KR100898603B1 - Integrated radio frequency identification tag and preparation method thereof - Google Patents

Abstract

The present invention relates to an RFID tag and a method for manufacturing the RFID tag integrally manufactured by an automated single process using a roll type electromagnetic wave absorber. The present invention provides a method of manufacturing an RFID tag, comprising: (a) supplying a roll type electromagnetic wave absorber through a continuous process line; (b) forming an insulating layer on the surface of the electromagnetic wave absorber to be supplied; (c) forming an antenna pattern on the insulating layer; And (d) attaching the IC chip to the antenna pattern, wherein step (d) comprises: (d1) applying a conductive adhesive or conductive paste to a location where the IC chip is attached; And (d2) attaching the IC chip at the portion to which the conductive adhesive or the conductive paste is applied. According to the present invention, an automated and unified RFID tag manufacturing process can improve work efficiency and productivity, and eliminate manpower waste and time waste. In addition, it is possible to reduce the frequency of defective product production and achieve cost savings.

RFID tag, RFID, electromagnetic wave absorber, electromagnetic shielding, integrated, single process

Description

Integrated RF ID tag and manufacturing method thereof {Integrated radio frequency identification tag and preparation method

1 is a front view of an RFID tag according to a preferred embodiment of the present invention;

2 is a side view of an RFID tag according to a preferred embodiment of the present invention;

3 is a side view of an RFID tag according to another preferred embodiment of the present invention;

4 is a flowchart illustrating a method of manufacturing an electromagnetic wave absorber in an RFID tag according to a preferred embodiment of the present invention.

5 is a flowchart illustrating a method of manufacturing an RFID tag according to an exemplary embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100: RFID tag 110: electromagnetic wave absorber

120: insulating layer 130: IC chip

132: antenna 300: protective coating layer

The present invention relates to an integrated RFID tag and a method of manufacturing the same. More specifically, the present invention relates to an RFID tag and a method for manufacturing the RFID tag integrally manufactured using a roll type electromagnetic wave absorber through an automated single process.

In general, RFID (Radio Frequency IDentification) is a contactless radio identification system that embeds a chip-like tag in a designated object and uses radio waves to communicate between the object tag and a reader or interrogator. to be. Such RFID can be recognized even if the object is located at a long distance from the reader or an obstacle is present in the middle, and it can identify several at the same time, which has a wider range of application than the existing barcode. In addition, RFID has the advantage that it can be used for a long time because it can store a large amount of information, is less likely to be damaged, and can be written and erased. Based on these advantages, RFID is increasingly used today.

As already mentioned, RFID consists of an RFID tag that stores data largely and a reader that reads data. In particular, the RFID tag includes a storage device for storing data including an ID code, an integrated circuit (IC) chip for controlling the storage device, and an antenna for transmitting data to the outside. The RFID tag is classified into an active tag and a passive tag according to the built-in battery.

However, when the RFID tag is in contact with a metallic material, the range of the recognition frequency is changed or the radio wave itself is not recognized due to the influence of the material. Thus, in the related art, an electromagnetic wave shielding agent is formed on an RFID tag to prevent scattering of electromagnetic waves generated between the metallic material. Conventionally, an RFID tag having such an electromagnetic shielding agent is manufactured through a plurality of processes as follows. First, a tag and an electromagnetic shielding agent in which an IC chip and an antenna are built are separately produced through each one process. Then, these (tags and electromagnetic shielding agent) are assembled and assembled through a manual assembly line, which is the third process. Subsequently, the product is manufactured through a casing step (see Korean Patent Registration Publication No. 717,629, "RF ID tag for 900 MHz metal").

However, for such a manufacturing process, the step of producing an electromagnetic shielding agent immediately after processing into a form suitable for the case should be added. In addition, in order to assemble the tag in the electromagnetic shielding agent, processes such as etching, stamping, printing, or the like must be preceded or reflected. As such, the process of producing an RFID tag having a conventional electromagnetic shielding agent has to go through a number of steps as well as requires a manual work line, thereby exposing problems such as reduced work efficiency, reduced productivity, waste of manpower, and waste of time. In addition, this has the disadvantage of increasing the possibility of producing defective products.

The present invention has been made to solve the above problems, an integrated RFID tag and a method for manufacturing the RFID tag, characterized in that the production of an RFID tag in one piece using an electromagnetic wave absorber (preferably a roll type) integrally. For the purpose of providing it.

The present invention has been made to achieve the above object, a method of manufacturing an RFID tag, comprising the steps of: (a) supplying a roll-type electromagnetic wave absorber through a continuous process line; (b) forming an insulating layer on the surface of the supplied electromagnetic wave absorber; (c) forming an antenna pattern on the insulating layer; And (d) attaching an IC chip to the antenna pattern, wherein step (d) comprises: (d1) applying a conductive adhesive or conductive paste to a location where the IC chip is attached; And (d2) attaching the IC chip at a portion to which the conductive adhesive or the conductive paste is applied.

In addition, the present invention provides a method of manufacturing an RFID tag, (a) at least one magnetic material selected from a metal alloy powder or ferrite powder is impregnated in a polymer resin solution containing a polymer resin and a solvent of the magnetic material Coating a surface with the polymer resin solution; (b) drying the magnetic material coated with the polymer resin solution; (c) heating or pressing the dried magnetic material to form an electromagnetic wave absorber having a predetermined shape; (d) supplying the shaped electromagnetic wave absorber on a continuous process line, and forming an antenna pattern on the surface of the supplied electromagnetic wave absorber; And (f) attaching an IC chip to the antenna pattern.

In addition, the present invention is an electromagnetic wave absorber; An insulating layer formed on one surface of the electromagnetic wave absorber; An antenna pattern integrally formed on the insulating layer; And an IC chip attached to the conductive adhesive coating layer or the conductive paste coating layer formed on the insulating layer and connected to the antenna pattern.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, the following will describe a preferred embodiment of the present invention, but the technical idea of the present invention is not limited thereto and may be variously modified and modified by those skilled in the art.

1 is a front view of an RFID tag according to a preferred embodiment of the present invention. 2 is a side view of an RFID tag according to a preferred embodiment of the present invention. 1 and 2, the RFID tag 100 according to a preferred embodiment of the present invention includes an electromagnetic wave absorber 110, an insulating layer 120, an IC chip 130, and an antenna 132. . The RFID tag 100 may further include a protective coating layer 300 as shown in FIG. 3 in the embodiment of the present invention.

The RFID tag 100 typically has various usage frequency bands, such as 125/134 KHz, 13.56 MHz, 433 MHz, 900 MHz, and the like. The RFID tag 100 according to the present invention uses the UHF (Ultra-High Frequency) frequency band of 900 MHz level for communication. When the RFID tag 100 uses the UHF frequency band, the recognition distance is extended to allow communication with a remote reader. This also creates the effect of making the RFID tag 100 applicable to a wider field. However, the RFID tag 100 according to the present invention does not use only the UHF frequency band. For example, the RFID tag 100 may also use a high frequency (HF) frequency band of 13.56 MHz. However, in this case, since the recognition distance is very short, there exists a defect that the RFID tag 100 can be applied only to a very limited field. Thus, the RFID tag 100 in the above case is more preferably designed as proposed in the Republic of Korea Utility Model Registration No. 412,323 "extended RFID tag".

As already mentioned, the RFID tag 100 has an electromagnetic wave absorber 110 in an embodiment of the present invention. The electromagnetic wave absorber 110 absorbs electromagnetic waves and functions to prevent scattering of electromagnetic waves, as in the electromagnetic wave shielding agent in the embodiment of the present invention. RFID tag 100 is able to perform its function without any effect even if attached to a metallic object using this property of the electromagnetic wave absorber 110. On the other hand, the RFID tag 100 may be provided with an electromagnetic shielding agent as an alternative means of the electromagnetic wave absorber 110 in the embodiment of the present invention. In this case, the electromagnetic wave shielding agent may be taken into consideration as proposed in Korean Patent Registration Publication No. 717,629.

RFID tag 100 is formed of a passive tag in the embodiment of the present invention may be formed of a general or active tag. Here, the characteristics of the passive tag and the active tag will be described as follows. Passive tags are commonly used and consist of an antenna and an IC chip. These passive tags operate in a manner that rectifies the AC current induced by the antenna into a DC current and applies it to the IC chip when it falls within the electromagnetic field emitted by the antenna, causing the IC chip to send data to the reader side. Active tags, on the other hand, have a built-in battery and operate by emitting RF signals at set time intervals while the battery is powered. These active tags can be used for long-distance transmission and reception, but they are expensive because they are expensive and are limited by the service life of the battery.

The electromagnetic wave absorber 110 may be formed of alloy powder or ferrite-based powder (eg, nickel-zinc ferrite (sanddust-based, permalloy-based, mollypermalloy-based, amorphous), or the like. Ni-Zn ferrite), manganese-zinc ferrite (Mn-Zn ferrite, etc.) are prepared in a roll type by mixing the resin with a predetermined mixing ratio. Here, the mixing ratio between the powder and the resin may vary depending on the required performance or processing conditions, thereby resulting in a difference in absorption rate for each frequency band used. Preferably the weight ratio compounding ratio between powder and resin is 60-90: 40-10.

The electromagnetic wave absorber 110 is made of a square plate-shaped body (preferably a roll type) in the embodiment of the present invention. The electromagnetic wave absorber 110 may be implemented to have a high electromagnetic wave absorbing power, thin thickness, light weight, excellent strength, excellent workability, strong adhesion. To this end, the electromagnetic wave absorber 110 may be referred to in the manufacture of the Republic of Korea Patent Publication No. 2006-123659, Republic of Korea Patent Publication No. 2007-7310. On the other hand, the electromagnetic wave absorber 110 may be a sheet type. However, when the electromagnetic wave absorber 110 is a roll type, it is more preferable because it is advantageous to the manufacturing process that proceeds continuously.

On the other hand, in the embodiment of the present invention, the electromagnetic wave absorber 110 may be manufactured by impregnating a metal alloy flaked (plate-shaped) into the polymer resin solution. The electromagnetic wave absorber 110 is coated with a thin metal alloy surface by the polymer resin liquid, the surface resistance is close to the insulation, and produces an effect of improving the adhesive strength during transfer by strengthening the bonding force between the metal alloy and the resin. This also produces the effect of not having the insulating layer 120 in the embodiment of the present invention. In addition, the electromagnetic wave absorber 110 is improved in the filling rate can be expected high performance, and the convenience in the manufacturing process is improved than before.

The above-described electromagnetic wave absorber 110 may be manufactured by the following method in the embodiment of the present invention. 4 is a flowchart illustrating a method of manufacturing an electromagnetic wave absorber in an RFID tag according to a preferred embodiment of the present invention.

Referring to FIG. 4, first, a metal alloy is prepared (or manufactured) (S400). The metal alloy may comprise one or more of the metal powder components already mentioned. However, it is also possible to use a ferrite powder instead of the metal alloy in the present invention, in which case the step S405 described later is omitted. Next, the metal alloy is processed into a flake state (S405). As a processing method, a wet method or a dry method may be used, thereby maximizing the effect of absorbing electromagnetic waves and dissipating it into heat.

On the other hand, a polymer resin solution is prepared (S410). Specifically, a polymer resin solution having a low viscosity (coefficient of viscosity) is prepared by mixing a polymer resin and a solvent for dissolving the polymer resin in a constant ratio. In the embodiment of the present invention, the polymer resin is acrylic resin, urethane resin, melamine resin, silicone resin, fluorine resin, EPDM (Ethylene Propylene Diene Monomer), polypropylene, polyethylene, polyvinyl chloride, chlorinated polyethylene, PVDF (Polyvinylidenefluoride), Polyester, polyamide, polymethyl methacrylate and the like can be used. As the solvent, toluene, chloroform, xylene, benzene, dichloromethane, dichloroethane, tetrachloroethane, dichloroethylene, tetrachloroethylene, chlorobenzene, acetone, methyl ethyl ketone, methyl butyl ketone, methyl isobutyl ketone, etc. may be used. Can be.

Next, the metal alloy is impregnated into the polymer resin solution (S415). In this case, as mentioned above, the metal alloy surface may be coated by the polymer resin solution, but in order to uniformly coat the surface, stirring is required. After stirring, the metal alloy is allowed to settle and the polymer resin solution is removed. Thereafter, the solvent remaining in the hot air spray drying method is removed before the metal alloy is completely solid (S420). After the step S420, the metal alloy is aggregated or entangled to form a lump.

Next, the lump-shaped metal alloy is granulated through filtering (S425). Filtering is required because it is necessary to granulate the metal alloy in which the agglomeration or entanglement has occurred for the next operation, and proceeds to the process of passing the metal alloy through a predetermined mesh network. This step S425 may be omitted in the embodiment of the present invention. On the other hand, the non-granulated metal alloy is granulated through a separate grinding process.

Next, the metal alloy in the powder state is processed (heated, pressurized, etc.) by pressing, calendering, extrusion, or the like (preferably calendering) to manufacture the electromagnetic wave absorber 110 (S430).

A description with reference to FIGS. 1 and 2 is as follows.

The insulating layer 120 is to prevent the antenna 132 from being affected by the surface resistance of the electromagnetic wave absorber 110, and is formed to have a predetermined thickness on the electromagnetic wave absorber 110 in the embodiment of the present invention. In the present invention, the insulating layer 120 may be formed only at the lower end of the portion in which the antenna 132 is to be installed, but is not limited thereto.

The electromagnetic wave absorber 110 is manufactured in a roll type as described above in the embodiment of the present invention. In this case, the electromagnetic wave absorber 110 has a surface resistance of about 10 ³ to 10 ⁷ 채 without the surface being completely insulated. However, this surface resistance prevents smooth operation when the antenna 132 is formed on the electromagnetic wave absorber 110. Therefore, the insulating layer 120 is provided on the electromagnetic wave absorber 110 for prevention thereof.

As the material of the insulating layer 120, an organic chemical coating agent such as urethane, polyester, acrylic, or the like may be used. The insulating layer 120 is preferably formed to have high insulation and low loss rate over a wide frequency band and to have excellent heat resistance and corrosion resistance (that is, to improve durability). Thus, the insulating layer 120 may be taken into consideration as proposed in Korean Utility Model Registration No. 364,947.

Meanwhile, the insulating layer 120 may not be provided in the RFID tag 100 under the condition that the antenna 132 is not affected by the surface resistance formed on the electromagnetic wave absorber 110. In the present invention, in consideration of this point, thermal stamping may be applied to the antenna 132 pattern formation. A more detailed description thereof will be described later.

The IC chip 130 stores data (for example, object information on which the RFID tag 100 is installed) and performs a control function so that the data can be transmitted to the outside. The IC chip 130 is formed on one side of the insulating layer 120 in the embodiment of the present invention. Specifically, the IC chip 130 is attached to the insulating layer 120 to enable wired and wireless communication with the antenna 132 using a conductive adhesive (paste).

The antenna 132 forms an electromagnetic field to activate the RFID tag 100. In addition, the antenna 132 transmits an electromagnetic wave to a space for transmitting and receiving data or performs the function of receiving the electromagnetic wave from the space. The antenna 132 is formed on the insulating layer 120 using a printing method or a thermal transfer printing method using a conductive ink in an embodiment of the present invention. The antenna 132 may be formed in various forms such as a pad type and a gate type. The antenna 132 may be formed at a close distance of the IC chip 130 or may be connected to one side of the IC chip 130 so that wired and wireless communication with the IC chip 130 may be performed. Is formed. The material of the antenna 132 is preferably excellent in malleability and ductility so as to be suitable for UHF band characteristics, and has a high degree of backscattering.

The protective coating layer 300 is formed on the outer surface of the RFID tag 100 to protect the integrated RFID tag 100 and to reinforce external pressure or impact. The protective coating layer 300 is generally formed throughout the RFID tag 100, but may be coated only on a portion (for example, a portion where the IC chip 130 and the antenna 132 is formed). The most important thing to note in forming the protective coating layer 300 is that it should not have any influence on the normal operation of the RFID tag 100. In consideration of this, the protective coating layer 300 is preferably selected from the material.

The protective coating layer 300 is ABS resin (Acrylonitrile Butadiene Styrene copolymer), polyethylene terephthalate (PET; Poly-Ethylene Terephthalate), engineering plastics, teflon-based fluorocarbon resin, polyvinyl chloride (PVC) Or the like can be produced. In this case, the protective coating layer 300 can generate effects such as excellent chemical resistance and impact resistance, light weight.

Next, a method of manufacturing the RFID tag 100 according to the preferred embodiment of the present invention having the above-described configuration will be described. 5 is a flowchart illustrating a method of manufacturing an RFID tag according to an exemplary embodiment of the present invention. Referring to FIG. 5, the manufacturing method of the RFID tag 100 is largely classified into five steps. Hereinafter, each step will be described in detail as follows.

[First Step] Manufacturing Electromagnetic Wave Absorber 110

In the embodiment of the present invention has already been mentioned that the electromagnetic wave absorber 110 is manufactured in a roll type. In the present invention, a method such as coating, calendering, and extrusion may be used to manufacture the electromagnetic wave absorber 110. When the coating method is used, an acrylic emulsion, urethane, melamine, silicone resin, or the like may be used as the resin. In addition, when the calendering method is used, the resin is ethylene propylene rubber (ethylene propylene rubber), EPDM (Ethylene Propylene Diene Monomer), polypropylene (PP; Poly Propylene), natural rubber, polyvinyl chloride, chlorinated polyethylene (CPE; Chlorinated). Poly-Ethylene) and the like can be used. In addition, when the extrusion method is used, polyvinyl chloride, ABS resin, ASA (Acrylonitrile Styrene Acrylate), polypropylene, or the like may be used as the resin.

[Second Step] Forming Insulating Layer 120 Closely on Electromagnetic Wave Absorber 110

In the embodiment of the present invention, the reason why the insulating layer 120 should be formed on the electromagnetic wave absorber 110 has been described. In addition, in some cases (that is, when thermal transfer printing is applied to the antenna 132 pattern formation, which will be described later), the insulating layer 120 may not be formed. Of course, in the present invention, it is most preferable to form the insulating layer 120 for smooth operation of the RFID tag 100. The insulating layer 120 is coated on the electromagnetic wave absorber 110 thin enough to serve as an insulator.

Meanwhile, before or after this step, a pretreatment process for cleaning foreign matter on the surface may be added to improve adhesion between materials.

[Third Step] The antenna 132 is formed in a specific pattern on the insulating layer 120.

In this step, a plurality of antennas 132 are formed on the insulating layer 120 according to a specific pattern. This is because the size of the insulating layer 120 is considerable compared to the size of the antenna 132. Of course, if the size of the insulating layer 120 is similar to the size of the antenna 132, it is also possible to form only one antenna 132.

In the present invention, the following methods are used to form the antenna 132 on the insulating layer 120 in a specific pattern. First, the present invention uses a printing method using conductive ink. Secondly, the present invention utilizes a thermal transfer printing method. First, the printing method using the conductive ink will be described, and then the thermal transfer printing method will be described.

(1) Printing method using conductive ink

In the past, a printing method using a conductive paste was mainly used for the third step. By the way, in recent years, many printing methods using conductive ink have been used for the purpose of cost reduction, mass production, and the like. In the present invention, the third step is realized through the following process through the printing method using the conductive ink.

First, the antenna 132 is printed in a specific pattern using conductive ink on the upper surface of the insulating layer 120. Next, this is fired at a predetermined temperature to fix the printed antenna 132. In some cases, a drying process may be added thereto to improve fixation force. The above is a method (first method) in which the antenna 132 is directly formed on the insulating layer 120 in a specific pattern. Of course, the present invention is not limited thereto, and a method (second method) of forming the antenna 132 on another substrate and then attaching the insulating layer 120 through an adhesive may be possible. This case can be accomplished by the following process. First, the antenna 132 is printed in a specific pattern using a conductive ink on a substrate such as paper or film. Next, it is fired at a predetermined temperature to fix the printed antenna 132. Next, the IC chip 130 is bonded to the antenna 132. Thereafter, the adhesive may be applied to one surface of the substrate and attached to the upper surface of the insulating layer 120 through the adhesive.

However, the reason why the first method is preferable to the second method is that it does not require the use of an adhesive, so that the thickness of the RFID tag 100 can be made thinner. In addition, the bonding force between the insulating layer 120 and the antenna 132 may be further improved, and defects caused by defects in the bonding portion of the IC chip 130 may also be reduced. This ultimately results in higher performance uniformity of the RFID tag 100.

The printing method using the conductive ink has an advantage of improving the bonding strength and tensile strength between the pastes after printing than the conventional method. In addition, even when applied in a thin thickness, excellent electrical conductivity can be achieved, and the phenomenon of easy bending is also eliminated. Printing methods using conductive inks achieve these effects through the firing process.

In the embodiment of the present invention, as the conductive ink, an ink containing silver (Ag) having excellent conductivity is preferably used. In this case, the composition proposed in Korean Patent Registration Publication No. 658,492 may be considered. However, the present invention is not limited to this, and it is also possible to use inks containing fillers of gold (Au), copper (Cu), nickel (Ni), silver-copper mixtures, silver-nickel mixtures, and the like. In addition, in the present invention, carbon black, graphite, graphite, carbon nanotubes, polyacetylene, polypyrrole, poly-anyline, polythiophene, poly-thiophene Ink containing a conductive polymer such as) as a filler is also possible. On the other hand, the conductive ink can also have ferromagnetic properties and excellent electrical reliability. In this case, as the conductive ink, the composition proposed in Korean Patent Registration Publication No. 697,981 may be used.

Printing methods using the above-described inks include inkjet printing, silkscreen printing, gravure printing, spin coating, roll coating, offset printing, pad printing, marking printing, dispensing printing, flexography, lithography ( lithography) and the like can be used.

(2) thermal transfer printing method

Conventionally, in addition to the printing method using a conductive paste, a stamping method using a metal foil was also used. Stamping method using a metal foil proceeds by stamping in a predetermined pattern after treating one surface of the metal foil with an adhesive. The use of the metal foil enables the generation of the RFID tag 100 having a thinner thickness than the use of the conductive paste or the conductive ink. In addition, better physical properties and higher electrical conductivity can be obtained, with excellent flexibility and little variation in local electrical conductivity. However, it is very difficult to print a thin metal foil in a complex pattern (especially this problem is apparent when the pattern must be formed at the edge portion or the thin width), and when stamping on the insulating layer 120, 120 or the electromagnetic wave absorber 110 may be damaged. Also, if the antenna 132 and the IC chip 130 are stamped on the other substrate and then formed on the insulating layer 120 to solve the problem, weakening of the bonding force of the bonded IC chip 130 mentioned above is problematic. Thus, the present invention proposes a thermal transfer printing method for a complete solution of this problem.

The thermal transfer printing method refers to a method of transferring a metal thin film onto a specific material in the shape of a mold by placing a mold having a desired pattern shape on a thin metal thin film and applying heat and pressure. By using the thermal transfer printing method, a complicated antenna pattern can be easily formed. This is because thermal transfer is easy if the mold is manufactured precisely according to the shape of the antenna pattern. In addition, since the bonding of the IC chip 130 is finally performed, the problem of weakening of the bonding force does not occur.

In this embodiment, the metal thin film is preferably coated with a thermoplastic resin layer (for example, polyethylene. See below) on one surface of the metal thin film. When both the thermoplastic resin layer and the insulating layer laminated on the metal thin film layer during thermal transfer are thermoplastic resins, adhesion between the antenna pattern and the absorber sheet may be improved according to thermal transfer printing.

In addition, the thermoplastic resin laminated on the metal thin film layer in the thermal transfer printing method has an effect of replacing the insulating layer 120 coated on the electromagnetic wave absorber 110. This is because the thermoplastic resin coated on the metal thin film may actually serve as an insulating layer.

On the other hand, the metal thin film used for thermal transfer printing is preferably made of a material having excellent electrical conductivity. Accordingly, the metal thin film may be nickel foil, aluminum foil, copper foil, gold foil, silver foil, permalloy foil, or the like. Preferably, nickel foil, aluminum foil, copper foil, etc. are used as a metal thin film.

In the present invention, the thermal transfer printing method is performed according to the following process in view of the above. First, the thermal transfer metal thin film sheet is adhered on the insulating layer 120. Thereafter, a mold having an antenna pattern shape is placed thereon. Thereafter, it is heated or pressurized downward from the top. Then, only the thermoplastic resin of the heated metal thin film sheet is melt | dissolved according to the shape of a metal mold | die. Thereafter, when the bonded metal thin film sheet is removed, the antenna 132 according to the present invention can be formed on the insulating layer 120.

On the other hand, it can be pointed out that the above-mentioned thermal transfer printing method simply introduces a conventional thermal transfer method. Conventional thermal transfer method has been used in many applications for coating metal foil on business cards or wrapping paper. However, these are not only for forming a conductive pattern, nor are they conductive. This is because the conductivity of the material is very weak and the thickness is also thin. On the other hand, in the present invention, since the conductive pattern is formed on the insulating layer 120 by the required thickness, it cannot be seen that the conventional method is simply introduced.

On the other hand, in the present invention, it is preferable to limit the thickness of the metal thin film to be used to 10 to 100 µm in view of the characteristics of the thermal transfer printing method. When the thickness of the metal thin film is thinner than 10 μm, it may not have sufficient electrical conductivity and may be easily torn. In addition, when the thickness of the metal thin film is thicker than 100㎛, the applicability is poor due to the thick antenna pattern, it is difficult to expect the improvement of conductivity.

[Step 4] Bonding the IC chip 130 on the insulating layer 120 on which the antenna 132 having a specific pattern is formed.

In this step, the plurality of IC chips 130 are electrically connected to the plurality of antennas 132 having a specific pattern in a one-to-one correspondence. Specifically, a conductive adhesive such as silver paste is applied near the antenna 132 to attach the IC chip 130. Such a conductive adhesive may be applied on the insulating layer 120 to form the antenna 132 in the previous step. In this case, the coating process can of course be omitted. Then, the IC chip 130 is attached on it, which needs to be bonded to the antenna 132. This portion is then heated and pressurized so that the IC chip 130 is electrically connected and connected to the antenna 132.

Conventionally, the IC chip 130 is assembled on the insulating layer 120 by manual operation, and thus, the bonding force of the bonded IC chip 130 is very weak, and thus a phenomenon of easily detaching occurs. In the case of forming the IC chip 130 and the antenna 132 together on another substrate and then attaching the IC chip 130 and the antenna 132 together on the insulating layer 120, the insulating layer (even if the IC chip 130 is printed on the substrate using conductive ink) In order to form the same, there is a problem of bonding again using a conductive paste. This may expose the disadvantage of weakening the physical properties of the IC chip 130. However, in the method according to the preferred embodiment of the present invention, the IC chip 130 is bonded just before the sixth step (to form the protective coating layer 300 on the skin), which will be described below.

[Step 5] Cutting the RFID Tag Structure

On the RFID tag structure manufactured through the first to fourth steps, a plurality of IC chips 130 and antennas 132 forming a one-to-one correspondence are provided. In this step, the RFID tag structure is cut to a predetermined size in consideration of mounting of a pair of IC chips 130 and an antenna 132 on one RFID tag 100.

In the conventional case, the combination of the electromagnetic shielding agent and the insulating layer (or the sole of the electromagnetic shielding agent) is cut to a size suitable for mounting one IC chip 130 and the antenna 132. Thereafter, a combination of the IC chip 130 and the antenna 132 generated through another process is attached thereto. Therefore, the attachment process was made by hand. On the other hand, in the present invention, since the cutting is performed after the first to fourth steps are performed in order, automation is possible.

[Sixth Step] A protective coating layer 300 is formed on the outer surface of the RFID tag 100 on which the IC chip 130 and the antenna 132 are mounted.

The RFID tag 100 manufactured through the first to fifth steps is virtually a finished product. In other words, the RFID tag 100 may be used as it is, and there is no problem in performance. However, when the IC chip 130 and the antenna 132 are exposed to the surface of the RFID tag 100, its lifespan may be shortened due to prolonged use or repeated use, which also causes cost problems. Thus, in the present invention, it is preferable to form a protective coating layer 300 on the outer shell of the RFID tag 100 in order to solve the above problems and to protect from external impact.

In the present invention, when the protective coating layer 300 is formed only on the upper surface where the IC chip 130 and the antenna 132 are formed, the order of the fifth and sixth steps may be changed.

The above description is merely illustrative of the technical spirit of the present invention, and those skilled in the art to which the present invention pertains various modifications, changes, and substitutions without departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical spirit of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by the embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

In contrast to the conventional RFID tag manufacturing process of manually or semi-automatically assembling the preformed absorber sheet and antenna pattern through each process in preparing the RFID tag, the present invention uses a roll type absorber sheet, and the absorber sheet By introducing a process of directly and integrally forming an antenna pattern thereon, RFID tags can be mass-produced through one automated process line. In addition, since the present invention integrally forms the antenna pattern on the absorber sheet or the insulating layer, the adhesion between the sheet and the antenna can be improved, and the reusability and durability of the RFID tag can be improved.

Claims (16)

In the method of manufacturing an RFID tag, (a) supplying a roll type electromagnetic wave absorber through a continuous process line; (b) forming an insulating layer on the surface of the supplied electromagnetic wave absorber; (c) forming an antenna pattern on the insulating layer; And (d) attaching an IC chip to the antenna pattern Including; In step (d), (d1) applying a conductive adhesive or conductive paste to the position where the IC chip is attached; And (d2) attaching the IC chip at a portion where the conductive adhesive or the conductive paste is applied; Method of manufacturing an integrated RFID tag comprising a. The method of claim 1, The antenna pattern forming in the step (c) is a method of manufacturing an integrated RFID tag, characterized in that using any one of a thermal transfer printing method or a printing method using a conductive ink. The method of claim 1, The electromagnetic wave absorber in the step (a), (a1) impregnating at least one magnetic material selected from a metal alloy powder or a ferrite powder into a polymer resin solution containing a polymer resin and a solvent to coat the surface of the magnetic material with the polymer resin solution; (a2) drying the magnetic material coated with the polymer resin solution; And (a3) heating or pressurizing the dried magnetic material to form a predetermined shape Method of manufacturing an integrated RFID tag, characterized in that it is manufactured through. The method of claim 2, The thermal transfer printing method, (c1) depositing a metal thin film on the insulating layer; (c2) placing a mold having a predetermined antenna pattern on the metal thin film; (c3) transferring the antenna pattern provided in the mold to the electromagnetic wave absorber by heating or pressing the mold; And (c4) removing the metal thin film which is not transferred to the electromagnetic wave absorber from the metal thin film Method of manufacturing an integrated RFID tag comprising a. The method of claim 4, wherein The method of manufacturing an integrated RFID tag, wherein a thermoplastic resin layer is formed on one surface of the metal thin film in contact with the insulating layer. The method of claim 4, wherein The thickness of the metal thin film is a manufacturing method of the integrated RFID tag, characterized in that 10㎛ to 100㎛. The method of claim 2, The printing method using the conductive ink, (c1) printing a predetermined antenna pattern on the insulating layer with conductive ink; And (c2) firing the resultant product produced in the step (c1) to a constant temperature; Method of manufacturing an integrated RFID tag comprising a. The method of claim 1, (e) forming a coating layer for protecting the RFID tag on the surface to which the IC chip is attached; Method of manufacturing an integrated RFID tag further comprising a. delete The method of claim 1, The electromagnetic wave absorber in the step (a) comprises at least one powder component and a resin selected from the group consisting of sand dust, permalloy, molally permalloy, nickel-zinc ferrite and manganese-zinc ferrite, wherein the powder content is an absorber 60 to 90% by weight of the total component manufacturing method of the integrated RFID tag. The method according to any one of claims 1 to 8, and 10, Cutting the RFID tag on which the antenna pattern is formed to a predetermined size Method of manufacturing an integrated RFID tag further comprising a. In the method of manufacturing an RFID tag, (a) impregnating at least one magnetic material selected from a metal alloy powder or a ferrite powder into a polymer resin solution containing a polymer resin and a solvent to coat the surface of the magnetic material with the polymer resin solution; (b) drying the magnetic material coated with the polymer resin solution; (c) heating or pressing the dried magnetic material to form an electromagnetic wave absorber having a predetermined shape; (d) supplying the molded electromagnetic wave absorber on a continuous process line, and forming an antenna pattern on the surface of the supplied electromagnetic wave absorber; And (f) attaching an IC chip to the antenna pattern Method of manufacturing an integrated RFID tag comprising a. Electromagnetic wave absorbers; An insulating layer formed on one surface of the electromagnetic wave absorber; An antenna pattern integrally formed on the insulating layer; And An IC chip attached to the conductive adhesive coating layer or the conductive paste coating layer formed on the insulating layer, and connected to the antenna pattern An integrated RFID tag comprising a. The method of claim 13, And the antenna is printed by thermal transfer or printed using conductive ink. The method of claim 14, And the antenna is formed by stacking a metal thin film on the insulating layer, placing a mold having a predetermined antenna pattern on the metal thin film, and heating or pressing the mold. The method of claim 14, And the antenna is fired after printing a predetermined antenna pattern with the conductive ink on the insulating layer.

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