JP7236133B2 - Mechanism for attaching IC tag to adherend, winding core with IC tag, and package - Google Patents

Description

The present invention relates to a mechanism for attaching an IC tag to an adherend, a winding core with an IC tag around which a web of film, sheet, foil, paper, cloth, thread, or the like is wound, and a package.

Conventionally, an IC tag is attached to a winding core for storing and transporting a web for managing product information on the web. As a result, product information and information for each process in the manufacturing process are managed. However, IC tags are vulnerable to external shocks and pressures and are very easily damaged. In particular, there is a problem in that the web is wound around the winding core, and the damage caused by the impact when the web is unwound and the pressing force or impact between the winding cores during transportation.

As this type of winding core, in the manufacturing process of a paper winding core formed by spirally winding a paper tape on the surface of a mandrel, two sheets of a plurality of paper tapes are overlapped before being wound around the mandrel. A device has been developed in which an IC tag is sandwiched between paper tapes and arranged between the layers of a paper roll core. In this winding core manufacturing method, the IC tags can be arranged at regular intervals by sandwiching the IC tags at regular time intervals (see, for example, Patent Document 1 below).

However, in the manufacturing process of the paper winding core, the plurality of paper tapes that are coated with adhesive and overlapped on the surface of the mandrel are then tightened on the mandrel by a belt, whereby the plurality of paper tapes are adhered and made of paper. A winding core is formed. Therefore, when the IC tag passes through the belt, there is a possibility that the IC tag may be damaged by the tightening pressure of the belt. Moreover, even if the IC tag is sandwiched at regular time intervals, it is difficult to place the IC tag at the desired position on the paper core due to slight fluctuations in the production speed. Furthermore, since the IC tag is arranged between the layers of the winding core, there is also a problem that the visibility of the IC tag is lacking.

Further, a winding core has been proposed in which an IC tag is attached to a separate member such as an inner cylindrical body or an outer cylindrical body, and attached to the outer peripheral surface or inner peripheral surface of the core so that it is not exposed to the outer surface. According to this winding core, damage to the IC tag can be prevented by the inner cylindrical body or the outer cylindrical body (see, for example, Patent Document 2 below).

However, in order to attach the inner cylindrical body to the inner peripheral surface of the winding core without steps, it is necessary to cut the inner peripheral surface of the winding core. For this reason, the manufacturing process is complicated, and the manufacturing cost is high due to the necessity of the cylindrical body, which is a separate member. In particular, cores are strongly required to be inexpensive, and the problem of high manufacturing costs as described above cannot be ignored. Furthermore, in the case of paper winding cores, there is a problem that paper dust generated by cutting adversely affects the web.

JP 2010-149474 A JP 2008-24504 A

The present invention has been made in view of the actual situation of the prior art, and is an application of an IC tag capable of preventing breakage of the IC tag by reducing the impact force and pressing force transmitted to the IC chip from the outside. An object of the present invention is to provide an attaching mechanism to a body, a winding core with an IC tag, and a package.

In order to solve the above problems, the present inventors have made intensive studies and found that the mechanism for attaching an IC tag to an adherend according to the present invention consists of an adherend, an IC chip, and an antenna connected to the IC chip. and a mechanism for attaching an IC tag to an adherend, wherein the IC chip is attached in a floating state with respect to the attachment surface of the adherend.

According to this, since the IC chip is mounted in a floating state with respect to the mounting surface of the adherend, it is possible to reduce the impact force and pressing force transmitted from the outside to the IC chip, and the IC tag can be used as an IC tag. damage can be prevented.

Further, the surface of the adherend may be formed with a recess capable of accommodating the IC chip.

According to this method, a recess is formed in the adherend and the IC tag is attached thereon, so that the IC chip is placed in a floating state. As a result, it is possible to reduce the impact force and pressing force applied to the IC chip from the outside, and prevent damage to the IC tag. Furthermore, since the surface of the adherend may be processed by forming a recess that can accommodate at least an IC chip, it is easy to provide an adherend with an IC tag that can reduce manufacturing costs. .

Also, the IC tag includes a bonding layer, an inlet in which an IC chip is connected to an antenna laid on at least one surface of an inlet base material, and a protective layer. It may consist of at least one of a protective layer and a second protective layer having a through hole capable of accommodating an IC chip.

According to this, by forming the protective layer on the inlet, it is possible to further reduce the impact force and pressing force applied to the IC tag from the outside.

Also, the second protective layer may be laminated on the side where the IC chip is arranged with respect to the inlet base material.

According to this, since the protrusions caused by the IC chip can be accommodated in the through holes of the second protective layer, it is possible to reduce the external pressing force on the IC chip.

Moreover, the concave portion of the adherend may be formed in a mortar shape or a substantially hemispherical shape.

According to this, since the concave portion has a gentle shape, it is possible to prevent the IC tag from being bent and damaged in the space of the concave portion.

The adherend is a winding core, and the IC tag is attached by the mechanism for attaching the IC tag to the adherend.

According to this, since damage to the IC tag can be prevented with a simple structure, an inexpensive winding core can be provided.

The IC tag may be attached to the outer peripheral surface near the end of the winding core.

According to this, even when the web is wrapped around, the position where the IC tag is attached can be easily visually recognized, and it is easy to manage with a reader.

Further, in the package according to the present invention, a web is wound around the outer peripheral surface of the core with an IC tag according to the present invention.

According to this, since damage to the IC tag can be prevented with a simple structure, it is possible to manage product information on the web at low cost.

According to the present invention, a mechanism for attaching an IC tag to an adherend, a winding core with an IC tag, and a packaging body, which can reduce the impact force and pressing force transmitted to the IC chip and prevent damage, are provided at a low cost. can do.

1 is a perspective view of a winding core with an IC tag according to a first embodiment; FIG. FIG. 2 is a cross-sectional view of the essential parts of the winding core with an IC tag according to the first embodiment; 1 is a schematic diagram of an IC tag label of the first embodiment; FIG. 1 is a perspective view of a package of the first embodiment; FIG. It is a schematic diagram of the IC tag label of the second and third embodiments. 1 is a schematic diagram of an IC tag label according to the present embodiment; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described based on its preferred embodiments with reference to the drawings. In each of the embodiments shown below, the mechanism for attaching an IC tag to an adherend according to the present invention is applied to a winding core as an adherend. Here, the vertical direction of the IC tag is the vertical direction in FIGS. 3, 5 and 6. FIG.

<First embodiment>
A first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. As shown in FIG. 1, a core 1 with an IC tag according to the first embodiment of the present invention has an IC tag 3 attached to the outer peripheral surface of a cylindrical core 2 . The IC tag 3 is attached to the outer peripheral surface of the winding core 2 in the vicinity of one end in the circumferential direction.

The material of the winding core 2 is paper. The paper winding core 2 is manufactured by applying an adhesive to a plurality of paper tapes and spirally winding them on a mandrel. For example, it has an outer diameter of 96 mm, an inner diameter of 76 mm, and an overall length of 480 mm. Examples of paper include base paper for paper tubes, liners, and high-quality paper. A barrier layer, a cushion layer, or the like can be appropriately provided depending on the characteristics of the winding core 2 .

As shown in FIG. 2, a concave portion 4 is provided on the outer peripheral surface of the paper core 2 . The concave portion 4 has a hemispherical shape with a deeper central portion and a shallower depth away from the center. The IC tag 3 is attached so that the IC chip 51 is positioned above the recess 4 . The recess 4 has a depth that can accommodate the thickness of the IC chip 51 . Further, the opening of the recess 4 is formed to be larger than the IC chip 51 of the IC tag 3 in plan view. The concave portion 4 can be formed by pressing the outer surface of the winding core 2 with a spherical body.

The material of the core 2 can be paper, plastic, metal, or the like. Examples of plastics include polyolefins such as polyethylene and polypropylene, ABS, polystyrene, polyvinyl chloride, polyamides, polyesters, FRP, phenolic resins, and the like.

FIG. 3 is a schematic diagram of an IC tag label attached to the winding core 2. FIG. It has a release layer 9, an inlet 5 and a protective layer. The release layer 9 and the inlet base material 53 are formed via the bonding layer 8 . An antenna 52 is laid on the upper surface of the inlet base material 53 , and the IC chip 51 is connected to the antenna 52 . An inlet 5 is formed by the IC chip 51 , the antenna 52 and the inlet base material 53 . A protective layer is further formed on the upper surface of the inlet 5 with a bonding layer 8 interposed therebetween. It is attached to the winding core 2 by peeling off the release layer 9 .

Examples of the inlet base material 53 include plastic films, papers, and the like, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene, polyethylene, polystyrene, ABS, polyacrylate, polyurethane, polyvinyl chloride, and vinyl chloride. -Various materials such as vinyl acetate copolymers, polycarbonates, polyamides, polyimides, resin-impregnated papers, coated papers, non-woven fabrics, etc. can be used. The thickness of the inlet base material 53 is preferably 100 μm to 600 μm.

As the protective layers, a first protective layer 6 having no through-holes capable of accommodating the IC chip 51 and a second protective layer 7 having through-holes capable of accommodating the IC chip 51 are formed. The thickness of the second protective layer 7 is equal to or larger than the thickness of the IC chip 51, and a through hole is formed which is equal to or larger than the IC chip 51 in plan view. Moreover, the second protective layer 7 is preferably made of a material having cushioning properties. Since the second protective layer 7 is laminated on the side where the IC chip 51 is arranged with respect to the inlet base material 53, the protrusion caused by the IC chip 51 can be accommodated in the through hole. As a result, the pressing force applied to the IC chip 51 from the outside can be reduced.

Examples of protective layers include plastic films and papers, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene, polyethylene, polystyrene, ABS, polyacrylate, polyurethane, polyvinyl chloride, vinyl chloride-acetic acid. Various materials such as vinyl copolymers, polycarbonates, polyamides, polyimides, resin-impregnated papers, coated papers, and non-woven fabrics can be used.

FIG. 4 is a perspective view of the package 11 in which the film 10 is wound around the winding core 1 with an IC tag. Since the IC tag 3 is attached to the outer peripheral surface near the end of the winding core 2 in the circumferential direction, when the film 10 is wound, it is attached to the area where the film 10 is not wound. Therefore, the visibility of the IC tag 3 as a package is high. Especially with passive tags, since the communication distance is short, it is easy to receive radio waves from the reader and to transmit to the reader. Furthermore, if the web is made of a conductive material, deterioration of communication performance can be prevented.

<Second embodiment>
Next, a second embodiment of the winding core 1 with an IC tag according to the present invention will be described with reference to FIG. In the following description, configurations different from those of the first embodiment will be described, and the same configurations will be denoted by the same reference numerals, and description thereof will be omitted.

FIG. 5 is a schematic diagram of an IC tag label to be attached to the winding core 2. FIG. The winding core 2 is made of paper as in the first embodiment. The IC tag label has a release layer 9 , a second protective layer 7 , an inlet 5 , and a first protective layer 6 formed with a bonding layer 8 interposed therebetween. The release layer 9 is peeled off and attached to the winding core 2 . A recess 4 is formed on the outer surface of the winding core 2 to which the IC tag 3 is attached. An IC chip 51 and an antenna 52 are provided on the lower surface of the inlet base material 53 . The IC tag 3 has a second protective layer 7 laminated on the side of the inlet base material 53 on which the IC chip 51 is arranged. As a result, since the protrusion of the IC chip 51 can be accommodated in the through hole, it can be prevented from being damaged by an external force before or after attachment to the winding core 2 .

<Third Embodiment>
Next, a second embodiment of the winding core 1 with an IC tag according to the present invention will be described. Configurations different from those of the first and second embodiments will be described, and the same configurations will be denoted by the same reference numerals, and descriptions thereof will be omitted.

The core 2 is made of paper as in the first and second embodiments, and the configuration of the IC tag 3 is the same as in the second embodiment. The outer peripheral surface of the winding core 2 is flat without the concave portion 4 . The IC tag 3 has an IC chip 51 and an antenna 52 provided on the lower surface of an inlet base material 53 . The IC tag 3 has a second protective layer 7 laminated between the inlet 5 and the winding core 2 . The through holes of the second protective layer 7 allow the IC tag 3 to be attached to the surface of the core 2 in a floating state.

In the above embodiment, both the first protective layer 6 and the second protective layer 7 are formed as protective layers, but at least one of them may be formed as a single layer. Two or more protective layers 7 may be configured, and different materials may be used.

Although the core was described as the adherend 2, it is not particularly limited to the core. For example, it can be applied to packaging materials, packaging materials, packaging containers, and the like.

Next, examples will be described in order to clarify the effects of the present invention.
[Example 1]
A paper core (outer diameter: 96.2 mm, inner diameter: 76.2 mm) was cut into a predetermined length and used as the core. A concave portion was formed at a predetermined position from the edge of the outer surface of the core, and the IC tag was attached in the circumferential direction of the core so that the IC chip of the IC tag was above the concave portion of the core. The size of the recess was 7 mm in diameter and 0.48 mm in depth.
The label size of the IC tag was 10 mm wide and 70 mm long. The IC tag label used had the configuration shown in FIG. A release layer, an inlay, and a first protective layer are laminated via a bonding layer, and the release layer is peeled off and attached to the winding core. A PET film (160 μm) was used as an inlay base material, and an antenna was provided on the upper surface of the base material and connected to an IC chip. The antenna size was 4 mm×60 mm. A PET film (110 μm) was used for the first protective layer.
[Example 2]
A paper core (outer diameter: 96.2 mm, inner diameter: 76.2 mm) was cut into a predetermined length and used as the core. A concave portion was formed at a predetermined position from the edge of the outer surface of the core, and the IC tag was attached in the circumferential direction of the core so that the IC chip of the IC tag was above the concave portion of the core. The size of the recess was 7 mm in diameter and 0.48 mm in depth.
The label size of the IC tag was 10 mm wide and 70 mm long. The IC tag label used had the configuration shown in FIG. A release layer, an inlay, a first protective layer, and a second protective layer are laminated via a bonding layer, and attached to the winding core after the release layer is peeled off. A PET film (160 μm) was used as an inlay base material, and an antenna was provided on the upper surface of the base material and connected to an IC chip. The antenna size was 4 mm×60 mm. A PET film (110 μm) was used for the first protective layer. An epoxy-containing polyester nonwoven fabric (180 μm) is used for the second protective layer, and through holes having a diameter of 6 mm are formed.
[Example 3]
A paper core (outer diameter: 96.2 mm, inner diameter: 76.2 mm) was cut into a predetermined length and used as the core. A concave portion was formed at a predetermined position from the edge of the outer surface of the core, and the IC tag was attached in the circumferential direction of the core so that the IC chip of the IC tag was above the concave portion of the core. The size of the recess was 7 mm in diameter and 0.48 mm in depth.
The label size of the IC tag was 10 mm wide and 70 mm long. The IC tag label used had the configuration shown in FIG. A peeling layer, a second protective layer, an inlay, and a first protective layer are laminated via a bonding layer, and attached to the winding core after peeling off the peeling layer. A PET film (160 μm) was used as the inlay base material, and an antenna was provided on the bottom surface of the base material and connected to the IC chip. The antenna size was 4 mm×60 mm. A PET film (110 μm) was used for the first protective layer. An epoxy-containing polyester nonwoven fabric (180 μm) is used for the second protective layer, and through holes having a diameter of 6 mm are formed.
[Comparative Example 1]
The same winding core and IC tag as in Example 1 were used. However, a flat winding core was used without forming a concave portion. An IC tag was attached to a predetermined position from the end of the outer peripheral surface of the core in the circumferential direction.

<Falling weight impact test>
A winding core having a total length of 100 mm and a weight of about 220 g was used. The recesses formed in the winding cores of Examples 1, 2, and 3 were provided at positions 50 mm from the ends. A falling weight impact test was performed assuming that the winding cores of Examples 1, 2 and 3 and Comparative Example 1 were dropped from heights of 0.3 m, 1 m, 1.5 m, 2 m and 3 m. Each drop impact energy was calculated, and the corresponding weight was dropped from the calculated height toward the IC tag attached to the outer peripheral surface of the paper tube. After the test, a reader (DOTR-910J manufactured by Tohoku Systems Support) was used to check for damage to the IC tag. The number of test samples was N=3. Table 1 shows the results.

As shown in Table 1, in Examples 1, 2, and 3 according to the present invention, damage to the IC tag was not observed even in the drop weight impact test from the 3m phase or the like. On the other hand, in Comparative Example 1, no damage was observed in the falling weight impact test from the 0.3m phase or the like, but damage was observed at the 1.0m phase or the like.

<Drop impact test>
A winding core having a total length of 480 mm and a weight of about 1045 g was used. The recesses formed in the winding cores of Examples 1, 2, and 3 were provided at positions 10 mm from the ends. Examples 1, 2, 3 and Comparative Example 1 were dropped from heights of 0.3 m, 0.5 m, 1.0 m and 1.5 m. The axial direction of the winding core was made horizontal, and it was dropped so that the dropping part became an IC tag. Using a reader (DOTR-910J manufactured by Tohoku Systems Support), the presence or absence of damage to the IC tag was confirmed. The number of test samples was N=3. Table 2 shows the results. A drop tester (manufactured by Yasuda Seiki Seisakusho: DT-100B) was used.

As shown in Table 2, in Examples 1, 2, and 3 according to the present invention, damage to the IC tag was not observed even when dropped from a height of 1.5 m. On the other hand, in Comparative Example 1, damage was not observed at a drop height of 0.3 m, but damage was observed at a drop height of more than 0.3 m.

Therefore, in Examples 1, 2, and 3, the IC tag was not damaged in both the drop weight impact test and the drop impact test, but in Comparative Example 1, the IC tag was damaged. In Examples 1, 2, and 3, since the direct and indirect pressing force and impact force applied to the IC chip can be reduced, damage to the IC tag can be prevented.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. Various modifications and variations can be made within the same scope as the present invention or within an equivalent scope.

1 winding core with IC tag (adherend with IC tag)
2 winding core (adherend)
3 IC tag 4 Recessed portion 5 Inlet 51 IC chip 52 Antenna 53 Inlet base material 6 First protective layer 7 Second protective layer 8 Bonding layer 9 Release layer 10 Film

Claims (8)

A mechanism for attaching an IC tag to an adherend , comprising an adherend, and an IC tag formed using a film-like inlet base material provided with an IC chip and an antenna connected to the IC chip. There is
A recess capable of accommodating the IC chip is formed on the surface of the adherend,
The IC tag is provided along the surface of the adherend so as to straddle the opening of the recess, and the lower surface side of the inlet base material of the IC tag is on the outer surface of the adherend following the outer peripheral edge of the opening. spliced,
A mechanism for attaching an IC tag to an adherend, wherein the IC chip is attached so as to correspond to the opening . 2. The IC tag adherend according to claim 1, wherein the concave portion of the adherend has a shape such as a mortar shape, a substantially hemispherical shape, or the like. mounting mechanism. 3. A mechanism for attaching an IC tag to an adherend according to claim 1, wherein the depth of said recess is at least twice the thickness of said IC. 4. The mechanism for attaching an IC tag to an adherend according to claim 1, wherein said inlet base material is made of a synthetic resin material or a paper material. The IC tag includes a bonding layer, an inlet in which the IC chip is connected to the antenna laid on at least one surface of an inlet base material, and a protective layer, and the protective layer protects the IC tag. 5. The IC tag according to any one of claims 1 to 4, wherein the IC tag comprises at least one of a first protective layer having a through-hole capable of accommodating the IC chip and a second protective layer having a through-hole capable of accommodating the IC chip. Attachment mechanism to the adherend. A winding core with an IC tag, wherein the adherend is a winding core, and the IC tag is attached by the mechanism for attaching the IC tag to the adherend according to any one of claims 1 to 5. 7. The winding core with an IC tag according to claim 6, wherein the IC tag is attached to the outer peripheral surface near the end of the winding core. A package comprising a web wound around the outer peripheral surface of the winding core with an IC tag according to claim 6 or 7.

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