CN203941538U - Electronic tag and inlay thereof - Google Patents
Electronic tag and inlay thereof Download PDFInfo
- Publication number
- CN203941538U CN203941538U CN201420305197.5U CN201420305197U CN203941538U CN 203941538 U CN203941538 U CN 203941538U CN 201420305197 U CN201420305197 U CN 201420305197U CN 203941538 U CN203941538 U CN 203941538U
- Authority
- CN
- China
- Prior art keywords
- slab
- dielectric
- chip
- antenna
- electronic tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Aerials (AREA)
Abstract
The utility model relates to REID field, and a kind of electronic tag and inlay thereof are provided.Wherein, electronic tag inlay comprises: dielectric-slab, which is provided with pad; Chip and antenna, be connected with described dielectric-slab respectively, realizes the electrically conducting between chip and antenna; Protective materials, is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; Protective sleeve, is positioned at the outside of protective materials, by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthens the structural strength of described electronic tag inlay.Electronic tag inlay reliable in structure, intensity that the utility model provides are high and flexible or stretch.
Description
[technical field]
The utility model relates to REID field, particularly relates to a kind of electronic tag and inlay thereof.
[background technology]
Radio-frequency (RF) identification (Radio Frequency Identification, RFID) technology is as a kind of emerging short-distance wireless communication technology, compare bar code and other recognition technologies, REID has the plurality of advantages such as sweep velocity is fast, discrimination is high, antijamming capability is strong, is widely applied in different industries at present.
Electronic tag is the core of REID, generally pastes by gum or screw is fixed on and is identified on object.Electronic tag is generally made up of chip, antenna, base material and package casing four parts, chip is used for storing the relevant information of object, antenna is used for receiving and launched microwave signal, and base material is as the carrier of fixed chip and antenna, jointly determining the various functional attributes of antenna with parameters such as antenna specification and frequency of operation, as gain, impedance, bandwidth and radiance etc.Antenna substrate is generally divided into soft base material and hard base material, corresponding electronic tag is called soft label and hard label, soft base material can adopt polyethylene terephthalate (polyethylene terephthalate, PET), polypropylene (Polypropylene, or teflon (Polytetrafluoroethene PP), the material such as PTFE), and hard base material general adopt FR4, pottery even the material such as glass make.On base material, form the geomery of antenna by etching or electrically conductive ink typography, then use chip on board (Chip On Board, COB) or lose money instead of making money the techniques such as hot pressing chip is arranged on to assigned address, form electrical connection with sky wire pin.The effect of package casing is in order to protect chip and antenna not affected by environment.Soft label generally covers on antenna conductive material is protected with dielectric film, prevents from causing property abnormality with air catalytic oxidation; And for the protection of hard label, generally adopt the method for direct spraying three anti-paint on antenna and base material, or die sinking fabrication plastic casing; then by ultrasound wave hot melt mode, body seal is got up; the label shell that this mode encapsulates, structure is relatively firm, but cost is higher.
But, under some site environments, due to shape irregular or large (as circle or the tubular articles) of curved surface of identified object itself, the position of neither one relatively flat is used for pasting and fixed labels, now adopts hard label just cannot install, because the encapsulating material of the no matter inner base material of hard label or outside, all hard material, cannot be bending, once stressed bending, will cause shell breakage, even inside antenna base material fracture; And although soft label can adapt to bending by a relatively large margin, between chip and antenna, adopt conducting resinl to connect, its undercapacity, and because its packaging technology is simple, cannot bear external impacts, therefore also cannot be useful in more severe site environment.
Most electronic tag in the market, all require in use body surface as far as possible smooth, otherwise label cannot effectively be installed.The base material of hard label and package casing just cannot flexural deformations after completing, and are screwed in smooth body surface so must paste or adopt; Although and soft label has certain flexibility, technique is simple, package reliability is poor, cannot successfully manage the various environmental changes such as rainwater, dust, acid and alkali corrosion and mantle friction, stressed impact.
Also there are some electronic tags, adopt at uneven body surface borehole, then label is embedded or is partly embedded in hole.Although this mode does not rely on the flatness of body surface to a certain extent, but due to the structure of object itself is destroyed, under a lot of applicable cases, user cannot accept, and hollow out with embedded tags itself and also can produce a lot of costs, therefore the application mode of this electronic tag is very restricted.
In published patent, publication number CN202904630U, open day provide a kind of RFID elasticity electronic tag for the Chinese patent of 2013.04.24, it adopts has flexible imitative spring antenna, on radio-frequency module substrate, label chip and spring antenna are electrically connected, then seal with fastening sealing, although adopt this frame mode antenna to there is reasonable elasticity, the structural strength deficiency of connecting portion.
Publication number CN102054194B, open day provide a kind of RFID electronic tire tag and manufacture method thereof for the Chinese patent of 2011.05.11; it is also to adopt spring antenna to adapt to various stress and bent change; Electronic Tag Structure and CN202904630U are similar; but chip and antenna interconnecting piece position do not have structural preservation; be easy to be subject to damage, can only be arranged in rubber tyre and use.
Publication number CN1801190A, open day provide a kind of special electronic label for automobile engine for the Chinese patent of 2006.07.12, it adopts protective metal shell to be used for fixing whole label, protective metal shell is in whole packaged label both sides, on it, there is screw hole, be used for label to be arranged on the body of motor car engine.
Publication number CN103679253A, within open day, for providing a kind of high temperature resistant RFID ultrahigh frequency that can repeatedly wash, the Chinese patent of 2014.03.26 washs label and production technology, it is at pcb board, chip, base material antenna outer cover has seal protection cover, the material of protective sleeve is silica gel, but this protective sleeve is not in order to protect chip and circuit board, a but package cover of whole electronic tag, be equivalent to spring antenna, chip and circuit board all get up with silica gel sealing, and then vacuumize discharge the inside air, the essence of this protective sleeve is exactly the shell of electronic tag.
Above-mentioned patent, and prior art all fails to provide a kind of bending that can adapt in various degree, and structural strength electronic tag inlay very reliably.Given this, overcoming the existing defect of above-mentioned prior art is the art problem demanding prompt solution.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of bending that can adapt in various degree, and structural strength electronic tag inlay very reliably, and the electronic tag that adopts this electronic tag inlay to make.
The utility model adopts following technical scheme:
A kind of electronic tag inlay, described electronic tag inlay comprises:
Dielectric-slab, described dielectric-slab is provided with pad;
Chip and antenna, described chip is connected with described dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna;
Protective materials, described protective materials is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve; described protective sleeve is positioned at the outside of protective materials; by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthen the structural strength of described electronic tag inlay.
Further, described protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties.
Further, described protective sleeve is heat-shrink tube, metal sleeve or rigid plastic casing-pipe; The diameter of described protective sleeve is a bit larger tham the width of described dielectric-slab, and the length of protective sleeve is greater than the length of dielectric-slab.
Further, described chip adopts the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or described chip is fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
Described antenna is connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, described antenna is threaded connection mode and is connected with the pad of dielectric-slab, or the position being connected with antenna at the two ends of described pad offers metallic vias, the metal wire that is connected one end on described antenna with pad is through in metallic vias and is welded in one with pad.
Further, described antenna is helical wire or the copper litz wire of plain metal line, spring structure; Described antenna comprises two parts equal in length, is connected to the both sides of dielectric-slab.
Further, described dielectric-slab is glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate.
The utility model also provides a kind of electronic tag, and described electronic tag is made up of above-mentioned electronic tag inlay encapsulation.
Compared with prior art, the beneficial effects of the utility model are:
The utility model is by providing a kind of reliable in structure, high strength, flexible electronic tag inlay, inlay itself has very high intensity, can bear very large external impacts, the Electronic Tag Structure that has made to apply this electronic tag inlay is very reliable, can bear pressure and jerk significantly, can also bear bending or stretching by a relatively large margin, and after electronic tag bending, can recover original shape and not affect any performance, thereby solve existing electronic tag and cannot effectively be applied to the difficult problem on the smooth object of air spots or curved surface larger object.
Electronic tag inlay manufacture craft of the present utility model is simple, because have protective sleeve as carrier, when injecting glue, can operate quickly and easily, is applicable to batch production.
Electronic tag inlay of the present utility model is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, no matter adopt injection moulding sealing or additive method, all without operation or the pressure of worrying technique itself, inlay is caused damage or affects its electric property.
Electronic tag inlay of the present utility model can directly be applied on the object that needs identification, thereby or adopts Elastic plastic-rubber sealing to be arranged on flexibly on the object of various surface imperfections.
[brief description of the drawings]
Fig. 1 is the electronic tag inlay decomposition texture schematic diagram of the utility model embodiment 1;
Fig. 2 is the structural representation of the electronic tag inlay of the utility model embodiment 1.
Reference numeral:
10-dielectric-slab, 20-chip, 30-spring antenna, 40-protective sleeve.
[embodiment]
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
In addition,, in each embodiment of described the utility model, involved technical characterictic just can combine mutually as long as do not form each other conflict.
The utility model embodiment provides a kind of electronic tag inlay, and it comprises:
Dielectric-slab, which is provided with pad;
Chip and antenna, be connected with dielectric-slab respectively, realizes the electrically conducting between chip and antenna;
Protective materials, is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve, is positioned at the outside of protective materials, by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthens the structural strength of electronic tag inlay.
Below each specific embodiment is elaborated:
embodiment 1:
Fig. 1 is made up of a kind of electronic tag inlay that the utility model embodiment 1 provides with Figure 2 shows that dielectric-slab 10, chip 20, antenna, protective materials and protective sleeve 40 5 parts, wherein:
On dielectric-slab 10, be provided with pad; Dielectric-slab 10 can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate (being PTFE plate), or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad;
Chip 20 is connected with dielectric-slab respectively with antenna, realizes the electrically conducting between chip 20 and antenna, in the present embodiment, antenna is the helical wire (being designated hereinafter simply as spring antenna 30) of spring structure, can certainly adopt other to there is the antenna that the metal construction of certain bending and stretch characteristics is made as plain metal line etc., spring antenna 30 comprises two parts equal in length, be connected to the both sides of dielectric-slab 10, in the present embodiment, the length of every partial spring antenna 30 is about 1/4th (in concrete application of radiofrequency signal wavelength, the length of spring antenna 30 is selected the pitch of the laps diameter with spring antenna 30, the interval of antenna wire diameter and each circle is relevant, according to the pitch of the laps diameter of spring antenna 30, the length of spring antenna 30 every parts is finally determined at the interval of antenna wire diameter and each circle), chip 20 can adopt the packaging body with pin to be connected on the pad of dielectric-slab 10 by gold thread or scolding tin, or is fixed on dielectric-slab 10 by the naked brilliant COB technique that adopts, spring antenna 30 can be connected with the pad of dielectric-slab 10 by welding manner, or offer screw via hole at dielectric-slab 10 two ends, spring antenna 30 is threaded connection mode and is connected with the pad of dielectric-slab 10, or metallic vias is offered with the position that spring antenna 30 is connected in the two ends at pad, and the metal wire that is connected one end on spring antenna 30 with pad is through in metallic vias and is welded in one with pad,
Protective materials is packaged in dielectric-slab 10, chip 20 and is connected in the outside of the spring antenna 30 on dielectric-slab 10, for sealing the connecting portion of chip 20 and dielectric-slab 10, chip 20 and spring antenna 30, and bears certain external impacts; Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue;
Protective sleeve 40 is positioned at the outside of protective materials, by dielectric-slab 10, chip 20, spring antenna 30 and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip 20 and dielectric-slab 10, chip 20 and spring antenna 30, thereby ensure that chip 20 has minimum form factor, and as the carrier of protective materials, strengthen the structural strength of electronic tag inlay together with protective materials, can be used to protective medium plate 10 and chip 20 and in the time being subject to external impacts, avoid damaging; In the present embodiment, protective sleeve 40 is metal sleeve (being the sleeve pipe that metal material is made), and its diameter is a bit larger tham the width of dielectric-slab, and length is greater than the length of dielectric-slab.Wherein, metal sleeve can adopt stainless steel, iron, aluminium, copper and other metal materials to make.Certainly; can also adopt acrylonitrile-butadiene-styrene copolymer (Acrylonitrile butadiene Styrene copolymers; ABS), polycarbonate (Polycarbonate; PC), polyphenylene sulfide (Polyphenylene sulfide; PPS) the rigid plastic casing-pipe that, the material such as Polyvinylchloride (Polyvinyl chloride polymer, PVC), PTFE and PP is made is as protective sleeve 40.
Adopt the electronic tag inlay of the present embodiment to make electronic tag, not only solved the problem that electronic tag can be bending or stretches, and the structure of whole electronic tag will be very reliable, and can bear pressure and jerk significantly.After epoxide-resin glue solidifies, have very large hardness, after especially adopting metal sleeve protection, can bear very large external force collision, this is other flexible electronic labels or simply adopts the label construction of freezing plastic encapsulation not accomplish.
In addition, the electronic tag inlay of the present embodiment is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, so no matter adopt injection moulding sealing or additive method encapsulation, all without operation or the pressure of worrying technique itself, inlay caused damage or affects its electric property.
embodiment 2:
The electronic tag inlay that the present embodiment provides is made up of dielectric-slab, chip, antenna, protective materials and protective sleeve five parts equally, wherein:
On dielectric-slab, be provided with pad; Dielectric-slab can adopt the sheet materials such as glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate, or the sheet material of other applicable high-frequency signal transmission; Pad can adopt copper etching pad;
Chip is connected with dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna; In the present embodiment, antenna is copper litz wire, and copper litz wire comprises two parts equal in length, is connected to the both sides of dielectric-slab, and in the present embodiment, the length of every part copper braided wire is about 1/4th of radiofrequency signal wavelength; Chip can adopt the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or is fixed on dielectric-slab by the naked brilliant COB technique that adopts; Copper litz wire can be connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, copper litz wire is threaded connection mode and is connected with the pad of dielectric-slab, or metallic vias is offered in the position being connected with copper litz wire at the two ends of pad, the metal wire that is connected one end on copper litz wire with pad is through in metallic vias and is welded in one with pad;
Protective materials is packaged in dielectric-slab, chip and is connected in the outside of the copper litz wire on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and copper litz wire, and bears certain external impacts; Protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties, specifically can be according to the difference of electronic tag inlay packaging technology and environment for use (comprising serviceability temperature, intensity, impact etc.), adopt different materials as protective materials, for example adopt epoxide-resin glue, hot melt adhesive (or other thermoplastic cement), silicon rubber, aerogel, acrylate glue, one-component or multicomponent polymeric glue, high-temperature plastic and thermosetting polymer glue, etc.; In the present embodiment, adopt epoxide-resin glue;
Protective sleeve is positioned at the outside of protective materials, by dielectric-slab, chip, copper litz wire and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and copper litz wire, thereby ensure that chip has minimum form factor, and as the carrier of protective materials, strengthen the structural strength of electronic tag inlay together with protective materials, can be used to protective medium plate and chip and in the time being subject to external impacts, avoid damaging; In the present embodiment, protective sleeve is heat-shrink tube, and its diameter is a bit larger tham the width of dielectric-slab, and length is greater than the length of dielectric-slab.Wherein, heat-shrink tube can adopt the heat-shrink tube that tygon, polyene hydrogen class material are made.
Adopt the electronic tag inlay of the present embodiment to make electronic tag, not only solved the problem that electronic tag can be bending or stretches, and the structure of whole electronic tag will be very reliable, and can bear pressure and jerk significantly.After epoxide-resin glue solidifies, have very large hardness, after especially adopting heat-shrink tube protection, can bear larger external force collision, this is other flexible electronic labels or simply adopts the label construction of freezing plastic encapsulation not accomplish.
In addition, the electronic tag inlay of the present embodiment is as the inlay of other a lot of labels, there is very high suitability, because the structural strength of inlay own is very high, so no matter adopt injection moulding sealing or additive method encapsulation, all without operation or the pressure of worrying technique itself, inlay caused damage or affects its electric property.
embodiment 3:
The present embodiment provides a kind of electronic tag, and this electronic tag is made up of the electronic tag inlay encapsulation of embodiment 1 or embodiment 2.This Electronic Tag Structure is very reliable, can bear pressure and jerk significantly, can also bear bending or stretching by a relatively large margin, and after electronic tag bending, can recover original shape and not affect any performance, solve existing electronic tag and cannot effectively be applied to the difficult problem on the smooth object of air spots or curved surface larger object.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (7)
1. an electronic tag inlay, is characterized in that, described electronic tag inlay comprises:
Dielectric-slab, described dielectric-slab is provided with pad;
Chip and antenna, described chip is connected with described dielectric-slab respectively with antenna, realizes the electrically conducting between chip and antenna;
Protective materials, described protective materials is packaged in dielectric-slab, chip and is connected in the outside of the antenna on dielectric-slab, for sealing the connecting portion of chip and dielectric-slab, chip and antenna, and bears external impacts; And
Protective sleeve; described protective sleeve is positioned at the outside of protective materials; by dielectric-slab, chip, antenna and protective materials parcel, for preventing the interference of the connecting portion of external environment to chip and dielectric-slab, chip and antenna, and strengthen the structural strength of described electronic tag inlay.
2. electronic tag inlay as claimed in claim 1, is characterized in that, described protective materials is to have high temperature resistant and organic colloid or inorganic colloid insulative properties.
3. electronic tag inlay as claimed in claim 1, is characterized in that, described protective sleeve is heat-shrink tube, metal sleeve or rigid plastic casing-pipe; The diameter of described protective sleeve is a bit larger tham the width of described dielectric-slab, and the length of protective sleeve is greater than the length of dielectric-slab.
4. electronic tag inlay as claimed in claim 1, it is characterized in that, described chip adopts the packaging body with pin to be connected on the pad of dielectric-slab by gold thread or scolding tin, or described chip is fixed on dielectric-slab by the naked brilliant chip on board technique that adopts;
Described antenna is connected with the pad of dielectric-slab by welding manner, or offer screw via hole at dielectric-slab two ends, described antenna is threaded connection mode and is connected with the pad of dielectric-slab, or the position being connected with antenna at the two ends of described pad offers metallic vias, the metal wire that is connected one end on described antenna with pad is through in metallic vias and is welded in one with pad.
5. the electronic tag inlay as described in claim 1 or 4, is characterized in that, described antenna is helical wire or the copper litz wire of plain metal line, spring structure; Described antenna comprises two parts equal in length, is connected to the both sides of dielectric-slab.
6. electronic tag inlay as claimed in claim 1, is characterized in that, described dielectric-slab is glass mat, ceramic wafer, resin plate, composite plate, bakelite plate or Teflon plate.
7. an electronic tag, is characterized in that, described electronic tag is made up of the electronic tag inlay encapsulation described in claim 1-6 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420305197.5U CN203941538U (en) | 2014-06-10 | 2014-06-10 | Electronic tag and inlay thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420305197.5U CN203941538U (en) | 2014-06-10 | 2014-06-10 | Electronic tag and inlay thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203941538U true CN203941538U (en) | 2014-11-12 |
Family
ID=51860837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420305197.5U Expired - Fee Related CN203941538U (en) | 2014-06-10 | 2014-06-10 | Electronic tag and inlay thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203941538U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104050497A (en) * | 2014-06-10 | 2014-09-17 | 杨雪 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
| CN110245738A (en) * | 2018-03-09 | 2019-09-17 | 刘台华 | High temperature resistant RFID label tag |
| CN113644419A (en) * | 2021-10-18 | 2021-11-12 | 深圳市中天迅通信技术股份有限公司 | Spring rubber-coated antenna and production method thereof |
-
2014
- 2014-06-10 CN CN201420305197.5U patent/CN203941538U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104050497A (en) * | 2014-06-10 | 2014-09-17 | 杨雪 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
| CN110245738A (en) * | 2018-03-09 | 2019-09-17 | 刘台华 | High temperature resistant RFID label tag |
| CN113644419A (en) * | 2021-10-18 | 2021-11-12 | 深圳市中天迅通信技术股份有限公司 | Spring rubber-coated antenna and production method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104050497A (en) | Electronic tag inlay, processing method of electronic tag inlay and electronic tag | |
| JP3908549B2 (en) | RFID tag manufacturing method | |
| CN102339402B (en) | Method for manufacturing radio frequency tags with hot and cold stamping technology | |
| CN203941538U (en) | Electronic tag and inlay thereof | |
| KR20190057293A (en) | Tire insert type electronic tag and assembling process | |
| JP2008107947A (en) | Rfid tag | |
| CN102999777B (en) | Radio frequency identification electronic label and preparation method thereof | |
| CN101636750B (en) | Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method | |
| US20100079290A1 (en) | Rfid device having protective cap element and method of making | |
| CN203606858U (en) | RFID flexible tag | |
| CN101663750A (en) | Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device | |
| KR100898603B1 (en) | Integrated radio frequency identification tag and preparation method thereof | |
| CN205302350U (en) | Flexibility electronic tags that can stretch | |
| CN206515873U (en) | Tamper RFID | |
| CN201773418U (en) | Wireless radio frequency identification label | |
| CN103646269A (en) | RFID (radio frequency identification) flexible tag and packaging method thereof | |
| CN206258900U (en) | A kind of RFID label tag | |
| JP5969823B2 (en) | Non-contact type data receiving / transmitting body and resin molded body having the same | |
| CN102880900A (en) | RFID (radio frequency identification) electronic tag inlay | |
| CN205091779U (en) | Take electronic tags's instrument | |
| CN207008667U (en) | A kind of UHF RFID label tags | |
| CN207250712U (en) | A kind of integrated chip | |
| CN202159363U (en) | Radio Frequency Identification assembly based on flexible circuit board antenna | |
| CN202523097U (en) | Washable flexible electronic label | |
| CN112232470A (en) | Electronic tag, cable and cable production equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141112 Termination date: 20150610 |
|
| EXPY | Termination of patent right or utility model |