CN208903288U - With radium-shine or electroplated decoration smart card - Google Patents
With radium-shine or electroplated decoration smart card Download PDFInfo
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- CN208903288U CN208903288U CN201821042710.0U CN201821042710U CN208903288U CN 208903288 U CN208903288 U CN 208903288U CN 201821042710 U CN201821042710 U CN 201821042710U CN 208903288 U CN208903288 U CN 208903288U
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- smart card
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- layer
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Abstract
The utility model relates to a kind of with radium-shine or electroplated decoration smart card, the bed of material is equipped with one or more contactless chips in smart card therein, the induction antenna being connect with each contactless chip related circuit, and to the insulator that contactless chip and induction antenna encapsulate；At least one includes the assembly of laser film and substrate, is connected to the surface of the bed of material in the smart card；The substrate is equipped with transparent position；The front of the laser film is connected to the back side of substrate, and the laser film is able to show in the front of substrate by transparent position；The back side of the laser film and/or the back side of substrate are connected to the bed of material in the smart card.The utility model can use laser film, electroplated metal layer etc. on smart card surface and carry out beautifying and decorating, and novel form meets individual requirements.
Description
Technical field
It is the utility model relates to field of intelligent cards, in particular to a kind of with radium-shine or electroplated decoration smart card.
Background technique
Contact type intelligent card by extensively, be widely used in the payments such as urban transportation, finance, social security, information storage and
The every field of identification.However, existing smart card is generally only the printing image-text information in rectangular card, form is more
It is single, it is difficult to meet the individual demand of custom.
Utility model content
The utility model provides a kind of with radium-shine or electroplated decoration smart card, can use on smart card surface radium-shine
Film, electroplated metal layer etc. carry out beautifying and decorating.
In order to achieve the above object, the technical solution of the utility model is to provide a kind of with radium-shine or electroplated decoration
Smart card: the bed of material is equipped with one or more contactless chips in smart card, connect with each contactless chip related circuit
Induction antenna, and to the insulator that contactless chip and induction antenna encapsulate；
At least one includes the assembly of laser film and substrate, is connected to the surface of the bed of material in the smart card；The base
Piece is equipped with transparent position；The front of the laser film is connected to the back side of substrate, and the laser film is able to by transparent position
In the front display of substrate；The back side of the laser film and/or the back side of substrate are connected to the bed of material in the smart card.
Optionally, the substrate includes transparent film layer made of plastic material, and the transparent film layer is equipped with described transparent
Position and nontransparent silk-screen layer.
Optionally, the substrate includes transparent film layer made of plastic material, and the transparent film layer is equipped with described transparent
The metal finishing layer at position and vacuum plating；Silk-screen protective layer is additionally provided on the metal finishing layer.
Optionally, view reading Information Level is further provided on the metal finishing layer or silk-screen protective layer.
Optionally, in the smart card bed of material a surface, connect with an assembly comprising laser film and substrate；
Another surface of the bed of material in the smart card is connect with another assembly comprising laser film and substrate, or
Person is provided with view and reads Information Level.
Optionally, the front of the laser film and/or the front of substrate are provided with view and read Information Level.
Optionally, it is described depending on read Information Level be silk-screen layer or offset printing layer or printable layer.
Optionally, the bed of material is connect by insulation module or insulation diaphragm with the assembly in the smart card；
Contactless chip and induction antenna are directly encapsulated by insulation module；
Alternatively, contactless chip and induction antenna are attached on insulation diaphragm, or it is clipped among two insulation diaphragms.
Optionally, the bed of material is connect by card matrix with the assembly in the smart card；
Contactless chip and induction antenna are directly encapsulated by the card matrix of insulating materials；
Alternatively, being packaged with contactless chip and induction day by insulating materials or the card matrix of metal material to carry
The insulation module of line；
Alternatively, by insulating materials or the card matrix of metal material, to carry insulation diaphragm；Contactless chip and induction
Antenna is attached on insulation diaphragm or is clipped among two insulation diaphragms.
Optionally, it is formed on the card matrix of metal material and lets out wave seam, described let out in wave seam is the air gap, or is filled with
The union body of insulating materials.
The utility model can use laser film, electroplated metal layer etc. on smart card surface and carry out beautifying and decorating, shape
Formula is novel, meets individual requirements.
Detailed description of the invention
Fig. 1 ~ Fig. 6 corresponds to the first embodiment of the utility model；
Fig. 1 is the front schematic view of substrate；
Fig. 2 is the side diagrammatic cross-section of substrate；
Fig. 3 is the schematic diagram that substrate is connect with laser film；
Fig. 4 is that the combination of substrate and laser film is connected to the schematic diagram of bed of material one side in smart card；
Fig. 5 is that bed of material another side forms the schematic diagram that view reads information in smart card；
Fig. 6 is the schematic diagram for being further formed view on substrate and laser film and reading information.
Fig. 7 ~ Figure 13 corresponds to the second embodiment of the utility model；
Fig. 7 is the front schematic view of substrate；
Fig. 8 is the schematic diagram that protective layer is formed on metal finishing layer；
Fig. 9 is the side diagrammatic cross-section of substrate；
Figure 10 is the schematic diagram that substrate is connect with laser film；
Figure 11 is that the combination of substrate and laser film is connected to the schematic diagram of bed of material one side in smart card；
Figure 12 is the combined schematic diagram that bed of material another side also connects substrate and laser film in smart card；
Figure 13 is the schematic diagram for being further formed view on substrate and laser film and reading information.
Figure 14 is the schematic diagram of an exemplary construction of the bed of material in smart card.
Specific embodiment
Below in conjunction with attached drawing, multiple embodiments of the utility model are illustrated.
It is described in the utility model that there is radium-shine or electroplated decoration smart card, comprising expecting in substrate, laser film, smart card
Layer.Exemplary shape is rectangular card chip, the practical present invention to smart card shape applicatory and size there is no limit.
In one embodiment, as shown in Figure 1 and Figure 2, the substrate 10 is saturating made of plastic material (PC, PET, PVC etc.)
Bright film layer 11 makes the transparent position 12 in position for needing to be shown as radium-shine pattern on the substrate 10 by existing methods such as silk-screens,
Other are the nontransparent positions 13 being made of silk-screen layer etc..Transparent position 12 or nontransparent position 13 can form corresponding figure
The views such as case, text read information.
In another embodiment, as shown in Fig. 7, Fig. 8, Fig. 9, the substrate 10 ' is a kind of electroplated metal layer；The electroplating gold
Belonging to layer is that vacuum electric is coated with (various colorss such as gold, silver) on the transparent film layer 11 made of plastic material (PC, PET, PVC etc.)
Metal finishing layer 14, the predetermined patterns for needing to retain plating metal color on the substrate 10 ' form silk by existing methods such as silk-screens
Print protective layer 15(Fig. 8).The part for not needing to retain plating metal color is decorporated metal finishing layer with solvent, forms transparent position 12
(Fig. 9).Metal finishing layer 14, silk-screen protective layer 15 or the transparent position 12 of reservation can form corresponding pattern, text etc.
Depending on reading information.
In two above-mentioned embodiments, as shown in Fig. 3 or Figure 10, first associated layer such as band viscose glue on the laser film 20 of finished product
21 one side is Nian Jie with the substrate 10/10 ', and laser film 20 is made to appear to come from the transparent position 12 of substrate 10/10 '.It is different
Example in, the laser film 20 can be almost the same or smaller with 10/10 ' size of substrate, can also only cover transparent position
The region on 12 peripheries.
As shown in Fig. 4 or Figure 11, any one second patch such as double-sided adhesive or viscose glue is covered in the another side of laser film 20
Attached layer 30, and then be adhesively fixed with the surface of the bed of material 40 in smart card.Transparent 12 periphery of position is covered in above-mentioned laser film 20
In example, second associated layer 30 can also be further disposed on the substrate 10/10 ' on 20 periphery of laser film.The substrate
10/10 ' with the assembly of laser film 20, can further cut according to the actual application, to match the bed of material 40 in smart card
Geomery.
As shown in Fig. 6 or Figure 13, it is not connect with the bed of material 40 in smart card on the laser film 20 and/or substrate 10/10 '
Surface can also further form silk-screen layer, offset printing layer, printable layer etc. by existing method, and it is each to be shown as text, pattern etc.
Kind is beautified depending on reading information 50.The two sides of the bed of material 40 can be with correspondingly connected two substrates 10/ in the smart card
10 ' and laser film 20 assembly (Figure 12), can also only the one side of the bed of material 40 connects the substrate 10/10 ' within a smart card
And the assembly of laser film 20, and silk-screen layer, offset printing layer, printable layer etc. are formed by existing method in another side, to show text
Word, pattern etc. are various to be beautified (Fig. 5) depending on reading information 60.
As shown in figure 14, the bed of material 40 in the smart card is smart card based on radio RF recognition technology (RFID) and outer
The read-write equipment in portion carries out the critical component of wireless data exchange.The bed of material 40 includes contactless chip 41 in the smart card,
The induction antenna 42 to form inductive loop is connect with the electrode of contactless chip 41, and to the insulator that the two is packaged
43。
The insulator can be a kind of card matrix of insulating materials, have the shape and length and width almost the same with substrate
Size (thickness can be determined according to chip and antenna), directly encapsulates contactless chip and induction antenna.Alternatively, described exhausted
Edge body includes insulation module, is encapsulated to contactless chip and induction antenna；By insulating materials or the card matrix pair of metal material
The insulation module is carried, such as insulation module is embedded into the mounting groove of the card matrix.Alternatively, the insulator packet
The diaphragm containing insulation, contactless chip and induction antenna are attached on thin insulation diaphragm or are clipped among two insulation diaphragms；
The card matrix surface for being attached at insulating materials or metal material again is carried by the latter, can open up installation on the card matrix when needing
Slot is to be placed on thickness direction contactless chip outstanding.Assuming that insulation diaphragm or forgoing substrate are sufficiently tight, it is used alone
Or if it can directly carry contactless chip and induction antenna after the two is fixed, then card matrix is dispensed.
The contactless chip can be ID chip, IC chip, cpu chip, or a kind of simultaneously equipped with difference
The compound chip of more sub- chips of frequency or different agreement.The induction antenna can be printed antenna, etching antenna, or
It is implanted into automatic, manual coiled antenna of enameled wire, etc..It can be simultaneously comprising one or more contactless chips；With multiple
When contactless chip, the multiple induction antennas to match with chip radio frequency frequency can be respectively set.The contactless core
The combination of piece and induction antenna, can with (binding materials such as double-sided adhesive) stickup, ultrasonic bonding, hot moulding, cold forming,
Card matrix is installed in perhaps any other suitable mounting means setting to card matrix or is directly arranged or is encapsulated into displacement
It is internal.
The card matrix of insulating materials is e.g. made of various nonmetallic organic or inorganic materials: the plastics of various insulation
Material, e.g. PVC(polyvinyl chloride), PET(polyethylene terephthalate), ABS(acrylonitrile-butadiene-styrene (ABS) it is total
It is poly-) or epoxy resin etc.；Alternatively, can also be glass, leather, wooden, stone material, natural or synthetic cut stone etc..
On the card matrix of metal material, need to let out wave seam by punching, fluting or other feasible existing way formation, with
Ensure that the card matrix will not constitute the closed circuit of circuit, to avoid dry to contactless chip and induction antenna generation radio frequency
It disturbs.The wave seam of letting out need to penetrate through the front and back of card matrix, and inside can be the air gap, be also possible to filled with insulation material
The union body of material.Metal material is, for example, the Huang of stainless steel or aluminium or electrodepositable containing chromium, nickel, molybdenum or other alloys
Copper, red copper etc..The card base in metal can be set with the modularization of insulator encapsulation or laminar chip and antenna combination
On body；Chip and antenna combination without insulation-encapsulated cannot be directly embedded on the card matrix of metal.
In conclusion it is provided by the utility model a kind of with radium-shine or electroplated decoration smart card, it can be in smart card
Surface can use laser film, electroplated metal layer etc. and carry out beautifying and decorating, novel form.
It is discussed in detail although the content of the utility model has passed through above preferred embodiment, but it should be appreciated that on
The description stated is not considered as limitations of the present invention.After those skilled in the art have read above content, for
A variety of modifications and substitutions of the utility model all will be apparent.Therefore, the protection scope of the utility model should be by appended
Claim limit.
Claims (10)
1. a kind of smart card with laser decoration, which is characterized in that
The bed of material is equipped with one or more contactless chips, the sense connecting with each contactless chip related circuit in smart card
Antenna is answered, and to the insulator that contactless chip and induction antenna encapsulate；
At least one includes the assembly of laser film and substrate, is connected to the surface of the bed of material in the smart card；The substrate is set
There is transparent position；The front of the laser film is connected to the back side of substrate, and the laser film is able to by transparent position in base
The front display of piece；The back side of the laser film and/or the back side of substrate are connected to the bed of material in the smart card.
2. as described in claim 1 with the smart card of laser decoration, which is characterized in that
The substrate includes transparent film layer made of plastic material, and the transparent film layer is equipped with the transparent position and nontransparent
Silk-screen layer.
3. as described in claim 1 with the smart card of laser decoration, which is characterized in that
The substrate includes transparent film layer made of plastic material, and the transparent film layer is equipped with the transparent position and vacuum electric
The metal finishing layer of plating；Silk-screen protective layer is additionally provided on the metal finishing layer.
4. as claimed in claim 3 with the smart card of laser decoration, which is characterized in that
It is further provided with view on the metal finishing layer or silk-screen protective layer and reads Information Level.
5. as described in claim 1 with the smart card of laser decoration, which is characterized in that
A surface of the bed of material in the smart card is connect with an assembly comprising laser film and substrate；
Another surface of the bed of material in the smart card is connect, Huo Zheshe with another assembly comprising laser film and substrate
It is equipped with view and reads Information Level.
6. as described in claim 1 with the smart card of laser decoration, which is characterized in that
The front of the laser film and/or the front of substrate are provided with view and read Information Level.
7. with the smart card of laser decoration as described in claim 4 or 5 or 6, which is characterized in that
It is described depending on read Information Level be silk-screen layer or offset printing layer or printable layer.
8. as described in claim 1 with the smart card of laser decoration, which is characterized in that
The bed of material is connect by insulation module or insulation diaphragm with the assembly in the smart card；
Contactless chip and induction antenna are directly encapsulated by insulation module；
Alternatively, contactless chip and induction antenna are attached on insulation diaphragm, or it is clipped among two insulation diaphragms.
9. as described in claim 1 with the smart card of laser decoration, which is characterized in that
The bed of material is connect by card matrix with the assembly in the smart card；
Contactless chip and induction antenna are directly encapsulated by the card matrix of insulating materials；
Alternatively, by the card matrix of insulating materials or metal material, contactless chip and induction antenna are packaged with to carry
Insulation module；
Alternatively, by insulating materials or the card matrix of metal material, to carry insulation diaphragm；Contactless chip and induction antenna
It is attached on insulation diaphragm or is clipped among two insulation diaphragms.
10. as claimed in claim 9 with the smart card of laser decoration, which is characterized in that
It is formed on the card matrix of metal material and lets out wave seam, described let out in wave seam is the air gap, or filled with insulating materials
Union body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821042710.0U CN208903288U (en) | 2018-07-02 | 2018-07-02 | With radium-shine or electroplated decoration smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821042710.0U CN208903288U (en) | 2018-07-02 | 2018-07-02 | With radium-shine or electroplated decoration smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208903288U true CN208903288U (en) | 2019-05-24 |
Family
ID=66567163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821042710.0U Expired - Fee Related CN208903288U (en) | 2018-07-02 | 2018-07-02 | With radium-shine or electroplated decoration smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208903288U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298432A (en) * | 2019-06-29 | 2019-10-01 | 飞天诚信科技股份有限公司 | A kind of smart card and its manufacturing method |
-
2018
- 2018-07-02 CN CN201821042710.0U patent/CN208903288U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298432A (en) * | 2019-06-29 | 2019-10-01 | 飞天诚信科技股份有限公司 | A kind of smart card and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190524 Termination date: 20210702 |