CN104050497A - Electronic tag inlay, processing method of electronic tag inlay and electronic tag - Google Patents
Electronic tag inlay, processing method of electronic tag inlay and electronic tag Download PDFInfo
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- CN104050497A CN104050497A CN201410253930.8A CN201410253930A CN104050497A CN 104050497 A CN104050497 A CN 104050497A CN 201410253930 A CN201410253930 A CN 201410253930A CN 104050497 A CN104050497 A CN 104050497A
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Abstract
The invention relates to the technical field of radio frequency identification and provides an electronic tag inlay, a processing method of the electronic tag inlay and an electronic tag. The electronic tag inlay comprises a dielectric slab, a chip, an antenna, a protective material and a protective sheath, wherein a bonding pad is arranged on the dielectric slab, the chip and the antenna are respectively connected with the dielectric slab to achieve electrical breakover of the chip and the antenna, the protective material is packaged in the dielectric slab and the chip, connected to the outside of the antenna on the dielectric slab and used for sealing the chip, the dielectric slab and a connecting position of the chip and the antenna and bearing external force impact, and the protective sheath is located outside the protective material, wraps the dielectric slab, the chip, the antenna and the protective material and is used for preventing an outside environment from interfering the chip, the dielectric slab and the connecting position of the chip and the antenna and enhancing the structural strength of the electronic tag inlay. The electronic tag inlay is reliable in structure, high in strength and capable of being bent or stretched.
Description
[technical field]
The present invention relates to REID field, particularly relate to job operation and the electronic tag of a kind of electronic tag inlay, electronic tag inlay.
[background technology]
Radio-frequency (RF) identification (Radio Frequency Identification, RFID) technology is as a kind of emerging short-distance wireless communication technology, compare bar code and other recognition technologies, REID has the plurality of advantages such as sweep velocity is fast, discrimination is high, antijamming capability is strong, is widely applied in different industries at present.
Electronic tag is the core of REID, generally pastes by gum or screw is fixed on and is identified on object.Electronic tag is generally made up of chip, antenna, base material and package casing four parts, chip is used for storing the relevant information of object, antenna is used for receiving and launched microwave signal, and base material is as the carrier of fixed chip and antenna, jointly determining the various functional attributes of antenna with parameters such as antenna specification and frequency of operation, as gain, impedance, bandwidth and radiance etc.Antenna substrate is generally divided into soft base material and hard base material, corresponding electronic tag is called soft label and hard label, soft base material can adopt polyethylene terephthalate (polyethylene terephthalate, PET), polypropylene (Polypropylene, or teflon (Polytetrafluoroethene PP), the material such as PTFE), and hard base material general adopt FR4, pottery even the material such as glass make.On base material, form the geomery of antenna by etching or electrically conductive ink typography, then use chip on board (Chip On Board, COB) or lose money instead of making money the techniques such as hot pressing chip is arranged on to assigned address, form electrical connection with sky wire pin.The effect of package casing is in order to protect chip and antenna not affected by environment.Soft label generally covers on antenna conductive material is protected with dielectric film, prevents from causing property abnormality with air catalytic oxidation; And for the protection of hard label, generally adopt the method for direct spraying three anti-paint on antenna and base material, or die sinking fabrication plastic casing; then by ultrasound wave hot melt mode, body seal is got up; the label shell that this mode encapsulates, structure is relatively firm, but cost is higher.
But, under some site environments, due to shape irregular or large (as circle or the tubular articles) of curved surface of identified object itself, the position of neither one relatively flat is used for pasting and fixed labels, now adopts hard label just cannot install, because the encapsulating material of the no matter inner base material of hard label or outside, all hard material, cannot be bending, once stressed bending, will cause shell breakage, even inside antenna base material fracture; And although soft label can adapt to bending by a relatively large margin, between chip and antenna, adopt conducting resinl to connect, its undercapacity, and because its packaging technology is simple, cannot bear external impacts, therefore also cannot be useful in more severe site environment.
Most electronic tag in the market, all require in use body surface as far as possible smooth, otherwise label cannot effectively be installed.The base material of hard label and package casing just cannot flexural deformations after completing, and are screwed in smooth body surface so must paste or adopt; Although and soft label has certain flexibility, technique is simple, package reliability is poor, cannot successfully manage the various environmental changes such as rainwater, dust, acid and alkali corrosion and mantle friction, stressed impact.
Also there are some electronic tags, adopt at uneven body surface borehole, then label is embedded or is partly embedded in hole.Although this mode does not rely on the flatness of body surface to a certain extent, but due to the structure of object itself is destroyed, under a lot of applicable cases, user cannot accept, and hollow out with embedded tags itself and also can produce a lot of costs, therefore the application mode of this electronic tag is very restricted.
In published patent, publication number CN202904630U, open day provide a kind of RFID elasticity electronic tag for the Chinese patent of 2013.04.24, it adopts has flexible imitative spring antenna, on radio-frequency module substrate, label chip and spring antenna are electrically connected, then seal with fastening sealing, although adopt this frame mode antenna to there is reasonable elasticity, the structural strength deficiency of connecting portion.
Publication number CN102054194B, open day provide a kind of RFID electronic tire tag and manufacture method thereof for the Chinese patent of 2011.05.11; it is also to adopt spring antenna to adapt to various stress and bent change; Electronic Tag Structure and CN202904630U are similar; but chip and antenna interconnecting piece position do not have structural preservation; be easy to be subject to damage, can only be arranged in rubber tyre and use.
Publication number CN1801190A, open day provide a kind of special electronic label for automobile engine for the Chinese patent of 2006.07.12, it adopts protective metal shell to be used for fixing whole label, protective metal shell is in whole packaged label both sides, on it, there is screw hole, be used for label to be arranged on the body of motor car engine.
Publication number CN103679253A, within open day, for providing a kind of high temperature resistant RFID ultrahigh frequency that can repeatedly wash, the Chinese patent of 2014.03.26 washs label and production technology, it is at pcb board, chip, base material antenna outer cover has seal protection cover, the material of protective sleeve is silica gel, but this protective sleeve is not in order to protect chip and circuit board, a but package cover of whole electronic tag, be equivalent to spring antenna, chip and circuit board all get up with silica gel sealing, and then vacuumize discharge the inside air, the essence of this protective sleeve is exactly the shell of electronic tag.
Above-mentioned patent, and prior art all fails to provide a kind of bending that can adapt in various degree, and structural strength electronic tag inlay very reliably.Given this, overcoming the existing defect of above-mentioned prior art is the art problem demanding prompt solution.
[summary of the invention]
The technical problem to be solved in the present invention is to provide a kind of bending that can adapt in various degree, and structural strength electronic tag inlay and job operation thereof very reliably, and the electronic tag that adopts this electronic tag inlay to make.
The present invention adopts following technical scheme:
A kind of electronic tag inlay, described electronic tag inlay comprises:
Dielectric-slab, described dielectric-slab is provided with pad;
Chip and antenna, described chip is connected with described dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna;
Protective materials, described protective materials is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve; described protective sleeve is positioned at the outside of protective materials; by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthen the structural strength of described electronic tag inlay.
Further, described protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties.
Further, described protective sleeve is heat-shrink tube, metal sleeve or rigid plastic casing-pipe; The diameter of described protective sleeve is a bit larger tham the width of described dielectric-slab, and the length of protective sleeve is greater than the length of dielectric-slab.
Further, described chip adopts the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or described chip is fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
Described antenna is connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, described antenna is threaded connection mode and is connected with the pad of dielectric-slab, or the position being connected with antenna at the two ends of described pad offers metallic vias, the metal wire that is connected one end on described antenna with pad is through in metallic vias and is welded in one with pad.
Further, described antenna is helical wire or the copper litz wire of plain metal line, spring structure; Described antenna comprises two parts equal in length, is connected to the both sides of dielectric-slab.
Further, described dielectric-slab is glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate.
The present invention also provides a kind of job operation of above-mentioned electronic tag inlay, and described method comprises the steps:
(1) adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin chip, or chip is directly fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
(2) antenna is connected with the pad of dielectric-slab by welding manner;
(3) metal sleeve or rigid plastic casing-pipe are fitted inside and move to dielectric-slab position from antenna one end, be set in dielectric-slab, chip, antenna outside, metal sleeve or rigid plastic casing-pipe one end adopt gummed paper sealing, and protective materials is injected until fill from metal sleeve or the rigid plastic casing-pipe other end;
(4), after protective materials solidifies, the gummed paper of metal sleeve or rigid plastic casing-pipe one end is dismantled.
The present invention also provides the job operation of another kind of above-mentioned electronic tag inlay, and described method comprises the steps:
(1) adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin chip, or chip is directly fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
(2) antenna is connected with the pad of dielectric-slab by welding manner;
(3) with protective materials, the connecting portion of chip and dielectric-slab, chip and antenna is sealed;
(4) after protective materials solidifies, heat-shrink tube is fitted inside and moves to dielectric-slab position from antenna one end, by dielectric-slab, chip, antenna and protective materials parcel, heat to heat-shrink tube with heat gun, until heat-shrink tube is contracted to completely, dielectric-slab, chip, antenna and protective materials are tightly wrapped up.
In above-mentioned two kinds of methods, further, the metal wire that is connected one end on antenna with pad is through in the metallic vias of offering with antenna link position on pad, be welded in one with pad.
The present invention also provides a kind of electronic tag, and described electronic tag is made up of above-mentioned electronic tag inlay encapsulation.
Compared with prior art, beneficial effect of the present invention is:
The present invention is by providing a kind of reliable in structure, high strength, flexible electronic tag inlay, inlay itself has very high intensity, can bear very large external impacts, the Electronic Tag Structure that has made to apply this electronic tag inlay is very reliable, can bear pressure and jerk significantly, can also bear bending or stretching by a relatively large margin, and after electronic tag bending, can recover original shape and not affect any performance, cannot effectively be applied to the difficult problem on the smooth object of air spots or curved surface larger object thereby solved existing electronic tag.
Electronic tag inlay manufacture craft of the present invention is simple, because have protective sleeve as carrier, when injecting glue, can operate quickly and easily, is applicable to batch production.
Electronic tag inlay of the present invention is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, no matter adopt injection moulding sealing or additive method, all without operation or the pressure of worrying technique itself, inlay is caused damage or affects its electric property.
Electronic tag inlay of the present invention can directly be applied on the object that needs identification, thereby or adopts Elastic plastic-rubber sealing to be arranged on flexibly on the object of various surface imperfections.
[brief description of the drawings]
Fig. 1 is the electronic tag inlay decomposition texture schematic diagram of the embodiment of the present invention 1;
Fig. 2 is the structural representation of the electronic tag inlay of the embodiment of the present invention 1.
Reference numeral:
10-dielectric-slab, 20-chip, 30-spring antenna, 40-protective sleeve.
[embodiment]
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
In addition,, in each embodiment of described the present invention, involved technical characterictic just can combine mutually as long as do not form each other conflict.
The embodiment of the present invention provides a kind of electronic tag inlay, and it comprises:
Dielectric-slab, which is provided with pad;
Chip and antenna, be connected with dielectric-slab respectively, realizes the electrically conducting between chip and antenna;
Protective materials, is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve, is positioned at the outside of protective materials, by dielectric-slab, chip, antenna and protective materials parcel,
For preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthen the structural strength of electronic tag inlay.
Below each specific embodiment is elaborated:
embodiment 1:
Fig. 1 is made up of a kind of electronic tag inlay that the embodiment of the present invention 1 provides with Figure 2 shows that dielectric-slab 10, chip 20, antenna, protective materials and protective sleeve 40 5 parts, wherein:
On dielectric-slab 10, be provided with pad; Dielectric-slab 10 can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate (being PTFE plate), or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad;
Chip 20 is connected with dielectric-slab respectively with antenna, realizes the electrically conducting between chip 20 and antenna, in the present embodiment, antenna is the helical wire (being designated hereinafter simply as spring antenna 30) of spring structure, can certainly adopt other to there is the antenna that the metal construction of certain bending and stretch characteristics is made as plain metal line etc., spring antenna 30 comprises two parts equal in length, be connected to the both sides of dielectric-slab 10, in the present embodiment, the length of every partial spring antenna 30 is about 1/4th (in concrete application of radiofrequency signal wavelength, the length of spring antenna 30 is selected the pitch of the laps diameter with spring antenna 30, the interval of antenna wire diameter and each circle is relevant, according to the pitch of the laps diameter of spring antenna 30, the length of spring antenna 30 every parts is finally determined at the interval of antenna wire diameter and each circle), chip 20 can adopt the packaging body with pin to be connected on the pad of dielectric-slab 10 by gold thread or scolding tin, or is fixed on dielectric-slab 10 by the naked brilliant COB technique that adopts, spring antenna 30 can be connected with the pad of dielectric-slab 10 by welding manner, or offer screw via hole at dielectric-slab 10 two ends, spring antenna 30 is threaded connection mode and is connected with the pad of dielectric-slab 10, or metallic vias is offered with the position that spring antenna 30 is connected in the two ends at pad, and the metal wire that is connected one end on spring antenna 30 with pad is through in metallic vias and is welded in one with pad,
Protective materials is packaged in dielectric-slab 10, chip 20 and is connected in the outside of the spring antenna 30 on dielectric-slab 10, for sealing the connecting portion of chip 20 and dielectric-slab 10, chip 20 and spring antenna 30, and bears certain external impacts; Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue;
Protective sleeve 40 is positioned at the outside of protective materials, by dielectric-slab 10, chip 20, spring antenna 30 and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip 20 and dielectric-slab 10, chip 20 and spring antenna 30, thereby ensure that chip 20 has minimum form factor, and as the carrier of protective materials, strengthen the structural strength of electronic tag inlay together with protective materials, can be used to protective medium plate 10 and chip 20 and in the time being subject to external impacts, avoid damaging; In the present embodiment, protective sleeve 40 is metal sleeve (being the sleeve pipe that metal material is made), and its diameter is a bit larger tham the width of dielectric-slab, and length is greater than the length of dielectric-slab.Wherein, metal sleeve can adopt stainless steel, iron, aluminium, copper and other metal materials to make.Certainly; can also adopt acrylonitrile-butadiene-styrene copolymer (Acrylonitrile butadiene Styrene copolymers; ABS), polycarbonate (Polycarbonate; PC), polyphenylene sulfide (Polyphenylene sulfide; PPS) the rigid plastic casing-pipe that, the material such as Polyvinylchloride (Polyvinyl chloride polymer, PVC), PTFE and PP is made is as protective sleeve 40.
Adopt the electronic tag inlay of the present embodiment to make electronic tag, not only solved the problem that electronic tag can be bending or stretches, and the structure of whole electronic tag will be very reliable, and can bear pressure and jerk significantly.After epoxide-resin glue solidifies, have very large hardness, after especially adopting metal sleeve protection, can bear very large external force collision, this is other flexible electronic labels or simply adopts the label construction of freezing plastic encapsulation not accomplish.
In addition, the electronic tag inlay of the present embodiment is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, so no matter adopt injection moulding sealing or additive method encapsulation, all without operation or the pressure of worrying technique itself, inlay caused damage or affects its electric property.
embodiment 2:
The electronic tag inlay that the present embodiment provides is made up of dielectric-slab, chip, antenna, protective materials and protective sleeve five parts equally, wherein:
On dielectric-slab, be provided with pad; Dielectric-slab can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate, or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad;
Chip is connected with dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna; In the present embodiment, antenna is copper litz wire, and copper litz wire comprises two parts equal in length, is connected to the both sides of dielectric-slab, and in the present embodiment, the length of every part copper braided wire is about 1/4th of radiofrequency signal wavelength; Chip can adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or is fixed on dielectric-slab by the naked brilliant COB technique that adopts; Copper litz wire can be connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, copper litz wire is threaded connection mode and is connected with the pad of dielectric-slab, or metallic vias is offered in the position being connected with copper litz wire at the two ends of pad, the metal wire that is connected one end on copper litz wire with pad is through in metallic vias and is welded in one with pad;
Protective materials is packaged in dielectric-slab, chip and is connected in the outside of the copper litz wire on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and copper litz wire, and bears certain external impacts; Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue;
Protective sleeve is positioned at the outside of protective materials, by dielectric-slab, chip, copper litz wire and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and copper litz wire, thereby ensure that chip has minimum form factor, and as the carrier of protective materials, strengthen the structural strength of electronic tag inlay together with protective materials, can be used to protective medium plate and chip and in the time being subject to external impacts, avoid damaging; In the present embodiment, protective sleeve is heat-shrink tube, and its diameter is a bit larger tham the width of dielectric-slab, and length is greater than the length of dielectric-slab.Wherein, heat-shrink tube can adopt the heat-shrink tube that tygon, polyene hydrogen class material are made.
Adopt the electronic tag inlay of the present embodiment to make electronic tag, not only solved the problem that electronic tag can be bending or stretches, and the structure of whole electronic tag will be very reliable, and can bear pressure and jerk significantly.After epoxide-resin glue solidifies, have very large hardness, after especially adopting heat-shrink tube protection, can bear larger external force collision, this is other flexible electronic labels or simply adopts the label construction of freezing plastic encapsulation not accomplish.
In addition, the electronic tag inlay of the present embodiment is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, so no matter adopt injection moulding sealing or additive method encapsulation, all without operation or the pressure of worrying technique itself, inlay caused damage or affects its electric property.
embodiment 3:
The present embodiment provides a kind of job operation of electronic tag inlay, comprises the steps:
(1) adopt the packaging body with pin to be connected to by gold thread or scolding tin on the pad of dielectric-slab chip, in other embodiments, chip directly can also be fixed on dielectric-slab by the naked brilliant COB technique that adopts.
Dielectric-slab can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate, or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad.
(2) antenna is connected with the pad of dielectric-slab by welding manner, in other embodiments, can also offers at dielectric-slab two ends screw via hole, antenna is threaded connection mode and is connected with the pad of dielectric-slab.
Wherein, antenna can be the helical wire (being designated hereinafter simply as spring antenna) of copper litz wire, spring structure, can also adopt other to there is the antenna that the metal construction of certain bending and stretch characteristics is made as plain metal line etc., in the present embodiment, adopt copper litz wire as antenna, it comprises two parts equal in length, be connected to the both sides of dielectric-slab, in the present embodiment, the length of every part copper braided wire is about 1/4th of radiofrequency signal wavelength.
In order to increase the reliability of connection, the pad being connected with copper litz wire can adopt via hole mode, on pad, offer metallic vias with copper litz wire link position, before welding, first the metal wire that is connected one end on copper litz wire with pad is fitted inside to one little section from via hole, then be welded in one with pad.In the time of stressed force-extension, this tie point can prevent that metal wire and pad from departing from very reliably like this, and then prevents that copper litz wire and pad from departing from.
(3) protective sleeve is fitted inside and move to dielectric-slab position from copper litz wire one end, be set in dielectric-slab, chip, copper litz wire outside, protective sleeve one end adopts gummed paper sealing, and protective materials is injected until fill from the protective sleeve other end.
Protective sleeve can adopt metal sleeve or rigid plastic casing-pipe, and metal sleeve can adopt stainless steel, iron, aluminium, copper and other metal materials to make, and rigid plastic casing-pipe can adopt the materials such as ABS, PC, PPS, PVC, PTFE and PP to make.In the present embodiment, adopt stainless steel metal sleeve pipe as protective sleeve, its diameter is a bit larger tham the width of dielectric-slab, facilitates installing of sleeve pipe, and its length is greater than the length of dielectric-slab, can the whole dielectric-slab of integral coating.
Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue.
(4), after epoxide-resin glue solidifies, the gummed paper of metal sleeve or rigid plastic casing-pipe one end is dismantled.
So far, completed the processing preparation of electronic tag inlay.
Because copper litz wire itself can be bending arbitrarily flexibly; and chip and antenna (copper litz wire) connecting portion adopts epoxide-resin glue sealing and stainless steel metal casing protection; so the electronic tag that adopts this electronic tag inlay to make can stand various flexural deformation, and whole electronic tag also can stand sizable external impacts and not affect its performance at all.
The job operation of the present embodiment, its manufacture craft is simple, because have protective sleeve as carrier, therefore can operate quickly and easily when injecting glue, is applicable to batch production.
embodiment 4:
The present embodiment provides the job operation of another kind of electronic tag inlay, comprises the steps:
(1) adopt the packaging body with pin to be connected to by gold thread or scolding tin on the pad of dielectric-slab chip, in other embodiments, chip directly can also be fixed on dielectric-slab by the naked brilliant COB technique that adopts.
Dielectric-slab can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate, or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad.(2) antenna is connected with the pad of dielectric-slab by welding manner, in other embodiments, can also offers at dielectric-slab two ends screw via hole, antenna is threaded connection mode and is connected with the pad of dielectric-slab.
Wherein, antenna can be copper litz wire, the helical wire (being designated hereinafter simply as spring antenna) of spring structure, can also adopt other to there is the antenna that the metal construction of certain bending and stretch characteristics is made as plain metal line etc., in the present embodiment, adopt spring antenna (the spiral copper cash of for example spring structure) as antenna, it comprises two parts equal in length, be connected to the both sides of dielectric-slab, in the present embodiment, the length of every partial spring antenna is about 1/4th (in concrete application of radiofrequency signal wavelength, the length of spring antenna is selected the pitch of the laps diameter with spring antenna, the interval of antenna wire diameter and each circle is relevant, according to the pitch of the laps diameter of spring antenna, the length of the every part of spring antenna is finally determined at the interval of antenna wire diameter and each circle).
In order to increase the reliability of connection, the pad being connected with spring antenna can adopt via hole mode, on pad, offer metallic vias with spring antenna link position, before welding, first the metal wire that is connected one end on spring antenna with pad is fitted inside to one little section from via hole, then be welded in one with pad.In the time of stressed force-extension, this tie point can prevent that metal wire and pad from departing from very reliably like this, and then prevents that spring antenna and pad from departing from.
(3) with protective materials, the connecting portion of chip and dielectric-slab, chip and spring antenna is sealed.
Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue.
(4) after epoxide-resin glue solidifies, heat-shrink tube is fitted inside and moves to dielectric-slab position from spring antenna one end, by dielectric-slab, chip, spring antenna and epoxide-resin glue parcel,, dielectric-slab, chip, spring antenna and epoxide-resin glue are tightly wrapped up until heat-shrink tube is contracted to completely lightly to heat-shrink tube heating with heat gun.Wherein, the heat-shrink tube that heat-shrink tube can adopt tygon, polyene hydrogen class material to make, its diameter is a bit larger tham the width of dielectric-slab, facilitates installing of heat-shrink tube, and its length is greater than the length of dielectric-slab, can the whole dielectric-slab of integral coating.
So far, completed the processing preparation of electronic tag inlay.
The job operation of the present embodiment, its manufacture craft is simple, because have protective sleeve as carrier, therefore can operate quickly and easily when injecting glue, is applicable to batch production.
embodiment 5:
The present embodiment provides a kind of electronic tag, and this electronic tag is made up of the electronic tag inlay encapsulation of embodiment 1 or embodiment 2.This Electronic Tag Structure is very reliable, can bear pressure and jerk significantly, can also bear bending or stretching by a relatively large margin, and after electronic tag bending, can recover original shape and not affect any performance, solve existing electronic tag and cannot effectively be applied to the difficult problem on the smooth object of air spots or curved surface larger object.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. an electronic tag inlay, is characterized in that, described electronic tag inlay comprises:
Dielectric-slab, described dielectric-slab is provided with pad;
Chip and antenna, described chip is connected with described dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna;
Protective materials, described protective materials is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve; described protective sleeve is positioned at the outside of protective materials; by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthen the structural strength of described electronic tag inlay.
2. electronic tag inlay as claimed in claim 1, is characterized in that, described protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties.
3. electronic tag inlay as claimed in claim 1, is characterized in that, described protective sleeve is heat-shrink tube, metal sleeve or rigid plastic casing-pipe; The diameter of described protective sleeve is a bit larger tham the width of described dielectric-slab, and the length of protective sleeve is greater than the length of dielectric-slab.
4. electronic tag inlay as claimed in claim 1, it is characterized in that, described chip adopts the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or described chip is fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
Described antenna is connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, described antenna is threaded connection mode and is connected with the pad of dielectric-slab, or the position being connected with antenna at the two ends of described pad offers metallic vias, the metal wire that is connected one end on described antenna with pad is through in metallic vias and is welded in one with pad.
5. the electronic tag inlay as described in claim 1 or 4, is characterized in that, described antenna is helical wire or the copper litz wire of plain metal line, spring structure; Described antenna comprises two parts equal in length, is connected to the both sides of dielectric-slab.
6. electronic tag inlay as claimed in claim 1, is characterized in that, described dielectric-slab is glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate.
7. a job operation for the electronic tag inlay described in claim 1-6 any one, is characterized in that, described method comprises the steps:
(1) adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin chip, or chip is directly fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
(2) antenna is connected with the pad of dielectric-slab by welding manner;
(3) metal sleeve or rigid plastic casing-pipe are fitted inside and move to dielectric-slab position from antenna one end, be set in dielectric-slab, chip, antenna outside, metal sleeve or rigid plastic casing-pipe one end adopt gummed paper sealing, and protective materials is injected until fill from metal sleeve or the rigid plastic casing-pipe other end;
(4), after protective materials solidifies, the gummed paper of metal sleeve or rigid plastic casing-pipe one end is dismantled.
8. a job operation for the electronic tag inlay described in claim 1-6 any one, is characterized in that, described method comprises the steps:
(1) adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin chip, or chip is directly fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
(2) antenna is connected with the pad of dielectric-slab by welding manner;
(3) with protective materials, the connecting portion of chip and dielectric-slab, chip and antenna is sealed;
(4) after protective materials solidifies, heat-shrink tube is fitted inside and moves to dielectric-slab position from antenna one end, by dielectric-slab, chip, antenna and protective materials parcel, heat to heat-shrink tube with heat gun, until heat-shrink tube is contracted to completely, dielectric-slab, chip, antenna and protective materials are tightly wrapped up.
9. a kind of job operation of electronic tag inlay as claimed in claim 7 or 8, it is characterized in that, described step (2) is specially: the metal wire that is connected one end on antenna with pad is through in the metallic vias of offering with antenna link position on pad, is welded in one with pad.
10. an electronic tag, is characterized in that, described electronic tag is made up of the electronic tag inlay encapsulation described in claim 1-6 any one.
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| CN201410253930.8A CN104050497A (en) | 2014-06-10 | 2014-06-10 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
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| CN201410253930.8A CN104050497A (en) | 2014-06-10 | 2014-06-10 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
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Application publication date: 20140917 |