CN203606858U - RFID flexible tag - Google Patents
RFID flexible tag Download PDFInfo
- Publication number
- CN203606858U CN203606858U CN201320751612.5U CN201320751612U CN203606858U CN 203606858 U CN203606858 U CN 203606858U CN 201320751612 U CN201320751612 U CN 201320751612U CN 203606858 U CN203606858 U CN 203606858U
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- circuit chip
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- antenna
- rfid
- rfid flexible
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Abstract
The utility model relates to an RFID flexible tag. The RFID flexible tag comprises a circuit chip, antennas, a substrate plate, a circuit chip protective colloid and an outer packaging; and the circuit chip is in conductive connection with the antennas, the antennas are disposed on the substrate plate, and the circuit chip protective colloid covers the circuit chip. The RFID flexible tag is characterized in that the RFID flexible tag also comprises first protective strips and a second protective strip, each first protective strip is provided with an opening hole and covers the corresponding antenna, each opening hole exposes a fixing position of the circuit chip and the corresponding antenna, and the second protective strip covers the opening holes and is disposed on the first protective strips. Triple protection for the circuit chip is carried out by utilization of adhesive dispense, the first protective strips and the second protective strip, the outer packaging of the tag is prepared by flexible materials, so that the RFID flexible tag is advantaged by external pressure resistance, high temperature resistance and corrosion prevention and the like, and efficiency of reading information stored in the RFID flexible tag can be improved.
Description
Technical field
The utility model relates to RFID label field, relates in particular to a kind of RFID flexible label.
Background technology
In recent years, along with the development of the communication technology, take radio-frequency technique as support, the short-range communication take wireless communication technology as means obtains constantly perfect, RFID(Radio Frequency Identification, is called for short RFID) REID arises at the historic moment.
RFID radio-frequency (RF) identification is a kind of contactless automatic identification technology, and it can see through exterior material, is automatically identified destination object and is obtained related data by radiofrequency signal, and identification work need not manual intervention, can work in various rugged surroundings.RFID technology not only can be identified high-speed moving object but also can identify multiple labels simultaneously, convenient to operation.Radio frequency identification RFID produces in this technical foundation.
Because radio frequency identification RFID has very large information storage amount, therefore, there is application very widely in fields such as the management of modern logistics, electric power asset and foodstuff traceabilities, thus the making of radio frequency identification RFID and be encapsulated into RFID REID and be able to the hardware guarantee in association area application.Chinese invention patent CN200610004747.X has announced a kind of RFID label, the circuit chip of this RFID label is electrically connected with antenna pattern, both are fixed on substrate simultaneously, on substrate, be fixed with away from the position of circuit chip the first strengthening body that covers circuit chip, and the first strengthening body is not fixed on circuit chip.Although this RFID label design can reduce the impact of bending stress on circuit chip, but when object is in the severe environmental conditions such as crooked pressure, high temperature, corrosion lower time, RFID chip and antenna easily come off from backing material plate because of factor impacts such as crooked pressure, high temperature and corrosion, thereby have a strong impact on scanning device reading the built-in information of radio frequency identification RFID.
Utility model content
Primary technical matters to be solved in the utility model is to provide a kind of for above-mentioned prior art can carry out the RFID flexible label that normal data information reads in stressed bending situation.
The further technical matters to be solved of the utility model is to provide a kind of RFID flexible label with superperformances such as high temperature resistant and anticorrosions for above-mentioned prior art.
The technical scheme that the above-mentioned primary technical matters of the utility model solution adopts is: a kind of RFID flexible label, comprise circuit chip, antenna, backing material plate, circuit chip protecting colloid and outer package, circuit chip conducts electricity and is connected with antenna, antenna is arranged on backing material plate, circuit chip protecting colloid is covered on circuit chip, it is characterized in that, also comprise the first ceiling and the second ceiling, described the first ceiling is provided with perforate and is covered on antenna, described perforate exposes the bearing of circuit chip and antenna, described the second ceiling covers perforate and is arranged at the upside of the first ceiling.
As preferably, described the first ceiling is cover antenna at least completely, and the thickness of the first ceiling at least equals the thickness of circuit chip, and described the second ceiling covers perforate at least completely.
As preferably, described the first ceiling and/or the second ceiling adopt exotic material to make.
Selectively, adopt conducting resinl or welding or metal wire to conduct electricity and be connected between described circuit chip and described antenna, described antenna is by metal material or Nano Silver or printing ink to manufacture.
As improvement, the downside of described backing material plate is provided with the 3rd ceiling, and the 3rd ceiling is covering substrates plate at least completely, and the 3rd ceiling adopts exotic material to make.
As preferably, described outer package adopts flexible material to make.
Compared with prior art; the utility model has the advantage of: the RFID flexible label that the utility model provides adopts some glue, the first ceiling and the second ceiling to carry out triple protection to circuit chip; the outer package of label adopts flexible material to make simultaneously; bear external pressure; thereby make RFID flexible label there is the advantages such as the external pressure of bearing, high temperature resistant and anticorrosion, improved reading speed and the reliability to storing information in RFID label in practical application.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of RFID flexible label in the utility model embodiment;
Fig. 2 is the decomposition texture schematic diagram (except outer package) of RFID flexible label in the utility model embodiment;
Fig. 3 is the cross-sectional view after the improvement of RFID flexible label in the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing, embodiment is described in further detail the utility model.
As shown in Figure 1, a kind of RFID flexible label, comprise circuit chip 1, antenna 2, backing material plate 3, circuit chip protecting colloid 7 and outer package 6, circuit chip 1 conducts electricity and is connected with antenna 2, antenna 2 is arranged on backing material plate 3, circuit chip protecting colloid 7 is covered on circuit chip 1, it is characterized in that, also comprise the first ceiling 4 and the second ceiling 5, described the first ceiling 4 is provided with perforate 8 and is covered on antenna 2, described perforate 8 exposes the bearing of circuit chip 1 and antenna 2, described the second ceiling 5 covers perforate 8 and is arranged at the upside of the first ceiling 4.
The reason that perforate 8 is set on the first ceiling 4 is; between circuit chip 1 and antenna 2, adopt some glue mode to be fixed; in order to limit a glue in condition of high temperature current downflow; thereby affect the fixed effect of the second ceiling 5 in order to make the first ceiling 4 be unlikely to be convex because a gelling is solid further, the measure of taking at this is, on the first ceiling 4, perforate 8 is set.In a glue process, required colloid can adopt the high-temperature plastic of black glue or other types.
For circuit chip 1 is fully come out with antenna 2 bearings, to utilize some glue by perforate 8, circuit chip 1 and antenna 2 to be fixed, to be protected, as preferably, perforate 8 at least can expose the bearing of circuit chip 1 and antenna 2 completely.
As preferably; in use affect the infringement causing for fear of antenna 2 because of external force such as label bending, distortions; the thickness of at least complete cover antenna 2, the first ceilings 4 of the first ceiling 4 at least equals the thickness of circuit chip 1, and the first ceiling 4 adopts exotic material to make.For example, exotic material can adopt the exotic materials such as high temperature resistant PET material to make.The thickness that why requires the thickness of the first ceiling 4 at least to equal circuit chip 1 be because; after circuit chip 1 and antenna 2 are fixed in the mode of a glue; the bearing of circuit chip 1 and antenna 2 is just in the perforate 8 in the first ceiling 4; thereby can avoid the impact of ambient pressure, play protective effect.
As preferably, described the second ceiling 5 covers perforate 8, the second ceilings 5 at least completely and adopts exotic material to make.For example, exotic material can adopt the exotic materials such as high temperature resistant PET material to make.The reason that the second ceiling 5 covers perforate 8 at least is completely; arranging like this can make the bearing of circuit chip 1 and antenna 2 in an enclosure space being surrounded by the first ceiling 4 and the second ceiling 5, thereby reduced the impact of the factor such as external pressure, temperature.
As preferably, between described circuit chip 1 and described antenna 2, adopt conducting resinl or welding or metal wire to conduct electricity and be connected, so that circuit chip 1 can be communicated with the external world by antenna 2.
As preferably, described antenna 2 is by metal material or Nano Silver or printing ink to manufacture.That metal material can be selected is copper, aluminium matter and the metal such as silver, to can effectively launch signal.For protection of the environment and the needs that save production cost, antenna 2 can also be by Nano Silver or printing ink to manufacture.
As preferably, described outer package 6 adopts flexible material to make.Flexible material can be selected the flexible material such as silica gel or plastics or petroleum derivation product.
For RFID flexible label structure is described intuitively, Fig. 2 has provided the decomposition texture schematic diagram (except outer package) of RFID flexible label.
As improvement; for circuit chip 1, antenna 2 and backing material plate 3 are fixed further and are protected; the downside of backing material plate 3 is provided with the 3rd ceiling 9; the 3rd ceiling 9 is covering substrates plate 3 at least completely; the material of the 3rd ceiling 9 can be identical with the material of the first ceiling 4, also can be different.Fig. 3 has provided the cross-sectional view after the improvement of RFID flexible label in the utility model embodiment.
Claims (6)
1. a RFID flexible label; comprise circuit chip, antenna, backing material plate, circuit chip protecting colloid and outer package; circuit chip conducts electricity and is connected with antenna; antenna is arranged on backing material plate; circuit chip protecting colloid is covered on circuit chip; it is characterized in that; also comprise the first ceiling and the second ceiling; described the first ceiling is provided with perforate and is covered on antenna; described perforate exposes the bearing of circuit chip and antenna, and described the second ceiling covers perforate and is arranged at the upside of the first ceiling.
2. a kind of RFID flexible label according to claim 1, is characterized in that, described the first ceiling is cover antenna at least completely, and the thickness of the first ceiling at least equals the thickness of circuit chip, and described the second ceiling covers perforate at least completely.
3. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, described the first ceiling and/or the second ceiling adopt exotic material to make.
4. a kind of RFID flexible label according to claim 1 and 2, it is characterized in that, between described circuit chip and described antenna, adopt conducting resinl or welding or metal wire to conduct electricity and be connected, described antenna is by metal material or Nano Silver or printing ink to manufacture.
5. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, the downside of described backing material plate is provided with the 3rd ceiling, and the 3rd ceiling is covering substrates plate at least completely, and the 3rd ceiling adopts exotic material to make.
6. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, described outer package adopts flexible material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320751612.5U CN203606858U (en) | 2013-11-25 | 2013-11-25 | RFID flexible tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320751612.5U CN203606858U (en) | 2013-11-25 | 2013-11-25 | RFID flexible tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203606858U true CN203606858U (en) | 2014-05-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320751612.5U Expired - Fee Related CN203606858U (en) | 2013-11-25 | 2013-11-25 | RFID flexible tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203606858U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646269A (en) * | 2013-11-25 | 2014-03-19 | 浙江钧普科技股份有限公司 | RFID (radio frequency identification) flexible tag and packaging method thereof |
| CN104865181A (en) * | 2015-05-28 | 2015-08-26 | 山东泰宝防伪技术产品有限公司 | Weatherability screening method for conductive adhesive in electronic tag inlay |
| CN106355237A (en) * | 2016-08-30 | 2017-01-25 | 苏州金信宇电子科技有限公司 | Polyester fabric based RFID (radio frequency identification) tag |
| CN107451639A (en) * | 2017-09-11 | 2017-12-08 | 上海合玉科技发展有限公司 | A kind of RFID label tag and preparation method |
| CN111222615A (en) * | 2018-11-23 | 2020-06-02 | 财团法人纺织产业综合研究所 | Wireless radio frequency yarn module |
| US11600912B2 (en) | 2019-12-12 | 2023-03-07 | Au Optronics Corporation | Antenna device and manufacturing method thereof |
-
2013
- 2013-11-25 CN CN201320751612.5U patent/CN203606858U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646269A (en) * | 2013-11-25 | 2014-03-19 | 浙江钧普科技股份有限公司 | RFID (radio frequency identification) flexible tag and packaging method thereof |
| CN104865181A (en) * | 2015-05-28 | 2015-08-26 | 山东泰宝防伪技术产品有限公司 | Weatherability screening method for conductive adhesive in electronic tag inlay |
| CN106355237A (en) * | 2016-08-30 | 2017-01-25 | 苏州金信宇电子科技有限公司 | Polyester fabric based RFID (radio frequency identification) tag |
| CN107451639A (en) * | 2017-09-11 | 2017-12-08 | 上海合玉科技发展有限公司 | A kind of RFID label tag and preparation method |
| CN111222615A (en) * | 2018-11-23 | 2020-06-02 | 财团法人纺织产业综合研究所 | Wireless radio frequency yarn module |
| CN111222615B (en) * | 2018-11-23 | 2024-05-10 | 财团法人纺织产业综合研究所 | Wireless radio frequency yarn module |
| US11600912B2 (en) | 2019-12-12 | 2023-03-07 | Au Optronics Corporation | Antenna device and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 Termination date: 20211125 |