JP6060489B2 - Non-contact IC label and nameplate - Google Patents

Description

  The present invention relates to non-contact IC labels and nameplates used in UHF and SHF bands.

Conventionally, wireless communication is performed between an RFID tag (a non-contact IC (Integrated Circuit) label) and a reader. However, when this RFID tag is attached to a metal adherend, the communication performance deteriorates. To solve this problem, various configurations of RFID tags as described below have been studied. Yes.
For example, in an electromagnetic induction type RFID tag using radio waves in the 13.56 MHz band, a magnetic material (magnetic sheet) having a high magnetic permeability is provided between the antenna and the adherend, and loss is caused between the antenna and the adherend. By securing a route for a small amount of magnetic flux, an RFID tag that can be used even when attached to a metal adherend is realized.

On the other hand, in a radio frequency RFID tag used in the UHF band and the SHF band, a gap between the antenna and the adherend is secured by providing a dielectric or an air layer between the antenna and the adherend. A method for suppressing the influence of the adherend is generally used.
However, in this method, when a dielectric having a thickness of about 500 μm is used between the antenna and the adherend or an air layer having the same thickness is provided, the distance between the antenna and the adherend is not sufficient. Since it is too narrow, it is strongly influenced by the metal adherend and communication is impossible. Therefore, at present, it is considered difficult to produce a thin RFID tag (thickness of 500 μm or less).

  As another RFID tag of the radio wave system used in the UHF band and the SHF band, as shown in Patent Document 1, a configuration in which a magnetic body is provided between an antenna and an adherend has been proposed. In this RFID tag, a soft magnetic material is disposed between an antenna and a metal adherend. In Patent Document 1, there is a clear description of the soft magnetic material, but there is no clear description of the antenna to be used. As an application example of the antenna, there is a description of a monopole antenna, but there is only a description that the ground side element of the dipole antenna is dropped on a casing (metal object), and details thereof are not shown.

JP 2005-309811 A

  As an electrical connection method between the ground side and the housing in the monopole antenna described in Patent Document 1, methods such as bolts and screws, caulking, and the like are conceivable. Since there are problems such as oxide film formation and contamination on the connection conductor surface provided in the housing, the electrical connection method described above breaks those insulating films due to mechanical stress, and the electrical connection reliability Is increasing.

  However, when the RFID tag is used for a thin and small label, the above-described method of connecting to the housing such as bolts and screws, caulking, etc. is not practical because it is very inconvenient. . In addition, when an RFID tag is used as a label, the structure is affixed to the housing by the adhesive force of a non-conductive adhesive layer (adhesive) provided on the back surface, so that the convenience as a label is maintained. There is a problem in that it is not easy to electrically connect the ground side element to the casing.

  The present invention has been made in view of such problems, and operates as a monopole antenna, can communicate even when attached to a metal adherend, is thin, small, and practical. An object of the present invention is to provide a contactless IC label and a nameplate which are extremely excellent in performance.

In order to solve the above problems, the present invention proposes the following means.
The non-contact IC label of the present invention includes a magnetic sheet, an antenna unit disposed on one surface of the magnetic sheet, and a surface disposed on one surface of the magnetic sheet, and is electrically connected to the antenna unit. The impedance matching circuit unit, the IC chip provided in the impedance matching circuit unit, and a part thereof are disposed on the other surface of the magnetic sheet and bent so as to be disposed along the edge of the magnetic sheet. And a ground portion electrically connected to the impedance matching circuit portion, and an adhesive layer disposed on the other surface of the magnetic sheet, and viewed in the thickness direction of the magnetic sheet Sometimes, the antenna unit is disposed in a region occupied by the ground unit, the magnetic sheet, the antenna unit, the impedance matching circuit unit, the ground unit, and Serial adhesive layer is characterized by having a heat resistance.

In the above non-contact IC label, a substrate formed in a film shape and having heat resistance is provided, and the IC chip, the antenna unit, the impedance matching circuit unit, and the ground unit are main components of the substrate. More preferably, it is provided on the surface.
In the non-contact IC label, it is more preferable that the IC chip and the impedance matching circuit portion are metal welded by ultrasonic bonding.

In the above non-contact IC label, the magnetic sheet is formed of magnetic particles or magnetic flakes and a binder, and the binder includes a silicone resin, a fluorine resin, an epoxy curable resin, a polyether sulfone. It is more preferable that at least one of a series resin and a polyimide series resin is used.
In the non-contact IC label, it is more preferable that the antenna unit, the impedance matching circuit unit, and the ground unit are formed of aluminum.

  Another non-contact IC label of the present invention includes a magnetic sheet, an antenna portion disposed on one surface of the magnetic sheet, and disposed on one surface of the magnetic sheet, and electrically connected to the antenna portion. The connected impedance matching circuit unit, the IC chip provided in the impedance matching circuit unit, and a part thereof are arranged on the other surface of the magnetic sheet so as to be arranged along the edge of the magnetic sheet And a protective member housed in a ground portion electrically connected to the impedance matching circuit portion and a hole formed in the magnetic sheet so as to penetrate in the thickness direction of the magnetic sheet. And when viewed in the thickness direction, the antenna portion is disposed in an area occupied by the ground portion, and the protective member is disposed on one surface side of the magnetic sheet. Wherein the housing portion formed to extend in the thickness direction, is characterized in that said IC chip is disposed.

In the above non-contact IC label, it is more preferable that the housing portion penetrates the protective member in the thickness direction.
In the non-contact IC label, it is more preferable that the length of the housing portion in the thickness direction is longer than the length of the IC chip in the thickness direction.
Further, in the above non-contact IC label, a communication portion that communicates with the housing portion and opens on an outer peripheral surface of the protection member is formed at an edge portion on one surface side of the magnetic sheet in the protection member, More preferably, a part of the impedance matching circuit section is disposed in the communication section.

In the above non-contact IC label, it is more preferable that the communication part penetrates the protective member in the thickness direction.
In the non-contact IC label, it is more preferable to use a radio wave system as a communication system with the data reading device.

  Further, the non-contact IC label of the present invention has a communication part capable of non-contact communication and a hole for accommodating the communication part on the first surface, and the second side opposite to the first surface. A sheet-like main body having a display surface as a display surface, wherein the communication unit includes a magnetic sheet, an antenna unit disposed on one surface of the magnetic sheet, and the magnetic sheet. An impedance matching circuit unit electrically connected to the antenna unit, an IC chip provided in the impedance matching circuit unit, and a part thereof on the other surface of the magnetic sheet. A ground portion that is disposed and bent so as to be disposed along an edge portion of the magnetic sheet, and is electrically connected to the impedance matching circuit portion; and a thickness direction of the magnetic sheet When seen in the ante Parts is characterized by being arranged in the region where the ground portion is occupied.

In the nameplate, it is more preferable to include a lid portion that is attached to the first surface of the main body portion and seals the hole portion in a watertight manner.
In the nameplate, the hole is formed on a hole main body formed on the first surface of the main body, and on the second surface side of the hole main body of the main body. More preferably, the IC chip is provided at a position overlapping the auxiliary hole when viewed in the thickness direction.
In the nameplate, the communication unit includes a protective member housed in a hole formed to penetrate the magnetic sheet in the thickness direction. In the protective member, one of the magnetic sheets More preferably, the IC chip is arranged in a housing portion formed so as to extend in the thickness direction from the surface side.

Further, in the above-mentioned nameplate, a communication portion that communicates with the housing portion and opens on the outer peripheral surface of the protection member is formed at an edge portion on one surface side of the magnetic sheet in the protection member, and the impedance matching It is more preferable that a part of the circuit part is disposed in the communication part.
In the nameplate, it is more preferable to use a radio wave system as a communication system with the data reader.

  According to the non-contact IC label and the nameplate of the present invention, it operates as a monopole antenna, can communicate even when attached to a metal adherend, is thin, small, and extremely practical. It can be.

It is sectional drawing of the side which shows typically the non-contact IC label of a reference example. It is a top view of the non-contact IC label. It is a bottom view of the non-contact IC label. It is a figure which shows the state which printed the antenna part, the impedance matching circuit part, and the ground part on the main surface of the base material in the same non-contact IC label. It is sectional drawing which shows the state which affixed the non-contact IC label on the metal to-be-adhered body. It is a side view explaining the content of the experiment using the non-contact IC label. It is sectional drawing of the side which shows typically the non-contact IC label of 1st Embodiment of this invention. It is a top view of the non-contact IC label. It is a bottom view of the non-contact IC label. It is sectional drawing of the side which shows typically the non-contact IC label of 2nd Embodiment of this invention. It is a top view of the non-contact IC label. It is a perspective view of the protection member of the non-contact IC label. It is a perspective view of the protection member in the modification of the non-contact IC label. It is a top view of the nameplate of 3rd Embodiment of this invention. It is a plane perspective view of the nameplate. It is sectional drawing of the side surface which shows typically the nameplate.

(Reference example)
Before describing an embodiment of a non-contact IC label according to the present invention, a non-contact IC label as a reference example will be described with reference to FIGS. The non-contact IC label is used for non-contact communication with a data reading device (not shown).
As shown in FIGS. 1 to 3, the non-contact IC label 1 of the reference example includes a magnetic sheet 10, an antenna unit 21 and an impedance matching circuit unit 22 arranged on one surface 10 a of the magnetic sheet 10, an impedance An IC chip 23 provided in the matching circuit unit 22 and a ground unit 24 disposed on the other surface 10b of the magnetic sheet 10 are provided.
In FIGS. 2 and 3, a base material 26 described later is not shown for convenience of explanation.

The thickness of the magnetic sheet 10 is, for example, 250 μm, and the magnetic sheet 10 is formed with a hole 11 that penetrates in the thickness direction D of the magnetic sheet 10.
As the magnetic sheet 10, a known material rich in flexibility can be used as a label, which is made of a composite material of magnetic particles or magnetic flakes and plastic or rubber. The magnetic sheet 10 is formed in a rectangular shape in plan view as viewed in the thickness direction D of the magnetic sheet 10.

In this reference example, the antenna part 21, the impedance matching circuit part 22, and the ground part 24 are made of silver paste ink on a main surface 26a of a base material 26 formed in a film shape with a resin such as PET, as shown in FIG. Are integrally formed by printing. The thickness of the base material 26 is, for example, 50 μm.
Then, the base material 26 is wound around the magnetic sheet 10 and pasted by a magnetic sheet adhesive layer (not shown), whereby the antenna unit 21, the impedance matching circuit unit 22, and the ground unit 24 are provided on the surfaces 10a and 10b of the magnetic sheet 10. Is arranged.

As shown in FIGS. 1 to 3, the antenna portion 21 and the ground portion 24 are formed in a rectangular shape in plan view. The antenna unit 21 and the ground unit 24 are each electrically connected to the impedance matching circuit unit 22.
The ground portion 24 is bent so as to be arranged along the edge portion 10 d of the magnetic sheet 10 on the other surface 10 b and the side surface 10 c of the magnetic sheet 10.
In the plan view shown in FIG. 2, the antenna unit 21 is disposed in a region occupied by the ground unit 24. That is, in plan view, the antenna unit 21 and the ground unit 24 may overlap with each other so that the antenna unit 21 and the ground unit 24 occupy each other.

As shown in FIG. 2, the impedance matching circuit unit 22 is formed by wiring meandering into a predetermined shape. The impedance matching circuit unit 22 is electrically connected to an electrical contact (not shown) of the IC chip 23, and is equal to each other between the IC chip 23 and the antenna unit 21 and between the IC chip 23 and the ground unit 24. The impedance and the resistance value are generated.
The IC chip 23 has a known configuration, and predetermined information is stored in the IC chip 23. Then, by supplying radio wave energy from an electrical contact (not shown) provided on the IC chip 23 by a radio wave system, the stored information can be transmitted from the electrical contact to the outside as a radio wave. The IC chip 23 is accommodated in the hole 11 of the magnetic sheet 10.

The antenna unit 21, the impedance matching circuit unit 22, the IC chip 23, and the ground unit 24 configured in this way constitute the main communication unit 20. And the base material 26 with which the main communication part 20 was provided is wound around the magnetic sheet 10, and the antenna part 21 and the ground part 24 are arrange | positioned on both sides on both sides of the magnetic sheet 10, respectively. The side on which the antenna unit 21 shown in FIG. 2 is arranged is the front surface of the non-contact IC label 1, and the side on which the ground unit 24 shown in FIG.
The non-contact IC label 1 of the reference example configured as described above is attached to a metal plate (adhered body) 32 via an adhesive layer 31 provided on the back surface of the non-contact IC label 1 as shown in FIG. wear. Any adhesive layer 31 may be used as long as it transmits radio waves.
By facing an external data reading device to the antenna unit 21, the antenna unit 21 becomes a radiation surface (radiation antenna element), the ground portion 24 becomes a ground surface (earth), and the non-contact IC label 1 becomes a monopole antenna (1 / 4 wavelength grounded antenna).

  A non-contact IC label usually employs a non-grounded half-wave dipole antenna, and is provided with a radiating antenna element having a quarter wavelength or less at each position across the IC chip. ing. In order to reduce the size of the non-contact IC label, there are many cases in which the radiating antenna element has a meander shape (meandering shape).

  The monopole antenna employed in this reference example and the present invention to be described below normally has a 1/4 wavelength image antenna electrically connected to the ground side by grounding a radiating antenna element on one side of the dipole antenna. A grounded half-wavelength dipole antenna is formed by combining with the other quarter-wavelength radiation antenna element that is formed and remaining. Therefore, as shown in FIG. 2, a single-wavelength antenna unit 21 can provide almost the same performance as a normal half-wavelength dipole antenna. When the antenna is mounted, the size of the label can be reduced as compared with the case where the normal half-wave dipole antenna is mounted.

However, the operation of the monopole antenna described above is based on the general condition that the radiating antenna element stands upright with respect to the ground plane and that the radiating antenna element is surrounded by the same dielectric such as air. This is the case. On the other hand, the configuration of the non-contact IC label 1 of this reference example is greatly different. That is, the antenna portion 21 that is a radiation surface is parallel to the ground portion 24 that is a ground surface. Further, the surface of the antenna portion 21 facing the external data reader is air with the base material 26 in between, but the back surface is in contact with the magnetic sheet 10 and the thin magnetic sheet. A ground portion 24 is arranged with 10 therebetween.
For this reason, it is considered that the non-contact IC label 1 of this reference example and the monopole antenna under the general conditions described above have different effects and actions.

  A verification experiment was conducted in which the non-contact IC label 1 of the reference example configured as described above was attached to a metal plate, and the communication distance in that state was measured. The contents and results will be described below.

(Experiment)
In the experiment, the equipment and materials shown below were used, and the construction was as shown in FIG.
-Magnetic sheet 10: NRC025 (thickness 250 μm) manufactured by Daido Steel Co., Ltd.
IC chip 23: NCODE UCODE G2iL
Antenna portion 21, ground portion 24: 12 μm thick aluminum thin film Antenna portion 21 dimensions 15 mm × 5 mm
・ Impedance matching circuit 22: Except IC chip 23, pattern printing with silver paste ink on substrate 26 made of in-house manufactured PET film (thickness 50 μm) (thickness 8 μm)
Reader / writer R1: 950 MHz band RFID reader / writer Mitsubishi Electric Corp. RF-RW002 (maximum output 1W 30 dBm)
Read antenna R2: 950 MHz band RFID antenna RF-ATCP001 manufactured by Mitsubishi Electric Corp. (maximum gain of circular polarization 6 dBi)
Fixed attenuator R3: Hirose Electric AT-107 (attenuation 7 dB)
The reader / writer R1, the reading antenna R2, and the fixed attenuator R3 constitute a data reading device R10.
-Metal plate 32: made of stainless steel (250 mm x 250 mm x 0.5 mm)

(1 Experimental method)
As shown in FIG. 6, the non-contact IC label 1 of the reference example was placed on a stainless steel metal plate 32, and the communication distance of the non-contact IC label 1 was measured by the reading antenna R2.
The antenna unit 21 and the ground unit 24 are electrically connected to the impedance matching circuit unit 22 by surface contact with a connection pad (surface electrode) (not shown) formed outside the impedance matching circuit unit 22, and FIG. As shown, the antenna unit 21, the ground unit 24, and the impedance matching circuit unit 22 are integrated.
In this experiment, instead of the adhesive layer 31, a resin film 31A having a dielectric constant comparable to that of an adhesive material that is actually assumed to be used as the adhesive layer 31 (same as the adhesive layer 31) was used. Specifically, a PET film having a thickness of 25 μm was used.
Since the resin film 31A was used in place of the adhesive layer 31, a non-illustrated foaming polystyrene was placed on the non-contact IC label 1 to bring the metal plate 32 and the resin film 31A into close contact with each other, and the non-contact IC label 1 and the metal plate 32. It has been found that polystyrene foam has little effect on the measurement results of communication distance.

The reader / writer R1 and the reading antenna R2 used in the experiment are a UHF band high-power reader / writer and an antenna that can read the non-contact IC label 1 of the reference example at a certain communication distance.
The maximum output of the reader / writer R1 is 1 W (30 dBm). For the convenience of the experimental environment, a −7 dB fixed attenuator R3 is connected to the coaxial cable connecting the reader / writer R1 and the reading antenna R2, and the output of the reader / writer R1 is output. The experiment was conducted by attenuating to 0.2 W (23 dBm).

(2 Experimental results)
The reading antenna R2 is rotated so as to face the non-contact IC label 1, and the maximum distance at which the reading antenna R2 can read information from the main communication unit 20 is defined as the communication distance. In this case, the communication distance was 140 mm.
The above communication distance is a numerical value that can be said to have sufficient performance as a thin and small non-contact IC label capable of communicating even when directly attached to a metal adherend.

In actual use, since the output of the data reading device R10 can be increased up to 1 W (30 dBm) by removing the fixed attenuator R3, it goes without saying that the communication distance is further increased.
Further, the electrical property values (permeability, magnetic loss, dielectric constant, dielectric loss, etc.) of the magnetic sheet 10 are made suitable, the impedance matching of the impedance matching circuit unit 22, the thickness of the magnetic sheet 10, It is considered that the communication distance is further increased by optimizing the shapes of the antenna portion 21 and the ground portion 24.

When the non-contact IC label 1 configured in this manner is attached to the metal plate 32 and communication is performed between the non-contact IC label 1 and the data reader R10 by a radio wave system, the ground portion is not shown in the figure. 24 is capacitively coupled to the metal plate 32 via the substrate 26 and the adhesive layer 31. At this time, the metal plate 32 as an adherend is also a ground plane as a monopole antenna.
In the case of communication in the UHF frequency band, it is sufficient that the area of the portion of the ground portion 24 facing the metal plate 32 is, for example, about ²⁰ to 30 mm ² .
Therefore, the ground part 24 is not necessarily larger than the antenna part 21.

  Among the above-mentioned metal adherends, such as boilers, electric heaters, internal combustion engines, steam turbines, motors, light sources, etc., such that the adherend itself becomes high temperature or passes through a high-temperature drying furnace. There are many things such as metal parts that are temporarily exposed to high-temperature environments. When non-contact IC labels are attached to these items, in addition to the above-mentioned communication performance as non-contact IC labels, heat resistance against high temperatures is also provided. Required. The high temperature here has an upper limit of approximately 200 ° C.

  However, in the non-contact IC label 1 of the above-mentioned reference example, the upper limit of the use temperature is 85 ° C. The operating temperature here refers to the surface temperature of the metal object that is the adherend, and the ambient temperature (atmosphere temperature) of the noncontact IC label when the noncontact IC label is attached to the adherend. Means. The basic structure of the non-contact IC label 1 of the reference example is not changed, and the heat resistance temperature of each component member is raised to increase the heat resistance as a non-contact IC label. explain.

(First embodiment)
Next, the first embodiment of the present invention will be described with reference to FIGS. 7 to 9, but the same parts as those in the reference example will be denoted by the same reference numerals and the description thereof will be omitted, and only the differences will be described. explain. In FIGS. 8 and 9, a base material 126 described later is not shown for convenience of description.
First, the use temperature of the non-contact IC label of the present invention will be described.
The non-contact IC label of the present invention has an upper limit of the use temperature of 200 ° C., and the label is intended to be free from deformation, discoloration, alteration, peeling off of the label, and deterioration of communication performance under this upper limit temperature. However, the communication performance under this upper limit temperature is not covered by the present invention. For example, when the non-contact IC label of the present invention is attached to an adherend that is operating and has a high temperature of about 200 ° C., and the non-contact IC label is about 200 ° C., Communication with a data reader or the like is not performed.

In the conventional non-contact IC label, the heat resistance is improved by performing a heat-resistant protection process for covering the IC inlet with a resin or the like, or encapsulating it in glass or the like. However, when these heat-resistant protection processing and sealing processing are performed, there is a problem that the non-contact IC label becomes thick or the flexibility of the non-contact IC label is lowered.
Since the non-contact IC label of the present invention is thin, flexible and also has heat resistance, the basic structure is not changed with respect to the non-contact IC label 1 of the above-described reference example, and the heat resistance temperature of each constituent member is not changed. By raising, the heat resistance as a non-contact IC label was improved. The contents will be described in detail below.

As shown in FIGS. 7 to 9, the non-contact IC label 101 of this embodiment includes a magnetic sheet 10, a base material 26, an antenna unit 21, an impedance matching circuit unit 22, and a ground of the non-contact IC label 1 of the reference example. Instead of the unit 24, a magnetic sheet 110, a base material 126, an antenna unit 121, an impedance matching circuit unit 122, and a ground unit 124 are provided. The impedance matching circuit unit 122 includes the IC chip 23 described above.
The outer shape and arrangement of the magnetic sheet 110, the base 126, the antenna part 121, the impedance matching circuit part 122, and the ground part 124 of the non-contact IC label 101 are the same as the magnetic sheet 10 and the base 26 of the non-contact IC label 1 of the reference example. The outer shape and arrangement of the antenna unit 21, the impedance matching circuit unit 22, and the ground unit 24 are set to be the same.

The magnetic sheet 10 used for the non-contact IC label 1 of the above-described reference example is formed of a composite material of magnetic particles or magnetic flakes and plastic or rubber. The upper limit of the use temperature of the magnetic sheet 10 used in the above-described experiment is 85 ° C. (manufacturer recommended value). Among the specific physical property values of the magnetic sheet 10, parameters that greatly affect the antenna characteristics (antenna sensitivity) are magnetic permeability and magnetic loss values, and one of the dielectric constant and dielectric loss values is smaller than that. I know that.
The magnetic permeability and magnetic loss values of the magnetic sheet are determined by the shape, direction, density, etc. of the magnetic particles or magnetic flakes used. On the other hand, the values of dielectric constant and dielectric loss are determined by the dielectric constant and dielectric loss of the binder (binder) itself for fixing the magnetic particles or magnetic flakes, in addition to the shape, direction and density of the magnetic particles or magnetic flakes.

The magnetic sheet 110 included in the non-contact IC label 101 of the present embodiment has the magnetic particles or magnetic flakes of the magnetic sheet 10 as they are, and the binder alone is a silicone resin, a fluorine resin, an epoxy curable resin, or a polyether sulfone resin. It is changed to at least one of a resin and a polyimide (polyamide) resin and changed to a binder whose heat-resistant temperature exceeds 200 ° C. With this configuration, the magnetic sheet 110 itself can be a heat-resistant magnetic sheet.
In the magnetic sheet 110, changing the binder used from the magnetic sheet 10 also changes the values of dielectric constant and dielectric loss as the magnetic sheet. However, as described above, these two parameters have little influence on the antenna characteristics, and by optimizing the impedance matching circuit of the impedance matching circuit unit 122, the non-contact IC label accompanying the change to the heat-resistant binder is used. It is considered that there is almost no decrease in communication performance.

  In the non-contact IC label 1 of the above-described reference example, the antenna part 21, the impedance matching circuit part 22, and the ground part 24 are formed on the base material 26 by pattern printing with silver paste ink. However, in the environment of 200 ° C., which is the upper limit of the use temperature described above, the heat resistance temperature of the member is too low, so this configuration cannot be used at all. From this, the heat-resistant temperature of the constituent members shown below was raised.

  The base material 126 provided in the non-contact IC label 101 of the present embodiment is formed of a film material having a heat resistant temperature exceeding 200 ° C. such as polyimide or polyetherimide, and the base material 126 itself becomes a so-called heat resistant substrate. ing. In addition, since the base material 26 of the reference example is formed of a PET film, and the value of the dielectric constant of the base material is changed by using the base material 126 in this embodiment, in the non-contact IC label 101, the magnetic sheet It is necessary to optimize the impedance matching circuit of the impedance matching circuit unit 122 together with the use of 110.

On the main surface 126a of the base 126, the above-described antenna part 121, impedance matching circuit part 122, and ground part 124 are formed via an adhesive (not shown).
The antenna unit 121, the impedance matching circuit unit 122, and the ground unit 124 are formed by bonding an aluminum thin film or a copper thin film on the above-described adhesive applied to the main surface 126a of the base 126 with a thickness of several μm. By forming the thin film by an etching (corrosion) method, it is integrally formed. Thus, in this embodiment, the antenna part 121, the impedance matching circuit part 122, and the ground part 124 are formed of the same metal.
As the adhesive layer 131, an acrylic or silicone material having a heat resistant temperature exceeding 200 ° C. can be suitably used. As the above-described adhesive for adhering the antenna portion 121 and the like to the base material 126, the same adhesive as the adhesive layer 131 can be appropriately selected and used.
With this configuration, the upper limit of the use temperature of the base material 126, the adhesive layer 131, the antenna unit 121, the impedance matching circuit unit 122, and the ground unit 124 can be raised to 200 ° C.

In the above-described experiment using the non-contact IC label 1 of the reference example described above, the flip chip mounting bonding method using the bonding material ACP is used to connect the bump of the IC chip 23 and the impedance matching circuit unit 22. Due to the adhesive effect of the ACP material, the bump and the impedance matching circuit unit 22 are electrically connected.
However, in this mounting method, the electrical connection between the IC chip 23 and the impedance matching circuit unit 22 cannot be guaranteed under the environment of 200 ° C., which is the upper limit of the use temperature, because the heat resistant temperature of the ACP is too low.

As a joining method for solving this problem, there is an ultrasonic welding method (metal welding method by ultrasonic joining) in which a joining material having a low heat-resistant temperature such as ACP is not used at all. The bumps of the IC chip 23 are generally formed of gold (Au) having a low electrical contact resistance. In this ultrasonic welding method, the bumps of the IC chip 23 and the impedance matching circuit portion 122 can be welded to each other by using ultrasonic waves.
Conventionally, in the non-contact IC label, this ultrasonic welding method has been a technique for obtaining high electrical contact reliability. However, in the present invention, the upper limit of the use temperature of the non-contact IC label 101 is 200 ° C. This method was used to obtain electrical connection reliability in the environment.

In addition, the thin film which comprises the impedance matching circuit part 122 is formed very thin with a thickness of 10-20 micrometers. For this reason, since the expansion due to an increase in the use temperature is small, the shape of the impedance matching circuit unit 122 is stable, and mechanical internal stress is reduced at the junction between the bump of the IC chip 23 and the impedance matching circuit unit 122. There is almost no outbreak.
Therefore, the bonding between the bump of the IC chip 23 and the impedance matching circuit unit 122 metal-welded by ultrasonic welding has electrical connection reliability even in an environment of 200 ° C., which is the upper limit of the use temperature. Therefore, the joint will not come off unless unexpected external stress is applied.

  The non-contact IC label 101 of the present embodiment configured as described above is not described above, and the experiment like the non-contact IC label 1 of the reference example shown in FIG. 6 is not performed. However, the non-contact IC label 101 of the present embodiment is different from the non-contact IC label 1 of the reference example in that the materials of the magnetic sheet, base material, antenna unit, impedance matching circuit unit, ground unit, and adhesive layer are changed. Therefore, it is considered that an experimental result of almost the same communication distance as that of the non-contact IC label 1 can be obtained.

  As described above, according to the non-contact IC label 101 of the present embodiment, the heat resistance temperature of the magnetic sheet 110, the antenna unit 121, the impedance matching circuit unit 122, the ground unit 124, and the base material 126 is increased to reduce the thickness. In addition, it was able to withstand the environment of 200 ° C., which is the upper limit of the use temperature, and was extremely excellent in practicality.

Further, even when the non-contact IC label 101 is attached to a metal adherend by the adhesive layer 131, the non-contact IC label 101 can be used without any trouble and communication can be performed.
A hole 11 is formed in the magnetic sheet 110, and the IC chip 23 is accommodated in the hole 11. For this reason, the IC chip 23 can be prevented from protruding outward from the one surface 110a of the magnetic sheet 110, and the appearance of the non-contact IC label 101 can be improved.

The IC chip 23, the antenna unit 121, the impedance matching circuit unit 122, and the ground unit 124 are bent in a state of being provided on the main surface 126 a of the base material 126, and the one surface 110 a and the other surface 110 b of the magnetic sheet 110. Is arranged. Thus, the manufacturing efficiency of the non-contact IC label 101 can be improved by providing a plurality of parts on the base material 126 in advance.
Since the bumps of the IC chip 23 and the impedance matching circuit unit 122 are joined using an ultrasonic welding method, the bumps and the impedance matching circuit unit 122 can be securely connected even at the upper limit of the use temperature of the non-contact IC label 101. Can be electrically connected

The magnetic sheet 110 is formed of magnetic particles or magnetic flakes and a binder made of at least one of a silicone resin, a fluorine resin, an epoxy curable resin, a polyether sulfone resin, and a polyimide resin. Thereby, the heat-resistant temperature of the magnetic sheet 110 can be raised to 200 ° C. which is the upper limit of the use temperature.
Since the antenna unit 121, the impedance matching circuit unit 122, and the ground unit 124 are formed of an aluminum thin film or a copper thin film, the heat resistance temperature of the antenna unit 121, the impedance matching circuit unit 122, and the ground unit 124 is set to the operating temperature. It can be raised to the upper limit.

In this embodiment, the target value of the upper limit of the use temperature is set to 200 ° C., but the member having the lowest heat-resistant temperature among the constituent members used for the non-contact IC label 101 is obstructed. Needless to say, the upper limit value of the operating temperature of the non-contact IC label 101 as a whole can be increased if the heat resistant temperature of the non-contact IC label 101 can be increased.
On the other hand, when the usage temperature is less than the upper limit, among the constituent members of the non-contact IC label 101, an expensive member in which the cost is increased by raising the heat-resistant temperature, for example, the base material 126 is formed. Although the heat resistant temperature of the polyimide film is lowered, the cost can be reduced by changing the polyimide film to an inexpensive polyester film.
Further, as described above, in this embodiment, communication performance under the upper limit temperature is excluded, but if the upper limit of the operating temperature of the IC chip 23 used in the non-contact IC label 101 is increased, the non-contact IC label is used. The communication performance under the upper limit temperature as 101 can also be guaranteed.

  When the non-contact IC label 101 of this embodiment is actually used, although not shown in the figure, a heat-resistant film or paper that contains information such as characters and figures for visual or machine reading is described. However, it may be provided on the side opposite to the magnetic sheet 110 with respect to the antenna unit 121 and the impedance matching circuit unit 122 to also protect the IC chip 23. This information may be written on the heat-resistant film by a printer or the like after the heat-resistant film or the like is provided on the non-contact IC label 101.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. 10 to FIG. explain.
As shown in FIG. 10 and FIG. 11, the non-contact IC label 201 of this embodiment includes an impedance matching circuit unit 222 and a protective member instead of the impedance matching circuit unit 22 of the non-contact IC label 1 of the reference example described above. 40. In addition, the base material 26 is not shown in FIG.
In this example, the hole 11 of the magnetic sheet 10 described above is formed in a columnar shape having an axis parallel to the thickness direction D.

As shown in FIGS. 10 to 12, the protection member 40 is formed in a cylindrical shape having an outer diameter slightly smaller than the inner diameter of the hole 11. The protective member 40 is formed with an accommodating portion 41 so as to extend in the thickness direction D from the one surface 10 a side of the magnetic sheet 10. The protection member 40 is formed with a communication portion 42 that communicates with the housing portion 41 and opens on the outer peripheral surface of the protection member 40. The accommodating portion 41 and the communicating portion 42 are formed so as to penetrate the protective member 40 in the thickness direction D, respectively.
The length of the protective member 40 in the thickness direction D (hereinafter simply referred to as “thickness”) is set to be approximately equal to the thickness of the magnetic sheet 10. The thickness of the accommodating portion 41 is set longer (thicker) than the thickness (for example, 75 μm) of the IC chip 23.

The protection member 40 configured in this way is formed in a substantially C shape when viewed in the thickness direction D, and is accommodated in the hole 11 of the magnetic sheet 10.
As a material for forming the protection member 40, any material can be used as long as it can withstand an assumed impact force such as bringing the data reading device R10 into contact, and various materials can be used regardless of metal or non-metal. Can do. However, it is preferably formed of a metal harder than the IC chip 23.

The IC chip 23 is provided on the base material 26 and is disposed in the accommodating portion 41 of the protection member 40. That is, the IC chip 23 is provided on the base material 26 so as to be disposed in the housing portion 41 when the base material 26 is disposed on the one surface 10 a of the magnetic sheet 10.
The convex portion 222 a forming a part of the impedance matching circuit portion 222 is disposed in the communication portion 42 of the protection member 40.
An electrical contact (not shown) of the IC chip 23 is electrically connected to the convex portion 222 a of the impedance matching circuit portion 222.

  The non-contact IC label 201 of this embodiment configured as described above is not subjected to an experiment like that of the non-contact IC label 1 of the reference example described above and shown in FIG. However, the non-contact IC label 201 of the present embodiment includes only the impedance matching circuit unit 222 and the protection member 40 instead of the impedance matching circuit unit 22 with respect to the non-contact IC label 1 of the reference example. For this reason, it is considered that an experimental result with almost the same communication distance as the non-contact IC label 1 can be obtained.

  When the non-contact IC label 201 receives an impact force from one side D1 in the thickness direction D shown in FIG. 10, the convex portion 222a of the IC chip 23 and the impedance matching circuit portion 222 is formed in the housing portion 41 and the communication portion 42. Move to the other side D2 in the thickness direction D. For this reason, the impact force acts only on the protection member 40 and does not act on the convex portion 222a of the IC chip 23 and the impedance matching circuit portion 222.

  The non-contact IC label 1 of the above-described reference example is generally an adherend to which the non-contact IC label 1 is attached and has a characteristic that the IC chip 23 is made of single crystal silicon and thus is very easy to break. The metal member is hard. For this reason, for example, when the non-contact IC label 1 receives external stress or impact, the metal member sinks to absorb the external impact and suppress damage to the non-contact IC label 1. difficult. Furthermore, if the thickness of the non-contact IC label 1 itself is thin, the portion that absorbs and cushions the impact in the thickness direction D decreases. Therefore, there is a problem that the IC chip 23 in the non-contact IC label 1 is easily cracked by external stress or impact.

On the other hand, according to the non-contact IC label 201 of the present embodiment, the IC chip 23 is disposed in the accommodating portion 41 of the protection member 40, and therefore when receiving an impact force in the thickness direction D, etc. The damage to the IC chip 23 is suppressed, and the practicality is extremely excellent.
Since the housing portion 41 penetrates the protective member 40 in the thickness direction D, the range in which the IC chip 23 can move in the thickness direction D within the housing portion 41 is widened. Therefore, it can suppress more reliably that an impact is applied to the IC chip 23.
Since the thickness of the accommodating portion 41 is thicker than the thickness of the IC chip 23, the entire IC chip 23 is accommodated in the accommodating portion 41, and it is possible to reliably suppress the impact on the IC chip 23.

Since the convex portion 222a is disposed in the communication portion 42, it is possible to prevent the convex portion 222a from being damaged when the non-contact IC label 201 receives an impact force.
Since the communicating portion 42 penetrates the protective member 40 in the thickness direction D, the range in which the convex portion 222a can move in the thickness direction D within the communicating portion 42 is widened. Therefore, it can suppress more reliably that an impact is applied to the convex-shaped part 222a.
Since the thickness of the protection member 40 is set substantially equal to the thickness of the magnetic sheet 10, the non-contact IC label 201 can be configured to be thin.

In the present embodiment, the protective member 40 is formed in a C shape when viewed in the thickness direction D. However, the shape of the protective member is not particularly limited as long as the IC chip 23 can be disposed in the protective member housing. For example, as shown in FIG. 13, the protection member 50 may be formed in a rectangular parallelepiped shape.
In this modification, the accommodating portion 51 and the communicating portion 52 are formed only on the one surface 10a side in the thickness direction D of the magnetic sheet 10 and do not penetrate the protective member 50 in the thickness direction D.
Even if the protection member 50 is configured in this way, it is possible to suppress an impact from being applied to the IC chip 23 by disposing a part of the IC chip 23 in the accommodating portion 51 of the protection member 50.

  In addition, when the strength of the convex portion 222a is relatively high, the communication portion 42 may not be formed in the protection member 40.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. 14 to 16. However, the same parts as those of the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted. Only differences will be described. explain. In FIG. 15, the base material 26 is not shown for convenience of explanation. As an application of the non-contact IC label 101 and the non-contact IC label 201 of the present invention, a name plate incorporating the non-contact IC labels 101 and 201 is formed. be able to.
The nameplate will be described below.

  As shown in FIGS. 14 to 16, the nameplate 301 of the present embodiment accommodates the non-contact IC label 201 (communication unit) 201 capable of non-contact communication and the non-contact IC label 201 on the first surface 311. A sheet-shaped nameplate main body (main body portion) 310 in which a hole portion 312 is formed, and a sealing layer (lid portion) 320 that is attached to the first surface 311 and seals the hole portion 312 in a watertight manner. .

The nameplate body 310 is formed in a rectangular shape in plan view as viewed in the thickness direction D, and the thickness is set to about 1 mm. At the four corners of the nameplate main body 310, attachment holes 314 that penetrate in the thickness direction D are provided.
The nameplate main body 310 prevents communication troubles when communicating between the non-contact IC label 201 and the data reading device, and fixes the nameplate main body 310 with caulking, screws or the like using the mounting holes 314. In order not to break at the time, it is formed of a resin or the like which is a non-metallic material having a certain strength.

The hole 312 is formed on the first surface 311 of the nameplate main body 310 on the second surface 313 side of the nameplate main body 310 opposite to the first surface 311 of the hole main body 316. The auxiliary hole portion 317 is formed and communicated with the hole portion main body 316. The auxiliary hole 317 is formed at a position overlapping the protection member 40 in a plan view shown in FIG.
As shown in FIG. 14, the second surface 313 of the nameplate main body 310 is a display surface. On the second surface 313, a display W indicating the product name, model, and the like is formed. The display W is formed on the second surface 313 of the nameplate body 310 by printing or laser engraving.

As shown in FIG. 16, the sealing layer 320 is for preventing liquid, dust, moisture, gas and the like from entering the hole 312 of the nameplate main body 310. Any material may be used for the sealing layer 320 as long as it has a function of preventing the entry of the liquid or the like.
When the nameplate body 310 is fixed to the wall surface or the like using the attachment holes 314 with the sealing layer 320 in contact with the wall surface or the like, the holes in the nameplate body 310 by the sealing layer 320 are used. The effect of sealing the portion 312 can be further enhanced.

Next, the operation of the auxiliary hole 317 will be described.
Since the nameplate 301 is as thin as about 1 mm, the nameplate body 310 is easily deformed particularly when a force is applied to the second surface 313 of the nameplate body 310.
For example, when a strong force is received near the IC chip 23 on the second surface 313 with a metal hammer or the like, the space of the auxiliary hole 317 is crushed by the external stress, and as a result, the bottom surface 317a of the auxiliary hole 317 is obtained. Moves to the protection member 40. Furthermore, the nameplate main body 310 may be deformed and enter the inside of the housing portion 41 of the protective member 40 together with the base material 26 cut at the edge portion (edge portion) of the housing portion 41 of the protective member 40. Conceivable.
In the present embodiment, an auxiliary hole 317 is provided to reduce the thickness between the second surface 313 and the bottom surface 317a. If the thickness between the second surface 313 and the bottom surface 317a is large, the nameplate main body 310 is deformed and reaches the deep portion of the housing portion 41 together with the base material 26. As a result, the IC chip 23 is damaged. Because it is possible.

According to the nameplate 301 of the present embodiment configured as described above, communication is possible even when the non-contact IC label 201 is accommodated in the hole 312 and attached to a metal adherend, and is thin and small. Can be formed.
By providing the sealing layer 320, it is possible to prevent liquid, dust, moisture, gas and the like from entering the hole 312 of the nameplate body 310, and to improve the durability of the non-contact IC label 201.
When viewed in the thickness direction D, the IC chip 23 is formed at a position overlapping the auxiliary hole 317. For this reason, it is possible to prevent the IC chip 23 from being damaged by the deformed nameplate body 310 when an external force is applied to the nameplate body 310.

Since the IC chip 23 is disposed in the housing portion 41 of the protective member 40, the IC chip 23 is prevented from being damaged when receiving an impact force in the thickness direction D, and is extremely practical. Become.
Since the convex portion 222a is disposed in the communication portion 42, it is possible to prevent the convex portion 222a from being damaged when the non-contact IC label 201 receives an impact force.

  According to the nameplate 301 of the present embodiment, it is possible to communicate even if attached to a metal adherend such as a facility, apparatus, or component, and the water resistance, weather resistance, durability, and impact resistance are improved. The display W marked on the display surface of the nameplate body 310 can be reliably stored for a long period of time.

In the above-described embodiment, the name plate main body 310 is not provided with the attachment hole 314 but the first surface 311 of the name plate main body 310 is provided with an adhesive layer or the like, and the name plate main body 310 is fixed to the adherend by the adhesive layer. Also good. Moreover, the sealing layer 320 does not need to be provided when humidity and moisture are low in an environment where the nameplate is used. Further, when the impact resistance is not required, the protection member 40 and the auxiliary hole 317 may not be provided.
In addition, while making the material of the nameplate main body 310 and the sealing layer 320 into a heat-resistant material and incorporating the above-described non-contact IC label 201 in the nameplate main body 310, a nameplate having heat resistance can be configured.

  The first to third embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the configuration does not depart from the gist of the present invention. Changes are also included. Furthermore, it goes without saying that the configurations shown in the embodiments can be used in appropriate combinations.

10, 110 Magnetic sheet 11 Hole portion 23 IC chip 40, 50 Protection member 41, 41 Housing portion 42, 52 Communication portion 101, 201 Non-contact IC label (communication portion)
110a One surface 110b The other surface 121 Antenna portion 122, 222 Impedance matching circuit portion 124 Ground portion 126 Base material 126a Main surface 131 Adhesive layer 301 Name plate 310 Name plate main body (main body portion)
311 First surface 312 Hole 313 Second surface 316 Hole body 317 Auxiliary hole 320 Sealing layer (lid)
D Thickness direction R10 Data reader

Claims (16)

A magnetic sheet;
An antenna unit disposed on one surface of the magnetic sheet;
An impedance matching circuit unit disposed on one surface of the magnetic sheet and electrically connected to the antenna unit;
An IC chip provided in the impedance matching circuit section;
A part of the magnetic sheet is disposed on the other surface of the magnetic sheet, is bent so as to be disposed along an edge of the magnetic sheet, and is electrically connected to the impedance matching circuit unit. ,
An adhesive layer that transmits radio waves disposed on the other surface of the magnetic sheet;
Provided with a base material that is formed into a film and has heat resistance,
The IC chip, the antenna unit, the impedance matching circuit unit, and the ground unit are provided on the main surface of the base material,
The ground part is capacitively coupled to the metal plate via the base material and the adhesive layer,
The non-contact IC label, wherein the magnetic sheet, the antenna unit, the impedance matching circuit unit, the ground unit, and the adhesive layer have heat resistance.   The non-contact IC label according to claim 1, wherein the IC chip and the impedance matching circuit unit are metal-welded by ultrasonic bonding. The magnetic sheet is formed from magnetic particles or magnetic flakes and a binder,
3. The binder according to claim 1, wherein at least one of a silicone resin, a fluorine resin, an epoxy curable resin, a polyether sulfone resin, and a polyimide resin is used as the binder. Non-contact IC label.   The contactless IC label according to any one of claims 1 to 3, wherein the antenna unit, the impedance matching circuit unit, and the ground unit are formed of aluminum. A magnetic sheet;
An antenna unit disposed on one surface of the magnetic sheet;
An impedance matching circuit unit disposed on one surface of the magnetic sheet and electrically connected to the antenna unit;
An IC chip provided in the impedance matching circuit section;
A part of the magnetic sheet is disposed on the other surface of the magnetic sheet, is bent so as to be disposed along an edge of the magnetic sheet, and is electrically connected to the impedance matching circuit unit. ,
An adhesive layer that transmits radio waves disposed on the other surface of the magnetic sheet;
Provided with a substrate formed into a film,
The ground part is capacitively coupled to the metal plate via the base material and the adhesive layer,
A protective member housed in a hole formed in the magnetic sheet so as to penetrate in the thickness direction of the magnetic sheet;
With
When viewed in the thickness direction, the antenna portion is disposed in a region occupied by the ground portion,
The contactless IC label according to claim 1, wherein the IC chip is disposed in a housing portion formed in the protective member so as to extend in the thickness direction from one surface side of the magnetic sheet.   The non-contact IC label according to claim 5, wherein the housing portion penetrates the protective member in the thickness direction.   The non-contact IC label according to claim 5 or 6, wherein a length of the housing portion in the thickness direction is longer than a length of the IC chip in the thickness direction. On the edge of one surface side of the magnetic sheet in the protection member, a communication portion that communicates with the housing portion and opens on the outer peripheral surface of the protection member is formed.
The non-contact IC label according to any one of claims 5 to 7, wherein a part of the impedance matching circuit section is disposed in the communication section.   The non-contact IC label according to claim 8, wherein the communication portion penetrates the protective member in the thickness direction.   The non-contact IC label according to any one of claims 1 to 9, wherein a radio wave system is used as a communication system with the data reading device. A communication unit capable of contactless communication;
A sheet-shaped main body portion in which a hole for accommodating the communication unit is formed on the first surface, and a second surface opposite to the first surface is a display surface;
A nameplate comprising:
The communication unit is
A magnetic sheet;
An antenna unit disposed on one surface of the magnetic sheet;
An impedance matching circuit unit disposed on one surface of the magnetic sheet and electrically connected to the antenna unit;
An IC chip provided in the impedance matching circuit section;
A part of the magnetic sheet is disposed on the other surface of the magnetic sheet, is bent so as to be disposed along an edge of the magnetic sheet, and is electrically connected to the impedance matching circuit unit. ,
An adhesive layer that transmits radio waves disposed on the other surface of the magnetic sheet;
Provided with a substrate formed into a film,
The ground part is capacitively coupled to the metal plate via the base material and the adhesive layer,
Wherein when viewed in the thickness direction of the magnetic sheet, the antenna unit nameplate, characterized in that arranged in the region where the ground portion is occupied.   The nameplate according to claim 11, further comprising a lid portion that is attached to the first surface of the main body portion and seals the hole portion in a watertight manner. The hole is
A hole main body formed on the first surface of the main body;
An auxiliary hole portion formed on the second surface side of the hole body in the main body portion and communicating with the hole body,
The nameplate according to claim 11 or 12, wherein the IC chip is provided at a position overlapping the auxiliary hole when viewed in the thickness direction. The communication unit has a protective member accommodated in a hole formed so as to penetrate the magnetic sheet in the thickness direction,
14. The IC chip according to claim 11, wherein in the protective member, the IC chip is disposed in a housing portion formed to extend in the thickness direction from one surface side of the magnetic sheet. Nameplate according to one item. On the edge of one surface side of the magnetic sheet in the protection member, a communication portion that communicates with the housing portion and opens on the outer peripheral surface of the protection member is formed.
The nameplate according to claim 14, wherein a part of the impedance matching circuit section is disposed in the communication section.   The nameplate according to any one of claims 11 to 15, wherein a radio wave system is used as a communication system with the data reading device.

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