CN205067970U - Consumable chip and consumable container - Google Patents
Consumable chip and consumable container Download PDFInfo
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- CN205067970U CN205067970U CN201520864836.6U CN201520864836U CN205067970U CN 205067970 U CN205067970 U CN 205067970U CN 201520864836 U CN201520864836 U CN 201520864836U CN 205067970 U CN205067970 U CN 205067970U
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Abstract
The utility model provides a consumable chip and consumable container, this consumptive material chip include the base plate, and wafer and coil are all fixed on the base plate first surface and the coil is connected with the wafer electricity, have the covering cover on wafer top and wafer and the winding connection point, post the double faced adhesive tape on the second surface of base plate, wherein, shape crystallization circle installation position between two rings of adjacent insulated wire of coil, the wafer sets up in the position is installed to the wafer. This consumptive material container has the casing, and the casing encloses the cavity that becomes to hold to have the consumptive material, is provided with an aforesaid consumptive material chip on the outer wall of casing. The utility model discloses an only set up the coil and set up the wafer in the position is installed to the wafer at the base plate first surface to need not not use the via hole to connect wafer and coil electricity, and guarantee not short circuit of coil, make on coil, wafer only be present in same real estate, make and only can realize the RFID product function with the base plate of single face, reach reduce cost and reduce because the environmental pollution's that the corruption base plate causes purpose.
Description
Technical field
The utility model relates to a kind of consumable chip and consumable container, and especially a kind of have the consumable chip of radio frequency recognizing electronic label and have the consumable container of this consumable chip.
Background technology
RFID radio RF recognition technology is a kind of contactless automatic identification technology, the principal feature of this technology is that main equipment automatically identifies destination object by radio frequency signal and obtains related data, identification work need not manual intervention, and main equipment and destination object can work in various rugged surroundings.As frequency identification electronic (RFID) label of destination object, containing an integrated circuit (IC) in it, in IC, store a coding, in electronic tag, also have a coil to be connected with IC.During card reading module identification radio frequency recognizing electronic label as main equipment, send electromagnetic wave to radio frequency recognizing electronic label, comprise requirement radio frequency recognizing electronic label in this electromagnetic wave and the coding stored is beamed back the order come.Electromagnetic wave is converted to voltage for IC work by the coil in radio frequency recognizing electronic label, after IC receives order, coding is sent to card reading module by coil.
At present, the pattern of radio frequency recognizing electronic label is a lot, generally be pressed in plastic cement after coil is connected with the wafer by silicon semiconductor production of integrated circuits to make hard cards, or directly wafer is connected on flexible circuitry board coil, then stick gum, or direct being attached on PCB coil by wafer makes label.Current radio frequency recognizing electronic label has and is applied on the print cartridge of ink-jet printer or the cartridge of laser printer.
With reference to Fig. 1, Fig. 1 is common ink-jet printer 10, is provided with a slide bar 11 in printer 10 housing, reciprocating printing word car 14 on slide bar 11, carried out the main control board 12 of data communication by winding displacement 13 and printing word car 14, be arranged on the print cartridge 15 of the print cartridge installation position printed on word car.Reference Fig. 2, Fig. 2 are print cartridge 15 schematic diagram, and print cartridge 15 1 outside surface has consumable chip 16.
With reference to Fig. 3, Fig. 3, the powder box that conventional laser printer uses is shown, powder box has housing 17, and housing 17 surrounds the cavity holding carbon dust, and the outer wall of housing is provided with a chip installation position 18, and consumable chip 19 is installed on chip installation position 18.Identical with the consumable chip that print cartridge uses, the consumable chip 19 that cartridge uses also is have substrate, coil substrate being provided with wafer and being connected with wafer.
Publication No. is disclose a kind of consumable chip and consumable container in the patent documentation of CN203142018U, as shown in Figure 4, its consumable chip comprises substrate 101, consumable chip also comprises wafer 105, wafer 105 is fixed on substrate 101 first surface, consumable chip also comprises a coil 102, coil 102 to be fixed on substrate 101 first surface and to be connected with wafer 105, coil has two pads 103 and 104, wafer also has two pads 106 and 107, pad 103 is connected to pad 107 by binding line 111, pad 104 is connected to pad 106 by binding line 112, wherein, above wafer 105 with on wafer 105 and coil 102 tie point, there is coverture 108 to cover, the double faced adhesive tape 20 less than substrate 101 area is posted at the second surface of substrate 101.And can find that coil 102 has 2 intersection points 30,40 from Fig. 4, these intersection points just must can avoid the phenomenon of short circuit by the connection handling of Fig. 5, thus keep the integrality of circuit.
Fig. 5 is the electrical connection figure of existing consumable chip substrate first surface and second surface, the second surface connecting line 110 of above-mentioned existing consumable chip is positioned on second surface, coil 102 on first surface could must be connected with the second surface connecting line 110 be positioned on second surface with via hole 113 by via hole 109, if not by via hole 109 and via hole 113, directly second surface connecting line 110 is put into first surface, coil 102 short circuit on first surface will be caused, thus cause RFID label tag normally to work.
Therefore, what current product adopted is Double-side line, the two sides of substrate is all provided with coil, by the generation using via hole to avoid short circuit phenomenon, but uses Double-side line not only result in the increase of production cost but also use via hole technique easily to occur in process of production opening a way producing defective products, thus cause qualification rate to reduce, meanwhile, substrate is two-sided is all copper coin, and after excessive erosion, second surface only leaves a bit of line, other most copper are all corroded, and easily cause environmental pollution.
Summary of the invention
Fundamental purpose of the present utility model is to provide a kind of consumable chip that only can realize RFID function without the need to via hole with single substrate.
Another object of the present utility model is to provide and is provided with a kind of consumable container that only can realize the consumable chip of RFID function without the need to via hole with single substrate.
For realizing above-mentioned fundamental purpose, the utility model provides a kind of consumable chip, comprise substrate, be fixed on the wafer on substrate first surface, be fixed on the coil be electrically connected on substrate first surface and with wafer, coil comprises the insulated conductor of at least two loops, cover above wafer and the coverture covered on wafer and coil tie point, be attached to double faced adhesive tape on second substrate surface and the area of double faced adhesive tape is less than the area of substrate, wherein, wafer there is wafer pad, wired lap welding dish on coil, coil pad is electrically connected with wafer pad, two of coil encloses between adjacent insulated conductor and forms wafer installation position, wafer is arranged in wafer installation position.
From such scheme, the consumable chip that the utility model provides only arranges coil on the first surface of substrate, and between the insulated conductor that two circles of coil are adjacent, vacate a space, i.e. wafer installation position, for placing wafer, thus via hole need not be used two of a wafer wafer pad can be connected with two coil pads of coil, and ensure the phenomenon that coil can not be short-circuited, make coil, wafer, coil pad and wafer pad are only present on same real estate, make only can realize RFID product function with the substrate of one side, reduce costs, reduce the environmental pollution caused because of corrosion substrate, meanwhile, covered the tie point of wafer and wafer and coil by coverture above wafer, the coil pad of coil and the wafer pad of wafer effectively cover and protect by coverture, like this when dismounting or chip, due to the protection of coverture, make the connection of wafer and coil when dismantling or install not fragile, can repeated multiple timesly use, saving resource, reduce the pollution to environment, and select casting glue as coverture, effectively must to be cured the tie point of wafer and coil, reach waterproof, moistureproof, dust-proof, insulation, heat conduction, maintain secrecy, anticorrosion, effect such as shockproof grade.
A preferred scheme is, the area of wafer is less than the area of wafer installation position.
Therefore, the space that one is greater than wafer area is vacateed between the insulated conductor that two circles of coil are adjacent, make wafer can be placed on the inside, can not be uneven because of being caused by coil support chip, thus avoid causing See-saw effect in binding procedure.
A preferred scheme is that wafer installation position is at the linearity region of coil or corner region.
Therefore, a spatial placement wafer installation position can be vacateed for placing wafer in optional position between the insulated conductor that two circles of coil are adjacent, wafer installation position both can be arranged on the linearity region of insulated conductor coil parallel to each other, also can be arranged on the corner region of coil.
A preferred scheme is, substrate only arranges coil on its first surface.
Therefore, substrate is only provided with coil on its first surface, not only save production cost during substrate employing Double-side line, and do not need to use via hole can avoid the generation of short circuit phenomenon, simultaneously, owing to not needing the second surface of connection substrate, thus decrease the environmental pollution of corroding substrate and causing.
A preferred scheme is that wafer pad is electrically connected with coil pad by binding line.
Therefore, by binding this common processing technology, utilizing binding machine to machine, construction cycle and production cycle can be shortened by binding this connected mode, cost-saving.
For realizing another above-mentioned object, the utility model provides a kind of consumable container, comprise housing, the consumable chip installation position that the outer wall of housing is arranged, be removably mounted on the consumable chip on consumable chip installation position, consumable chip comprises substrate, be fixed on the wafer on substrate first surface, be fixed on the coil be electrically connected on substrate first surface and with wafer, coil comprises the insulated conductor of at least two loops, cover above wafer and cover the coverture on the tie point of wafer and coil, be attached to the double faced adhesive tape on second substrate surface, the area of double faced adhesive tape is less than the area of substrate, wherein, wafer there is wafer pad, wired lap welding dish on coil, coil pad is electrically connected with wafer pad, two of coil encloses between adjacent insulated conductor and forms wafer installation position, wafer is arranged in wafer installation position.
From such scheme, by above-mentioned, the consumable container that repeatedly can remove and install consumable chip is installed, makes consumable container and consumable chip by repeatedly using after the operations such as reset, achieve energy-conserving and environment-protective, save cost, protection of the environment.
Accompanying drawing explanation
Fig. 1 is existing ink-jet printer structural representation.
Fig. 2 is existing print cartridges structure enlarged drawing.
Fig. 3 is the STRUCTURE DECOMPOSITION figure of existing powder box.
Fig. 4 is existing consumable chip structural drawing.
Fig. 5 is the electrical connection figure of existing consumable chip substrate first surface and second surface.
Fig. 6 is the annexation figure on the substrate first surface of the utility model consumable chip first embodiment.
Fig. 7 is the annexation schematic diagram of subelement in the utility model consumable chip first embodiment.
Fig. 8 is the annexation figure on the substrate first surface of the utility model consumable chip second embodiment.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Embodiment
The silicon wafer being loaded with integrated circuit (IC) that the wafer that consumable chip of the present utility model uses is known for those of ordinary skill, and improvements of the present utility model do not lie in wafer, therefore omit illustrating of inside wafer structure.
Consumable chip first embodiment:
With reference to Fig. 6, consumable chip comprises PCB substrate 201, consumable chip also comprises wafer 205, wafer 205 is fixed on PCB substrate 201 first surface, consumable chip also comprises coil 202, coil 202 to be fixed on PCB substrate 201 first surface and to be connected with wafer 205, coil 202 has two coil pads 203, 204, wafer 205 also has two wafer pads 206, 207, coil pad 203 is connected to wafer pad 207 by binding line 211, coil pad 204 is connected to wafer pad 206 by binding line 212, wherein, above wafer 205 with on wafer 205 and coil 202 tie point, there is coverture 208 to cover, wherein coverture 208 is casting glue, casting glue coverage forms some glue scope.
The second surface of PCB substrate 201 posts the double faced adhesive tape (Fig. 6 not indicate) less than PCB substrate 201 area.The PCB substrate 201 of consumable chip is only provided with coil 202 on its first surface.Enclose in the left side two of coil 202 between adjacent insulated conductor and vacateed a space, i.e. wafer installation position, for placing wafer 205, and the area of the wafer installation position vacateed is greater than the area of wafer 205, thus via hole need not be used two of a wafer 205 wafer pad can be connected with two coil pads of coil 202, and ensure the phenomenon that coil 202 can not be short-circuited, make only can realize RFID product function by the PCB substrate 201 of one side.
With reference to Fig. 7, the annexation between the coil pad 203,204 of coil 202 and the wafer pad 206,207 of wafer better can be understood by Fig. 7.In the PCB substrate 201 of consumable chip, coil pad 203 is connected with wafer pad 207 by binding line 211, and coil pad 204 is connected with wafer pad 206 by binding line 212.And; coverture 208 (Fig. 7 does not indicate) is coated with above wafer 205 and on the tie point of wafer 205 and coil 202; coverture 208 is casting glue, utilize casting glue to protect binding line and wafer, and the shape after casting glue sealing is semi-spherical shape.
Consumable chip second embodiment:
With reference to Fig. 8, consumable chip comprises PCB substrate 301, consumable chip also comprises wafer 305, wafer 305 is fixed on PCB substrate 301 first surface, consumable chip also comprises coil 302, coil 302 to be fixed on PCB substrate 301 first surface and to be connected with wafer 305, coil 302 has two coil pads 303, 304, wafer 305 also has two wafer pads 306, 307, coil pad 303 is connected to wafer pad 307 by binding line 311, coil pad 304 is connected to wafer pad 306 by binding line 312, wherein, above wafer 305 and on the tie point of wafer 305 and coil, there is coverture 308 to cover, wherein coverture 308 is casting glue, casting glue coverage forms some glue scope, the second surface of PCB substrate 301 posts the double faced adhesive tape (Fig. 8 not indicate) less than PCB substrate 301 area.
The PCB substrate 301 of consumable chip is only provided with coil 302 on the first surface, a space has been vacateed between the insulated conductor that two circles in the upper left corner of coil 302 are adjacent, i.e. wafer installation position, for placing wafer 305, and the area of the wafer installation position vacateed is greater than the area of wafer 305, thus via hole need not be used two of a wafer 305 wafer pad can be connected with two coil pads of coil 302, and ensure the phenomenon that coil 302 can not be short-circuited, make only can realize RFID product function by the PCB substrate 301 of one side.
Consumable container of the present utility model is accommodate the print cartridge of ink or accommodate the cartridge of cartridge.
Print cartridge embodiment:
The print cartridge of the present embodiment comprises a housing, and housing surrounds the cavity accommodating ink, and the lower end of cavity is provided with ink outlet port, and ink can flow out from ink outlet port.An outer wall of housing is removably provided with one piece of consumable chip according to the utility model above-described embodiment, wherein, the one side of double faced adhesive tape is attached in the PCB substrate of consumable chip, when installing consumable chip, tear the barrier paper of double faced adhesive tape, the another side of double faced adhesive tape is attached on the housing exterior walls of consumable chip installation position.
Cartridge embodiment:
The cartridge of the present embodiment comprises a housing, and housing surrounds the cavity accommodating carbon dust, and the lower end of cavity is provided with meal outlet, and carbon dust can flow out from meal outlet.An outer wall of housing is removably provided with the consumable chip of one piece of the utility model above-described embodiment, wherein, the one side of double faced adhesive tape is attached in the PCB substrate of consumable chip, when installing consumable chip, tear the barrier paper of double faced adhesive tape, the another side of double faced adhesive tape is attached on the housing exterior walls of consumable chip installation position.
Pass through above-described embodiment, PCB substrate is only provided with coil at its first surface, and wafer is placed and any two encloses any space vacateed between adjacent insulated conductor in coil, namely in wafer installation position, the area ratio wafer area of this wafer installation position is large, thus need not wafer can be connected with coil by via hole, and coil not short circuit, make coil, wafer and coil pad are positioned at same PCB substrate face, make only just can realize RFID product function by one side PCB substrate, reduce costs, reduce the environmental pollution because corrosion PCB substrate causes, in addition, utilize casting glue as coverture to protect the tie point of wafer and wafer and coil, make consumable chip not fragile from consumable container dismounting or installation process, extend the serviceable life of consumable chip.What utilize double faced adhesive tape nonexpondable characteristic can make it possible to repeated removal and installation and the problem such as can not cause getting loose occurs simultaneously.
Finally it is emphasized that; the utility model is not limited to above-mentioned embodiment; as the coverture adopting other position vacating spaces between the adjacent insulated conductor of two circles of coil to place wafers or other shapes, or in coil and the wafer protection domain that adopts other connected modes etc. to change also should to be included in the utility model claim.
Claims (10)
1. consumable chip, comprises
Substrate;
Wafer, described wafer is fixed on the first surface of described substrate;
Coil, the described first surface that described coil is fixed on described substrate is electrically connected with described wafer, and described coil comprises the insulated conductor of at least two loops;
Coverture, described coverture covers above described wafer and on the tie point of described wafer and described coil;
Double faced adhesive tape, described double faced adhesive tape is on the second surface of described substrate, and the area of described double faced adhesive tape is less than the area of described substrate;
It is characterized in that:
Described wafer there is wafer pad;
Wired lap welding dish on described coil, described coil pad is electrically connected with described wafer pad;
Two of described coil encloses between adjacent insulated conductor and forms wafer installation position, and described wafer is arranged in described wafer installation position.
2. consumable chip as claimed in claim 1, is characterized in that:
The area of described wafer is less than the area of described wafer installation position.
3. consumable chip as claimed in claim 1, is characterized in that:
Described wafer installation position is at the linearity region of described coil or corner region.
4. consumable chip as claimed in claim 1, is characterized in that:
Described substrate only arranges described coil on the first surface.
5. consumable chip as claimed in claim 3, is characterized in that:
Described wafer pad is electrically connected with described coil pad by binding line.
6. consumable container, comprises
Housing, described housing surrounds the cavity holding consumptive material, and one end of described cavity is provided with consumptive material outlet;
Consumable chip, described consumable chip is removably mounted on the outer wall of described housing, described consumable chip comprises substrate, the wafer be fixed on described substrate first surface, be fixed on described substrate first surface and the coil be electrically connected with described wafer, described coil comprise at least two loops insulated conductor, cover above wafer and cover the coverture on the tie point of wafer and coil, the double faced adhesive tape be attached on the second surface of described substrate, the area of described double faced adhesive tape is less than the area of substrate;
It is characterized in that:
Described wafer there is wafer pad;
Wired lap welding dish on described coil, described coil pad is electrically connected with described wafer pad;
Two of described coil encloses between adjacent insulated conductor and forms wafer installation position, and described wafer is arranged in described wafer installation position.
7. consumable container as claimed in claim 6, is characterized in that:
The area of described wafer is less than the area of described wafer installation position.
8. consumable container as claimed in claim 7, is characterized in that:
Described wafer installation position is at the linearity region of described coil or corner region.
9. consumable container as claimed in claim 6, is characterized in that:
Described substrate only arranges described coil on the first surface.
10. consumable container as claimed in claim 6, is characterized in that:
Described wafer pad is electrically connected with described coil pad by binding line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520864836.6U CN205067970U (en) | 2015-10-30 | 2015-10-30 | Consumable chip and consumable container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520864836.6U CN205067970U (en) | 2015-10-30 | 2015-10-30 | Consumable chip and consumable container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205067970U true CN205067970U (en) | 2016-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520864836.6U Active CN205067970U (en) | 2015-10-30 | 2015-10-30 | Consumable chip and consumable container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205067970U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106250970A (en) * | 2016-07-29 | 2016-12-21 | 东莞市芯安智能科技有限公司 | Contactless money-equal card of one side and preparation method thereof |
-
2015
- 2015-10-30 CN CN201520864836.6U patent/CN205067970U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106250970A (en) * | 2016-07-29 | 2016-12-21 | 东莞市芯安智能科技有限公司 | Contactless money-equal card of one side and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |