JP2018036417A - Transfer-type security label sheet, method for attaching security label, and security label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer type security label sheet, a method for attaching a security label, and a security label which do not fail to break or damage a security function part with higher certainty when a security label on an attachment body is removed, to increase the safety and prevent an illegal access.SOLUTION: A transfer-type security label sheet 1 according to the present invention includes: a security label 2 having a resin supporting layer 5 and an adhesive layer 6 deposited on each other and having a security function part 7 buried in the resin supporting layer 5 and/or the adhesive layer 6 and used for determining the presence of an access from the outside; a carrier film 3 removably provided on the outer surface of the resin supporting layer 5 of the security label 2; and a separate film 4 removably provided on the outer surface of the adhesive layer 6 of the security label 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a transfer-type security label sheet having a security label that is affixed to an adherend and that can determine whether or not there is any access to itself and / or the adherend from the outside. The present invention relates to a method and a security label. In particular, the security label affixed to the adherend cannot be removed without destroying or damaging the security function part, and illegal access can be effectively prevented. It proposes a technology that can be used.

  In recent years, for the purpose of product management and the prevention of fraud such as theft, tampering, counterfeiting, modification, etc., the product or equipment, or the case or package containing or incorporating such goods or equipment (hereinafter referred to as “attachment”). There are many security labels that can be affixed to the body.

In this type of security label, a measure is taken so that it is not possible to peel off what is affixed to the adherend and then re-apply it after performing fraud.
For example, Patent Document 1 states that “the label identification information communication functional layer is provided on the back surface of the brittle label base material layer by a coil-shaped or linear antenna wire and a non-contact readable IC chip. An IC label for preventing reattachment as a feature has been proposed.

  Patent Document 2 states that “a label sheet 10 having a pressure-sensitive adhesive layer 2 provided on the back surface of a label base layer 1 and a surface of an antenna support base layer 3 smaller in size than the label sheet 10 are linear or A label identification information communication sheet 20 formed by laminating a coiled antenna wire 4 and an IC chip 5 is attached with the IC chip 5 superimposed on the adhesive layer 2 side, and the sheet edge of the label sheet 10 is attached. Cut lines 9 extending in a direction intersecting with the antenna lines 4 of the label identification information communication sheet 20 from the label base material layer 1 to the antenna support base material layer 3 are provided at several portions of the section. The inner end portion is provided so as to be hooked in the region of the antenna support base material layer 3 and / or the region of the antenna wire 4 in a state where the antenna wire 4 can be energized. IC Label " It has been proposed.

JP 2005-309935 A JP 2005-216044 A

In the IC label for anti-replacement described in Patent Documents 1 and 2 as described above, depending on the material, etc., in consideration of the handleability in the state before and upon adhering to the adherend. Since a relatively thick label base material layer is provided, the pressure sensitive adhesive to be adhered to the adherend is softened by heating, or only the pressure sensitive adhesive is dissolved by a release agent or solvent, so that the label base material layer It was possible to peel off the label without causing destruction or damage. Therefore, in order to sufficiently enhance the security function, it is necessary to select a material for the pressure-sensitive adhesive that does not soften by heating and does not dissolve in a solvent or the like, which limits the selection of the material.
On the other hand, if the thickness of the label base material layer is relatively thin, the strength is lowered, and there is a concern that the shape cannot be maintained before being attached to the adherend. is there.

  Moreover, the cut line provided in the label base material layer as described in Patent Document 2 can be formed only up to the portion in front of the antenna line so as not to cut the antenna line. Therefore, even when such a cut line is provided, it is not impossible to take out the antenna line without destroying or damaging the antenna line, and it is illegal to attach it again to the adherend. There was a problem of being able to perform the act.

  An object of the present invention is to solve such problems of the prior art, and the purpose of the present invention is to prevent the security function unit from being removed when the security label attached to the adherend is peeled off. It is an object of the present invention to provide a transfer type security label sheet, a method for attaching a security label, and a security label that can surely cause destruction or damage, increase safety and effectively prevent unauthorized access.

  As a result of intensive studies to solve the above-mentioned problems, the inventor provides a transfer type security label sheet in which a security film is provided with a carrier film and a separator film as a support in a state before being attached to an adherend. Thus, it was considered that it is possible to ensure the handleability before adhering to the adherend and to reduce the thickness of the resin support layer constituting a part of the security label.

  Based on this knowledge, the transfer-type security label sheet of the present invention is embedded in the resin support layer and the adhesive layer and the resin support layer and / or the adhesive layer that are laminated with each other, and whether there is access from the outside. A security label having a security function part used for the determination, a carrier film provided on the outer surface of the resin support layer of the security label in a peelable manner, and provided on the outer surface of the adhesive layer in the security label in a peelable manner. And a separator film.

  Here, in the transfer type security label sheet of the present invention, it is preferable that the adhesive layer of the security label has a thickness larger than that of the resin support layer.

In the transfer type security label sheet of the present invention, the adhesive layer of the security label preferably has a thickness in the range of 20 μm to 200 μm.
More preferably, the adhesive layer of the security label has a thickness in the range of 25 μm to 70 μm.

  Further, in the transfer type security label sheet of the present invention, the security function part of the security label includes an antenna coil and a capacitor, and is a resonance circuit capable of transmitting and receiving radio waves at a predetermined resonance frequency with an external device. It is preferable to have.

  In the transfer type security label sheet of the present invention, the security function part of the security label includes an antenna coil and an IC chip, and transmits and receives radio waves at a predetermined resonance frequency with an external device, and an IC chip. It is preferable to have an RF circuit capable of transferring recorded information in the memory.

  In the transfer-type security label sheet of the present invention, the security function part of the security label is formed of a material containing a luminescent pigment that is excited or fluoresced by a specific wavelength of light, and is specified from an external device. It is preferable to have a light emitting film layer capable of detecting a phosphorescent reaction due to light having a wavelength.

  In the transfer-type security label sheet of the present invention, the adhesive layer and / or the resin support layer of the security label can have at least a portion having a thickness different from that of other portions.

  The method for attaching a security label according to the present invention includes the step of pulling a separator film from the outer surface of the adhesive layer of the security label when the security label is attached to an adherend using any of the above transfer type security label sheets. The outer surface is peeled off, and then the outer surface of the adhesive layer of the security label is adhered to the surface of the adherend, and the security label is attached to the adherend together with the carrier film.

  In the security label attaching method of the present invention, it is preferable to remove the carrier film by peeling off the carrier film from the outer surface of the resin support layer of the security label.

  The security label of the present invention is embedded in the adhesive layer affixed to the surface of the adherend, the resin support layer laminated on the adhesive layer, the adhesive layer and / or the resin support layer, And a security function unit used to determine whether or not there is an external access.

  Here, in the security label of this invention, it is preferable that the said adhesion layer has thickness thicker than the resin support layer.

In the security label of the present invention, the adhesive layer preferably has a thickness in the range of 20 μm to 200 μm.
More preferably, the adhesive layer has a thickness in the range of 25 μm to 70 μm.

  In the security label of the present invention, it is preferable that the security function unit includes an antenna coil and a capacitor, and has a resonance circuit capable of transmitting and receiving radio waves at a predetermined resonance frequency with an external device.

  In the security label of the present invention, the security function unit includes an antenna coil and an IC chip, and transmits / receives radio waves at a predetermined resonance frequency with an external device and records information in a memory of the IC chip. It is preferable to have an RF circuit capable of transmitting and receiving.

  In the security label of the present invention, the security function part is formed of a material containing a luminescent pigment that is excited or fluorescent with respect to light having a specific wavelength, and phosphorescent reaction is caused by light of a specific wavelength from an external device. It is preferable to have a light-emitting film layer capable of detecting.

  In the security label of the present invention, the adhesive layer and / or the resin support layer may have at least a portion having a thickness different from that of other portions.

According to the present invention, since the transfer type security label sheet includes the carrier film and the separator film, the strength before adhering to the adherend is secured, so that the resin support layer of the security label has a predetermined thin thickness. Moreover, the deterioration of the handleability before sticking to a to-be-adhered body can be prevented.
The security label can be attached to the adherend by peeling off the separator film of the transfer type security label sheet and attaching the outer surface of the adhesive layer exposed thereby to the surface of the adherend. Here, the security label with the resin support layer thinned to a certain degree is brittle to the force to be peeled off from the adherend once it is applied to the adherend, so it is temporarily softened by heating to the adhesive layer. Even if dissolution occurs, the internal security function part is easily and reliably destroyed or damaged by the action of a small force on the security label. As a result, unauthorized access can be effectively prevented.

It is sectional drawing which follows one sheet | seat thickness direction which shows typically one Embodiment of the transfer type security label sheet | seat of this invention. It is an approximate line sectional view which meets an II-II line of Drawing 1. It is sectional drawing which follows the sheet | seat thickness direction which shows typically other embodiment of the transfer type security label sheet | seat of this invention. FIG. 4 is a schematic cross-sectional view along IV-IV in FIG. 3. FIG. 5 is a view similar to FIG. 4 schematically showing still another embodiment of the transfer type security label sheet of the present invention. It is sectional drawing which follows the sheet | seat thickness direction which shows typically other embodiment of the transfer type security label sheet | seat of this invention. It is sectional drawing which follows the VII-VII line of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The transfer type security label sheet 1 of the embodiment illustrated in FIGS. 1 and 2 is peeled off from a security label 2 attached to an adherend (not shown) and one surface of the security label 2 (upper surface in FIG. 1). The carrier film 3 that can be provided and the separator film 4 that can be peeled off on the other surface (the lower surface in FIG. 1) of the security label 2 are provided.

  More specifically, the security label 2 is embedded in the resin support layer 5 and the pressure-sensitive adhesive layer 6 and the resin support layer 5 and the pressure-sensitive adhesive layer 6 which are laminated to each other, and whether or not there is access from the outside. It has the security function part 7 used for determination. The carrier film 3 is provided on the outer surface of the resin support layer 5 of the security label 2 (that is, the surface on the back side of the surface laminated on the adhesive layer 6), and the adhesive layer 6 of the security label 2 The separator film 4 is provided on the outer surface (that is, the surface on the back side of the surface laminated on the resin support layer 5).

  When the transfer-type security label sheet 1 is attached to the adherend, first, the separator film 4 is peeled off from the outer surface of the adhesive layer 6 to expose the outer surface of the adhesive layer 6, and then the adhesive layer 6 This can be done by adhering the outer surface to a predetermined position on the surface of the adherend. Thereby, the security label 2 having the security function unit 7 can be attached to the adherend.

Normally, after the security label 2 and the carrier film 3 are attached to the adherend in this manner, the carrier film 3 is peeled off from the outer surface of the resin support layer 5 to remove the carrier film 3. In this case, only the security label 2 having the resin support layer 5, the adhesive layer 6 and the security function part 7 remains on the adherend.
However, in addition to the security function section 7, the carrier film 3 itself can be provided with some security function, and the carrier film 3 having such a function is also left on the adherend together with the security label 2. You can also.

  The security function unit 7 is configured to provide some access to the security label 2 and / or the adherend from the outside, such as an operation for removing the security label 2 attached to the adherend from the adherend. In this case, there is no particular limitation as long as some kind of change can occur, whereby it is possible to determine the authenticity of the adherend. For example, a security function unit that causes a change that can be visually confirmed by external access can be used.

  In the illustrated embodiment, the security function unit 7 includes a resonance circuit 8, a light emitting film layer 9, an RF circuit 10, and the like, and may include one of these, or may be attached to an adherend. A combination of these may be used depending on the level of security to be given.

  In the embodiment shown in FIGS. 1 and 2, the security function unit 7 has a resonance circuit 8 mainly composed of an antenna coil 8a, a capacitor 8b, and an insulating dielectric layer 8c. The resonance circuit 8 can transmit and receive radio waves at a predetermined resonance frequency with an external device without contact with the security function unit 7, for example. When the security function unit 7 is destroyed or damaged, the resonance frequency changes, and it becomes impossible to transmit / receive radio waves to / from an external device, so that it is possible to determine that there has been an external access. .

  The embodiment shown in FIGS. 3 and 4 includes a light emitting film layer 9 formed of a material containing a special luminescent pigment that is excited or excited with respect to light of a specific wavelength in addition to the resonance circuit 8 described above. Except for having, it has the structure substantially the same as embodiment shown in FIG. 1 and 2. FIG. The light emitting film layer 9 can detect a phosphorescent reaction due to light of a specific wavelength from an external device.

  The embodiment shown in FIG. 5 replaces the resonance circuit 8 described above with the exception of having an RF circuit 10 mainly composed of an antenna coil 10a, an IC chip 10b, and an insulating film layer 10c. It has the structure substantially the same as embodiment shown. For example, the RF circuit 10 can transmit and receive radio waves at a predetermined resonance frequency with an external device in a non-contact manner with the security function unit 7, and can also transmit and receive recorded information in the memory of the IC chip 10b.

  The security function part 7 can be provided by being embedded in the resin support layer 5 and / or the adhesive layer 6. In the embodiment of FIGS. 1 and 2 and the embodiment of FIGS. 3 and 4, the security function unit 7 is mainly located inside the adhesive layer 6 between the resin support layer 5 and the adhesive layer 6. As in the embodiments of 6 and 7, on the adhesive layer 6, a coating layer 11 located between the resin support layer 5 is provided, and inside the adhesive layer 6 and the resin support layer 5 including the coating layer 11, The security function unit 7 can also be embedded. 6 and 7, the security function unit 7 is disposed inside the coating layer 11 of the adhesive layer 6.

By the way, in order to more reliably destroy or damage the security function unit 7 when the security label 2 attached to the adherend is to be peeled off, the security label 2 as in the embodiment shown in FIGS. At least one of the pressure-sensitive adhesive layer 6 and the resin support layer 5 may have at least a portion having a thickness different from that of other portions.
6 and 7, the thin-walled portion 5a extending linearly in the width direction of the security label 2 (vertical direction in FIG. 7) has a predetermined interval in the length direction (horizontal direction in FIG. 7). There are a number of them. In this case, since the breaking strength and adhesive strength of the security label 2 partially change, if the security label 2 attached to the adherend is to be peeled off, the security function unit 7 is simultaneously broken or damaged. Are also susceptible to destruction or damage. Thereby, forgery of the security label 2 and production of similar products become more difficult.

Such a different thickness portion of the adhesive layer 6 and / or the resin support layer 5 may be different in thickness compared to other portions. For example, the thickness is made zero, that is, in the thickness direction of the portion. It is also possible that the material constituting the layer does not exist.
The embodiment shown in FIGS. 6 and 7 is substantially the same as the embodiment shown in FIGS. 1 and 2 except for the embedded position of the covering layer 11 and the security function portion 7 and the configuration of the thin portion 5a of the resin support layer 5. It has the composition of.

(Carrier film)
The carrier film 3 is not particularly limited as long as it is flexible and has a sufficient mechanical strength. For example, polycarbonate (PC), polyethylene (PE), polyethylene naphthalate ( Plastic films such as PEN), polyethylene terephthalate (PET), polyetherimide (PEI), polyimide (PI), polypropylene (PP), polystyrene (PS), and acrylic can be used. Moreover, the thickness of the film base material of the carrier film 3 is not particularly limited, but is preferably 25 μm to 250 μm, and more preferably 35 μm to 100 μm. The carrier film 3 has a role of a support body and a transport body when forming the resin support layer 5, the security function part 7, and, if necessary, the adhesive layer 6.

  The carrier film 3 may be any film as long as it has releasability from the resin support layer 5 laminated thereon, and the film base material may be used as it is. A release layer made of silicone or alkyd resin may be formed on the adhesive layer or film substrate. The adhesive strength at the peeling interface between the carrier film 3 and the resin support layer 5 can be adjusted by the type, thickness, etc. of the film substrate, the slightly adhesive layer or the peeling layer.

(Resin support layer)
The resin support layer 5 is formed on the release surface side of the carrier film 3. As a method for forming the resin support layer 5, a resin paint (paste) obtained by dispersing or dissolving a resin in a solvent is used, and printing methods such as screen printing, offset printing, and gravure printing, gravure coating, gravure reverse coating, and comma coating are used. It can be performed by coating on the carrier film 3 using a coating method such as knife coating or die coating.
When the resin support layer 5 is formed in a pattern according to the label shape, a printing method can be suitably used. In particular, when a uniform resin support layer 5 is formed on a wide area or the entire surface on the carrier film 3. In addition to the printing method, a coating method can also be suitably used.

Examples of materials that can be used for the resin support layer 5 include thermoplastic resins such as acrylic, methacrylic, urethane, polycarbonate, polyester, polypropylene, and polyimide, thermosetting resins such as phenol and epoxy, ultraviolet curable resins, and silicone resins. One of these materials or a mixture of two or more of these materials can be used.
The resin used here has flexibility and moderate coating strength when no external stress is applied, and is brittle when brittle when stress is applied from the outside. Is particularly preferred.

  As the solvent, considering the solubility and dispersibility of the resin, the boiling point suitable for the printing method or the coating method, water-based, alcohol-based, ketone-based, ester-based, ether-based, hydrocarbon-based, etc. may be used alone or in combination. Can be used. In addition, these solvents are used by appropriately adjusting the printing or coating suitability such as viscosity and thixotropy and the solid content. These solvents are volatilized by printing or drying after coating.

In the resin paint (paste), additives such as an antifoaming agent and a thickening agent can be used as necessary for measures against bubbles and viscosity adjustment.
Further, fillers and additives for the purpose of adjusting the balance between the coating film strength and the brittleness against external stress and preventing the deterioration of the security function portion 7 formed on the resin support layer 5 can be mixed.

  The thickness of the resin support layer 5 is not particularly limited as long as the balance between the coating film strength as a support layer and brittleness to external stress is obtained, but is preferably 1 μm to 30 μm, and in particular, 5 μm to 15 μm. More preferably. As shown in the drawing, the resin support layer 5 is particularly preferably thinner than the adhesive layer 6 described later.

(Security Function Department)
The resonant circuit 8 of the security function unit 7 as shown in FIGS. 1 and 2 includes an antenna coil 8a including a lower capacitor electrode that forms part of the capacitor 8b on the resin support layer 5, and a dielectric film that forms part of the capacitor 8b. In order to insulate the antenna coil 8a, an insulating dielectric layer 8c made of an insulating film and a jumper pattern for connecting the antenna coil including the upper layer capacitor electrode forming a part of the capacitor 8b are sequentially laminated.

As a method for forming the antenna coil 8a, it is possible to employ a printing method such as screen printing, offset printing, gravure printing, and ink jet printing using a conductive paint, a drawing method using a dispenser, or the like. Among these, screen printing is suitable for forming a thick film pattern with a narrow pitch and a narrow space. The conductive paint is a material that can be patterned by the above-described forming method, and is not particularly limited as long as it has conductivity after pattern formation. However, the conductive paint is obtained by dispersing or dissolving conductive particles in a dispersion solvent. Etc. can be used. The conductive paint may be mixed with a binder resin in addition to the conductive particles and the dispersion solvent. Alternatively, it is possible to use a coating mainly composed of a conductive polymer. As the conductive particles, silver, copper, carbon, gold, nickel or the like can be used, and an alloy system or a mixed system of various conductive particles can be used. As the conductive particles have higher conductivity, the degree of freedom in pattern design increases. Therefore, conductive particles mainly composed of silver having high conductivity are preferably used. As the solvent, considering the solubility and dispersibility of the conductive particles and binder resin, and the boiling point suitable for the printing method, water-based, alcohol-based, ketone-based, ester-based, ether-based, hydrocarbon-based, etc., alone or mixed Can be used. These solvents are used by appropriately adjusting printing suitability such as viscosity and thixotropy and solid content. These solvents are volatilized by drying after printing. If necessary, additives such as antioxidants and thickeners can be used to prevent the conductive particles from being oxidized and to adjust the viscosity.
The thickness of the antenna coil 8a is preferably as thick as possible to increase the conductivity, but can be set according to the balance between the flexibility and the coating strength and the circuit characteristics. Usually, it is 3 μm to 20 μm, and 5 μm to 15 μm is preferable.
The pattern shape of the antenna coil 8a is not particularly limited as long as it has a shape suitable for receiving a desired radio wave, but one end is formed by a wound coil pattern as illustrated in FIG. A shape in which the portion is a lower layer capacitor electrode and the other terminal portion is a connection pad can be mentioned.

As a method for forming the insulating dielectric layer 8c, it is possible to employ a printing method such as screen printing, offset printing, gravure printing, ink jet printing, or a drawing method using a dispenser, etc., using an insulating paint. Screen printing is preferable from the viewpoint of step following ability, lamination accuracy, and thick film formation associated with the formation of the antenna coil 8a on the pattern. The insulating paint is a material that can be patterned by the above forming method, and is not particularly limited as long as it is an electrically insulating material. A resin obtained by dispersing or dissolving an insulating resin in a solvent. It is a paint (paste) and can be used as an insulating resin by mixing one or more of acrylic, methacrylic, urethane, polycarbonate, polyester, polypropylene, phenol, epoxy and the like. The insulating resin may be selected in consideration of the dielectric constant or relative dielectric constant in addition to the electrical insulation. As the solvent, considering the solubility and dispersibility of the insulating resin and the boiling point suitable for the printing method, water-based, alcohol-based, ketone-based, ester-based, ether-based, hydrocarbon-based, etc. are used alone or in combination. Is possible. These solvents are used by appropriately adjusting printing suitability such as viscosity and thixotropy and solid content. These solvents are volatilized by drying after printing. If necessary, additives such as an antifoaming agent and a thickening agent can be used to prevent bubbles and adjust the viscosity.
The thickness of the insulating dielectric layer 8c is preferably as thick as possible to increase the insulation, but is set according to circuit characteristics. Usually, it is 10-100 micrometers, and 20-50 micrometers is suitable. In addition, in forming the insulating dielectric layer 8c, if the pattern step and roughness of the antenna coil layer are made to follow and the printed film is not formed without pinholes or unevenness, a short circuit or defective insulation may occur. In order to ensure the property more reliably, it is desirable to form the desired thickness by overprinting twice or more, rather than forming the desired thickness once.
The shape of the insulating dielectric layer 8c is not particularly limited as long as it has a shape suitable for forming the capacitor 8b, and can cover the entire surface other than the connection pads of the antenna coil 8a. As illustrated in FIG. 2, a shape that covers at least a lower layer capacitor electrode and a jumper wire, which will be described later, straddles the antenna coil is suitable.

As a method for forming the jumper pattern, a printing method such as screen printing, offset printing, gravure printing, and ink jet printing using a conductive paint, a drawing method using a dispenser, and the like are possible. Screen printing is preferable from the viewpoints of step following capability, lamination accuracy, and thick film formation associated with the pattern of the antenna coil 8a and formation on the insulating dielectric layer 8c.
The conductive paint is a material that can be patterned by the above-described forming method, and is not particularly limited as long as it is a conductive material, and the same paint as that used when forming the antenna coil 8a can be used. . From the viewpoint of designing circuit characteristics of the resonance circuit 8 and bonding reliability between the connection pads, it is preferable to use the same paint as the conductive paint at the time of forming the antenna coil 8a.
The thickness of the jumper pattern is preferably as thick as possible in order to increase the conductivity, but is set according to the bonding reliability and circuit characteristics between the connection pads. Usually, it is 3-30 micrometers, and 5-20 micrometers is suitable.
The jumper pattern shape is not particularly limited as long as it functions as a desired capacitor and has a shape suitable for electrical connection with the antenna coil 8a, but as illustrated in FIG. A jumper wire that straddles the antenna coil 8a and has a shape in which one terminal portion is an upper capacitor electrode and the other terminal portion is a connection pad.

  The RF circuit 10 of the security function unit 7 as shown in FIG. 5 includes an insulating film layer 10c, an IC chip bonding pad and an antenna for insulating the IC chip bonding pad and antenna coil 10a and the antenna coil 10a on the resin support layer 5. A jumper pattern for connecting to the coil 10a is sequentially laminated and the IC chip 10b is mounted on the IC chip joint.

As a method of forming the IC chip bonding pad and the antenna coil 10a, it is possible to adopt a printing method such as screen printing, offset printing, gravure printing, and ink jet printing using a conductive paint, a drawing method using a dispenser, or the like. is there. Screen printing is suitable for forming a thick film pattern with a narrow pitch and a narrow space. The conductive coating material is a material that can be patterned by the above-described forming method, and is not particularly limited as long as it is a conductive material, and the same coating material as that used when forming the antenna coil described above can be used.
The thickness of the IC chip bonding pad and the antenna coil 10a is preferably as thick as possible in order to increase the conductivity, but can be set according to the balance between the flexibility and the coating strength and the circuit characteristics. Usually, it is 3 μm to 20 μm, and 5 μm to 15 μm is preferable.
The pattern shape of the IC chip bonding pad and the antenna coil 10a is not particularly limited as long as it has a shape capable of obtaining a desired circuit characteristic. However, the IC connection pad and the winding as illustrated in FIG. There is a shape in which the winding coil pattern is formed, one end portion of the wound coil pattern is an IC chip bonding pad, and the other end portion is a jumper wire connection pad.

As a method for forming the insulating film layer 10c, it is possible to employ a printing method such as screen printing, offset printing, gravure printing, and ink jet printing, a drawing method using a dispenser, or the like using an insulating paint. Screen printing is preferable from the viewpoints of step following capability, lamination accuracy, and thick film formation associated with the formation of the antenna coil 10a on the pattern. The insulating paint is a material that can be patterned by the above-described forming method, and is not particularly limited as long as it is an electrically insulating material, and the same paint as that used for forming the insulating dielectric layer 8c described above is used. can do.
The thickness of the insulating film layer 10c is preferably as thick as possible in order to increase the insulation, but is set according to circuit characteristics. Usually, it is 10-100 micrometers, and 20-50 micrometers is suitable.
In the formation of the insulating film layer 10c, if the pattern step and roughness of the antenna coil layer are made to follow and the printed film is not formed without pinholes or unevenness, there is a possibility of causing a short circuit or poor insulation. In order to ensure the property more reliably, it is desirable to form the desired thickness by two or more overprints, rather than forming the desired thickness once.
The shape of the insulating film layer 10c is not particularly limited as long as it has a shape capable of covering at least a portion where the jumper wire straddles the antenna coil 10a, and the jumper wire connection pad and the IC chip junction of the antenna coil 10a. Although it is possible to cover the entire surface other than the pad, a shape in which the jumper wire covers the portion over the antenna coil 10a as shown in FIG. 5 is suitable.

As a method for forming the jumper line, it is possible to employ a printing method such as screen printing, offset printing, gravure printing, and ink jet printing using a conductive paint, a drawing method using a dispenser, or the like. Screen printing is preferable from the viewpoint of step following capability, lamination accuracy, and thick film formation associated with formation on the antenna pattern and the insulating film layer. The conductive paint is a material that can be patterned by the above-described forming method, and is not particularly limited as long as it is a conductive material, and the same paint as that used when forming the antenna coil 10a described above can be used. From the viewpoint of designing circuit characteristics of the RF circuit, bonding reliability between pads, and the like, it is preferable to use the same paint as the conductive paint at the time of forming the antenna coil.
The thickness of the jumper wire is preferably as thick as possible in order to increase the conductivity, but it is set by the bonding reliability and circuit characteristics between the pads. Usually, it is 3-30 micrometers, and 5-20 micrometers is suitable.
The pattern shape of the jumper line is not particularly limited as long as it has a shape suitable for electrically connecting the IC chip bonding pad and the connection pad of the jumper line of the antenna coil 10a. A jumper wire that straddles the antenna coil 10a as exemplified in FIG. 5 and a shape in which both end portions are connection pads with each pad can be mentioned.

On the IC chip bonding pad, the IC chip 10b is mounted by being electrically bonded by a flip chip method or the like.
As a material for mounting the IC chip, an anisotropic conductive film, anisotropic conductive paste, underfill, conductive wire adhesive, and the like can be used, but the IC chip and the bonding pad are electrically bonded. If it is, it will not be specifically limited.

The light emitting film layer 9 of the security function unit 7 as shown in FIGS. 3 and 4 is formed on the resin support layer 5 and uses a luminescent paint to print a screen printing, offset printing, gravure printing, ink jet printing, or the like. It can be formed by a drawing method using a dispenser or the like.
The material used as the light-emitting film layer 9 can be formed by the above-described forming method, and is not particularly limited as long as it is a material having a function of exciting or fluorescing or phosphorescence with respect to light of a specific wavelength. A special luminescent paint obtained by dispersing or dissolving a special luminescent pigment in a dispersion solvent can be used. The special luminescent paint may be mixed with a binder resin in addition to the special luminescent pigment and the dispersion solvent. As the special luminescent pigment, zinc sulfide, zinc silicate, strontium sulfide, calcium sulfide, calcium tungstate and the like can be used, and those obtained by adding metals such as copper and bismuth to these can be used. As the solvent, considering the solubility and dispersibility of the special luminescent pigment and binder resin, the boiling point suitable for the printing method, water-based, alcohol-based, ketone-based, ester-based, ether-based, hydrocarbon-based, etc., alone or It can be used as a mixture. These solvents are used by appropriately adjusting printing suitability such as viscosity and thixotropy and solid content. These solvents are volatilized by drying after printing.
The thickness of the light emitting film layer 9 is preferably as thick as possible in order to increase the light emitting property, but is usually 3 μm to 20 μm, preferably 5 μm to 15 μm.
The pattern shape of the light-emitting film layer 9 is not particularly limited as long as it has a size and shape suitable for reliably receiving light of a specific wavelength for excitation, and for fluorescence or phosphorescence. However, a belt-like pattern as exemplified in FIGS.

(Adhesive layer)
The pressure-sensitive adhesive layer 6 is formed on the resin support layer 5 with the security function part 7 sandwiched between them, and can be formed by printing methods such as screen printing, offset printing, gravure printing, gravure coating, gravure reverse coating, comma Application methods such as coating, knife coating, and die coating can be employed. When the adhesive layer 6 is formed in a pattern according to the label shape, a printing method can be suitably used, or when a uniform layer is formed on a large area or the entire surface, it is applied in addition to the printing method. A method can also be suitably used.

  The adhesive layer 6 is not particularly limited as long as it is a material that adheres to the adherend surface of the adherend and has adhesiveness at room temperature, and is not limited to acrylic, urethane, epoxy, rubber, polyester, cellulose, and the like. Adhesives such as systems and emulsions can be used. Moreover, a filler and a low molecular-weight additive can be mixed for the purpose of adhesiveness, prevention of deterioration of the security function part 7, and the like.

The thickness of the pressure-sensitive adhesive layer 6 is not particularly limited as long as an adhesive force can be obtained, and is usually 20 μm to 200 μm, preferably about 25 μm to 70 μm. As the thickness of the pressure-sensitive adhesive layer 6 increases, it tends to be peeled off from the adherend without damaging the other layers using a razor blade or a scraper. Therefore, the thickness of the pressure-sensitive adhesive layer 6 is preferably as thin as possible within a range in which the adhesive force with the adherend can be maintained.
The adhesive layer 6 is preferably thicker than the resin support layer 5. As a result, when the security label 2 firmly attached to the adherend is to be peeled off, the resin support layer 5 is a thin film. Since it is also transmitted to the layer 5, the security function part 7 is more surely destroyed or easily damaged together with the resin support layer 5, so that the safety by the security label 2 can be further enhanced.

  Moreover, when forming the adhesion layer 6, apply said adhesive to the peeling surface of the separator film 4 using application methods, such as gravure coating, gravure reverse coating, comma coating, knife coating, and die coating. It is also possible to adopt a method in which a layer in which the adhesive layer 6 is formed is prepared in advance, and the security function portion 7 is sandwiched between the resin support layer 5 and bonded together with a laminator or the like.

(Separator film)
The separator film 4 is not particularly limited as long as it is flexible and has a sufficient mechanical strength. For example, polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyetherimide (PEI), Polyimide (PI), Polypropylene (PP), Polystyrene (PS), Acrylic film substrate, Kraft paper, Glassine paper, Paraffin paper, Fine paper, Medium paper The surface of a paper substrate such as that having a release layer coated with a release agent such as silicone, fluorine, or alkyd resin can be used.

Moreover, although the thickness of the base material of the separator film 4 is not specifically limited, 25 micrometers-250 micrometers are preferable, Desirably 35 micrometers-100 micrometers.
The separator film 4 may be any film that has peelability from the laminated adhesive layer, and the base material may be used as it is. The adhesive strength at the peeling interface can be adjusted by the type and thickness of the base material and the release agent. It is.

  Next, the transfer type security label sheet of the present invention was prototyped and its effect was confirmed, and will be described below. However, the description here is for illustrative purposes only and is not intended to be limited to this.

Example 1
A transfer-type security label sheet was produced by the following procedure.
As a carrier film, a PET film “A54” (manufactured by Teijin DuPont Films Ltd.) having a thickness of 38 μm provided with a silicone release layer was prepared. As the resin support layer coating material, urethane thermosetting ink “SP-3100AU” (manufactured by Teikoku Ink Manufacturing Co., Ltd.) was prepared. Conductive paste "Dotite FA-333" (manufactured by Fujikura Kasei Co., Ltd.) is prepared as a conductive paint for forming a resonance circuit to be a security function part, and resist ink "Dotite XB-101G" (Fujikura) is used as an insulating paint. Prepared by Kasei Co., Ltd.). As the adhesive layer coating material, an acrylic adhesive “CAT-1300S adhesive” (manufactured by Teikoku Mfg. Co., Ltd.) was prepared. As a separator film, a 75 μm thick PET film “A31” (manufactured by Teijin DuPont Films Ltd.) provided with a silicone release layer was prepared.

  On the carrier film, a screen printing machine is used to print the resin support layer in a size of 20 × 50 mm, and a plurality of patterns are imprinted with an equidistant space, and is printed in a far infrared drying oven. Drying was performed at a temperature of 3 ° C. for 3 minutes, and the layer thickness after drying was 5 μm.

  On the resin support layer, it is printed with a coiled coil antenna pattern designed to obtain the desired circuit characteristics using a screen printer, and in a far-infrared drying oven at a temperature of 130 ° C. for 3 minutes. After forming the antenna coil so that the layer thickness after drying is 10 μm, use a screen printer to cover the portion where the lower layer capacitor electrode and the jumper wire straddle the antenna coil so that the insulation dielectric The layer is printed, dried in a far-infrared drying oven at a temperature of 100 ° C. for 3 minutes, and the film thickness per layer after drying is 15 μm. An insulating dielectric layer is formed so as to have a thickness of 30 μm, and a jumper pattern composed of an upper capacitor electrode and a jumper wire is printed on the insulating dielectric layer by using a screen printer, and a far-infrared dry layer is printed. And dried for 3 minutes at a temperature of 130 ° C. at the furnace, the layer thickness after drying to form a jumper pattern such that 10 [mu] m, to form a resonant circuit as a security function portion.

Next, using a screen printing machine, the security function part is sandwiched on the resin support layer, printed at the same size as the resin support layer, and dried for 3 minutes at a temperature of 100 ° C. in a far-infrared drying oven, The pressure-sensitive adhesive layer was formed so that the layer thickness after drying was 30 μm.
Finally, using a laminator, a separator film was bonded onto the adhesive layer and processed into a predetermined label size to produce a transfer type security label sheet.

(Example 2)
The same carrier film, resin support layer coating material, conductive coating material for forming an RF circuit serving as a security function part, adhesive layer coating material, and separator film were prepared as in Example 1.
After forming a resin support layer on the carrier film in the same manner as in Example 1, printing with a wound coil antenna pattern designed to obtain desired circuit characteristics using a screen printer on the resin support layer Then, after drying for 3 minutes at a temperature of 130 ° C. in a far-infrared drying oven, forming the antenna coil so that the layer thickness after drying is 10 μm, the jumper wire is connected to the antenna coil using a screen printer. The insulating film layer is printed so as to cover the upper part, and dried for 3 minutes at a temperature of 100 ° C. in a far-infrared drying oven so that the film thickness per layer after drying is 15 μm. Then, an insulating film layer is formed so as to have a total thickness of 30 μm by overprinting twice, and further a jumper pattern is printed on the insulating film layer by using a screen printer, and 130 ° C. in a far infrared drying furnace. Temperature And dried for 3 minutes in, layer thickness after drying to form a jumper pattern such that 10 [mu] m, to form an antenna for RF circuit to be security function portion.

Using a flip chip bonder, an IC chip having a 1.0 mm square and gold bump formed on the terminal portion is formed on the antenna IC chip bonding pad by an anisotropic conductive film “FP2322UST” (Dexerials Co., Ltd.). An RF circuit was formed by thermocompression bonding.
Next, using a screen printing machine, the security function part is sandwiched on the resin support layer, printed at the same size as the resin support layer, and dried for 3 minutes at a temperature of 100 ° C. in a far-infrared drying oven, The pressure-sensitive adhesive layer was formed so that the layer thickness after drying was 30 μm.
Finally, using a laminator, a separator film was bonded onto the adhesive layer and processed into a predetermined label size to produce a transfer type security label sheet.

(Example 3)
As a special light-emitting paint for forming a resonance circuit serving as a security function portion, a phosphorescent pigment dispersed in urethane-based ink “SG429 B Overcoat Clear” (manufactured by Seiko Advance Co., Ltd.) was prepared.
The resonance circuit is formed by using the same material and procedure as in Example 1, and a special light-emitting film layer in the form of a band is printed on the inner part of the wound coil pattern of the resonance circuit on the resin support layer using a screen printer. Then, drying was performed for 3 minutes at a temperature of 100 ° C. in a far-infrared drying oven, and a special light emitting film layer was formed so that the layer thickness after drying was 10 μm.
Thereafter, the adhesive layer was formed and the separator film was bonded together using the same materials and procedures as in Example 1, processed into a predetermined label size, and a transfer type security label sheet was produced.

Example 4
The same carrier film, resin support layer coating material, conductive coating material for forming a resonance circuit serving as a security function part, adhesive layer coating material, and separator film were prepared as in Example 1.
Use a screen printer to print a resin support layer with a stripe-shaped non-printed part on a carrier film with a size of 20 x 50 mm and an imposition of multiple patterns with evenly spaced spaces. Then, drying was performed for 3 minutes at a temperature of 80 ° C. in a far-infrared drying oven, and the layer thickness after drying was formed to be 5 μm.
On the resin support layer, a resonance circuit serving as a security function part similar to that in Example 1 was formed using a screen printer.

Next, using the same material as the resin support layer, using a screen printer, the security function part is sandwiched on the resin support layer and printed at the same size as the resin support layer, and at a temperature of 100 ° C. in a far infrared drying oven. A layer covering the resin support layer including the security function part was formed so that the layer thickness after drying was 3 μm. This layer is provided as a coating layer for preventing a portion where the adhesive layer is exposed on the surface when the label is attached to the adherend.
Furthermore, using a screen printer, the security function part is sandwiched on the resin support layer, the same size as the resin support layer is printed, and drying is performed at a temperature of 100 ° C. for 3 minutes in a far infrared drying oven. The pressure-sensitive adhesive layer was formed so that the subsequent layer thickness was 30 μm.
Finally, using a laminator, a separator film was bonded onto the adhesive layer and processed into a predetermined label size to produce a transfer type security label sheet.

(Comparative example)
A PET film “Teijin Tetron Film G2” (manufactured by Teijin DuPont Films Ltd.) having a thickness of 50 μm was prepared as a base film. Conductive paste "Dotite FA-333" (manufactured by Fujikura Kasei Co., Ltd.) is prepared as a conductive paint for forming a resonance circuit to be a security function part, and resist ink "Dotite XB-101G" (Fujikura) is used as an insulating paint. Prepared by Kasei Co., Ltd.). As the adhesive layer coating material, an acrylic adhesive “CAT-1300S adhesive” (manufactured by Teikoku Mfg. Co., Ltd.) was prepared. As a separator film, a 75 μm thick PET film “A31” (manufactured by Teijin DuPont Films Ltd.) provided with a silicone release layer was prepared. In addition, said base film is not peeled and removed after sticking to a to-be-adhered body like the carrier film used in Examples 1-4, but it affixes on an to-be-adhered body with another layer. It is what

  On the above base film, printed with a coiled coil antenna pattern designed to obtain desired circuit characteristics using a screen printer, and in a far-infrared drying oven at a temperature of 130 ° C. After drying for 3 minutes and forming the antenna coil so that the layer thickness after drying is 10 μm, using a screen printer, the lower layer capacitor electrode and the jumper wire cover the part over the antenna coil, Print an insulating dielectric layer, dry for 3 minutes at a temperature of 100 ° C. in a far-infrared drying oven, and make a film thickness of 15 μm per layer after drying. Then, an insulating dielectric layer is formed so that the total thickness becomes 30 μm, and a jumper pattern composed of an upper capacitor electrode and a jumper wire is printed on the insulating dielectric layer using a screen printer, And dried for 3 minutes at a temperature of 130 ° C. at the outside line drying oven, a layer thickness after drying to form a jumper pattern such that 10 [mu] m, to form a resonant circuit as a security function portion.

Next, using a screen printer, the security function part is sandwiched on the base film, printed at the same size as the base film, and dried at a temperature of 100 ° C. for 3 minutes in a far-infrared drying oven. The adhesive layer was formed so that the layer thickness after drying was 20 μm.
Finally, using a laminator, a separator film was bonded onto the adhesive layer and processed into a predetermined label size to produce a security label sheet.

  In order to prevent the base film from being easily peeled off after the security label is attached to the adherend, it is preferable that the base film is as thin as possible. It is necessary to ensure the substrate strength in consideration of prevention of wire breakage, ease of peeling of the separator film, and prevention of bending and bending of the label at the time of application to the adherend. Yes.

(Evaluation)
After peeling off the separator film of each transfer type security label sheet of Examples 1 to 4 obtained as described above, this was attached to the adherend of ABS, the carrier film was peeled off, and a dedicated recognition device was used. When the communication operation of the security function unit was confirmed by using it, it was confirmed that any of Examples 1 to 4 was operating normally.
Thereafter, when the security label was peeled off from the adherend, the label itself was broken, and at the same time, the security function part was destroyed, and it was confirmed that the security function was lost.

  On the other hand, after peeling off the separator film of the security label sheet of the comparative example obtained as described above, this is pasted on the adherend of the ABS, and the communication operation of the security function unit is performed using a dedicated recognition device. After confirming that the security label is operating normally, the security label can be peeled off from the adherend without being broken or broken. When the communication function of the security function part was confirmed using the recognition device, it was confirmed that it was operating normally and the security function was not lost.

In the present invention, as can be seen from the results of Examples 1 to 4, the security label is difficult to peel while retaining its form after being attached to the adherend due to its structure. This is effective to prevent reuse after fraudulent activity. Here, by using a relatively thin resin support layer that becomes a support for forming the security function part, it shows brittleness against stress when trying to peel the label from the adherend, The resin support layer breaks. Here, if the adhesive of the adhesive layer is dissolved and peeled by a release agent or solvent that can be dissolved and peeled, the resin support layer is also dissolved at the same time. Such a thin resin support layer can be realized by using a transfer type security label sheet with a carrier film.
On the other hand, as can be seen from the results of the comparative example, in the security label sheet that does not include the carrier film, there is a limit to the thickness of the base film that is attached to the adherend from the viewpoint of securing the strength. Thereby, the security label attached to the adherend can be peeled off without breaking the base film, and can be attached again.

From the above, the security label of the present invention maintains its security function unless it is applied with stress to be peeled off after being attached to the adherend, but it is intended to be peeled off from the adherend. It was found that when a stress is applied, the security label is broken or destroyed, and at the same time, the security function part is surely destroyed, and the security function can be lost.
In addition, when the security label is peeled off, the security function section breaks in a state where the security function is lost, so the function and characteristics of the security function section cannot be analyzed. Become.

DESCRIPTION OF SYMBOLS 1 Transfer type security label sheet 2 Security label 3 Carrier film 4 Separator film 5 Resin support layer 5a Thin part 6 Adhesive layer 7 Security function part 8 Resonant circuit 8a Antenna coil 8b Capacitor 8c Insulating dielectric layer 9 Light emitting film layer 10 RF circuit 10a Antenna Coil 10b IC chip 10c Insulating film layer 11 Covering layer

Claims (18)

  A security support layer and a pressure-sensitive adhesive layer laminated together, a security label embedded in the resin support layer and / or the pressure-sensitive adhesive layer, and having a security function part used to determine whether or not there is access from the outside, and security A transfer-type security label sheet comprising a carrier film provided on the outer surface of the resin support layer of the label in a peelable manner and a separator film provided on the outer surface of the adhesive layer in the security label in a peelable manner.   The transfer type security label sheet according to claim 1, wherein the adhesive layer of the security label has a thickness greater than that of the resin support layer.   The transfer type security label sheet according to claim 1 or 2, wherein the adhesive layer of the security label has a thickness in a range of 20 µm to 200 µm.   The transfer type security label sheet according to claim 3, wherein the adhesive layer of the security label has a thickness within a range of 25 μm to 70 μm.   The security function unit of the security label includes an antenna coil and a capacitor, and includes a resonance circuit capable of transmitting and receiving radio waves at a predetermined resonance frequency with an external device. The transfer type security label sheet according to claim 1.   The security function unit of the security label is configured to include an antenna coil and an IC chip, and can transmit and receive radio waves at a predetermined resonance frequency with an external device and exchange recorded information in the memory of the IC chip. The transfer type security label sheet according to any one of claims 1 to 5, comprising a circuit.   A light-emitting film in which the security function part of a security label is formed of a material containing a light-emitting pigment that is excited or fluoresced or phosphorylated with respect to light of a specific wavelength, and can detect a phosphorescent reaction caused by light of a specific wavelength from an external device The transfer type security label sheet according to any one of claims 1 to 6, comprising a layer.   The transfer type security label sheet according to any one of claims 1 to 7, wherein the adhesive layer and / or the resin support layer of the security label has at least a part having a thickness different from that of the other part. Using the transfer-type security label sheet according to any one of claims 1 to 8, when attaching a security label to an adherend,
The separator film is peeled off from the outer surface of the adhesive layer of the security label to expose the outer surface, and then the outer surface of the adhesive layer of the security label is adhered to the surface of the adherend, so that the security label is A method of attaching a security label that is attached to an adherend together with a film.   The method for attaching a security label according to claim 9, wherein the carrier film is removed by peeling off the carrier film from the outer surface of the resin support layer of the security label.   Adhesive layer affixed to the surface of the adherend, resin support layer laminated on the adhesive layer, and embedded in the adhesive layer and / or resin support layer, whether or not there is external access A security label having a security function unit used for determination.   The security label according to claim 11, wherein the adhesive layer has a thickness greater than that of the resin support layer.   The security label according to claim 11 or 12, wherein the adhesive layer has a thickness within a range of 20 µm to 200 µm.   The security label according to claim 13, wherein the adhesive layer has a thickness in a range of 25 μm to 70 μm.   The said security function part is comprised including an antenna coil and a capacitor | condenser, and has a resonance circuit which can transmit / receive the electromagnetic wave with the predetermined | prescribed resonant frequency with an external device. Security label as described in.   The security function unit includes an antenna coil and an IC chip, and has an RF circuit capable of transmitting and receiving radio waves with an external device at a predetermined resonance frequency and exchanging recorded information in the memory of the IC chip. The security label according to any one of claims 11 to 15.   The security function section is formed of a material containing a luminescent pigment that is excited or fluoresced or phosphorescent with respect to light of a specific wavelength, and has a light emitting film layer that can detect a phosphorescent reaction due to light of a specific wavelength from an external device. The security label according to any one of claims 11 to 16.   The security label according to any one of claims 11 to 17, wherein the adhesive layer and / or the resin support layer has at least a part having a thickness different from that of the other part.