JP6651715B2 - Seal seal - Google Patents

Description

  The present invention relates to a sealing seal, and more particularly, to a sealing seal that can be determined by mechanical detection and visual inspection when illegally peeled off.

  Attach a seal to detect the opening of fraudulent items such as precious metals, documents containing confidential information, wrapping bags, boxes, and housings that contain recording media. That is being done. As such a seal, there is known a seal made of paper, film, or the like, which can visually confirm the presence or absence of opening.

  For example, with respect to an opening method using a solvent, it is possible to detect that the seal has been opened by coloring the seal or breaking the pattern printed on the seal. Further, with respect to the opening method using the dryer, the fact that the pattern printed on the seal is broken or the cut provided on the seal is broken can detect that the opening has been performed. Further, it is possible to visually confirm (gaze) that the seal has been opened with respect to the method of cutting the seal at the boundary of the opening.

  However, in some cases, it is difficult to visually confirm the change in the seal described above. In order to increase the efficiency of opening detection, the demand for mechanical detection of the seal has been increasing in recent years. As a method of such mechanical detection, for example, it is known to use a resonance tag having a built-in resonance circuit in a sealing seal (for example, see Patent Documents 1 to 3).

  With respect to a method of cutting the sealing seal at the boundary of the opening, a disconnection of a part of the wiring of the resonance circuit can be mechanically detected using radio waves of the resonance frequency of the resonance circuit. Such a resonance tag forms a resonance circuit by forming a coil on one surface of a base material and forming electrodes on both surfaces with the base material interposed therebetween to form a capacitor. Therefore, there is a problem that productivity is low because processing for metal wiring is required on both the front and back surfaces of the base material.

  Further, the conventional resonance tag is mainly used to prevent shoplifting. In order to detect that a product to which a resonance tag is attached is illegally taken out of a store, an operation of a resonance circuit by radio waves of a resonance frequency is detected by a detection device installed at a doorway of the store. Therefore, when a product is legally purchased, a part of the resonance tag circuit of the product is cut off at a store or the like so that the product is not detected by the detection device.

JP-A-64-23395 JP 2005-326623 A JP 2005-128189 A

  However, if the resonance tag is used to detect whether or not the opening has been illegally performed, if the resonance tag can be peeled from the opening using a solvent or a drier to the extent that the wiring of the resonance circuit is not broken, the fraudulent operation is performed. It cannot be detected. That is, it is easy to attach the same resonance tag or attach a different resonance tag again after the resonance tag is peeled off, so that there is a problem that an improper replacement cannot be detected.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a seal seal that can be judged by mechanical detection and visual inspection, and that, when peeled off from the peripheral edge of the seal seal, causes brittle fracture without fail.

Brittle present invention, in order to achieve the above object, one embodiment is a seal seals with the detection circuit for electrically detecting, formed on one side of the substrate A treatment layer, an anchor layer formed on the surface of the brittle treatment layer, wherein the circuit to be detected is formed on the surface, the brittle treatment layer is made of a polyester-based adhesive, and has a thickness of The pattern adhesive layer is formed by including a portion where the pattern adhesive layer of 0.05 to 0.5 μm is formed and a portion where the pattern adhesive layer is not formed, and the peripheral edge of the sealing seal does not include the pattern adhesive layer. The portion is a pattern in which a pattern is scattered on a plane, and when peeled from the peripheral portion, starting from this, it is continuously peeled along a portion where the pattern-shaped adhesive layer is not formed. And each of the patterns Over emissions is characterized by a shape which is Hitotsutsutsumi.

  According to the present invention, the periphery of the sealing seal is formed by the brittle treatment layer that includes the portion where the pattern adhesive layer is formed and the portion where the pattern adhesive layer is not formed and does not include the pattern adhesive layer at the periphery of the sealing seal. When peeled from the part, brittle fracture can be surely caused.

It is a figure showing a seal seal concerning a 1st embodiment of the present invention. It is a figure showing a section of a seal of a 1st embodiment. It is a figure showing the shape of the pattern adhesive layer of the sealing seal of a 1st embodiment. It is a figure which shows the relationship between the shape of a pattern adhesive layer, and peeling weight. It is a figure which shows the relationship between the shape of a pattern adhesive layer, and peeling weight. It is a figure showing a seal seal concerning a 2nd embodiment of the present invention. It is a figure showing a section of a seal of a 2nd embodiment. It is a figure which shows the shape of the pattern adhesive layer of the sealing seal of Example 2.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Structure of sealing seal)
FIG. 1 shows a seal according to a first embodiment of the present invention. FIG. 1 is a perspective view of the base material 2 as viewed from above the sealing seal. FIG. 2 is a diagram showing a cross section taken along a chain line AB in FIG. In the production of the sealing seal 1, since the base material 2 is sequentially laminated from the release layer 10 as described later, the base material 2 is the lowermost layer, and the release layer 10 is the uppermost layer. On the other hand, at the time of use, since the release layer 10 is removed and the adhesive layer 9 is attached to the adherend, the base material 2 becomes the upper surface and is visually observed.

  The sealing seal 1 has a pattern-like adhesive layer 11 and a light diffraction layer 12 which are to be brittle treatment layers formed on one surface of a substrate 2, and an anchor layer 15 is formed thereon. The light diffraction layer 12 is composed of a diffraction forming layer 13 and a metal reflection layer 14, and will be described later in detail.

  On the anchor layer 15, a print 8 is formed, and a conductive film to be the coil 3 and the lower capacitor electrode 4 is formed thereon. The connection portion 3 a outside the coil 3 connects the coil 3 to the lower capacitor electrode 4. The print 8 is printed so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4. A dielectric layer 5 is formed so as to cover the lower capacitor electrode 4, and an upper capacitor electrode 6 is formed thereon to form a capacitor on one surface of the substrate 2. By providing a jumper wire 7 connecting the connection portion 3b inside the coil 3 and the upper capacitor electrode 6, a resonance circuit 17 is configured as a detected circuit for performing electrical detection.

  Further, an adhesive layer 9 is provided on the entire surface so as to cover the structure on the anchor layer 15, and a release layer 10 is formed as the outermost layer, thereby forming the sealing seal 1. With such a configuration, there is no need to process both surfaces of the base material as in the related art, and it is only necessary to sequentially laminate the structures on one surface, so that the productivity is excellent.

(Base material)
The substrate 2 is not particularly limited, but may have any function that can support the resonance circuit 17 and the like. When the print 8 is provided, it is preferable to use a transparent base material so that it can be visually recognized from the other surface of the base material 2. For example, a resin base such as an acrylic base such as polyethylene terephthalate (PET), a polyolefin base such as polyethylene, a polyester base, and a polycarbonate base can be used. The thickness of the substrate can be 20 to 200 μm.

(Printing)
At least a part of the print 8 can be provided on the anchor layer 15 so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4. When the sealing seal 1 is peeled off, the resonance circuit 17 can be operated by connecting a part of the broken resonance circuit 17 using conductive ink. Even if the resonance circuit 17 can be electrically operated by superimposing the print 8 on the resonance circuit 17, it is difficult to restore the print 8, so that unauthorized opening and alteration of the sealing seal are visually detected. can do.

  The print 8 can be formed by a conventional printing method, and specific examples include letters, numbers, symbols, and tint block. In particular, it is preferable to form them continuously and periodically. Further, the print 8 may be formed over the entire surface of the anchor layer 15 or may be formed along the resonance circuit 17. The thickness of the print 8 is 1 to 10 μm, preferably 2 to 3 μm. If the thickness is too large, the resonance circuit provided thereon may be adversely affected.

(Resonant circuit)
The coil 3 and the lower capacitor electrode 4 constituting the resonance circuit 17 are not particularly limited as long as they have conductivity. For example, a method of patterning a metal thin film by etching or the like, or a method of forming the same by a printing method such as screen printing using a conductive paste can be used. Considering that the resonance circuit 17 is easily broken when the sealing seal 1 is peeled off and that a capacitor is formed based on the lower capacitor electrode 4, it is preferable to use a conductive paste. In addition, from the viewpoint of productivity, it is preferable to use a conductive paste because it can be formed by printing.

  As the conductive paste, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When a conductive paste is used, the thickness is 10 to 30 μm. Although the pattern of the resonance circuit is not particularly limited, it can be constituted by one or more turns of a coil pattern adjusted to a desired resonance frequency and a capacitor on the same surface of the substrate 2.

  As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate or the like can be used. Further, the conductive paste may include a binder resin as needed.

  Detectors include a system that uses the resonance frequency of the resonance circuit and a frequency different from the resonance frequency in combination, and a system that uses only the resonance frequency of the resonance circuit. The former method enables detection regardless of the arrangement of the capacitors. In the latter method, if a capacitor is disposed inside the coil, the capacitor may be erroneously detected even if the coil is cut, and it may not be possible to detect that the coil has been cut. Therefore, considering that the latter method is used, it is preferable to dispose the capacitor outside the coil 3 as shown in FIG.

(Capacitor)
For the dielectric layer 5 constituting the capacitor, an insulating resin can be used. The insulating resin is preferably formed by printing. The dielectric layer 5 only needs to be formed so as to cover at least the lower capacitor electrode 4. When the upper capacitor electrode 6 is provided, the lower capacitor electrode 4 is formed so that conduction does not occur at the end of each electrode. Form larger. Note that an insulating resin may be formed on one entire surface of the base material 2, but the cost is increased. Preferably, the dielectric layer 5 is larger than the lower capacitor electrode 4 by 0.1 to 5 mm.

  The connection between the connection portion 3b inside the coil 3 and the upper capacitor electrode 6 is connected by a jumper wire 7 provided on the dielectric layer 5 formed over the coil 3 as shown in FIG.

  Examples of the insulating resin used for the dielectric layer include an acrylic / urethane-based resist. As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate or the like can be used. Further, it is preferable that the dielectric layer 5 is printed twice or more. This is because, when formed by printing, it is difficult to secure a thickness sufficient to secure insulation. From the viewpoint of productivity, it is preferable that the dielectric layer 5 can be formed by two printings. The dielectric layer 5 is formed by screen printing or the like, and has a thickness of 10 to 50 μm. Preferably it is especially 20 to 40 μm. Within this range, smoothness is not adversely affected, and a short circuit between the upper capacitor electrode 6 and the lower capacitor electrode 4 can be prevented.

  Upper capacitor electrode 6 and jumper wire 7 are formed on dielectric layer 5. The upper capacitor electrode 6 and the jumper wire 7 are not particularly limited as long as they have conductivity. Considering that the resonance circuit 17 is easily broken when the sealing seal 1 is peeled off, it is preferable to use a conductive paste. As the conductive paste, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When a conductive paste is used, the thickness is 10 to 30 μm. As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate or the like can be used. Further, the conductive paste may include a binder resin as needed.

  As described above, the detector using only the resonance frequency of the resonance circuit, if a capacitor is placed inside the coil, will detect the capacitor by mistake even if the coil is disconnected, and the coil will be disconnected. May not be detected. Therefore, in the seal 1 of the first embodiment, the capacitor is arranged outside the coil 3.

(Adhesive layer)
The adhesive layer 9 is provided for attaching a sealing seal to an adherend, and is not particularly limited as long as it has sufficient adhesiveness. Known adhesives and adhesives can be used. For example, an acrylic adhesive can be used. The adhesive layer 9 can be formed by a printing method, and has a thickness of 10 to 100 μm.

  A release layer 10 can be provided as the outermost layer. When the sealing seal 1 is used, the release layer 10 is peeled off, and the exposed adhesive layer 9 is attached to the adherend. The release layer 10 is not particularly limited, but a paper material can be used. Specifically, coated paper or the like that has been subjected to release processing can be used.

(Patterned adhesive layer)
For the patterned adhesive layer 11 functioning as the brittle treatment layer, a material having an adhesive strength stronger than the adhesive strength of the adhesive layer 9 is used. The pattern-like adhesive layer 11 is not applied to the entire surface of the base material 2 like the adhesive layer 9, but is formed on a pattern and subjected to a brittle treatment described below. When the sealing seal 21 once adhered is peeled off, in a portion where the pattern-shaped adhesive layer 11 is provided, the resonance circuit or the like is pulled toward the base material 2 and the pattern-shaped adhesive layer 11 is not provided. In the portion, a pattern is formed so that the resonance circuit and the like remain on the adherend together with the adhesive layer 9. As a result, when the sealing seal 21 is peeled off, the resonance circuit and the like can be easily broken, and the peeling of the sealing seal can be detected with higher accuracy.

  The pattern-like adhesive layer 11 is not particularly limited as long as it satisfies the above function, and for example, a polyester-based adhesive can be used. The pattern adhesive layer 11 can be formed by a printing method or the like, and has a thickness of 0.05 to 0.5 μm. In particular, it is preferably 0.2 μm or less. In this range, the unevenness is small, so that the shape of the patterned adhesive layer described below becomes inconspicuous, making it difficult for a person who performs forgery to notice. For this reason, when the sealing seal is peeled off, traces of the peeling can be more clearly left.

  FIG. 3 shows the shape of the patterned adhesive layer of the sealing seal of the first embodiment. The pattern of the patterned adhesive layer 11 is not particularly limited as long as it can destroy a resonance circuit or the like, but at least a portion where the patterned adhesive layer 11 is formed at the end of the sealing seal 1 and a portion where the patterned adhesive layer 11 is not formed. Is preferably included. In addition, as shown in FIG. 3, it is desirable that the pattern has a pattern in which a pattern is scattered on a plane, and that the pattern-shaped adhesive layer is not included in the periphery of the four sides of the sealing seal.

  FIG. 4 shows the relationship between the shape of the patterned adhesive layer and the peeling weight. When the patterned adhesive layer shown in FIG. 3 is peeled in the direction of FIG. 4B, the force (peeling weight) required for the peeling at the position where the light diffraction layer 12 is peeled from the substrate 2 is shown in FIG. (A). When the sealing seal is peeled off from the periphery of one of the four sides according to the pattern shown in FIG. 3, first, the light diffraction layer 12 is broken (peeled) from the base material 2 at the periphery. With this as a starting point, the light diffraction layer 12 is continuously peeled off from the base material 2 as it is along the portion where the pattern adhesive layer 11 is not formed. Thereby, brittle fracture can be reliably caused.

  That is, the pattern is such that the pattern is scattered on a plane, and the same pattern is periodically arranged, and the portion where the pattern-shaped adhesive layer 11 is not formed is opposed to the four sides of the sealing seal. It is desirable that the two sides be formed linearly.

  FIG. 5 shows a comparative example. The relationship between the shape of the patterned adhesive layer and the peeling weight is shown. The pattern adhesive layer shown in FIG. 5B includes a portion where the pattern adhesive layer 11 is formed and a portion where the pattern adhesive layer 11 is not formed, but has a continuous pattern of stripes. FIG. 5A shows the force (peeling weight) required for peeling when peeling in the direction of FIG. 5B. In a pattern in which no pattern is scattered, the peeling does not occur along the portion where the pattern-like adhesive layer 11 is not formed. Therefore, the force (peeling weight) required for peeling requires a certain force or more continuously. I do. Therefore, the pattern in which the patterns shown in FIG. 3 are dotted can surely cause brittle fracture.

  When the pattern-like adhesive layer 11 is formed on the peripheral edge of the four sides of the seal, when the seal is peeled off from the peripheral edge, before the light diffraction layer 12 is broken (peeled) from the substrate 2, There is a possibility that the sealing seal 1 may be peeled off from the adherend.

  As described above, the shape of the pattern of the pattern adhesive layer 11 is not particularly limited as long as it can destroy the resonance circuit and the like, but the shape is complicated, such as an X-shape or a star as shown in FIG. Is preferable. By making such a non-convex hull a complicated shape, when the sealing seal is peeled off from the adherend, the light diffraction layer 12 is not peeled cleanly from the substrate 2 according to the shape of the pattern. However, unlike the shape of the picture, it is peeled off into an irregular shape, so that it is difficult to stick it back.

  As described above, the resonance circuit 17 is preferably formed by printing a conductive paste by a printing method such as screen printing. This is because the resonance circuit itself is brittle and easily broken. In the case of forming by a printing method, since a solvent is often used for the conductive paste, drying at a high temperature is required. On the other hand, the substrate 2 and the peeling layer 10 may be peeled by heat in some cases, and the printing process of the resonance circuit 17 makes the peeling heavy and hard to break. Even in such a case, if the pattern-like adhesive layer 11 is a pattern in which pictures are scattered on a plane, a remarkable effect of reliably causing brittle fracture can be obtained.

(Light diffraction layer)
As the light diffraction layer 12, for example, a hologram layer including a diffraction forming layer 13 having a diffraction structure and a metal reflection layer 14 can be used. The provision of the light diffraction layer 12 makes it possible to visually judge when the optical fiber is illegally peeled off, thereby increasing the security level. The diffraction forming layer 13 is provided on the base material 2 and the patterned adhesive layer 11, and after forming the diffraction structure, the metal reflection layer 14 is provided. The diffraction forming layer 13 can be made of a resin material such as acryl, and forms a diffraction structure using an embossing plate. As the metal reflection layer 14, a metal reflection material such as aluminum, or a semi-transmissive and semi-reflective metal compound such as zinc oxide, zinc sulfide, and titanium oxide can be used.

  It is preferable that the diffraction forming layer 13 has a weaker adhesive strength with the substrate 2 than the adhesive strength of the adhesive layer 9. This is because, when the pattern-shaped adhesive layer 11 is provided, when the sealing seal 1 is peeled off, it is broken into a pattern. That is, in the portion where the patterned adhesive layer 11 is provided, the light diffraction layer 12 remains on the substrate 2 side, and in the portion where the patterned adhesive layer 11 is not provided, the light diffraction layer 12 is attached to the adhesive layer 9. And remains on the adherend side.

  When the patterned adhesive layer 11 is provided, the diffraction forming layer 13 can be provided on the patterned adhesive layer 11. By doing so, when the sealing seal 1 is peeled, the optical diffraction layer 12 is also destroyed together with the resonance circuit, and therefore, it is more preferable in terms of detecting the peeling of the sealing seal 1.

  When the light diffraction layer 12 is provided, the anchor layer 15 is provided between the light diffraction layer 12 and the resonance circuit 17. When a hologram layer is formed as the light diffraction layer 12, unevenness remains on the surface. Therefore, it is preferable to form the resonance circuit 17 after smoothing the surface with the anchor layer 15.

  Note that the light diffraction layer 12 is not limited to a hologram element, and various elements such as a scattering element and a multilayer interference element can be used. Alternatively, only the patterned adhesive layer 11 and the anchor layer 15 may be formed on one surface of the substrate 2 and only the brittle treatment layer having no hologram layer may be formed.

(Pattern of light diffraction layer)
Since the metal material has conductivity, it adversely affects the electrical characteristics of the resonance tag. In addition, the inside of the adherend to which the seal is attached cannot be seen due to lack of transparency. Therefore, the metal reflection layer 14 needs to be patterned in a halftone dot shape. Specifically, patterning can be performed by etching using a mask layer. By patterning, an optical effect can be partially exhibited, and by patterning in a halftone dot shape, the conductivity of the metal reflection layer can be eliminated, and the influence on the resonance circuit can be eliminated. Further, the visibility is improved by the patterning, and the inside of the adherend can be confirmed.

(IC tag)
FIG. 6 shows a seal according to a second embodiment of the present invention. FIG. 6 is a perspective view of the base material 2 as viewed from above the sealing seal. FIG. 7 is a diagram showing a cross section taken along a chain line AB in FIG. In the first embodiment, in order to perform electrical detection, a resonance circuit is used as a configuration that can be mechanically detected by a detector. However, in the second embodiment, a detected circuit for performing electrical detection is used. An IC tag on which an IC chip is mounted is used as a circuit.

  The sealing seal 21 has a patterned adhesive layer 11 and a light diffraction layer 12 serving as a brittle treatment layer formed on one surface of a substrate 2, and an anchor layer 15 formed thereon. The light diffraction layer 12 includes a diffraction forming layer 13 and a metal reflection layer 14. On the anchor layer 15, a print 8 is made, and a conductive film to be the coil 3 is formed thereon. An IC chip 22 is mounted inside the coil 3 and connected to the coil 3.

  Further, an adhesive layer 9 is provided on the entire surface so as to cover the structure on the anchor layer 15, and a release layer 10 is formed as the outermost layer, thereby forming the sealing seal 1. With such a configuration, there is no need to process both surfaces of the base material as in the related art, and it is only necessary to sequentially laminate the structures on one surface, so that the productivity is excellent.

[Example 1]
As the base material 2, PET having a length of 20 mm, a width of 40 mm, and a thickness of 50 μm was used. A pattern adhesive layer 11 made of a polyester resin adhesive was formed on one surface of the substrate 2 by gravure printing so as to have an average film thickness of about 0.15 μm. As the pattern of the pattern adhesive layer 11, X-shaped patterns having a crossing straight line length of 3 mm were arranged at intervals of 8 mm.

  A diffraction forming layer 13 made of urethane-acrylic resin was formed on the patterned adhesive layer 11 by gravure printing so as to have an average film thickness of about 1.5 μm. Next, a diffraction structure was formed on the diffraction forming layer 13 using a hologram embossing plate. The light diffraction layer 12 was formed thereon by providing aluminum as the metal reflection layer 14 with a thickness of 50 nm by an evaporation method.

  In order to pattern the metal reflection layer 14 into a halftone dot, a mask layer made of a vinyl acetate resin is formed to a thickness of about 1.5 μm using a gravure plate having a laser Poschel plate 250 line dot ratio of 35%. Next, it is formed by gravure printing. Next, the mask layer was printed by an alkali etching method to remove aluminum in portions other than the portion, thereby obtaining a light diffraction layer 12 having a dot pattern.

  An anchor layer 15 made of polyvinyl butyral resin was formed on the optical layer 12 by gravure printing so as to have an average thickness of about 0.1 μm.

  Print 8 was printed on anchor layer 15 using red ink. In Print 8, a repetition pattern of “TP0123” was formed by screen printing to a thickness of about 2 μm at a position overlapping the long side of the resonance circuit provided in a later step.

  Next, a resonance circuit 17 having a resonance frequency of 28 MHz was formed as follows. The coil 3 and the lower capacitor electrode 4 were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so that the average film thickness was about 10 μm. The pattern of the coil 3 is a substantially rectangular pattern composed of six turns, and is connected to the lower capacitor electrode 4 of 1.4 mm long × 20 mm wide at a connection portion 3 a outside the coil 3. The connection portion 3b inside the coil 3 is connected to the upper capacitor electrode 6 via a jumper wire.

  A dielectric layer 5 was formed below the lower capacitor electrode 4, a part of the connection portion 3b inside the coil 3, and below a jumper wire 7 provided in a later step. An average film thickness of about 15 μm was printed by one screen printing, and a dielectric layer 5 having an average film thickness of 30 μm was formed by two printings. As a material for the dielectric layer 5, a thermosetting highly transparent resist (manufactured by Asahi Chemical Laboratory Co., Ltd.) was used. In the portion covering the lower capacitor electrode 4, the dielectric layer 5 was provided in a shape larger by 1 mm outside each of the four sides of the lower capacitor electrode 4.

  An upper capacitor electrode 6 and a jumper wire 7 were formed on the dielectric layer 5 by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 10 μm. The resonance circuit 17 was produced by connecting the connection portion 3 b inside the coil 3, which is partially exposed, to the upper capacitor electrode 6 by a jumper wire 7.

  Finally, an acrylic pressure-sensitive adhesive was coated as the adhesive layer 9 with an average film thickness of about 50 μm, and a release paper was attached as the release layer 10 to produce a seal A.

[Example 2]
Sealing seal B was produced in the same manner as in Example 1. However, it differs from Example 1 only in the pattern of the pattern adhesive layer 11. As shown in FIG. 8, the pattern of the pattern adhesive layer 11 was a star-shaped pattern having a circumscribed circle of 5 mm in diameter and arranged at intervals of 10 mm.

(Comparative Example 1)
As a comparative example, a sealing seal C was produced. However, the difference from the first and second embodiments is only the pattern of the pattern adhesive layer 11. As the pattern of the pattern adhesive layer 11, a round pattern having a diameter of 5 mm was arranged at an interval of 10 mm.

(Comparative Example 2)
As a comparative example, a seal D was produced. However, the difference from Examples 1 and 2 is that only the pattern of the pattern adhesive layer 11 is different. As shown in FIG. 5B, a continuous diagonal stripe pattern having a width of 1 mm is formed at an interval of 3.5 mm. Arranged.

(Machine detection test)
The communication performance of the seal as a resonance tag was evaluated. In each of the seals A, C, and D produced in Examples 1 and 2 and Comparative Examples 1 and 2, the response of the resonance circuit could be detected using a detector (manufactured by AIMEX: electrical detection at a frequency of 28 MHz).

(Peeling test)
When the seal A attached to the acrylic plate was peeled off by hand, the seal was broken (peeled) from the periphery of the seal, and the optical diffraction layer and the resonance circuit were partially left on the acrylic plate and were visually broken. That was confirmed. In particular, as compared with the sealing sheet C of Comparative Example 1, the X-shaped concave portion was broken while the optical diffraction layer was pulled by the adhesive, so that it could not be attached cleanly. In addition, it was impossible to detect even with the detector, and it was clearly confirmed that the sealing seal was broken. Even when the sealing seal B of Example 2 was peeled off, the concave portion of the star-shaped pattern was broken while the optical diffraction layer was pulled by the adhesive, so that it could not be reattached cleanly.

  On the other hand, when the seal C produced in Comparative Example 1 was peeled off by hand, the seal was broken (peeled) from the periphery of the seal and the light diffraction layer and the resonance circuit were partially left on the acrylic plate. It was easily destroyed according to the pattern, so that it could be easily re-attached.

  Furthermore, when the sealing seal D produced in Comparative Example 2 was peeled off by hand, the peripheral edge of the sealing seal did not break (peel), so when carefully peeled, the seal could be peeled without breaking. In addition, it was also detected by the detector, and it was found that the seal could be reused.

DESCRIPTION OF SYMBOLS 1 Sealing seal 2 Base material 3 Coil 4 Lower capacitor electrode 5 Dielectric layer 6 Upper capacitor electrode 7 Jumper wire 8 Background printing part 9 Adhesive layer 10 Release layer 11 Patterned adhesive layer 12 Optical diffraction layer 13 Diffraction forming layer 14, 16 Metal reflection Layer 15 Anchor layer 17 Resonant circuit

Claims (9)

A seal seal having a detected circuit for performing electrical detection,
A brittle treatment layer formed on one surface of a substrate,
An anchor layer formed on a surface of the brittle treatment layer, wherein the detected circuit is formed on the surface,
The brittle treatment layer is made of a polyester-based adhesive and includes a portion where a pattern-like adhesive layer having a thickness of 0.05 to 0.5 μm is formed and a portion where the pattern-like adhesive layer is not formed. The portion where the pattern-like adhesive layer is not included in the portion, the portion where the pattern-like adhesive layer is formed is a pattern in which a pattern is scattered on a plane, and when peeled from the peripheral portion, the pattern-like A sealing seal formed so as to be continuously peeled along a portion where an adhesive layer is not formed, wherein each pattern of the picture has a non-convex hull shape.   In the brittle treatment layer, the pattern is periodically arranged, and a portion where the pattern adhesive layer is not formed is formed linearly between two opposing sides of the four sides of the sealing seal. The seal according to claim 1, wherein the seal is formed.   The part where the pattern-shaped adhesive layer of the brittle treatment layer is formed has an adhesive force stronger than an adhesive force of an adhesive layer for attaching the sealing seal to an adherend. Seal seal described. Having a light diffraction layer between the brittle treatment layer and the anchor layer,
The sealing seal according to any one of claims 1 to 3, wherein the light diffraction layer includes a diffraction forming layer and a metal reflection layer, and the metal reflection layer is formed in a halftone dot pattern.   The sealing seal according to claim 4, wherein the diffraction forming layer has an adhesive strength lower than an adhesive strength of an adhesive layer for attaching the sealing seal to an adherend.   The detected circuit is a resonance circuit including a coil and a capacitor, the coil and a lower electrode of the capacitor are formed on the anchor layer, and the capacitor is a dielectric layer covering the lower electrode and the lower electrode. The seal according to any one of claims 1 to 5, wherein the seal comprises a top electrode on the dielectric layer.   The seal according to claim 6, wherein the coil, the lower electrode, and the upper electrode are formed of conductive ink.   The sealing seal according to claim 6, wherein printing is performed so as to overlap a part of the coil and / or the lower electrode.   The seal according to claim 1, wherein the detected circuit is an IC tag on which an IC chip is mounted.