CN107944538B - Manufacturing process of high-temperature and high-pressure resistant UHF _ RFID label - Google Patents
Manufacturing process of high-temperature and high-pressure resistant UHF _ RFID label Download PDFInfo
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- CN107944538B CN107944538B CN201711325375.5A CN201711325375A CN107944538B CN 107944538 B CN107944538 B CN 107944538B CN 201711325375 A CN201711325375 A CN 201711325375A CN 107944538 B CN107944538 B CN 107944538B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000002861 polymer material Substances 0.000 claims abstract description 44
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 238000003466 welding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 229920006351 engineering plastic Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 238000004382 potting Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
The invention relates to a manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag, which adopts a high polymer material with the temperature of more than 300 ℃ to carry out encapsulation on the UHF _ RFID tag. The high polymer material of the label manufactured by the invention can effectively protect internal structures such as an RFID chip and the like after being cured, and the radio frequency label can withstand the high-temperature and high-pressure environment test at 175 ℃ and 100 MPa; the invention has the advantages of simple structure, convenient installation, low rejection rate and low cost.
Description
Technical Field
The invention relates to the technical field of UHF _ RFID tag manufacturing, in particular to a manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag.
Background
Radio Frequency Identification (RFID) is a non-contact automatic Identification technology. Compared with the traditional identification technology, the RFID technology has the advantages of water resistance, magnetism prevention, high temperature resistance, long service life, large reading distance, capability of encrypting tag data, large storage data capacity, convenience in information storage and the like.
The RFID tag mainly comprises an antenna, a radio frequency front end, a digital baseband and an EEPROM. The antenna is used for receiving and transmitting signals; the radio frequency front end mainly comprises a clock generating circuit, an envelope detection circuit, a modulation and demodulation circuit and a power management circuit; the EEPROM realizes the storage of data; the digital baseband module mainly realizes a set communication protocol, such as data coding and decoding, an anti-collision algorithm, CRC code verification and generation, and identifies and executes instructions sent by a reader-writer.
The basic working principle of the RFID system is: after the tag enters a reader-writer to emit an electromagnetic field, induced current obtained by a tag antenna is used as a power supply of a chip through a boost circuit, carried analog control information is converted into a digital signal through a radio frequency front-end circuit and is sent to a logic control circuit for processing, information needing to be replied is sent out from a tag memory, is sent back to the radio frequency front-end circuit through the logic control circuit and is sent to the reader-writer through the antenna.
At present, the application of the RFID technology covers all the fields, and relates to a plurality of fields such as libraries, access control systems, food safety traceability, automatic charging, health and medical application, aviation luggage tracking, supply chains and the like. Especially, with the development of the internet of things, the RFID technology is ubiquitous.
The UHF _ RFID tag operates in the UHF band. When the radio frequency tag is applied to the underground operation surface of a drilling site, the radio frequency tag needs to bear severe engineering environments such as high temperature, high pressure, strong acid and alkali and the like. At present, products meeting application conditions are not available at home, label products available at abroad are very limited, and the defects of high price and low yield exist.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a manufacturing process of a high temperature and high pressure resistant UHF _ RFID tag, so as to solve the problems of high price and low yield of the existing product.
The purpose of the invention is mainly realized by the following technical scheme:
a manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag is characterized in that a high-molecular material with the temperature of more than 300 ℃ is sprayed to encapsulate the UHF _ RFID tag.
The manufacturing method of the UHF _ RFID tag comprises the following steps:
s1, welding the RFID chip to the printed board;
s2, sealing and protecting the RFID chip and the welding spot by using epoxy protective glue;
s3, connecting the outer ring of the support pillar and the metal shell into a whole through laser welding;
s4, fixing the printed board after preliminary assembly to the metal shell through a positioning pin;
s5, encapsulating the high polymer material through the encapsulating hole;
and S6, naturally cooling the high polymer material, finishing and grinding the appearance of the label, and marking.
The concrete process of encapsulating the high polymer material comprises the following steps:
heating the high polymer material to more than 300 ℃, spraying the heated high polymer material into the UHF _ RFID label through a gap on a printing plate of the UHF _ RFID label under the injection pressure of 100MPa, and grinding the appearance of the UHF _ RFID label after the high polymer material is completely cooled and solidified.
In the manufacturing process, after all parts of the UHF _ RFID tag are installed and welded, the high polymer material is encapsulated; the high molecular material is thermoplastic resin or special engineering plastic.
The main body of the UHF _ RFID tag is circular and comprises a metal shell and a printed board;
the printed board is fixed inside the metal shell through a metal pin; the high polymer material is filled in the metal shell through the encapsulating process, and the printed board is coated and encapsulated.
The printed board is round or square or rhombic, and the left side and the right side are provided with filling holes; the high polymer material is sprayed into the metal shell through the filling and sealing hole;
the copper-clad side of the printed board faces the inside of the UHF _ RFID label, and a chip is welded on the copper-clad side of the printed board.
A solder mask layer is arranged at a pad of the chip;
before encapsulation of the high polymer material, the chip, the welding point of the chip and the solder mask are encapsulated by epoxy protective glue or polyurethane or silicon resin.
Positioning holes are formed in the upper portion and the lower portion of the printed board, and cylindrical supporting columns are arranged on the metal shell; the metal pin penetrates through the positioning hole and the supporting column to fix the printed board and the metal shell;
the locating hole all sets up to the metallization hole, and the part that metal casing and metal pin contacted carries out the copper cladding and handles.
The support column is tightly combined with the metal pin through interference fit or threaded connection;
the printed lines of the printed board are connected with the metal shell through the positioning holes, the metal pins and the supporting columns.
The filling hole holes are arc-shaped gaps and symmetrically arranged on two sides of the printed board, and the thickness of the printed board is 1mm-1.5 mm.
The invention has the following beneficial effects:
1. the high polymer material (such as special engineering plastic) selected for manufacturing the radio frequency tag has excellent chemical corrosion resistance in a high-temperature environment containing sulfide, methane, brine and crude oil, and has low moisture absorption rate, outstanding mechanical property, excellent wear resistance and low thermal expansion coefficient. After the high polymer material is cured, the internal structures such as the RFID chip and the like can be effectively protected, and the radio frequency tag can be guaranteed to withstand the extremely severe underground environments such as high-temperature and high-pressure environment of 175 ℃ and 100MPa, strong vibration, chemical corrosion, slurry abrasion and the like.
2. The invention has simple structure, convenient installation, obvious advantages of finished product rate and manufacturing cost compared with similar products, the finished product rate can reach more than 95 percent, and the cost is lower than one third of the price of the similar products abroad.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a cross-sectional view of a tag produced by a process for making a high temperature and high pressure resistant UHF _ RFID tag;
FIG. 2 is a schematic structural diagram of a tag produced by a manufacturing process of a high temperature and high pressure resistant UHF _ RFID tag;
FIG. 3 is a schematic diagram of printed circuit board welding of a tag produced by a manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag;
FIG. 4 is a schematic view of an epoxy glue seal of a tag produced by a manufacturing process of a high temperature and high pressure resistant UHF _ RFID tag;
FIG. 5 is a top view of a tag produced by a process for making a high temperature and high pressure resistant UHF _ RFID tag;
in the figure: 1-metal shell, 2-support column, 3-high polymer material, 4-printed board, 5-metal pin, 6-chip, 7-solder mask, 8-positioning hole, 9-protective adhesive and 10-encapsulating hole
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and which together with the embodiments of the invention serve to explain the principles of the invention.
A manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag is characterized in that the manufacturing process adopts a high polymer material 3 with the temperature of more than 300 ℃ to inject and encapsulate the UHF _ RFID tag. According to the invention, due to the high-temperature encapsulation of the over-high molecular material 3, the structures such as the printed board 4 antenna, the radio frequency tag chip 6 and the like are fixed in the metal shell 1. The polymer material 3 has excellent mechanical properties and heat resistance, and can ensure that the radio frequency tag can bear severe underground engineering environment; when the radio frequency tag is normally read and written, the dielectric constant of the high polymer material 3 can provide good support for the overall performance of the tag antenna.
The manufacturing method of the UHF _ RFID tag comprises the following steps:
s1, welding the RFID chip 6 to the printed board 4;
s2, sealing and protecting the RFID chip 6 and the welding spot by using epoxy protective glue 9;
s3, connecting the outer ring of the support column 2 and the metal shell 1 into a whole through laser welding;
s4, fixing the printed board 4 after preliminary assembly to the metal shell 1 through a positioning pin;
s5, encapsulating the high polymer material 3 through the encapsulating hole 10;
and S6, naturally cooling the high polymer material 3, finishing and grinding the appearance of the label, and marking.
The concrete process of encapsulating the high polymer material 3 is as follows:
heating the high polymer material 3 to more than 300 ℃, spraying the heated high polymer material 3 into the UHF _ RFID label through a gap on a printed board 4 of the UHF _ RFID label under the injection pressure of 100MPa, after the high polymer material 3 is completely cooled and solidified, firmly packaging the parts of the printed board 4 and the chip 6 in the metal shell 1, polishing the appearance of the UHF _ RFID label to facilitate the subsequent installation of the label antenna, ensuring the lower axial height and facilitating the miniaturization design.
And the reliability of the encapsulated product is ensured by proper encapsulation temperature and pressure. The encapsulation temperature and pressure are directly related to the hardness of the solidified polymer material 3 and the structural strength of the label product.
In the manufacturing process, after all parts of the UHF _ RFID tag are installed and welded, the high polymer material 3 is encapsulated; the high polymer material 3 is made of thermoplastic resin or special engineering plastics, and the high polymer material 3 with different tensile modulus and compression strength is selected according to different application occasions.
The main body of the UHF _ RFID tag is circular and comprises a metal shell 1 and a printed board 4;
the printed board 4 is fixed inside the metal shell 1 through a metal pin 5; the polymer material 3 is filled in the metal shell 1 through the potting process, and the printed board 4 is coated and encapsulated.
The printed board 4 is round, square or rhombic, meets the electrical property of the radio frequency tag, is provided with a high polymer material 3, and can be used at the encapsulation position, and the left side and the right side are provided with the encapsulation holes 10; the high polymer material 3 is sprayed into the metal shell 1 through the filling hole 10, so that direct impact of a high-pressure spraying material on the printed board 4 is avoided; the printed board 4 can be designed into a butterfly shape or other special shapes, preferably, the main circular filling hole 10 is an arc-shaped notch, so that the internal space of the label can be effectively utilized to the maximum extent, and the miniaturization design of the label is facilitated; the high-temperature molten high-molecular material 3 is injected from the vacant part of the printed board 4 at high pressure, so that the damage to the printed board 4 is reduced to the maximum extent.
The copper-clad side of the printed board 4 faces the inside of the UHF _ RFID tag, and the chip 6 is soldered.
A solder mask layer 7 is arranged at a pad of the chip 6; before encapsulation of the high polymer material 3, the chip 6, a welding spot of the chip 6 and the solder mask 7 are encapsulated by using epoxy protective glue 9 or polyurethane or silicon resin, so that the outward flow of soldering tin during high-temperature encapsulation is prevented, and the chip 6 is protected.
Positioning holes 8 are formed in the upper and lower parts of the printed board 4, and cylindrical supporting columns 2 are arranged on the metal shell 1; the metal pin 5 penetrates through the positioning hole 8 and the supporting column 2, and the printed board 4 and the metal shell 1 are fixed;
in order to ensure good grounding, the positioning holes 8 are all provided as metalized holes, and the part of the metal shell 1, which is in contact with the metal pin 5, is subjected to copper-clad treatment.
The support column 2 is tightly combined with the metal pin 5 through interference fit or threaded connection;
the printed line of the printed board 4 is connected with the metal shell 1 through the positioning hole 8, the metal pin 5 and the support column 2.
In order to ensure that the printed board 4 and the chip 6 are not damaged in the high-temperature and high-pressure encapsulating process, the printed board 4 is made of high-temperature resistant plates, encapsulating holes are symmetrically formed in two sides of the printed board, and the thickness of the printed board is 1mm-1.5 mm.
In summary, the embodiment of the invention provides a manufacturing process of a high-temperature and high-pressure resistant UHF _ RFID tag, in the invention, after a high polymer material is cured, internal structures such as an RFID chip and the like can be effectively protected, and a radio frequency tag can withstand the high-temperature and high-pressure environment of 175 ℃ and 100 MPa; the invention has the advantages of simple structure, convenient installation, low rejection rate and low cost.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (9)
1. The manufacturing process of the high-temperature and high-pressure resistant UHF _ RFID tag is characterized in that the manufacturing process adopts a high polymer material (3) with the temperature of more than 300 ℃ to carry out encapsulation on the UHF _ RFID tag;
the manufacturing method of the UHF _ RFID tag comprises the following steps:
s1, welding the RFID chip (6) to the printed board (4);
s2, sealing and protecting the RFID chip (6) and the welding spot by using epoxy protective glue (9);
s3, connecting the outer ring of the support pillar (2) and the metal shell (1) into a whole through laser welding;
s4, fixing the printed board (4) after preliminary assembly to the metal shell (1) through a positioning pin;
s5, encapsulating the high polymer material (3) through the encapsulating hole (10);
and S6, naturally cooling the high polymer material (3), finishing and grinding the appearance of the label, and marking.
2. The manufacturing process according to claim 1, wherein the specific process of encapsulating the polymer material (3) is as follows:
heating the high polymer material (3) to be above 300 ℃, spraying the heated high polymer material (3) into the UHF _ RFID label through a gap on a printing plate (4) of the UHF _ RFID label under the injection pressure of 100MPa, and polishing the shape of the UHF _ RFID label after the high polymer material (3) is completely cooled and solidified.
3. The manufacturing process according to claim 2, wherein the manufacturing process comprises potting a high molecular material (3) after the installation and welding of the parts of the UHF _ RFID tag are completed; the high polymer material (3) is thermoplastic resin or special engineering plastic.
4. The manufacturing process according to claim 3, wherein the body of the UHF _ RFID tag is circular and comprises a metal casing (1) and a printed board (4);
the printed board (4) is fixed inside the metal shell (1) through a metal pin (5); the high polymer material (3) is filled in the metal shell (1) through the potting process, and the printed board (4) is coated and packaged.
5. The manufacturing process according to claim 4, wherein the printed board (4) is circular, square or rhombic, and the left side and the right side are provided with filling holes (10); the high polymer material (3) is sprayed into the metal shell (1) through the filling hole (10);
the copper-clad side of the printed board (4) faces the inside of the UHF _ RFID label, and a chip (6) is welded on the copper-clad side of the printed board.
6. The manufacturing process according to claim 5, characterized in that a solder mask (7) is provided at the pads of the chip (6);
before the encapsulation of the high polymer material (3), the chip (6), the welding points of the chip (6) and the solder mask layer (7) are encapsulated by using epoxy protective glue (9) or polyurethane or silicon resin.
7. The manufacturing process according to claim 6, wherein positioning holes (8) are formed in the upper and lower sides of the printed board (4), and a cylindrical support column (2) is arranged on the metal shell (1); the metal pin (5) penetrates through the positioning hole (8) and the supporting column (2) to fix the printed board (4) and the metal shell (1);
the positioning holes (8) are all provided with metalized holes, and copper-clad treatment is carried out on the contact part of the metal shell (1) and the metal pin (5).
8. The manufacturing process according to claim 7, wherein the supporting column (2) and the metal pin (5) are tightly combined through interference fit or threaded connection;
the printed lines of the printed board (4) are connected with the metal shell (1) through the positioning holes (8), the metal pins (5) and the supporting columns (2).
9. The manufacturing process according to claim 8, wherein the filling hole (10) is an arc-shaped gap symmetrically arranged on two sides of the printed board (4), and the thickness of the printed board is 1mm-1.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325375.5A CN107944538B (en) | 2017-12-13 | 2017-12-13 | Manufacturing process of high-temperature and high-pressure resistant UHF _ RFID label |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325375.5A CN107944538B (en) | 2017-12-13 | 2017-12-13 | Manufacturing process of high-temperature and high-pressure resistant UHF _ RFID label |
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| Publication Number | Publication Date |
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| CN107944538A CN107944538A (en) | 2018-04-20 |
| CN107944538B true CN107944538B (en) | 2020-10-09 |
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| CN110516778B (en) * | 2019-08-19 | 2023-05-19 | 神思电子技术股份有限公司 | Electronic tag packaging method applied to RFID dinner plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336988A (en) * | 2013-07-01 | 2013-10-02 | 东营市胜软石油技术开发有限公司 | Special high-temperature and high-pressure RFID (radio frequency identification device) tag for oil field |
| CN103903046A (en) * | 2012-10-29 | 2014-07-02 | 奥普托塞斯股份有限公司 | Transponder for object identification and method for its fabrication |
| KR101500419B1 (en) * | 2013-10-02 | 2015-03-09 | 보나뱅크(주) | High temperature metal RFID tag for Automotive Paintshop Process |
| CN104989324A (en) * | 2015-07-15 | 2015-10-21 | 中国石油集团西部钻探工程有限公司 | Information label for underground intelligent switch tool |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8690066B2 (en) * | 2010-04-30 | 2014-04-08 | Axon Tubular Products, Inc. | High temperature high pressure tag |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903046A (en) * | 2012-10-29 | 2014-07-02 | 奥普托塞斯股份有限公司 | Transponder for object identification and method for its fabrication |
| CN103336988A (en) * | 2013-07-01 | 2013-10-02 | 东营市胜软石油技术开发有限公司 | Special high-temperature and high-pressure RFID (radio frequency identification device) tag for oil field |
| KR101500419B1 (en) * | 2013-10-02 | 2015-03-09 | 보나뱅크(주) | High temperature metal RFID tag for Automotive Paintshop Process |
| CN104989324A (en) * | 2015-07-15 | 2015-10-21 | 中国石油集团西部钻探工程有限公司 | Information label for underground intelligent switch tool |
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| CN107944538A (en) | 2018-04-20 |
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