WO2008133293A1 - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- WO2008133293A1 WO2008133293A1 PCT/JP2008/057909 JP2008057909W WO2008133293A1 WO 2008133293 A1 WO2008133293 A1 WO 2008133293A1 JP 2008057909 W JP2008057909 W JP 2008057909W WO 2008133293 A1 WO2008133293 A1 WO 2008133293A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive sheet
- base
- resin layer
- adhesive resin
- adhesive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009511898A JPWO2008133293A1 (en) | 2007-04-25 | 2008-04-24 | Adhesive sheet |
US12/597,197 US20100196703A1 (en) | 2007-04-25 | 2008-04-24 | Adhesive sheet |
CN200880011737.6A CN101657512B (en) | 2007-04-25 | 2008-04-24 | Adhesive sheet |
KR1020097018745A KR101108639B1 (en) | 2007-04-25 | 2008-04-24 | Adhesive sheet |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-115470 | 2007-04-25 | ||
JP2007115470 | 2007-04-25 | ||
JP2007-247785 | 2007-09-25 | ||
JP2007247785 | 2007-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133293A1 true WO2008133293A1 (en) | 2008-11-06 |
Family
ID=39925741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057909 WO2008133293A1 (en) | 2007-04-25 | 2008-04-24 | Adhesive sheet |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100196703A1 (en) |
JP (2) | JPWO2008133293A1 (en) |
KR (1) | KR101108639B1 (en) |
CN (1) | CN101657512B (en) |
TW (2) | TWI430882B (en) |
WO (1) | WO2008133293A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013038315A (en) * | 2011-08-10 | 2013-02-21 | Ajinomoto Co Inc | Manufacturing method of semiconductor package |
WO2018142827A1 (en) * | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
JP2019161101A (en) * | 2018-03-15 | 2019-09-19 | タツタ電線株式会社 | Electromagnetic wave shield film and shield printed wiring board |
JP2019216234A (en) * | 2019-03-01 | 2019-12-19 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting substrate, and electronic apparatus |
JP2019216156A (en) * | 2018-06-12 | 2019-12-19 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting substrate, and electronic apparatus |
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JP5348473B2 (en) * | 2009-01-20 | 2013-11-20 | ソニー株式会社 | Liquid crystal display device and electronic device |
JP5874289B2 (en) | 2011-10-07 | 2016-03-02 | ブラザー工業株式会社 | Tape cassette and tape printer |
CN104321401A (en) * | 2012-04-02 | 2015-01-28 | 陶氏环球技术有限责任公司 | Epoxy adhesive, manufacture and use thereof |
DE102015211852A1 (en) * | 2015-06-25 | 2016-12-29 | Schaeffler Technologies AG & Co. KG | Multilayer board and method for its production |
JP6502824B2 (en) * | 2015-10-19 | 2019-04-17 | 信越化学工業株式会社 | Wafer processed body, temporary adhesive for wafer processing, and method for manufacturing thin wafer |
KR102358212B1 (en) * | 2015-12-09 | 2022-02-04 | 도레이 카부시키가이샤 | Resins, slurries, laminates using them, and methods for manufacturing the same |
TWI613939B (en) * | 2016-06-23 | 2018-02-01 | Pomiran Metalization Research Co Ltd | Metallized flexible substrate and multilayer circuit board using the same |
FR3059151B1 (en) * | 2016-11-21 | 2018-12-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING THE SAME |
CN110050036A (en) * | 2016-12-09 | 2019-07-23 | 日立化成株式会社 | The manufacturing method of composition, bonding agent, sintered body, conjugant and conjugant |
US10605785B2 (en) * | 2017-06-07 | 2020-03-31 | General Electric Company | Sensor system and method |
JP7072860B2 (en) * | 2017-09-19 | 2022-05-23 | 賢三 有山 | Jigsaw puzzles and how to make them |
CN107764736A (en) * | 2017-10-18 | 2018-03-06 | 广东生益科技股份有限公司 | Multiple-plate roughening effect evaluation method |
JP6994926B2 (en) * | 2017-12-19 | 2022-01-14 | 三菱電機株式会社 | Rotating machine rotor manufacturing method and sleeve bonding device |
JP7424868B2 (en) * | 2020-03-06 | 2024-01-30 | 日本航空電子工業株式会社 | Method for producing electrical connection parts and wiring structure |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10330696A (en) * | 1997-05-28 | 1998-12-15 | Hitachi Chem Co Ltd | Adhesive film for multilayer printed circuit board |
JPH11217503A (en) * | 1997-11-28 | 1999-08-10 | Hitachi Chem Co Ltd | Heat-resistant resin composition and adhesive film using the same |
JPH11263912A (en) * | 1998-03-17 | 1999-09-28 | Hitachi Chem Co Ltd | Heat-resistant flame-retardant resin composition and adhesive film and metal foil with adhesive using the composition |
JP2001123060A (en) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | Heat resistant resin composition |
JP2001152015A (en) * | 1999-11-29 | 2001-06-05 | Hitachi Chem Co Ltd | Heat-resistant resin composition and adhesive film using the same |
JP2002146325A (en) * | 2000-11-16 | 2002-05-22 | Hitachi Chem Co Ltd | Adhesive composition and adhesive member using the same and substrate for loading semiconductor and semiconductor device |
JP2004051910A (en) * | 2002-07-24 | 2004-02-19 | Hitachi Chem Co Ltd | Resin film and metal-clad laminated sheet |
JP2004182792A (en) * | 2002-11-29 | 2004-07-02 | Hitachi Chem Co Ltd | Polyamideimide resin and adhesive composition using the same |
JP2005244150A (en) * | 2004-01-28 | 2005-09-08 | Ajinomoto Co Inc | Resin composition, adhesive film using it, and multi-layer printed wiring board |
JP2007051226A (en) * | 2005-08-18 | 2007-03-01 | Ajinomoto Co Inc | Resin composition with low dielectric constant |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003292778A (en) * | 1997-11-28 | 2003-10-15 | Hitachi Chem Co Ltd | Heat-resistant resin composition and adhesive film using same |
JP3994298B2 (en) * | 1998-03-20 | 2007-10-17 | 日立化成工業株式会社 | Flexible wiring board |
TWI228727B (en) * | 1999-02-03 | 2005-03-01 | Tomoegawa Paper Co Ltd | Thermosetting low dielectric resin composition, and prepreg, laminate, and laminate for circuit employing said resin composition |
JP2003138241A (en) * | 2001-08-21 | 2003-05-14 | Hitachi Chem Co Ltd | Heat-resistant adhesive and laminate using the same adhesive-applied heatsink and adhesive-applied metallic foil |
JP4075581B2 (en) * | 2002-11-21 | 2008-04-16 | 日立化成工業株式会社 | Prepreg with adhesive layer, method for producing metal-clad laminate, and metal-clad laminate |
JP2004256631A (en) * | 2003-02-25 | 2004-09-16 | Hitachi Chem Co Ltd | Adhesive composition and adhesive film |
KR100772296B1 (en) * | 2003-05-21 | 2007-11-02 | 히다치 가세고교 가부시끼가이샤 | Primer, Conductor Foil with Resin, Laminate and Process for Producing the Laminate |
JP2006066894A (en) * | 2004-07-28 | 2006-03-09 | Hitachi Chem Co Ltd | Printed-circuit board |
-
2008
- 2008-04-24 KR KR1020097018745A patent/KR101108639B1/en active IP Right Grant
- 2008-04-24 CN CN200880011737.6A patent/CN101657512B/en active Active
- 2008-04-24 US US12/597,197 patent/US20100196703A1/en not_active Abandoned
- 2008-04-24 WO PCT/JP2008/057909 patent/WO2008133293A1/en active Application Filing
- 2008-04-24 JP JP2009511898A patent/JPWO2008133293A1/en active Pending
- 2008-04-25 TW TW101111393A patent/TWI430882B/en active
- 2008-04-25 TW TW097115354A patent/TWI423740B/en active
-
2013
- 2013-06-25 JP JP2013132920A patent/JP5751284B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10330696A (en) * | 1997-05-28 | 1998-12-15 | Hitachi Chem Co Ltd | Adhesive film for multilayer printed circuit board |
JPH11217503A (en) * | 1997-11-28 | 1999-08-10 | Hitachi Chem Co Ltd | Heat-resistant resin composition and adhesive film using the same |
JPH11263912A (en) * | 1998-03-17 | 1999-09-28 | Hitachi Chem Co Ltd | Heat-resistant flame-retardant resin composition and adhesive film and metal foil with adhesive using the composition |
JP2001123060A (en) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | Heat resistant resin composition |
JP2001152015A (en) * | 1999-11-29 | 2001-06-05 | Hitachi Chem Co Ltd | Heat-resistant resin composition and adhesive film using the same |
JP2002146325A (en) * | 2000-11-16 | 2002-05-22 | Hitachi Chem Co Ltd | Adhesive composition and adhesive member using the same and substrate for loading semiconductor and semiconductor device |
JP2004051910A (en) * | 2002-07-24 | 2004-02-19 | Hitachi Chem Co Ltd | Resin film and metal-clad laminated sheet |
JP2004182792A (en) * | 2002-11-29 | 2004-07-02 | Hitachi Chem Co Ltd | Polyamideimide resin and adhesive composition using the same |
JP2005244150A (en) * | 2004-01-28 | 2005-09-08 | Ajinomoto Co Inc | Resin composition, adhesive film using it, and multi-layer printed wiring board |
JP2007051226A (en) * | 2005-08-18 | 2007-03-01 | Ajinomoto Co Inc | Resin composition with low dielectric constant |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013038315A (en) * | 2011-08-10 | 2013-02-21 | Ajinomoto Co Inc | Manufacturing method of semiconductor package |
WO2018142827A1 (en) * | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
JP2018125378A (en) * | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
JP2019161101A (en) * | 2018-03-15 | 2019-09-19 | タツタ電線株式会社 | Electromagnetic wave shield film and shield printed wiring board |
JP2019216156A (en) * | 2018-06-12 | 2019-12-19 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting substrate, and electronic apparatus |
JP2019216234A (en) * | 2019-03-01 | 2019-12-19 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting substrate, and electronic apparatus |
JP7099365B2 (en) | 2019-03-01 | 2022-07-12 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting board, and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008133293A1 (en) | 2010-07-29 |
TW200908822A (en) | 2009-02-16 |
KR101108639B1 (en) | 2012-01-31 |
CN101657512B (en) | 2014-05-28 |
TWI423740B (en) | 2014-01-11 |
TWI430882B (en) | 2014-03-21 |
JP2013237846A (en) | 2013-11-28 |
TW201242765A (en) | 2012-11-01 |
US20100196703A1 (en) | 2010-08-05 |
JP5751284B2 (en) | 2015-07-22 |
KR20100009534A (en) | 2010-01-27 |
CN101657512A (en) | 2010-02-24 |
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