JP2016081015A - Sealing sticker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform highly accurate opening detection through double mechanical detection by using a sealing sticker having a security function layer in addition to a resonance circuit on the same surface of a base material of a resonance tag.SOLUTION: A sealing sticker for electrical detection has a resonance circuit including a coil and a capacitor. The coil and a lower electrode of the capacitor are formed on one surface of a base material, the capacitor is constituted of the lower electrode, a dielectric layer covering the lower electrode and an upper electrode on the dielectric layer, a security function layer for performing optical detection is formed inside the coil on the one surface of the base material, and the capacitor is formed outside the coil.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a seal seal, and more particularly to a seal seal that can be mechanically detected when it is tampered with.

  A seal sticker is attached to the opening of precious metals and other valuables, documents containing confidential information, packaging bags for storing recording media, boxes, cases, etc., to detect whether or not they have been tampered with. To be done. As such a seal, a seal made of paper, film or the like that can be visually checked for the presence or absence of opening is known.

  For example, it is possible to detect the opening of a seal using a solvent by coloring the seal or destroying the pattern printed on the seal. In addition, it is possible to detect the opening of the opening mouth using a dryer by breaking the pattern printed on the seal or by breaking the notch provided on the seal. Furthermore, it can be confirmed by visual inspection (gazing) that the mouth which cuts the sealing seal at the boundary of the opening.

  However, there is a case where it is difficult to visually confirm the change of the seal seal described above, and in recent years, there has been an increasing demand for mechanical detection of the seal seal in order to improve the efficiency of detection of opening. As a method of such mechanical detection, for example, it is known to use a resonance tag in which a resonance circuit is incorporated in a seal seal (see, for example, Patent Documents 1 to 3).

  For a mouth that cuts the sealing seal at the boundary of the opening, a disconnection of a part of the wiring of the resonance circuit can be mechanically detected using a radio wave having a resonance frequency of the resonance circuit. In such a resonance tag, a coil is formed on one surface of a base material, and electrodes are formed on both surfaces of the base material to form a capacitor, thereby forming a resonance circuit. Therefore, since processing for metal wiring is required on both the front and back surfaces of the base material, there is a problem that productivity is low.

  Further, the conventional resonance tag is mainly used for shoplifting prevention. In order to detect that a product with a resonance tag attached is illegally taken out of the store, the operation of the resonance circuit by the radio wave of the resonance frequency is detected by a detection device installed at the entrance of the store. Therefore, when a product is legitimately purchased, a part of the resonance tag circuit of the product is cut off at a store so that it is not detected by the detection device.

Japanese Unexamined Patent Publication No. 64-23395 JP 2005-326623 A JP 2005-128189 A

  However, if the resonance tag is used to detect whether or not it has been tampered with, it can be illegal if it can be peeled off from the opening with a solvent and a dryer to the extent that the wiring of the resonance circuit is not broken. It cannot be detected. That is, after peeling off the resonance tag, it is easy to attach the same resonance tag again or attach a different resonance tag.

  The object of the present invention is to detect the opening with high accuracy by performing double mechanical detection on the same surface of the substrate of the resonance tag by using a sealing seal provided with a security function layer in addition to the resonance circuit. It is to provide a seal that can be performed.

  In order to achieve the above object, according to one aspect of the present invention, there is provided a sealing seal having a resonance circuit composed of a coil and a capacitor for electrical detection. A lower electrode is formed on one surface of the substrate, and the capacitor is configured by the lower electrode, a dielectric layer covering the lower electrode, and an upper electrode on the dielectric layer, and one surface of the substrate The security function layer for performing optical detection is formed inside the coil, and the capacitor is formed outside the coil.

  According to the present invention, it is possible to detect opening with high accuracy by performing double mechanical detection using a seal seal provided with a security function layer in addition to a resonance circuit.

It is a figure which shows the seal seal concerning the 1st Embodiment of this invention. It is a figure which shows the cross section of the seal seal concerning 1st Embodiment. It is a figure which shows the reading position of the seal sticker concerning 1st Embodiment. It is a figure which shows the seal seal concerning the 2nd Embodiment of this invention. It is a figure which shows the seal seal concerning the 3rd Embodiment of this invention. It is a figure which shows the comparison result of the seal seal | sticker concerning the Example of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 shows a seal seal according to a first embodiment of the present invention. FIG. 1 is a perspective view of the base material 2 as seen from the upper surface of the seal seal. FIG. 2 is a view showing a cross section taken along one-dot chain line AB in FIG. The seal seal 1 has a print 8 on one surface of a substrate 2 on which a conductive film to be a coil 3 and a lower capacitor electrode 4 is formed. The coil 3 and the lower capacitor electrode 4 are connected at the connection portion 3 a outside the coil 3. The print 8 is printed so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4. A dielectric layer 5 is formed so as to cover the lower capacitor electrode 4, and an upper capacitor electrode 6 is formed thereon to constitute a capacitor on one surface of the substrate 2. By providing a jumper wire 7 that connects the connection portion 3b inside the coil 3 and the upper capacitor electrode 6, a resonance circuit 17 for performing electrical detection is configured.

  A security function layer 16 for optical detection is provided inside the coil 3 on one surface of the substrate 2. The sealing seal 1 is provided with an adhesive layer 9 on the entire surface and a release layer 10 as the outermost layer so as to cover the resonance circuit 17 and the security function layer 16. With such a configuration, it is not necessary to process both sides of the base material as in the prior art, and only the components are sequentially laminated on one side, so that productivity can be improved.

(Base material)
Although it does not specifically limit as the base material 2, What is necessary is just to have the function which can support the resonance circuit 17, the security functional layer 16, etc. FIG. When the printing 8 is provided, it is preferable to use a transparent base material so that it can be viewed from the other surface of the base material 2. For example, resin base materials such as acrylic base materials such as polyethylene terephthalate (PET), polyolefin base materials such as polyethylene, polyester base materials, and polycarbonate base materials can be used. The thickness of a base material can be 20-200 micrometers.

(Printing)
At least a part of the print 8 can be provided so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4 on one surface of the substrate 2. When the seal seal 1 is peeled off, the resonant circuit 17 can be operated by connecting a part of the destroyed resonant circuit 17 using conductive ink. Even if the resonance circuit 17 can be electrically operated by overlapping the printing 8 with the resonance circuit 17, it is difficult to restore the printing 8, so that unauthorized opening and tampering of the seal seal are detected visually. can do.

  The print 8 can be formed by a conventional printing method, and specifically includes letters, numbers, symbols, and background patterns. In particular, it is preferable to form continuously and periodically. Further, the print 8 may be formed over the entire surface of the substrate 2 or may be formed along the resonance circuit 17. The thickness of the print 8 is 1 to 10 μm, preferably 2 to 3 μm. If it is too thick, there is a possibility of adversely affecting the resonance circuit provided thereon.

(Resonant circuit)
The coil 3 and the lower capacitor electrode 4 constituting the resonance circuit 17 are not particularly limited as long as they have conductivity. For example, a method of patterning a metal thin film by etching or the like, or a method of forming by a printing method such as screen printing using a conductive ink can be used. Considering that the resonance circuit 17 is easily destroyed when the sealing seal 1 is peeled off and that a capacitor is configured based on the lower capacitor electrode 4, it is preferable to use conductive ink. Also, from the viewpoint of productivity, it is preferable to use a conductive ink because it can be formed by printing.

  As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When the conductive ink is used, the thickness is 10 to 30 μm. The pattern of the resonance circuit is not particularly limited, but can be constituted by one or more coil patterns matched to a desired resonance frequency and a capacitor on the same surface of the substrate 2.

  As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Further, the conductive ink may contain a binder resin as necessary.

  The detector includes a method using a resonance frequency of the resonance circuit and a frequency different from the resonance frequency, and a method using only the resonance frequency of the resonance circuit. The former method can be detected regardless of the capacitor arrangement. In the latter method, when a capacitor is disposed inside the coil, the capacitor is erroneously detected even if the coil is cut, and it may not be possible to detect that the coil has been cut. Therefore, considering that the latter method is used, it is preferable to dispose the capacitor outside the coil 3 as shown in FIG.

(Capacitor)
For the dielectric layer 5 constituting the capacitor, an insulating resin can be used. The insulating resin is preferably formed by printing. The dielectric layer 5 only needs to be formed so as to cover at least the lower capacitor electrode 4, but when the upper capacitor electrode 6 is provided, the lower capacitor electrode 4 is prevented from conducting at the end of each electrode. Form larger. Insulating resin may be formed on one entire surface of the substrate 2, but the cost is increased. The dielectric layer 5 is preferably 0.1 to 5 mm larger than the lower capacitor electrode 4.

  As shown in FIG. 1, the connection portion 3 b inside the coil 3 and the upper capacitor electrode 6 are connected by a jumper wire 7 provided on the dielectric layer 5 formed across the coil 3.

  Examples of the insulating resin used for the dielectric layer include acrylic and urethane resists. Further, as the solvent, ester organic solvents such as diethylene glycol monoethyl ether acetate can be used. The dielectric layer 5 is preferably printed twice or more times. This is because, when forming by printing, it is difficult to secure a thickness sufficient to ensure insulation. From the viewpoint of productivity, it is preferable that the dielectric layer 5 can be formed by two printings. The dielectric layer 5 is formed by screen printing or the like and has a film thickness of 10 to 50 μm. The thickness is particularly preferably 20 to 40 μm. Within this range, smoothness is not adversely affected, and a short circuit between the upper capacitor electrode 6 and the lower capacitor electrode 4 can be prevented.

  The upper capacitor electrode 6 and the jumper wire 7 are formed on the dielectric layer 5. The upper capacitor electrode 6 and the jumper wire 7 are not particularly limited as long as they have conductivity. Considering that the resonance circuit 17 can be easily destroyed when the seal seal 1 is peeled off, it is preferable to use conductive ink. As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When the conductive ink is used, the thickness is 10 to 30 μm. As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Further, the conductive ink may contain a binder resin as necessary.

(Security function layer)
A security function layer 16 made of a light emitting layer is provided at an arbitrary position on one surface of the substrate 2. As the light-emitting layer, a material that can be excited by ultraviolet rays to emit visible light, a material that can be excited by infrared rays and emits infrared light that can be mechanically detected, and the like can be used, and a material that can be mechanically detected using a detector is used. The security function layer 16 is disposed inside the coil 3 as shown in FIG. With such a configuration, the detector can simultaneously detect the electrical response from the resonance circuit 17 and the optical response from the security function layer 16. That is, since the detector can determine the authenticity by double security verification by one reading, the security level becomes high.

  As described above, a detector that uses only the resonance frequency of the resonance circuit, if a capacitor is placed inside the coil, erroneously detects the capacitor even if the coil is disconnected, and the coil is disconnected. May not be detected. Therefore, in the sealing seal 1 of the first embodiment, the capacitor is disposed outside the coil 3.

  FIG. 3 shows the reading position of the seal sticker according to the first embodiment. Machine detection is performed at a detection distance H from the seal seal 1 using the detector 18 shown in FIG. When the security function layer 16 is disposed inside the coil 3 and mechanical detection is performed at the reading position X shown in FIG. 3B, the electrical response from the resonance circuit 17 and the optical function from the security function layer 16 are detected. Simultaneous responses can be detected at the same time. In addition, the capacitor is not erroneously detected even when the coil is cut. Only when both the electrical response and the optical response are normal, it is determined that the seal seal is not opened, so that it is possible to detect the opening with high accuracy.

  Examples of the light emitting layer used as the security function layer 16 include a fluorescent material and a phosphorescent material. Manufacturers manage production, sales, and shipments for security applications, and inks that are not available in the general market, expensive inks made using rare or expensive materials, or special physical phenomena Inks produced using the materials shown can be used as fluorescent materials and phosphorescent materials. The security functional layer 16 is configured by printing these inks on the base material 2.

  For example, the security functional layer 16 is formed by printing ink that emits light when irradiated with ultraviolet rays or infrared rays. Irradiation with a black lamp (ultraviolet ray) or an infrared ray (780 nm or more) lamp emits a pattern drawn with these inks. As a result, a pattern that is not detected by visible light (400 to 700 nm) can be detected visually or through a light receiving element. Since light of a specific wavelength corresponding to a specific material is used, mechanical detection by the detector becomes easy. These inks are preferably transparent and colorless, with the refractive index of the ink resin being the same as or similar to that of the fluorescent material, phosphorescent material, etc. dispersed in the ink resin. And what changes a color tone pattern by irradiation of an ultraviolet-ray or infrared rays is preferable.

As the fluorescent material or the phosphorescent material, there are an ultraviolet light emitting phosphor and an infrared light emitting phosphor. The ultraviolet phosphor emits light in the visible wavelength region when irradiated with ultraviolet rays. For example, Ca ₂ B ₅ O ₃ Cl: Eu ₂₊ , CaWO ₄ , ZnO: Zn ₂ SiO ₄ : Mn, Y ₂ O ₂ S: Eu, ZnS: Ag, YVO ₄ : Eu, Y ₃ O ₃ : Eu, Gd ₂ O ₂ S: Tb, La ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ : Ce, and the like. The security function layer 16 is produced by adding to the ink an amount of phosphor that can visually recognize the light emission when irradiated with black light or can be detected by the light receiving element of the detector.

Infrared light emitting phosphors include those that emit light in the visible wavelength region and those that emit light in the infrared wavelength region when irradiated with infrared rays. Examples of the former phosphor include YF ₃ : YB, Er, ZnS: CuCo, and the like. Examples of the latter phosphor include LiNd _0.9 Yb _0.1 P ₄ O ₁₂ , LiBi _0.2 Nd _0.7 Yb _0.1 P ₄ O ₁₂ , Nd _0.9 Yb _0.1 Nd ₅ (MoO ₄ ) ₄ , NaNb _0.3 Yb _0.1 P ₄ O ₁₂ , Nd _0.8 Yb _0.2 Na ₅ (WO ₄ ) ₄ , Nd _0.8 Yb _0.2 Na ₅ (Mo _0.5 WO _{0 .5} ) ₄ , Ce _0.05 Gd _0.05 Nd _0.75 Yb _0.25 Na ₅ (W _0.7 Mo _0.3 O ₄ ) ₄ , Nd _0.3 Yb _0.1 Al ₃ (BO ₃ ) ₄ , Nd _0.9 Yb _0.1 Al _2.7 Cr _0.3 (BO ₃ ) ₄ , Nd _0.4 P ₅ O ₄ , Nd _0.8 Yb _0.2 K ₃ (PO ₄ ) ₂ etc. There is. The latter phosphor emits infrared light having an emission spectrum peak at 980 nm to 1020 nm when irradiated with light having an infrared wavelength of about 800 nm. The security function layer 16 is produced by adding to the ink an amount of phosphor that can visually recognize the light emission when irradiated with infrared rays or can be detected by the light receiving element of the detector.

  The security function layer 16 having a high anti-counterfeiting effect can be obtained by printing the ink to which these fluorescent materials or phosphorescent materials are added between any layers of the seal. The security function layer 16 is preferably provided on the same plane as the resonance circuit 17. In particular, in the second embodiment, which will be described later, by providing on the surface on which the brittle treatment layer and the hologram layer are formed, the pattern of the security function layer can be destroyed when the seal seal once applied is peeled off. It is possible to prevent unauthorized reuse.

(Adhesive layer)
The adhesive layer 9 is provided for sticking a sealing seal on the adherend, and is not particularly limited as long as it has sufficient adhesiveness. Known pressure-sensitive adhesives and adhesives can be used. For example, acrylic pressure-sensitive adhesives can be used. The adhesive layer 9 can be formed by a printing method and has a thickness of 10 to 100 μm.

  A release layer 10 can be provided on the outermost layer. When the seal seal 1 is used, the release layer 10 is peeled off, and the exposed adhesive layer 9 is attached to the adherend. The release layer 10 is not particularly limited, but a paper material can be used. Specifically, a coated paper subjected to a peeling process can be used.

[Second Embodiment]
FIG. 4 shows a seal seal according to the second embodiment of the present invention. In the sealing seal 21, a brittle treatment layer and a hologram layer are formed on one surface of the substrate 2, and a resonance circuit 17 and a security function layer 16 are formed thereon as in the first embodiment. . Further, printing 8 is performed, and an adhesive layer 9 and a release layer 10 are provided to constitute a seal seal 21. The brittle treatment layer and the hologram layer are provided on the patterned adhesive layer 11 formed on the substrate 2, the optical layer 12 including the optical structure forming layer 13 and the reflective layer 14 formed thereon, and the optical layer 12. And an anchor layer 15.

(Pattern adhesive layer)
For the patterned adhesive layer 11 that functions as a brittle treatment layer, a material having an adhesive strength stronger than the adhesive strength of the adhesive layer 9 is used. The pattern adhesive layer 11 is not applied to the entire surface of the substrate 2 as in the adhesive layer 9, but is formed on the pattern and subjected to a brittle treatment described below. When the sealing sticker 21 once pasted is peeled off, the resonance circuit or the like is pulled to the substrate 2 side in the portion where the patterned adhesive layer 11 is provided, and the patterned adhesive layer 11 is not provided. In the portion, a pattern is formed so that the resonance circuit and the like remain on the adherend side together with the adhesive layer 9. As a result, when the seal seal 21 is peeled off, the resonance circuit and the like are easily broken, and the detection of the peel off of the seal seal can be performed with higher accuracy.

  The pattern adhesive layer 11 is not particularly limited as long as it satisfies the above functions, and for example, a polyester-based adhesive can be used. The patterned adhesive layer 11 can be formed by a printing method or the like, and has a thickness of 0.05 to 0.5 μm. Further, the pattern of the patterned adhesive layer 11 is not particularly limited as long as it can destroy the resonance circuit or the like, but the patterned adhesive layer 11 is formed at least at the end portions close to the four sides of the outer periphery of the seal seal 21. It is preferable to form a portion and a portion not formed. This is because the seal seal 21 is peeled off from the end portion, so that the ratio of destruction of the resonance circuit and the like is increased by performing brittle treatment on the end portion.

(Optical layer)
As the optical layer 12, for example, a hologram layer composed of an optical structure forming layer 13 having a diffractive structure and a reflective layer 14 can be used. The optical structure forming layer 13 preferably has a lower adhesive strength with the substrate 2 than the adhesive strength of the adhesive layer 9. This is because, when the pattern adhesive layer 11 is provided, when the seal seal 21 is peeled off, it is broken into a pattern. That is, in the portion where the patterned adhesive layer 11 is provided, the optical layer 12 remains on the substrate 2 side, and in the portion where the patterned adhesive layer 11 is not provided, the optical layer 12 is covered together with the adhesive layer 9. It remains on the body side.

  The optical layer 12 can use a resin material such as acrylic, and can form a diffractive structure using an embossed plate. As the reflective layer 14, a metal reflective material such as aluminum, or a transflective metal compound such as zinc oxide, zinc sulfide, or titanium oxide can be used. Since the metal material has conductivity, it may be necessary to adjust electrical characteristics, and a transflective metal compound can be preferably used.

  The reflective layer 14 may be patterned. Specifically, the reflective layer 14 can be patterned by etching using the mask layer. By patterning, the optical effect of the hologram layer can be partially shown. Further, by patterning in a dot pattern, it is possible to eliminate the influence on the resonance circuit 17 so that the reflective layer 14 does not have conductivity.

  When the patterned adhesive layer 11 is provided, the optical structure forming layer 13 can be provided on the patterned adhesive layer 11. By doing in this way, when peeling off the sealing seal | sticker 21, since the optical layer 12 is destroyed with a resonance circuit, it is more preferable at the point of the detection of peeling of a sealing sticker.

  Further, when the optical layer 12 is provided, the anchor layer 15 may be provided between the optical layer 12 and the resonance circuit 17. When a hologram layer is formed as the optical layer 12, unevenness remains on the surface. Therefore, it is preferable to form the resonance circuit 17 after the surface is smoothed by the anchor layer 15.

  The optical layer 12 is not limited to the hologram element, and various elements such as a scattering element and a multilayer interference element can be used. Alternatively, only the patterned adhesive layer 11 and the anchor layer 15 may be formed on one surface of the substrate 2 and only the brittle treatment layer having no hologram layer may be formed.

[Third Embodiment]
FIG. 5 shows a seal seal according to a third embodiment of the present invention. The sealing seal 31 is cut into the base material 2 as a brittle treatment layer instead of the patterned adhesive layer 11 of the second embodiment, and is provided with a patterned recess 19 such as a groove. When the sealing seal 21 once pasted is peeled off, the resonance circuit or the like is pulled to the substrate 2 side in the portion where the recess 19 is not provided, and the resonance circuit is provided in the portion where the recess 19 is provided. Etc. are formed so as to remain on the adherend side together with the adhesive layer 9. In this way, by applying strength to the adhesive force between the substrate 2 and the optical structure forming layer 13, when the seal seal 31 is peeled off, the resonance circuit and the like can be easily destroyed. Detection of peeling of the seal seal can be performed with higher accuracy.

  Further, by providing the pattern of the concave portion 19 and the pattern adhesive layer 11 together, the resonance circuit and the like can be easily destroyed when the seal seal 31 is peeled off. As the pattern of the concave portion 19, various patterns such as a notch penetrating the base material, a perforation shape, and a half cut shape can be used.

[Example]
An example of the seal seal according to the second embodiment will be described. As the base material 2, PET of 15 mm long × 38 mm wide × 50 μm thick was used. A patterned adhesive layer 11 made of a polyester resin adhesive was formed on one surface of the substrate 2 by gravure printing so as to have an average film thickness of about 0.15 μm. The pattern of the pattern adhesive layer 11 was a dot pattern in which a circular pattern having a diameter of 2.5 mm was arranged in the vertical direction and the horizontal direction at intervals of 10 mm.

  An optical structure forming layer 13 made of urethane-acrylic resin was formed on the patterned adhesive layer 11 by gravure printing so that the average film thickness was about 1.5 μm. Next, a diffraction structure was formed on the optical structure forming layer 13 using a hologram embossed plate. On top of that, the optical layer 12 was formed by providing zinc sulfide as the reflective layer 14 with a thickness of 50 nm by vapor deposition. On the optical layer 12, an anchor layer 14 made of polyvinyl butyral resin was formed by gravure printing so as to have an average film thickness of about 1 μm.

  On the anchor layer 14, a print 8 was printed using a red ink. For the print 8, a repetitive pattern of “TP0123” was formed by screen printing at a film thickness of about 2 μm at a position overlapping the long side of a resonance circuit provided in a subsequent process. Next, as the security function layer 16, infrared fluorescent ink that emits infrared light when irradiated with infrared rays is formed in a rectangular shape of 3 mm in length and 15 mm in width so as to be positioned inside the coil 3 of the resonance circuit 17. It was formed by screen printing at 15 μm.

  A resonance circuit 17 having a resonance frequency of 28 MHz was formed as follows. The coil 3 and the lower capacitor electrode 4 were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm. The pattern of the coil 3 is a substantially rectangular pattern consisting of six turns, and is connected to the lower capacitor electrode 4 at the connection portion 3 a outside the coil 3. A lower capacitor electrode 4 of 3 mm length × 9 mm width is formed outside the coil 3, and the upper capacitor electrode 6 is connected to the connection portion 3 b inside the coil 3.

  A dielectric layer 5 was formed on the lower capacitor electrode 4, a part of the connection portion 3 b inside the coil 3, and a lower part of a jumper wire provided in a later step. An average film thickness of about 15 μm was printed by one screen printing, and a dielectric layer 5 having an average film thickness of 30 μm was formed by two printings. As a material of the dielectric layer 5, a thermosetting highly transparent resist (manufactured by Asahi Chemical Research Co., Ltd.) was used. The portion covering the lower capacitor electrode 4 was provided with a dielectric layer 5 having a shape 1 mm larger than the four sides of the lower capacitor electrode 4. On the dielectric layer 5, the upper capacitor electrode 6 and the jumper wire 7 were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm. A resonance circuit 17 was produced by connecting the connection portion 3 b inside the partially exposed coil 3 and the upper capacitor electrode 6 by a jumper wire 7.

  Finally, an acrylic pressure-sensitive adhesive was coated as the adhesive layer 9 with an average film thickness of about 50 μm, and a release paper was attached as the release layer 10 to produce a seal seal 21.

(Comparative Example 1)
The difference from the above-described embodiment is that the lower capacitor electrode 4 having a length of 3 mm and a width of 9 mm is formed inside the pattern of the substantially rectangular coil 3 composed of 6 turns together with the security function layer 16. The dielectric layer 5 and the upper capacitor electrode 6 were formed thereon, and the capacitor and the security function layer 16 were produced inside the coil 3.

(Comparative Example 2)
The configuration is the same as that of the conventional resonance tag, and the difference from the above-described embodiment is that the security function layer 16 is not provided.

(Resistance measurement)
When the resistance value of the resonance circuit was measured, both Example, Comparative Example 1 and Comparative Example 2 were 100Ω or less, and it was confirmed that they had sufficient conductivity.

(Short or not)
Although the presence or absence of a short circuit between the electrodes in the capacitor was confirmed, it was confirmed that there was no short circuit in both Example, Comparative Example 1 and Comparative Example 2.

(Peel test)
When the seal sticker affixed to the acrylic plate was peeled off by hand, it was confirmed that a part of the resonance circuit remained on the acrylic plate in both Example, Comparative Example 1 and Comparative Example 2, and was visually destroyed. In addition, it was confirmed that it was difficult to recreate the resonance circuit using silver ink. In addition, the printing and the optical layer are also destroyed.

(Machine detection test)
FIG. 6 shows a comparison result of the seal seal according to the example of the present invention. An AIMEX detector capable of electrical detection of a resonance circuit having a resonance frequency of 28 MHz and optical detection of infrared light from the security function layer was used. Machine detection was performed at the reading position X shown in FIG. 2 for the normal product before peeling in the state of being attached to the acrylic plate and the peeled abnormal product.

  In the normal product before peeling, in Example and Comparative Example 1, both the response of the resonance circuit and the response of the security function layer were detected normally, and the determination was “OK”. However, since Comparative Example 2 does not have a security function layer, the response of the security function layer is impossible and the determination is “impossible”.

  In the case of the peeled abnormal product, even if the resonance circuit was destroyed, the capacitor inside the coil was erroneously detected even when the resonance circuit was broken. On the other hand, in the example, since the resonance circuit was destroyed and the capacitor was out of the reading position, the determination was “impossible” without erroneous detection. From the above results, the seal seal according to the present embodiment is obtained by performing double mechanical detection using a seal seal provided with a security function layer in addition to the resonance circuit on the same surface of the substrate of the resonance tag. It was confirmed that it was possible to detect opening with high accuracy.

DESCRIPTION OF SYMBOLS 1 Sealing seal 2 Base material 3 Coil 4 Lower capacitor electrode 5 Dielectric layer 6 Upper capacitor electrode 7 Jumper wire 8 Printing 9 Adhesive layer 10 Peeling layer 11 Patterned adhesive layer 12 Optical layer 13 Optical structure forming layer 14 Reflective layer 15 Anchor layer 16 Security function layer 17 Resonant circuit

Claims (7)

A sealing seal having a resonance circuit composed of a coil and a capacitor for electrical detection,
The coil and the lower electrode of the capacitor are formed on one surface of a base material, and the capacitor is composed of the lower electrode, a dielectric layer covering the lower electrode, and an upper electrode on the dielectric layer,
A sealing function characterized in that a security functional layer for optical detection is formed on one surface of the base material inside the coil, and the capacitor is formed outside the coil. seal.   The brittle treatment layer and the anchor layer are provided on one surface of the base material, and the resonance circuit and the security function layer are formed on the anchor layer. Seal seal.   The seal seal according to claim 2, further comprising an optical layer constituting a hologram between the brittle treatment layer and the anchor layer.   4. The sealing according to claim 2, wherein the brittle treatment layer is a patterned adhesive layer having an adhesive strength stronger than that of an adhesive layer for attaching the seal seal to an adherend. seal.   The sealing seal according to claim 2 or 3, wherein the brittle treatment layer is a pattern-shaped recess formed on one surface of the substrate.   The sealing seal according to any one of claims 1 to 5, wherein the coil, the lower electrode, and the upper electrode are formed of conductive ink.   The seal seal according to any one of claims 1 to 6, wherein printing is performed so as to overlap with a part of the coil and / or the lower electrode.

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