of the second mold 94. A machine (not shown) is provided.

  Similar to the first insert molding step described above, the injection molding apparatus is pre-dried as an initial operation before the second insert molding step. For example, the entire injection molding apparatus is dried at 80 ° C. for 4 hours. Further, the temperature of the injector is increased to about 230 ° C.

  Then, in step S31 of FIG. 6, mold opening is executed. That is, as shown in FIG. 7A, the movable plate 93 is raised and the second mold 94 is separated from the core 92. Further, in step S <b> 32, the molding intermediate 61 is set on the two support pins 96 provided on the bottom surface of the core 92.

  In step S33, as shown in FIG. 7B, the movable plate 93 is lowered and clamped, and then in step S34, the second resin material is put into the cavity of the second mold 94 by the injector 75. 13 is injected.

  For example, when the above-described polyethylene is used as the second resin, the second resin is injected into the cavity from the injection machine 75 at an injection molding temperature of 180 to 260 [° C.]. At this time, since the molding intermediate 61 is coated with the heat-resistant resin film, the molding intermediate 61 can be prevented from being deformed due to an overheated state.

  In step S35, the second mold 94 is cooled, and the movable plate 93 is raised as shown in FIG. Then, the game medium 1 which is a flat plate-shaped molded body formed on the core 92 is taken out. As a result, as shown in FIG. 7D, the game medium 1 in which the molded intermediate body 61 is insert-molded with the second resin material 13 is formed.

  In addition, by using the support pin 76 in the first insert molding step, the shape of the support pin 76 remains as a through hole in the first resin material 12 (molded intermediate body 61) after the first insert molding. There is a case. Similarly, by using the support pin 96 in the second insert molding step, the shape of the support pin 96 remains as a through hole in the second resin material 13 (game medium 1) after the second insert molding. There is a case. However, these through-holes are extremely small and invisible to human eyes, so that the strength is not lowered and the aesthetic appearance is not impaired.

  Next, a modification of this embodiment will be described. In the embodiment described above, the example in which the IC chip 21 and the antenna coil 22 constituting the ID tag 11 are formed and integrated on one silicon wafer has been described. However, in the modification, the ID tag is mounted on the film substrate. And Details will be described below.

  FIG. 8 is a plan view showing an ID tag 54 provided on a game medium 51 according to the modification, and FIG. 9 is a cross-sectional view of the game medium 51 according to the modification. As shown in FIG. 8, the ID tag 54 has an IC chip 52 mounted on a flexible rectangular film substrate 55, and an antenna coil 53 mounted in a spiral around the IC chip 52. It is configured. Since the IC chip 52 and the antenna coil 53 are mounted on the same film substrate 55, they are provided on the same plane.

  A cover sheet 56 is laminated on the upper surface of the film substrate 55 on which the IC chip 52 and the antenna coil 53 are mounted, and is fixed to the film substrate 55 with an adhesive. The cover sheet 56 is a flexible sheet that covers the entire ID tag 54, and as the material thereof, for example, vinyl chloride, polyethylene terephthalate, or the like can be used. The cover sheet 56 serves to protect the ID tag 54 during insert molding.

  Then, the film substrate 55 is insert-molded with the first resin material 12 in the same procedure as the first insert molding step shown in the flowchart of FIG. 4 and the explanatory diagram of FIG. The body 61 is formed, and the molding intermediate body 61 is insert-molded with the second resin material 13 in the same procedure as the procedure of the second insert molding process shown in the flowchart of FIG. 6 and the explanatory diagram of FIG. The game medium 51 is formed in a circular flat plate shape.

  In this case, when the film substrate 55 is attached to the support pins 76 shown in FIG. 5A, the game medium 51 to be manufactured is the IC chip 52, if the film substrate 55 is attached so as to be parallel to the core 72. The plane on which the antenna coil 53 is provided is arranged in parallel to the largest main surface (the circular surface of the game medium 51) among the surfaces constituting the game medium 51. As a result, it is possible to prevent an excessive force from being applied between the IC chip 52 and the antenna coil 53 due to a shearing force or the like generated when an impact is applied from the outside.

  Thus, in the ID tag built-in type game media 1 and 51 according to the present embodiment, the periphery of the ID tags 11 and 54 is covered with the first resin material 12 to form the molded intermediate 61, The periphery of the molding intermediate 61 is configured to be covered with the second resin material 13. And since the 2nd resin material 13 which forms the outer peripheral part of the game media 1 and 51 has a relatively large elastic coefficient compared with the 1st resin material 12 which comprises the inside of the game media 1 and 51, When an impact is applied to the game media 1 and 51 from the outside, deformation of the game media 1 and 51 itself can be reduced, and impact resistance can be improved. As a result, it is possible to prevent the ID tags 11 and 54 provided inside the game media 1 and 51 from being damaged.

  Further, the impact applied to the game media 1, 51 is transmitted to the ID tags 11, 54 via the first resin material 12, and the first resin material 12 is transmitted to the second resin material 13. Therefore, the impact transmitted to the ID tags 11 and 54 can be reduced. As a result, for example, when a large number of game media 1 and 51 are stacked, when the game media 1 and 51 are struck, or when the game media 1 and 51 are dropped on the floor, the impact received is reduced, and the ID Damage to the tags 11 and 54 can be prevented.

  Further, the ID tag 11, 54 is insert-molded with the first resin material 12 to obtain a molding intermediate 61, and the obtained molding intermediate 61 is further insert-molded with the second resin material 13. Since the flat molded body is manufactured, it is possible to manufacture the game media 1 and 51 having no joints on the outer peripheral portion. In the case where a seam is present in the game media 1 and 51 as in the prior art, when an impact is applied from the outside, stress is easily concentrated on the seam portion to cause damage, but the game according to this embodiment In the media 1 and 51, by eliminating this joint, the unity is increased, and the game media 1 and 51 itself can be made difficult to be damaged.

  Further, when insert molding is not used as in the prior art, in order to position the ID tags 11 and 54, it is necessary to fix the ribs inside the game media 1 and 51, and an impact is applied from the outside. In this case, the center of gravity of the ID tags 11 and 54 may be displaced and the ID tags 11 and 54 may be damaged between the positioning ribs. However, when insert molding is used as in this embodiment, the ribs Since it is not necessary, the ID tags 11 and 54 can be prevented from being damaged even if the center of gravity of the ID tags 11 and 54 is displaced by an impact.

  Further, in the present embodiment, the ID tag 11 is configured by integrating the IC chip 21 and the antenna coil 22, so that contact deterioration between the IC chip 21 and the antenna coil 22, mechanical stress, It is possible to prevent the occurrence of failure due to fatigue. Moreover, when the 1st resin material 12 is inject | poured by a 1st insert molding process, it can prevent that an excessive stress acts on ID tag 11, and can prevent damage to ID tag 11. FIG.

  Moreover, in the game medium 51 according to the modification, the impact applied to the game medium 51 is transmitted to the ID tag 54 mounted on the film substrate 55 via the first resin material 12. Since the first resin material 12 has a relatively small elastic coefficient as compared with the second resin material 13, the first resin material 12 can easily absorb the impact and can relieve the stress transmitted to the film substrate 55. Furthermore, since the stress transmitted to the film substrate 55 is dispersed and absorbed by the film substrate 55, the stress transmitted to the ID tag 54 is relaxed, and damage to the ID tag 54 can be prevented.

  Further, the IC chip 52 and the antenna coil 53 constituting the ID tag 54 are provided on the same plane, and this plane is arranged in parallel with the largest main surface among the surfaces constituting the game medium 51. Therefore, the IC chip 52 and the antenna coil 53 can be prevented from being separated from each other by the shearing force generated when an impact is applied from the outside, and damage to the ID tag 54 can be prevented.

  As described above, the ID tag built-in coin of the present invention has been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is an arbitrary configuration having the same function. Can be replaced.

  For example, in each of the above-described embodiments, a circular and flat gaming medium has been described as an example. However, the present invention is not limited to this, and various types of gaming media such as banknote-shaped gaming media. Can be applied to.

1 is a partially broken perspective view showing a configuration of an ID tag built-in type game medium according to an embodiment of the present invention. It is sectional drawing of the ID tag built-in type game media based on one Embodiment of this invention. It is a block diagram which shows the electric structure of the ID tag built in the ID tag built-in type game media based on one Embodiment of this invention. It is a flowchart which shows the procedure of the 1st insert molding process at the time of manufacturing the ID tag built-in type game media which concerns on one Embodiment of this invention. It is explanatory drawing which shows typically the procedure of the 1st insert molding process at the time of manufacturing the ID tag built-in type game media which concerns on one Embodiment of this invention. It is a flowchart which shows the procedure of the 2nd insert molding process at the time of manufacturing the ID tag built-in type game media based on one Embodiment of this invention. It is explanatory drawing which shows typically the procedure of the 2nd insert molding process at the time of manufacturing the ID tag built-in type game media which concerns on one Embodiment of this invention. It is a top view of the ID tag which concerns on the modification of this invention. It is sectional drawing of the ID tag built-in type game media which concerns on the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,51 ID tag built-in type game medium 11,54 ID tag 12 1st resin material 13 2nd resin material 21,52 IC chip 22,53 Antenna coil 31 Memory 32 Control circuit 41 Reader / writer module 42 Reader / writer Controller 43 Reader / writer transceiver 44 Antenna coil 55 Film substrate 56 Cover sheet 61 Molding intermediate 71, 91 Fixed plate 72, 92 Core 73, 93 Movable plate 74 First mold 75 Injection machine 76, 96 Support pin 94 No. 2 molds

Claims (4)

An ID tag storing ID information;
A first resin material covering the periphery of the ID tag;
A second resin material having a larger elastic coefficient than that of the first resin material and covering the periphery of the first resin material to form a flat plate shape ,
An ID tag built-in type game medium , wherein the second resin material is coated after the periphery of the first resin material is coated with a heat-resistant resin film . An ID tag storing ID information;
A first resin material covering the periphery of the ID tag;
A second resin material having a larger elastic coefficient than that of the first resin material and covering the periphery of the first resin material to form a flat plate shape,
The ID tag includes an IC chip and an antenna mounted on a film substrate, and a flexible sheet is provided on the film substrate so as to cover the IC chip and the antenna.
Further, the IC chip and the antenna are provided on the same plane parallel to the main surface having the largest area among the surfaces constituting the planar shaped molded body. . The ID tag is insert-molded with the first resin material to obtain a molded intermediate, and the obtained molded intermediate is insert-molded with the second resin material to produce the flat plate-shaped molded body. The ID tag built-in type game medium according to claim 2 . 4. The ID tag built-in game medium according to claim 2 , wherein the IC chip and the antenna are integrally formed.

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