JP2016020957A - Stamp seal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stamp seal for preventing falsification higher in the efficiency of productivity by using a mechanically detectable resonance tag.SOLUTION: A stamp seal is characterized in that, on one surface of a base material, a resonance circuit and a lower capacitor electrode are formed, a dielectric layer is provided on the lower capacitor electrode so as to cover the lower capacitor electrode, an upper capacitor electrode is formed on the dielectric layer, an adhesive layer is further provided, and brittle processing is carried out between the base material, and the resonance circuit and/or the lower capacitor electrode.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a seal seal that enables machine detection when it is illegally peeled off.

Sealing seals are known for detecting whether or not a casing or a box containing valuable parts for play or valuables such as precious metals has been opened illegally.
As such a seal seal, one that can be visually confirmed whether or not the seal has been opened is known.
For example, a seal was developed using a technique that breaks the pattern of the seal using a solvent, and the pattern breaks the seal, and a technique that breaks the pattern by breaking the pattern of the seal and cutting the seal using a dryer. It is a seal that can be confirmed to be opened by visual observation (gazing) on a seal and a technique for cutting a boundary.

However, there are cases where it is difficult to confirm visually, and in order to improve the detection efficiency, the demand for machine detection has increased in recent years.
As a method for detecting opening with such an apparatus, for example, a seal is known in which a resonance tag is attached to a mouth for cutting a boundary to detect the disconnection of the apparatus.
This resonance tag has a problem that productivity is poor because a coil is formed on one surface of a substrate and a capacitor is formed on the other surface, and processing is necessary on the front and back of the substrate (Patent Document 1). 2, 3, etc.).

In addition, because the main use of conventional resonant tags is to prevent shoplifting, it is necessary to be able to detect when they are illegally taken out. For this reason, when they are purchased legitimately, they are taken out by cutting some antennas at stores, etc. Occasionally machine detection was prevented.
For this reason, when this technique is used as a seal seal, there is a problem in that if the reassignment is attempted illegally, the resonance tag is not destroyed, so that the reassignment is easily performed.

Japanese Unexamined Patent Publication No. 64-23395 JP 2005-326623 A JP 2005-128189 A

  An object of the present invention is to use a resonance tag capable of machine detection and to provide a sealing seal that is highly productive and prevents unauthorized tampering.

  The invention described in claim 1 for achieving the above object includes a resonance circuit formed on a base material, and a capacitor element including an upper capacitor electrode and a lower capacitor electrode formed with a dielectric layer interposed therebetween. A sealing seal comprising a resonant circuit and a lower capacitor electrode formed on one surface of a substrate, and a dielectric layer is provided on the lower capacitor electrode so as to cover at least the lower capacitor electrode, and the upper capacitor is formed on the dielectric layer. The sealing seal is characterized in that an electrode is formed and an adhesive layer is further provided.

  Further, a brittleness treatment is performed between the base material and the resonance circuit and / or the lower capacitor electrode.

  In addition, the base material has a cut.

  The resonant circuit, the lower capacitor electrode, and the upper capacitor electrode are formed of conductive ink.

  In addition, the capacitor element is arranged outside the resonance circuit.

  Further, it is characterized in that at least a part of the background printing portion overlaps with the resonance circuit and / or the lower capacitor electrode.

  Further, the background printing section is provided continuously and periodically.

  In addition, the dielectric layer is formed by being overprinted a plurality of times by a printing method.

  Further, an optical layer is provided between the substrate, the resonance circuit, and the lower capacitor electrode.

It is a top view explaining an example of the composition of the seal seal of the present invention. It is sectional drawing explaining an example of a structure of the seal seal | sticker of this invention. It is sectional drawing explaining an example of a structure of the seal seal | sticker of this invention. It is a top view explaining an example of the composition of the seal seal of the present invention. It is a top view of the pattern-like adhesion layer used for the seal seal of the present invention.

  Hereinafter, the structure of the seal seal | sticker which becomes this invention is demonstrated with reference to drawings.

FIG. 1 is a plan view for explaining an example of the configuration of the seal seal as viewed from the base material side according to the present invention, and FIG. 2 is a cross-sectional view showing a cross-section between A and B in FIG.
1 and 2, the printing 8 is provided on the substrate 2, and the resonance circuit 3 and the lower capacitor electrode 4 are provided so that at least a part of the coil overlaps the printing 8. Then, the dielectric layer 5 is formed so as to cover the lower capacitor electrode 4, the upper capacitor electrode 6 and the jumper wire 7 are formed thereon, the adhesive layer 9 is provided, and the sealing seal 1 is provided with the release layer 10 as the outermost layer. is there.
By adopting such a configuration, it is not necessary to process both surfaces of the base material as in the prior art, and it is only necessary to perform lamination according to one surface, so that productivity is excellent.

  FIG. 3 shows a cross-sectional view of an example of another configuration. In FIG. 3, a patterned adhesive layer 11 is provided on a substrate 2, an optical layer 12 comprising an optical structure forming layer 13 and a reflective layer 14 is formed thereon, an anchor layer 15 is provided, and a print 8 is formed thereon. The resonance circuit 3 and the lower capacitor electrode 4 are provided so that at least a part of the coil overlaps the print 8. Then, the dielectric layer 5 is formed so as to cover the lower capacitor electrode 4, the upper capacitor electrode 6 and the jumper wire 7 are formed thereon, the adhesive layer 9 is provided, and the sealing seal 1 is provided with the release layer 10 as the outermost layer. is there.

Although it does not specifically limit as the base material 2, It can have what has a support function. When the background printing unit 8 is provided, it is preferable to use a transparent substrate.
As such, a resin-based substrate such as polyethylene terephthalate (PET), an acrylic substrate, a polyolefin-based substrate such as polyethylene, a polyester-based substrate, or a polycarbonate-based substrate can be used.
The thickness of the substrate is about 20 to 200 μm.

The background printing unit 8 can be provided on the substrate so that at least a part thereof overlaps the resonance circuit or the lower capacitor.
Even if the damaged resonance circuit and the lower capacitor electrode are connected using conductive ink after the label is peeled off by overlapping with the resonance circuit or the lower capacitor electrode, it is difficult to restore the background printing part, so fraud is detected. be able to.
The background printing unit 8 can be formed by a printing method, and specifically includes letters, numbers, symbols, and background patterns. In particular, it is preferable to form continuously and periodically. Further, the background printing portion may be formed over the entire surface of the substrate, or may be formed along the resonance circuit or the lower capacitor electrode.
The thickness of the background printing unit 8 is about 1 to 10 μm, preferably about 2 to 3 μm. If it is too thick, there is a possibility of adversely affecting the resonance circuit and the lower capacitor electrode provided thereon.

The resonant circuit 3 and the lower capacitor electrode 4 are formed on the substrate. The resonance circuit 3 and the lower capacitor electrode 4 are not particularly limited as long as they have conductivity and function, but a method of patterning a metal thin film by etching or the like, screen printing using a conductive ink, etc. The method of forming by a printing method is mention | raise | lifted. In particular, considering the point of destructibility at the time of peeling off the seal and the provision of the upper capacitor electrode via an insulating layer on the lower capacitor electrode, it can be formed by a printing method using conductive ink in terms of production. preferable.
As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent or an ink containing another conductive material can be used. When conductive ink is used, the thickness is about 10 to 30 μm.
The pattern of the resonance circuit is not particularly limited, but can be a coil pattern of one or more turns that matches the desired resonance frequency, the inner end is connected to the lower capacitor electrode, and the outer end is a jumper described later. It can be set as the connection part for connecting with a line.
As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Moreover, you may contain binder resin as needed.

The dielectric layer 5 is provided between the lower capacitor electrode and the upper capacitor electrode, and forms a capacitor element together therewith.
As the dielectric layer, an insulating resin can be used. The insulating resin is preferably formed by printing.
The dielectric layer may be formed so as to cover at least the lower capacitor electrode, but it is preferable that the dielectric layer be formed slightly larger than the lower capacitor electrode so that conduction at the end portion does not occur when the upper capacitor electrode is provided. Although it may be formed on the entire surface, it is disadvantageous in terms of cost, and is preferably about 0.1 to 5 mm larger than the lower capacitor electrode.
At the same time, in order to connect to one end of the resonance circuit, it is also necessary to form a jumper wire portion arranged across the resonance circuit. That is, it is necessary to form at least a portion where the resonance circuit and the jumper wire overlap. It is preferable to form the dielectric layer so that at least part or all of the connecting portion formed at one end of the resonant circuit is exposed. Thus, when forming the jumper line on the dielectric layer, the exposed connection part and the jumper line are connected by forming the jumper line continuously up to the connection part of the resonance circuit.

Examples of the insulating resin used for the dielectric layer include acrylic and urethane resists. Further, as the solvent, ester organic solvents such as diethylene glycol monoethyl ether acetate can be used.
The dielectric layer is preferably applied twice. This is because, when forming by printing, it is difficult to ensure a thickness sufficient to ensure insulation. Three times or more may be used, but two times is preferable in terms of productivity.
The dielectric layer is formed by screen printing or the like, and the film thickness is preferably about 10 to 50 μm. 20-40 micrometers is especially good. Within this range, the smoothness is not adversely affected, and a short circuit between the upper capacitor electrode and the lower capacitor electrode can be prevented.

The upper capacitor electrode 6 and the jumper line are formed on the dielectric layer 5. The upper capacitor electrode 6 and the jumper wire are not particularly limited as long as they have conductivity and function, but a method of patterning a metal thin film by etching or the like, screen printing using a conductive ink, etc. The method of forming by a printing method is mention | raise | lifted. In particular, it is preferably formed by a printing method using a conductive ink from the viewpoint of breakability at the time of peeling off the seal and the like, and from the viewpoint of workability.
The upper capacitor electrode is provided with a size approximately equal to that of the lower capacitor electrode.
As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent or an ink containing another conductive material can be used. When conductive ink is used, the thickness is about 10 to 30 μm.
As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Moreover, you may contain binder resin as needed.

Note that the capacitor element including the upper capacitor electrode and the lower capacitor electrode formed with the dielectric layer interposed therebetween may be disposed inside the resonance circuit or may be disposed outside.
When inspecting the detector and the seal with a certain distance, even if the capacitor element is placed inside the resonance circuit, it can be confirmed that the resonance circuit is destroyed and detection by detection is impossible. When inspecting with the detector and seal sealed in close contact, if the capacitor element is placed inside the resonance circuit, the capacitor element is detected as a metal plate, and only the mechanical inspection indicates that the resonance circuit has been destroyed. Then you may not understand.
Therefore, when only the resonance frequency of the resonance circuit is used, it is preferable to dispose the capacitor element outside the resonance circuit so as not to be affected by the capacitor element. Specifically, there is an arrangement as shown in FIG.

The adhesive layer 9 is provided in order to attach a seal seal to the adherend, and any known pressure-sensitive adhesive or adhesive can be used without particular limitation as long as it has sufficient tackiness.
For example, an acrylic adhesive can be used.
The adhesive layer can be formed by a printing method and has a thickness of about 10 to 100 μm.

  A release layer 10 can be provided on the outermost layer. In use, the release layer is peeled off and attached to the adherend. Although it does not specifically limit as a peeling layer, A paper material can be used. Specifically, a coated paper subjected to a peeling process can be used.

A brittle treatment may be applied between the substrate and the resonance circuit and / or the lower capacitor electrode, or a cut or the like may be provided in the substrate 2. By performing a brittle treatment or providing a cut, the seal seal is partially broken when it is peeled off, so that it can be prevented from being reused illegally. In particular, since the resonance circuit is destroyed, the peeling of the seal can be confirmed by mechanical detection.
Specifically, the resonance circuit is destroyed when it is illegally peeled off, and it can be confirmed that the seal is illegally peeled by detecting the destruction of the resonance circuit. In other words, the presence of the resonance circuit can be confirmed by the detector before the resonance circuit is destroyed, and if the resonance circuit is broken by peeling off the seal, the detector cannot be detected. I can confirm.

As the brittle treatment, a patterned adhesive layer 11 can be provided on the substrate. For the pattern adhesive layer, a material having an adhesive strength stronger than that of the adhesive layer 9 is used. In this way, when peeling off the seal sticker once attached, the resonance circuit or the like is pulled to the substrate side in the portion where the patterned adhesive layer is provided, and the patterned adhesive layer is not provided. In the portion, the resonance circuit and the like remain on the adherend side, and as a result, the resonance circuit and the like can be destroyed, and unauthorized reuse can be prevented.
The pattern adhesive layer is not particularly limited as long as it satisfies the above functions. For example, a polyester-based adhesive can be used. The patterned adhesive layer can be formed by a printing method or the like, and the film thickness is about 0.05 to 0.5 μm.
Further, the pattern of the patterned adhesive layer is not particularly limited as long as it can destroy the resonance circuit or the like. For example, as shown in FIG. 5, the pattern adhesive layer is formed at least with a portion where the patterned adhesive layer is formed at the seal seal end. It is preferable that it is provided so that the part which is not included. This is because when the sealing seal is peeled from the end portion, the resonance circuit or the like can be cleanly broken by the portion remaining on the adherend and the portion dragged by the substrate.

As the incision, various types such as an incision penetrating the base material, a perforation shape, and a half cut shape can be used.
The notch pattern is not particularly limited as long as it is a pattern that can destroy the resonance circuit and the like when peeled off. Further, by combining the notch pattern and the pattern adhesive layer pattern, the resonance circuit and the like can be easily destroyed at the time of peeling.

Further, security can be further improved by providing the optical layer 12.
As the optical layer 12, for example, a hologram element including an optical structure forming layer 13 and a reflective layer 14 can be used. Specifically, the optical structure forming layer 13 is provided on the substrate, and after forming the diffraction structure, the reflective layer 14 is provided.
As the optical structure forming layer 13, it is preferable to make the adhesive force with the base material 2 weaker than the adhesive force of the adhesive layer 9. Thus, when the patterned adhesive layer 11 is provided, the portion of the patterned adhesive layer 11 remains on the substrate 2 side, and the other portions remain on the adherend side, and therefore can be broken into patterns. As such, a resin material such as acrylic can be used, and a diffractive structure can be formed using an embossed plate. As the reflective layer, a metal reflective material such as aluminum or a transflective metal compound such as zinc oxide, zinc sulfide, or titanium oxide can be used. Since the metal material has conductivity, it may be necessary to adjust electrical characteristics, and a semi-transparent and semi-reflective metal compound can be preferably used.
Note that the reflective layer may be patterned. Specifically, the reflective layer can be patterned by etching using a mask layer. The optical effect can be partially shown by patterning. Further, by patterning in a dot pattern, the conductivity of the reflective layer can be eliminated and the influence on the resonance circuit can be eliminated.

When providing a patterned adhesive layer, an optical structure forming layer can be provided on the patterned adhesive layer. By doing so, the optical element is destroyed together with the resonance circuit when the seal seal is peeled off, which is more preferable in terms of detecting unauthorized peeling.
Moreover, when providing an optical layer, you may provide an anchor layer between an optical layer and a resonance circuit. When a hologram is used as the optical layer, since the surface has irregularities, it is preferable to provide a resonance circuit after smoothing with an anchor layer. When a reflective layer made of a conductive material is used, an anchor layer is provided so that the resonance circuit is not affected by the reflective layer.
The optical layer is not limited to the above-described hologram element, and various elements such as a scattering element and a multilayer interference element can be used.

In addition, a security printing layer such as a light emitting layer such as a fluorescent layer or a phosphorescent layer may be provided between any layers of the seal seal. As the light emitting layer, one that excites with ultraviolet rays to emit visible light, or one that excites with infrared rays and mechanically A light emitting infrared light that can be detected can be used.
Further, the security print layer may be formed so as to overlap the resonance circuit, the lower capacitor electrode, and the upper capacitor electrode. In this way, even if the resonance circuit and the lower capacitor electrode that have been illegally peeled and destroyed are connected using conductive ink, it is difficult to restore security printing, so that fraud can be detected.

<Example 1>
Using PET with a length of 20 mm × width 40 mm × thickness 50 μm as a base material, a pattern adhesive layer made of a polyester resin-based adhesive on one surface of this base material is made to have an average film thickness of about 0.15 μm by gravure printing. Formed. The pattern of the pattern adhesive layer was a stripe pattern parallel to the short-side direction of the substrate with 2 × 10 mm and an interval of 2 mm.
On top of this, an optical structure forming layer made of urethane-acrylic resin was formed by gravure printing so as to have an average film thickness of about 1.5 μm. Thereafter, a diffractive structure was formed on the optical structure forming layer using a hologram embossed plate. A zinc sulfide film having a thickness of 50 nm was formed thereon by vapor deposition. An anchor layer made of polyvinyl butyral resin was formed thereon by gravure printing so as to have an average film thickness of about 1 μm.

  Background printing was provided on this anchor layer using red ink. In background printing, a repetitive pattern of “TOPPAN” was formed by screen printing at a film thickness of about 2 μm at a position overlapping the long side of a resonance circuit provided in a later step. Next, the resonance circuit and the lower capacitor electrode designed at a resonance frequency of 28 MHz were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm. The pattern of the resonant circuit is a substantially rectangular coil-shaped pattern consisting of 5 turns, a pattern in which a lower capacitor electrode 3 × 10 mm in width is connected to one end on the inner side, and a connection part for connecting to a jumper wire is connected to one end on the outer side. did.

Next, a dielectric layer is applied twice by screen printing at an average film thickness of about 15 μm at a position that covers a part of the lower capacitor and the connection part and becomes a lower part of a jumper wire provided in a later process, and an average film thickness meter About 30 μm was formed. As the dielectric layer, a thermosetting highly transparent resist (manufactured by Asahi Chemical Laboratory Co., Ltd.) was used. The portion covering the lower capacitor was provided with a dielectric layer having a shape 1 mm larger than the lower capacitor.
An upper capacitor and jumper wires were formed on the dielectric layer using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm, and connected to the resonance circuit through a partially exposed connection.

  Thereafter, an acrylic pressure-sensitive adhesive was formed by coating so as to have an average film thickness of about 50 μm, and finally a release paper was provided to create a seal.

<Example 2>
The pattern of the resonance circuit is a substantially rectangular coil-shaped pattern consisting of 5 turns, and a pattern in which a lower capacitor electrode 3 × 10 mm in width is connected to one end on the outer side and a connection part for connecting to a jumper wire is connected to one end on the inner side. A seal seal was prepared in the same manner as in Example 1 except that a dielectric layer and an upper capacitor electrode were formed accordingly.

<Evaluation>
(Resistance value)
When the resistance value of the resonance circuit was measured, both Examples 1 and 2 were 100Ω or less, and it was confirmed that they had sufficient conductivity.
(short)
Although the presence or absence of a short circuit in the capacitor portion was confirmed, it was confirmed that both Examples 1 and 2 had no short circuit.
(Peel test)
When the seal sticker affixed to the acrylic plate was peeled off by hand, it was confirmed that the resonance circuit partially remained on the acrylic plate and was visually destroyed.
In addition, since the background portion was also destroyed, it was confirmed that it was difficult to re-form the resonance circuit using silver ink.

(Communication test)
When the communication characteristics were confirmed using a detector (made by AIMEX: operating frequency: 28 MHz) in the state of being attached to an acrylic plate and in the state of being peeled off as described above, both Examples 1 and 2 were detected before peeling. I was able to.
After peeling, Example 2 could not be detected regardless of the distance between the detector and the seal seal, and it was confirmed that the resonance circuit was destroyed. Example 1 could not be detected when the detector and the seal were inspected at a certain distance, but could be detected when the detector was inspected with the seal in close contact.

DESCRIPTION OF SYMBOLS 1 ... Seal seal 2 ... Base material 3 ... Resonance circuit 4 ... Lower capacitor electrode 5 ... Dielectric layer 6 ... Upper capacitor electrode 7 ... Jumper Line 8 ... Background printing part 9 ... Adhesive layer 10 ... Release layer 11 ... Pattern adhesive layer 12 ... Optical layer 13 ... Optical structure forming layer 14 ... Reflective layer 15 ... Anchor layer

Claims (9)

A sealing seal having a resonance circuit formed on a substrate and a capacitor element composed of an upper capacitor electrode and a lower capacitor electrode formed with a dielectric layer interposed therebetween,
A resonant circuit and a lower capacitor electrode are formed on one surface of the substrate, and a dielectric layer is provided on the lower capacitor electrode so as to cover at least the lower capacitor electrode, and an upper capacitor electrode is formed on the dielectric layer. A sealing seal, further comprising an adhesive layer.   The seal seal according to claim 1, wherein a brittleness treatment is performed between the base material and the resonance circuit and / or the lower capacitor electrode.   The sealing seal according to claim 1 or 2, wherein the base material is cut.   The sealing seal according to any one of claims 1 to 3, wherein the resonance circuit, the lower capacitor electrode, and the upper capacitor electrode are formed of conductive ink.   The sealing seal according to claim 1, wherein the capacitor element is disposed outside the resonance circuit.   The seal seal according to any one of claims 1 to 5, further comprising a background printing portion at least partially overlapping the resonance circuit and / or the lower capacitor electrode.   The sealing sticker according to any one of claims 1 to 6, wherein the background printing section is provided continuously and periodically.   The sealing seal according to any one of claims 1 to 7, wherein the dielectric layer is formed by being overprinted a plurality of times by a printing method.   The sealing seal according to any one of claims 1 to 8, further comprising an optical layer between the substrate, the resonance circuit, and the lower capacitor electrode.