JP2013205902A - Ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC label capable of contact communication and non-contact communication.SOLUTION: An IC label 1 has a base material 2, and an IC chip 3 and wiring 4 connected to the IC chip 3 on one surface of the base material 2. The wiring 4 has an IC chip connection part for being connected to the IC chip 3 and an antenna part 5, and further has an external terminal part 6 between the IC chip connection part and the antenna part 5. An adhesive layer is provided on the other surface of the base material 2, and a cutting line 7 is provided between the antenna part 5 and the external terminal part 6.

Description

  The present invention relates to an IC (integrated circuit) label that is used by being attached to, for example, a product or its package. Specifically, the present invention relates to an IC label that can be switched from a non-contact communication function to a contact communication function.

Conventionally, there is a method of managing electrical appliances and their consumables using IC chips. These products use a contact type IC medium in order to manage the state of the product by contact type communication at the use stage.
However, in the manufacturing stage and the distribution stage, management by non-contact communication is more efficient for product management, and a medium capable of non-contact communication and contact communication is required.
An IC label is known as a member for managing products by non-contact communication.

Conventional IC labels are non-contact communication type, and are used to determine the authenticity of articles that are difficult to be counterfeited by being attached to relatively expensive products such as high-class liquor or consumables for electrical appliances (patents) References 1, 2, and 3).
Specifically, an IC inlet (non-contact IC medium) having a high security function is attached to a part of the adhesive surface of the label base material. According to this IC label, individual identification is made possible by storing identification information unique to the IC chip embedded in the IC inlet.
However, since the IC label is a non-contact communication type, it does not support contact type communication.

JP-A-11-134460 JP 2004-355519 A Japanese Patent No. 4781771

  Therefore, an object of the present invention is to provide an IC label capable of contact type communication and non-contact type communication.

  The present invention includes a base material, an IC chip and a wiring connected to the IC chip, and an adhesive layer, and the wiring has an IC chip connection part and an antenna part for connecting to the IC chip, and the IC chip The IC label has an external terminal portion between the connection portion and the antenna portion, and a cut line between the antenna portion and the external terminal portion.

  Further, a protective layer is provided on the IC chip and the wiring, and the protective layer has an opening for exposing the external terminal.

  Further, the external terminal portion is wider than the width of the wiring.

  Further, the external terminal portion is plated.

  Further, the cut line is a perforation and a half cut.

  Moreover, an external terminal protective seal is provided on the opening of the protective layer.

  Further, the cut line is provided in a portion where no wiring is formed.

  According to the present invention, an IC label capable of contact type communication and non-contact type communication can be obtained.

It is the schematic which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is a schematic cross section which shows an example of the IC label of this invention. It is the schematic which shows an example of the IC label of this invention.

Hereinafter, embodiments of the IC label according to the present invention will be described.
FIG. 1 is a schematic view of an IC label 1, and FIG. 2 is a cross-sectional view showing an example of a cross section taken along line AA ′ of FIG.
3 to 7 are sectional views showing other examples of the IC label.
As shown in FIGS. 1 and 2, the IC label 1 has an IC chip (IC module) and a wiring 4 provided on one surface of a base material 2. The wiring 4 has an IC chip (not shown) (not shown) and is connected to the IC chip via the IC connecting part.An adhesive layer 8 is provided on the other surface of the substrate. Prepare.
Further, the wiring 4 includes an antenna unit 5 capable of non-contact communication with an external device and an external terminal unit 6 for enabling contact communication with the external device. The wiring has a cut line between the antenna portion and the external terminal portion. This cut line serves as a guideline and a guide for cutting off the label. Since the cut line has a cut line, it is possible to make an IC label capable of non-contact communication before cutting and capable of contact communication after cutting.
Moreover, as shown in FIG. 4, the structure which provided the wiring 4 in the one surface of the base material, and also provided the adhesion layer 8 on it can also be taken. In this case, an opening can be provided in a portion corresponding to the external terminal portion 6 of the base material to enable contact communication with an external device. If it does in this way, a base material can also have a function as a protective layer.

Further, as shown in FIGS. 3 and 5 to 7, a protective layer 9 may be provided on the wiring 4. When the protective layer is provided, an opening can be provided so that the external terminal portion 6 of the wiring 4 is exposed. By providing the opening, contact communication with an external device becomes possible.
Moreover, you may provide the external terminal protection seal 11 in opening of this protective film, as shown in FIG. By having the external terminal protection seal, the external terminal can be protected before or when the external terminal is not used.
Furthermore, you may provide the peeling layer 10 on the adhesion layer 8, as shown in FIG.

As the substrate 2, a plastic substrate or a fragile substrate can be used. Examples of the plastic substrate include acrylic materials, polyester materials, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), and the like.
Examples of the brittle substrate include brittle plastic materials and paper materials. Examples of the brittle plastic material include, for example, a synthetic resin film such as brittle vinyl chloride and brittle polyester mixed with an appropriate amount of a plasticizer such as kaolin and calcium carbonate, or cellulose acetate, low density polyethylene, polystyrene, polyphenylene. Examples thereof include a film formed by forming a highly crystalline plastic material such as sulfide by solution film formation. Examples of paper materials that can be used include high-quality paper, medium-quality paper, fine-coated paper, coated paper, art paper, cast-coated paper, glass-impregnated paper, kraft paper, and synthetic paper. . If it is a fragile base material, it is difficult to peel it cleanly after being pasted once, so that unauthorized re-covering can be prevented. In addition, it is possible to prevent reuse by destroying the antenna at the time of peeling.

The substrate 2 may be a single layer or a laminate of a plurality of layers.
As what laminated | stacked multiple layers, you may use what bonded together the support body 22, the inlet base material 21 which provided the IC chip and the wiring, as shown in FIG. When a single-layer base material is used, the thickness is about 50 to 200 μm. When a plurality of base materials are used, each layer has a thickness of about 50 to 100 μm and a total thickness of about 100 to 200 μm.
The support 22 can be the same as the substrate 2.
The same inlet substrate as that of the substrate 2 can be used.
The inlet base material 21 and the support 22 can be bonded together with an adhesive, but depending on the material, they may be bonded together by heat fusion.

The IC chip 3 has at least a contact communication function and a non-contact communication function, and is connected to the wiring via an IC chip connection portion (not shown) formed in the wiring.
Note that the IC chip 3 may be provided on a base material, or a recess or an opening for receiving the IC chip may be provided on the base material and stored therein.
As the IC chip, an IC chip (so-called bare chip) having connection bumps (connection terminals) on the IC can be used. Also, a so-called IC module sealed with an IC chip resin mounted on a connection plate may be used.
The bumps of the IC chip 4 are electrically connected to the antenna 3 through electrical joints.
The electrical joint is composed of metal particles such as anisotropic conductive paste (ACP) and anisotropic conductive film (ACF) and an adhesive binder, and is electrically connected by curing the adhesive binder under heat and pressure conditions. It is preferable that the connection is realized. Note that the electrical connection between the IC chip connection portion of the wiring and the IC chip 3 is not limited to the above-described contact bonding method using ACP or ACF. For example, non-conductive paste (NCP) or non-conductive film (NCF) May be a contact bonding method using an ultrasonic wave, and may be a metal bonding method using ultrasonic waves (USB).

The wiring 4 has an IC chip connection part, an antenna part 5, and an external terminal part 6. Moreover, you may provide a capacitor | condenser, a matching circuit, etc. as needed.
The wiring 4 is not particularly limited as long as it can form a circuit with a conductive material, and various wirings can be used. For example, a method of forming a metal thin film into a pattern by etching, a method of arranging a conductive wire, and a method of forming an ink containing conductive particles in a pattern by printing. At least the IC chip connection portion and the antenna portion 5 can be formed in the same manner as the wiring 4, and the external terminal portion 6 may be formed in the same manner as the wiring, but may be formed and connected separately. In consideration of the cut-out property, a method of forming a metal thin film in a pattern by etching and a method of forming an ink containing conductive particles in a pattern by printing can be preferably used.
The thickness of the wiring is not particularly limited, but a wiring having a thickness of about 0.05 to 2 mm can be used.

The antenna unit 5 only needs to be able to communicate with an external non-contact communication terminal, and a radial antenna for a coiled antenna or a dipole antenna can be used. When using a coiled antenna, communication with an external terminal can be performed via the antenna portion before being cut by a cutoff line, which will be described later. Although it is not possible to perform non-contact communication after the cut by the cut line, the antenna portion is lost, but communication with an external terminal is possible through the external terminal portion. The number of turns of the coil antenna can be arbitrarily set according to the purpose.
When a radial antenna is used, communication with an external terminal through the antenna unit and communication with an external terminal through the external terminal unit are possible before cutting with a cutoff line described later. After being cut off by the cut line, the antenna portion is eliminated, and in the case of non-contact communication, the communication distance is remarkably shortened or communication is impossible, but communication with an external terminal via the external terminal portion is possible.

As a method of forming a metal thin film into a pattern by etching, a circuit pattern-like mask layer is formed using a substrate 2 or an inlet substrate 21 formed with a metal thin film such as aluminum, copper, silver, or tin. The wiring pattern of the metal thin film can be obtained by removing the metal thin film other than the portion where the mask layer is formed with the etching solution.
When this method is used, if wiring is directly provided on the base material 2, a plastic film having etching resistance can be suitably used for the base material 2. Moreover, if it provides on the inlet base material 21, the plastic film which has the inlet base material 21 etching tolerance can be used suitably, and a plastic base material and a brittle base material can be used as a support body.
In addition, when forming a coil-shaped antenna part by this method, you may draw out the jumper wire for connection to an external terminal part from a coil innermost periphery. For the jumper wire, an insulating layer is provided on both sides of the linear metal thin film, and both ends are in contact with the wiring, or a metal thin film pattern is provided on the surface opposite to the surface on which the wiring of the base material or inlet base material is provided. There is a method in which a conductive material is provided and connected to a through hole penetrating the base material or the inlet base material.

As a method of arranging the conductive wire, a conductive wire such as a metal wire can be arranged on the base material or the inlet base material by a winding machine or the like.
As the conductive wire, a wire made of a metal material such as copper, aluminum, silver, gold, iron, or tin can be used. Moreover, you may use what was coat | covered with the insulating material. By covering with an insulating material, the coil can be disposed across the coil from the innermost periphery of the coil to the external terminal portion, and a jumper wire need not be used.

The method using an ink containing conductive particles is a method of patterning an ink containing conductive particles, a solvent, a binder resin, etc., such as a silver paste, by a printing method. Examples of the conductive particles include metal particles such as silver, copper, nickel, and tin, conductive carbon powder, conductive fibers, and conductive whiskers. The solvent is not particularly limited and can be selected in consideration of the compatibility of particles and the like. The resin binder can be added as necessary.
As a printing method, it can be formed by printing by a printing method such as screen printing, flexographic printing, gravure printing, offset printing, or inkjet method. Since the wiring formed by this method is easily peeled off from the base material and easily broken, it is possible to prevent the IC label from being reused.
In addition, when forming a coil-shaped antenna part by this method, you may draw out the jumper wire for connection to an external terminal part from a coil innermost periphery. The jumper wire is provided with an insulating layer other than both ends of the linear metal thin film, and a method of bringing both ends into contact with the wiring, or a conductive pattern on the surface opposite to the surface on which the wiring of the base material or the inlet base material is provided, There is a method in which a conductive material is provided and connected to a through hole penetrating a base material or an inlet base material.

The external terminal portion 6 can be formed simultaneously with the formation of the wiring when the wiring is formed by a method of forming a metal thin film into a pattern by etching or a method using an ink containing conductive particles. In this case, the external terminal portion 6 can be formed in accordance with the size of the terminal with respect to the position where the terminal of the external terminal for contact comes. For example, the external terminal portion 6 can be formed wider with respect to the wiring so as to be easily in contact with the terminal portion on the external terminal device side. The external terminal portion 6 can be formed with a size of about 0.5 × 0.5 mm to 5 × 5 mm, for example.
Depending on the size and shape of the terminal portion on the external terminal device side, the wiring line may also be used as the external terminal portion. The external terminal portion can be plated. By plating, contact failure can be reduced and durability can be improved, and connection reliability can be improved. As a material to be plated, gold, silver, nickel, or an alloy thereof can be used.
Further, the conductive member may be arranged on the wiring as an external terminal portion without being formed simultaneously with the formation of the wiring.
In addition, as shown in FIG. 4, when an opening is provided in the base material and the external terminal 6 is exposed from the opening, wiring is provided to the vicinity of the opening on the back surface of the base material, and a conductive member provided with a conductive material is opened in the support. The external terminal 6 can be provided by connecting to the wiring.

When the wiring is formed by the method of disposing the conductive wire, the external terminal portion can be formed by disposing the conductive member on the wiring as the external terminal portion.
As the conductive member, a conductive material may be formed by transferring a metal thin film or printing. The external terminal portion 6 can be formed in accordance with the size of the terminal with respect to the position where the terminal of the external terminal for contact comes. For example, the external terminal portion 6 can be formed wider with respect to the wiring so as to be easily in contact with the terminal portion on the external terminal device side. The external terminal portion can be plated. By plating, it is possible to reduce contact failure and improve durability. Gold, silver, nickel or the like can be used as a material to be plated.
Further, depending on the size and shape of the terminal portion of the external terminal device, the wiring line made of the conductive wire may be used also as the external terminal portion.
In addition, as shown in FIG. 4, when an opening is provided in the base material and the external terminal 6 is exposed from the opening, wiring is provided to the vicinity of the opening on the back surface of the base material, and a conductive member is provided in the opening and connected to the wiring. Thus, the external terminal 6 can be provided.

An adhesive layer (or adhesive layer) can be provided on the surface of the substrate opposite to the surface provided with the antenna, IC chip, or the like. As the adhesive layer, for example, an acrylic material, a urethane material, an epoxy material, an ethylene-vinyl acetate resin, or the like can be used.
The pressure-sensitive adhesive layer may be provided on the entire surface of the label, or may be provided only on the IC chip side with a folding line interposed therebetween.

  In the present invention, the release layer 10 may be provided. The release layer is peeled off when used. As the release layer 10, a separator in which a release agent layer such as a silicone resin is laminated on a paper or plastic sheet by coating or the like is used.

In the present invention, the protective layer 9 can be provided on the surface of the substrate on which the IC chip and the wiring are formed. The protective layer can be formed by bonding or transfer forming film materials such as acrylic, polyester, and cellulose materials and sheet materials such as paper materials. Alternatively, a resin material such as an acrylic resin, a polyester resin, or a urethane resin may be applied. When a film is transferred and formed, a film subjected to hologram processing may be transferred and formed.
The protective layer 9 is formed so as to expose the external terminal portion. When the sheet material is bonded and transferred to form, it can be formed by providing an opening in a portion corresponding to the external terminal portion, aligning, bonding, and transferring. When the resin material is applied, it can be formed by printing while avoiding the external terminal portion by a printing method or the like. The opening part of the protective layer 9 should just expose at least the part which contacts an external terminal among external terminal parts, and should just be exposed about 80 to 200% with respect to the area of an external terminal part.
Moreover, as thickness of the protective layer 9, although it can set suitably within the range of about 0.1-1000 micrometers, it is not restricted to this.
Further, the protective layer may be transparent, but may be a colored layer that can conceal the wiring. The circuit pattern can be prevented from flowing out by having concealment.
The protective layer may function as a label base material.

You may provide an external terminal protection seal in the opening part which the external terminal of the protective layer 9 exposed. By providing the external terminal protection seal, the external terminal portion can be protected before contact communication with the external terminal or when contact communication is not performed. The external terminal protective seal may be provided in the opening of the protective layer as shown in FIG. 5, or may be provided so as to cover the opening as shown in FIG.
As external terminal protective seals, protective seal substrates made of polyester materials such as PET, acrylic materials, paper materials, etc., and adhesives such as acrylic materials, urethane materials, epoxy materials, ethylene-vinyl acetate resins, etc. The thing which has can be used.
Moreover, you may form an easy peeling layer in the label side as needed so that it may peel easily.

The IC label according to the present invention is characterized in that a cut line 7 is provided between a portion of the substrate 2 provided with the antenna portion 5 and a portion provided with the external terminal portion 6. The cut line 7 may be a straight line, a curve, or a combination thereof as long as the label can be divided across the wiring 4 connecting the antenna unit 5 and the external terminal 6.
The cut line 7 can be provided according to the base material used for the IC label and the material of the protective layer. For example, a line serving as a guide for cutting, a linear recess formed from one side or both sides for easy cutting, from one side or both sides A linear half cut, perforation, or the like can be used.

The cut line may be provided so that the IC label can be easily cut.
The reference line is a line having a hue different from that of the substrate by printing, printing, or the like. This method can be used when the substrate is made of paper. In particular, when the directions of the fibers are aligned, for example, by providing a reference line along the direction of the fiber, it can be cut out cleanly along the line.
The recess can be provided by pressing with a wire or the like. When providing a linear recessed part, the recessed part which becomes a thickness of about 5 to 50% with respect to the total thickness of a label can be formed by pressing from the one side or both sides of a label. In the case where the protective layer is provided, a concave portion may be provided on each of the base material and the protective layer for alignment, or the concave portion may be provided only on the uppermost protective layer. Moreover, you may form before providing an adhesion layer, and you may press from on an adhesion layer after forming an adhesion layer.
Half-cutting can be provided by cutting halfway in the substrate cross-sectional direction using a blade material. In the case of providing a linear half cut, it is possible to form a cut from one side or both sides of the label so as to be about 5 to 50% of the total thickness of the label. When the protective layer is provided, the protective layer side may be cut from the protective layer to the base material, or may be provided only on the protective layer. In this case, a cut may be made on the side of the substrate opposite to the protective layer. Moreover, you may form before providing an adhesion layer, and you may make a notch | incision from the adhesion layer after forming an adhesion layer.
Perforations form holes at regular intervals. When the perforation is provided, either a through hole or a non-through hole may be used. When the protective layer is provided, perforations may be provided in both the protective layer and the substrate, or perforations may be provided only in the protective layer. Moreover, you may form before providing an adhesion layer, and you may make a notch | incision from the adhesion layer after forming an adhesion layer.
Moreover, when it has a protective layer, you may provide a recessed part, a half cut, and a perforation only in a base material. In this case, a reference line may be provided on the protective layer as necessary. Such a configuration can be adopted when the protective layer is a relatively thin paper material.

  Further, the cutoff line can be provided so as to avoid a portion where the wiring is formed, that is, a portion where the wiring is not formed. When half cuts, recesses, and perforations are used as the cut lines, there is a possibility of electrical disconnection if these are formed in the wiring portion. Therefore, disconnection of the wiring can be prevented by not providing a cut line in the portion where the wiring is formed.

Further, a solvent coloring layer (solvent detector) may be provided on the surface opposite to the surface on which the IC chip and the wiring are formed. The solvent coloring layer has a property of chemically reacting with a peeling solvent for peeling the IC label attached to the adherend. Examples of the stripping solvent include weakly soluble organic solvents such as ethyl alcohol and acetone, and commercially available seal strippers. The solvent coloring layer has a structure in which dye particles that are insoluble in water and soluble in the peeling solvent are held in a dispersed state with an extender pigment in a resin binder. As a result, when the IC label is peeled off using a peeling solvent, the pigment held in a dispersed state in the solvent coloring layer is dissolved, and a trace remains as a color on the substrate. In addition, as dye particle | grains, dyes, such as a leuco dye and a fluorescent whitening agent, can be used, for example.
In addition to the action of peeling with a peeling solvent as described above, it is assumed that the adhesive material of the pressure-sensitive adhesive layer is softened by heat of a dryer or the like to peel off the IC label. In this case, the above-described dye alone does not reach the melting temperature, and the effect is insufficient. Therefore, it is preferable to use a thermal coloring material that develops color by thermal stimulation as the material of the solvent coloring layer. For example, together with the leuco dye, a developer that binds to the leuco dye by thermal stimulation is dispersed. In this case, a leuco dye is usually a colorless or light-colored material, and a material that manifests as a color tone when reacted with thermal is suitable. As a result, the solvent coloring layer has a thermal coloring function, and when the adhesive layer is softened and peeled off by heat, the solvent coloring layer is colored and a trace remains. In addition, the solvent coloring layer should just have at least one function of the above-mentioned solvent coloring function or thermal coloring function.
Moreover, it may replace with the above-mentioned solvent coloring layer, and you may provide the solvent melt | dissolution layer (solvent detection part) which melt | dissolves in a peeling solvent. Thereby, when peeling of an IC label is attempted using a peeling solvent, the solvent-dissolved layer is dissolved by the peeling solvent, and a trace remains on the substrate. In addition, you may provide the above-mentioned solvent coloring layer and solvent melt | dissolution layer, respectively. Thereby, the trace of peeling remains more reliably.

  Further, the IC label of the present invention may be provided with a security printing layer made of an invisible security ink such as an infrared absorbing material or a light emitting material such as a fluorescent material between or on each layer. The security printing layer can print a unique number or the like.

In the present invention, a picture layer, a printing layer, and the like can be provided as necessary.
Further, a concealing layer for concealing the wiring may be provided. The hiding layer can be formed by applying an ink containing a colored pigment or dye.

A PET film having a thickness of 50 μm was used as a base material, and a wiring obtained by etching copper was formed on one surface of the base material. The wiring thickness was 10 μm and the line width was 0.5 mm. The wiring pattern was as shown in FIG. 1, and an IC chip connection part (not shown), an external terminal part, and an antenna part were formed. Two external terminal portions having a size of 1.5 × 4 mm were formed, and the antenna portion was a three-turn coil antenna.
Next, a dual IC chip capable of contact communication and non-contact communication was connected to the IC chip connection portion of the wiring.
Next, a paper base material having two 1.5 × 4 mm openings formed in accordance with the external terminal portion as a protective layer is prepared, and the acrylic resin is prepared by aligning the positions of the openings and the external terminals formed on the base material. It bonded together with the adhesive agent.
Next, a perforation having a cut portion of 2 mm and a pitch of 1 mm was formed between the antenna portion and the external terminal portion.
Finally, an acrylic adhesive and release paper were provided on the side of the substrate opposite to the side on which the wiring was formed to obtain an IC label of the example.

<Evaluation>
Using the non-contact type R / W and the contact type R / W, the communication state with the IC label of Example 1 was confirmed.
As a result, before the IC label was cut along the perforation, communication with the non-contact type R / W was successfully performed, but communication with the contact type R / W was not possible. After the IC label was cut off along the perforation, communication with the non-contact type R / W was not possible, and communication with the contact type R / W was good.

DESCRIPTION OF SYMBOLS 1 ... IC label 2 ... Base material 21 ... Inlet base material 22 ... Support body 3 ... IC chip 4 ... Wiring 5 ... Antenna part 6 ... ····································································································· 7 Layer 13 ... Protective seal substrate

Claims (7)

A substrate, an IC chip, wiring connected to the IC chip, and an adhesive layer;
The wiring has an IC chip connection part and an antenna part for connecting to the IC chip, and further has an external terminal part between the IC chip connection part and the antenna part,
An IC label comprising a cut line between an antenna portion and an external terminal portion. A protective layer on the IC chip and the wiring;
2. The IC label according to claim 1, wherein the protective layer has an opening for exposing the external terminal.   The IC label according to claim 1, wherein the external terminal portion is wider than a width of the wiring.   The IC label according to claim 1, wherein the external terminal portion is plated.   The IC label according to claim 1, wherein the cut line is a perforation and a half cut.   The IC label according to any one of 2 to 5, wherein an external terminal protective seal is provided on the opening of the protective layer.   The IC label according to any one of 1 to 6, wherein the cut line is provided in a portion where no wiring is formed.

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