CN219456883U - Electronic tag and electronic tag system - Google Patents
Electronic tag and electronic tag system Download PDFInfo
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- CN219456883U CN219456883U CN202320439269.4U CN202320439269U CN219456883U CN 219456883 U CN219456883 U CN 219456883U CN 202320439269 U CN202320439269 U CN 202320439269U CN 219456883 U CN219456883 U CN 219456883U
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Abstract
The utility model discloses an electronic tag and an electronic tag system. The electronic tag includes: the antenna, the chip, the conductive adhesive, the first protective layer and the second protective layer; the chip is positioned on the antenna, the conductive adhesive is positioned between the chip and the antenna, and the chip is fixed on the antenna through the conductive adhesive; the first protective layer is positioned on one side of the antenna, and the second protective layer is positioned on the other side of the antenna; the first protective layer covers the chip, the conductive adhesive and part of the antenna; the first protective layer and the second protective layer are sealing bodies; the second protective layer covers the vertical projection of the chip and the conductive adhesive on the antenna. According to the technical scheme provided by the embodiment of the utility model, the electronic tag is prevented from being damaged due to high pressure or over-high temperature, and the effect of protecting the electronic tag is achieved.
Description
Technical Field
The utility model relates to the technical field of electronic tags, in particular to an electronic tag and an electronic tag system.
Background
The electronic tag is used as a mode of product identification and is widely applied to the field of food tracing anti-counterfeiting. Electronic tags are often used as important components in products, along with different types of products, and are required to meet the pressure, temperature and other operating requirements of the surrounding environment.
However, many products may have a severe surrounding environment, for example, in the process of making a tea cake, an electronic tag may be placed in the middle of tea, and the electronic tag and the tea enter steaming, pressing, drying and other operations, where the steaming step is subjected to high-temperature steam, the temperature can reach 200 ℃, stone grinding or machine pressing is generally adopted for pressing, and the pressure can reach tens of tons. Therefore, the electronic tag is easily damaged by a large pressure or by an excessively high temperature.
Disclosure of Invention
The utility model provides an electronic tag and an electronic tag system, which are used for solving the problem that the electronic tag is damaged due to high pressure or over-high temperature.
According to an aspect of the present utility model, there is provided an electronic tag including: the antenna, the chip, the conductive adhesive, the first protective layer and the second protective layer;
the chip is positioned on the antenna, the conductive adhesive is positioned between the chip and the antenna, and the chip is fixed on the antenna through the conductive adhesive;
the first protective layer is positioned on one side of the antenna, and the second protective layer is positioned on the other side of the antenna; the first protective layer covers the chip, the conductive adhesive and part of the antenna; the first protective layer and the second protective layer are sealing bodies;
and the vertical projection of the second protective layer on the antenna covers the vertical projection of the chip and the conductive adhesive on the antenna.
Optionally, the perpendicular projection of the second protective layer on the antenna coincides with the perpendicular projection of the first protective layer on the antenna.
Optionally, the electronic tag further comprises a substrate;
the antenna is positioned on the first surface of the substrate, and the chip is positioned on one side of the antenna away from the substrate;
the second protective layer is positioned on a second surface of the substrate, and the second surface is opposite to the first surface.
Optionally, the first protective layer and the second protective layer are epoxy resin glue.
Optionally, the first protective layer is semicircular, semi-elliptical, arched or rectangular;
the second protective layer is semicircular, semi-elliptic, arched or rectangular.
Optionally, the first protective layer and the second protective layer have the same structure.
Optionally, the chip is located in the middle of the antenna.
Optionally, the antenna is an etched antenna.
According to another aspect of the present utility model, there is provided an electronic tag system, including a reader and a tag according to any one of the embodiments of the present utility model;
the reader-writer is in communication connection with the electronic tag, and the reader-writer is configured to perform read-write operation on the electronic tag.
Optionally, the electronic tag system further comprises a server;
the reader-writer is in communication connection with the server, and the server is configured to acquire information read by the reader-writer from the electronic tag.
According to the technical scheme, the first protective layer and the second protective layer are arranged, and are of high-temperature-resistant, flexible and nonconductive structures, so that the first protective layer and the second protective layer can not be damaged and the signal transmission of the chip and the antenna can not be affected when the chip is impacted by high temperature and high pressure. The first protection layer covers the chip, so that the first protection layer protects the chip from being impacted by external objects, the chip is prevented from being impacted by high pressure, and the effect of protecting the chip is achieved. The first protective layer also covers the conductive adhesive, so that the conductive adhesive is prevented from being damaged due to external pressure, and the reliability of connection between the chip and the antenna is ensured. The second protective layer covers the chip and the conductive adhesive in the vertical projection of the antenna, so that the first protective layer and the second protective layer can carry out omnibearing protection on the chip and the conductive adhesive, damage to the chip and the conductive adhesive is avoided when the environment temperature of the electronic tag is too high, the chip and the conductive adhesive are further protected, and the stability and the reliability of the electronic tag are improved. And moreover, the first protective layer and the second protective layer are sealing bodies, so that the chip and the conductive adhesive can be better wrapped, water vapor cannot enter, and the chip can work normally in a complex environment, so that the electronic tag is prevented from being damaged, and even if the electronic tag is operated along with various operations of the product, the information of the product can be read from the electronic tag, the product can be prevented from being manufactured again due to the damage of the electronic tag, and the cost is reduced.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic tag according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of another electronic tag according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of an electronic tag system according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of yet another electronic tag system according to an embodiment of the present utility model.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The application field of the electronic tag is wide, for example, the electronic tag is applied to anti-counterfeiting tracing of bottled wine, the electronic tag is attached to the outside of a wine bottle or on the top of a wine bottle cap, and when bottled wine is conveyed in links such as lamination, packaging, transportation and storage of the bottled wine, the situation of collision, extrusion and dropping can occur, so that a tag chip in the electronic tag can be damaged due to collision. The electronic tag can also be applied to tea cakes, and in the manufacturing process of the tea cakes, the electronic tag can be placed in the middle of tea, and the electronic tag enters steaming, pressing, drying and other operations along with the tea, wherein the steaming step is subjected to high-temperature steam, the temperature can reach 200 ℃, stone grinding or machine pressing is generally adopted for pressing, and the pressure can reach tens of tons. Therefore, the electronic tag is susceptible to a large pressure or a high ambient temperature. The tag chip mainly consists of monocrystalline silicon, has small thickness, is a very fragile glass material, and has very high risk of being crushed; the label chip is stuck on the antenna by adopting a flip-chip technology, when the surrounding temperature of the label chip is higher, the product can shrink, so that the label chip and the antenna are misplaced, the label chip and the antenna are in poor contact, and the electronic label is damaged. After the electronic tag is damaged, the information of the product cannot be read, the product needs to be manufactured again or processed, and the cost is high.
Aiming at the technical problems, the embodiment provides an electronic tag. Fig. 1 is a schematic structural diagram of an electronic tag according to an embodiment of the present utility model, and referring to fig. 1, the electronic tag includes: antenna 101, chip 102, conductive paste 103, first protective layer 104, and second protective layer 105; the chip 102 is positioned on the antenna 101, the conductive adhesive 103 is positioned between the chip 102 and the antenna 101, and the chip 102 is fixed on the antenna 101 through the conductive adhesive 103; the first protection layer 104 is located at one side of the antenna 101, and the second protection layer 105 is located at the other side of the antenna 101; the first protective layer 104 covers the chip 102, the conductive adhesive 103 and a part of the antenna 101; the first protective layer 104 and the second protective layer 105 are sealing bodies; the second protective layer 105 covers the vertical projection of the chip 102 and the conductive paste 103 on the antenna 101.
The chip 102 is a RFID (Radio Frequency Identification) chip, and the antenna 101 is connected with the chip 102, so that the antenna 101 can transmit information in the chip 102 in a radio frequency signal form, and can also transmit a received radio frequency signal to the chip 102, so that interaction between the chip 102 and other devices is realized, and reading of product information from an electronic tag is realized. The chip 102 is adhered to the antenna 101 through the conductive adhesive 103, so that the chip 102 and the antenna 101 perform signal transmission. The first protective layer 104 and the second protective layer 105 are, for example, structures that are resistant to high temperature, flexible, and nonconductive, such as epoxy glue, and can be damaged when being impacted by high temperature and high pressure, and can not affect signal transmission between the chip 102 and the antenna 101.
Specifically, the first protection layer 104 covers the chip 102, so that the first protection layer 104 protects the chip 102 from being impacted by an external object, and the chip 102 is prevented from being impacted by high pressure, thereby achieving the effect of protecting the chip 102. The first protection layer 104 also covers the conductive adhesive 103, so that the conductive adhesive 103 is prevented from being damaged by external pressure, and the reliability of connection between the chip 102 and the antenna 101 is ensured. The vertical projection of the second protection layer 105 on the antenna 101 covers the vertical projection of the chip 102 and the conductive adhesive 103 on the antenna 101, that is, the second protection layer 105 insulates the chip 102 from the outside on the side of the antenna 101 away from the chip 102, that is, the second protection layer 105 protects the chip 102 on the side of the antenna 101 away from the chip 102. Therefore, the first protective layer 104 and the second protective layer 105 can protect the chip 102 and the conductive adhesive 103 in an omnibearing manner, so that the chip 102 and the conductive adhesive 103 are prevented from being damaged when the environmental temperature of the electronic tag is too high, the chip 102 and the conductive adhesive 103 are further protected, and the stability and the reliability of the electronic tag are improved. If only the first protective layer 104 is provided, the chip 102 and the conductive adhesive 103 may be damaged when the temperature of the side of the antenna 101 away from the chip 102 is too high. Through setting up first protective layer 104 and second protective layer 105, chip 102 and conductive adhesive 103 that can be fine cover carries out the omnidirectional protection to chip 102 and conductive adhesive 103, avoids chip 102 and conductive adhesive 103 to receive high temperature impact.
Moreover, the first protective layer 104 and the second protective layer 105 are both sealing bodies, so that the chip 102 and the conductive adhesive 103 can be better wrapped, water vapor cannot enter, and the chip 102 can work normally in a complex environment, so that the electronic tag is guaranteed not to be damaged, and even if the electronic tag is operated with various operations of the product, the information of the product can be read from the electronic tag, the product can be prevented from being manufactured again due to the damage of the electronic tag, and the cost is reduced. Therefore, the first protective layer 104 and the second protective layer 105 of the present application can better insulate the chip 102 and the conductive paste 103 from the outside and better protect the chip 102 and the conductive paste 103 than the chip placed by recessing in the protective layers.
In addition, the first protection layer 104 covers part of the antenna 101, so that the situation that the antenna 101 is covered more, the communication of the antenna 101 is affected, and the cost is reduced can be avoided.
According to the technical scheme, the first protective layer and the second protective layer are arranged, and are of high-temperature resistant, flexible and nonconductive structures, so that the chip and the antenna can not be damaged when being impacted by high temperature and high pressure, and signal transmission of the chip and the antenna can not be affected. The first protection layer covers the chip, so that the first protection layer protects the chip from being impacted by external objects, the chip is prevented from being impacted by high pressure, and the effect of protecting the chip is achieved. The first protective layer also covers the conductive adhesive, so that the conductive adhesive is prevented from being damaged due to external pressure, and the reliability of connection between the chip and the antenna is ensured. The second protective layer covers the chip and the conductive adhesive in the vertical projection of the antenna, so that the first protective layer and the second protective layer can carry out omnibearing protection on the chip and the conductive adhesive, damage to the chip and the conductive adhesive is avoided when the environment temperature of the electronic tag is too high, the chip and the conductive adhesive are further protected, and the stability and the reliability of the electronic tag are improved. And moreover, the first protective layer and the second protective layer are sealing bodies, so that the chip and the conductive adhesive can be better wrapped, water vapor cannot enter, and the chip can work normally in a complex environment, so that the electronic tag is prevented from being damaged, and even if the electronic tag is operated along with various operations of the product, the information of the product can be read from the electronic tag, the product can be prevented from being manufactured again due to the damage of the electronic tag, and the cost is reduced.
As a further implementation manner of the present embodiment, on the basis of the foregoing technical solution, fig. 2 is a schematic structural diagram of still another electronic tag provided in the embodiment of the present utility model, and optionally, referring to fig. 2, a vertical projection of the second protection layer 105 on the antenna 101 coincides with a vertical projection of the first protection layer 104 on the antenna 101.
Specifically, the first protection layer 104 wraps the chip 102 and the conductive adhesive 103, and by setting the vertical projection of the second protection layer 105 on the antenna 101 to coincide with the vertical projection of the first protection layer 104 on the antenna 101, the vertical projection of the second protection layer 105 on the antenna 101 can be ensured to cover the chip 102 and the conductive adhesive 103, so that the effect of better protecting the chip 102 and the conductive adhesive 103 is achieved. The shapes of the first protective layer 104 and the second protective layer 105 may be the same or different, and are not limited herein.
Optionally, referring to fig. 2, the electronic tag further includes a substrate 106; antenna 101 is located on first surface A1 of substrate 106, and chip 102 is located on a side of antenna 101 away from substrate 106; the second protection layer 105 is located on a second surface A2 of the substrate 106, and the second surface A2 is opposite to the first surface A1.
Specifically, the substrate 106 has a supporting function, and the substrate 106 includes, for example, a PET substrate, which can be made thinner, which is beneficial to the realization of miniaturization of the electronic tag. The first protection layer 104 is located on the first surface A1 of the substrate 106, and the second protection layer 105 is located on the second surface A2 of the substrate 106, so that the chip 102 and the conductive adhesive 103 can be protected by the first protection layer 104 and the second protection layer 105 in an omnibearing manner, the chip 102 is prevented from being impacted by high pressure and high temperature, and the effect of protecting the chip 102 is achieved; at the same time, the conductive agent 103 can be protected from being melted at high temperature, and the reliability of the connection between the chip 102 and the antenna 101 is ensured.
Optionally, referring to fig. 2, the first protective layer 104 and the second protective layer 105 are epoxy glue.
Specifically, the epoxy resin adhesive has higher tensile strength and better flexibility, and can protect the chip 102 and the conductive adhesive 103 from high-pressure impact. The temperature resistance of the epoxy resin glue can reach 300 ℃, and the chip 102 and the conductive glue 103 are protected from being damaged by high temperature. Illustratively, the first protective layer 104 may be formed by dropping epoxy resin glue on the surface of the chip 102 and then curing the epoxy resin glue, so that the first protective layer 104 may completely encapsulate the chip 102; on the second surface of the substrate 106, epoxy resin glue is dropped at the opposite position of the first protection layer 104, and the second protection layer 105 is formed in a manner of curing, so that the second protection layer 105 protects the chip 102 from being damaged by high temperature.
Alternatively, referring to fig. 2, the first protective layer 104 is semicircular, semi-elliptical, arched, or rectangular; the second protective layer 105 is semicircular, semi-elliptical, arched or rectangular.
Specifically, the first protection layer 104 is provided to be semicircular, semi-elliptical, arched or rectangular, so that the contact area between the first protection layer 104 and the first surface A1 of the substrate 106 is larger, and the effect of better covering the chip 102 and the conductive adhesive 103 is achieved. If the first protection layer 104 is circular or elliptical, the contact area between the first protection layer 104 and the first surface A1 of the substrate 106 is smaller, so that the first protection layer 104 cannot completely encapsulate the conductive adhesive 103. Preferably, the first protection layer 104 is arched, which not only ensures that the contact area between the first protection layer 104 and the first surface A1 of the substrate 106 is larger, but also ensures that the part of the first protection layer 104 away from the substrate 106 is arc-shaped, so as to better bear impact and achieve the effect of better protecting the chip 102 and the conductive adhesive 103.
The second protection layer 105 is arranged to be semicircular, semi-elliptical, arched or rectangular, so that the contact area of the second surface A2 of the substrate 106 of the second protection layer 105 is larger, and the effect of better covering the chip 102 and the conductive adhesive 103 is achieved. Preferably, the second protection layer 105 is arched, which not only ensures that the contact area between the second protection layer 105 and the second surface A2 of the substrate 106 is larger, but also ensures that the part of the second protection layer 105 away from the substrate 106 is arc-shaped, so as to better bear impact and achieve the effect of better protecting the chip 102 and the conductive adhesive 103.
Alternatively, referring to fig. 2, the first protective layer 104 and the second protective layer 105 have the same structure.
Specifically, the first protective layer 104 and the second protective layer 105 have the same structure, for example, are all arched, and the first protective layer 104 and the second protective layer 105 can be prepared in the same manner, so that the preparation method is simplified. Moreover, the first protective layer 104 and the second protective layer 105 may be made symmetrical with respect to the substrate 106, that is, the first protective layer 104 and the second protective layer 105 are symmetrically disposed, so that the substrate 106 is uniformly stressed.
Alternatively, referring to fig. 2, the chip 102 is located at the middle portion of the antenna 101. The arrangement is such that the chip 102 is near the end of the antenna 101, facilitating connection of the chip 102 to the antenna 101.
Alternatively, referring to fig. 2, antenna 101 is an etched antenna.
Specifically, the antenna 101 is an etched antenna, such as an aluminum etched antenna or a copper etched antenna, and is formed by etching a thin aluminum layer or a thin copper layer on the substrate 106. The etched antenna has smaller volume, which is beneficial to the realization of miniaturization of the electronic tag.
The technical solution of this embodiment further provides an electronic tag system, and fig. 3 is a schematic structural diagram of the electronic tag system provided by this embodiment of the present utility model, and referring to fig. 3, the electronic tag system includes a reader/writer 100 and an electronic tag 200 provided by any of the foregoing embodiments; the reader-writer 100 is in communication connection with the electronic tag 200, and the reader-writer 100 is configured to perform read-write operation on the electronic tag 200.
Specifically, when the electronic tag 200 is used, the reader-writer 100 sends a read-write instruction to the electronic tag 200, and the electronic tag 200 sends product information of a product where the electronic tag 200 is located to the reader-writer 100 through the antenna 101, so that the reader-writer 100 obtains the product information corresponding to the electronic tag 200, and is convenient to learn the state of the product, for example, learn the state of whether the manufacturing process of the product is complete, whether the product is started, and the like.
Fig. 4 is a schematic structural diagram of yet another electronic tag system according to an embodiment of the present utility model, and optionally, referring to fig. 4, the electronic tag system further includes a server 300; the reader/writer 100 is communicatively connected to the server 300, and the server 300 is configured to acquire information read by the reader/writer 100 from the electronic tag 200.
Specifically, the reader 100 may send the acquired data to the server 300, and the server 300 may analyze the data acquired by the read/write area 100, so as to acquire the product information corresponding to the electronic tag 200. The server 300 can also send the parsed product information to other terminals, such as a mobile phone or a computer, so that the user can obtain the product information of the product where the electronic tag 200 is located, and is convenient for the user to know the state of the product, and the anti-counterfeiting verification and the traceability query of the product are realized.
The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. An electronic tag, comprising: the antenna, the chip, the conductive adhesive, the first protective layer and the second protective layer;
the chip is positioned on the antenna, the conductive adhesive is positioned between the chip and the antenna, and the chip is fixed on the antenna through the conductive adhesive;
the first protective layer is positioned on one side of the antenna, and the second protective layer is positioned on the other side of the antenna; the first protective layer covers the chip, the conductive adhesive and part of the antenna; the first protective layer and the second protective layer are sealing bodies;
and the vertical projection of the second protective layer on the antenna covers the vertical projection of the chip and the conductive adhesive on the antenna.
2. The electronic tag of claim 1, wherein a perpendicular projection of the second protective layer at the antenna coincides with a perpendicular projection of the first protective layer at the antenna.
3. The electronic tag of claim 1, further comprising a substrate;
the antenna is positioned on the first surface of the substrate, and the chip is positioned on one side of the antenna away from the substrate;
the second protective layer is positioned on a second surface of the substrate, and the second surface is opposite to the first surface.
4. The electronic tag of claim 1, wherein the first protective layer and the second protective layer are epoxy glue.
5. The electronic tag of claim 1, wherein the first protective layer is semicircular, semi-elliptical, arched, or rectangular;
the second protective layer is semicircular, semi-elliptic, arched or rectangular.
6. The electronic tag of claim 1, wherein the first protective layer and the second protective layer are identical in structure.
7. The electronic tag of claim 1, wherein the chip is located in a middle portion of the antenna.
8. The electronic tag of claim 1, wherein the antenna is an etched antenna.
9. An electronic tag system comprising a reader and an electronic tag according to any one of claims 1 to 8;
the reader-writer is in communication connection with the electronic tag, and the reader-writer is configured to perform read-write operation on the electronic tag.
10. The electronic label system of claim 9, further comprising a server;
the reader-writer is in communication connection with the server, and the server is configured to acquire information read by the reader-writer from the electronic tag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320439269.4U CN219456883U (en) | 2023-03-08 | 2023-03-08 | Electronic tag and electronic tag system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320439269.4U CN219456883U (en) | 2023-03-08 | 2023-03-08 | Electronic tag and electronic tag system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219456883U true CN219456883U (en) | 2023-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320439269.4U Active CN219456883U (en) | 2023-03-08 | 2023-03-08 | Electronic tag and electronic tag system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219456883U (en) |
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- 2023-03-08 CN CN202320439269.4U patent/CN219456883U/en active Active
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