JP2019090959A - IC tag label roll - Google Patents

Abstract

To provide an IC tag label roll that enables the supply of inexpensive IC tag labels for metal products that can be pasted to the products by a labelling machine quickly and stably.SOLUTION: On an IC tag label roll, IC tag labels having an attached inlet including an IC chip and a transmission/reception antenna and capable of performing contactless communication are temporarily attached on one side of a long belt-like separator at prescribed intervals. Each of the IC tag labels includes an adhesive part having an adhesive layer for being pasted to a product, and a non-adhesive part. The adhesive part is provided in a flow direction side of the IC tag label roll with respect to the IC tag label.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an IC tag label roll for enabling an IC tag label to be attached to a metal product or the like to be attached at a high speed using a label attaching machine.

  In recent years, as a tag attached to an article such as a commodity or a package to identify and manage the article, an RFID (including a data carrier system capable of non-contacting writing and reading of various data by communication with the outside) An individual recognition system using a Radio Frequency Identification) tag (IC tag) is known.

  The IC tag uses physical identification, such as physical distribution, distribution, management of goods and products handled by FA (Factory Automation) and articles such as packages, or solid identification information such as a unique identification number, and identification of authenticity and distribution, etc. It is widely used also for traceability such as, security.

  Especially in physical distribution and distribution, it becomes possible to grasp the current status of individual goods and products, so by reading the solid identification information of the IC tag attached to or linked to the goods or products with an external reader without contact. , Sales management and inventory management of goods and products can be performed efficiently (for example, Patent Document 1).

  However, when the IC tag is attached to the surface of the metal article, when the IC tag is attached to the surface of the metal article in contact with it, magnetic lines of force emitted from the wireless reader / writer flow into the metal article, There is a problem that communication between the IC tag and the wireless reader / writer becomes impossible.

  Therefore, there has also been proposed a method of attaching an IC tag to a metal article by interposing a magnetic material made of an amorphous sheet or the like (for example, Patent Document 2).

  However, when attaching an amorphous sheet to an IC tag as described above and attaching it to a metal article, the number of parts constituting the IC tag increases, and the manufacturing process becomes complicated, which increases the manufacturing cost. However, the mass of the electronic tag itself may be heavy, which may limit the articles to be attached, resulting in the inconvenience of inconvenient handling.

  In order to address such a problem, in Patent Document 3, a mounting portion capable of mounting an IC tag seal formed of a label base material on which an IC chip and an inlet having an antenna are positioned and mounted is attached to a product. Providing a tag base material having a portion, and providing a fold at the bendable portion of the tag base material on which the IC tag seal is mounted, so that the IC tag seal does not touch the surface of the article when attached to the article It has been proposed to

Japanese Patent Application Laid-Open No. 8-44794 JP, 2000-276565, A Unexamined-Japanese-Patent No. 2007-171301

  However, such a method requires a step of attaching the electronic tag seal to the tag substrate one by one and then attaching it to the article, and it is difficult to attach the article continuously to many articles at a high speed. There was a problem.

  The present invention has been made in view of the circumstances as described above, and it is an IC that enables supply of an inexpensive IC tag label for metallic articles, which can be stably performed at high speed and stably, by applying a labeling machine to articles. It provides a tag label roll.

  The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 is an IC tag label having an IC chip and a transmitting / receiving antenna, and having an inlet that can communicate in a non-contact manner. An IC tag label roll temporarily attached at a predetermined interval on one side of a strip-shaped separator, wherein the IC tag label has an adhesive part having an adhesive layer for adhering to an article, and a non-adhesive part The adhesive part is provided on the side of the IC tag label in the flow direction of the IC tag label, which is an IC tag label roll.

  The invention according to claim 2 is the IC tag label roll according to claim 1, wherein in the IC tag label, the IC chip and the transmitting and receiving antenna are provided in the non-adhesive portion.

  The invention according to claim 3 is characterized in that, in the IC tag label, the width of the adhesive portion orthogonal to the flow direction is equal to or larger than the width of the non-adhesive portion. It is an IC tag label roll according to claim 1 or claim 2.

  The invention described in claim 4 is that the IC tag labels temporarily attached to the IC tag label roll are temporarily attached such that the IC tag labels partially overlap each other. It is an IC tag label roll as described in.

  The invention according to claim 5 is characterized in that in the IC tag label, a bent portion such as a perforation, a cut or a broken line is provided in the vicinity of the boundary between the adhesive portion and the non-adhesive portion. It is an IC tag label roll according to any one of claims 1 to 4.

  According to the IC tag label roll of the present invention, when the IC tag label roll is attached to a labeling machine and an inexpensive IC tag label for metallic articles is attached to an article, problems such as jam during transport and peeling of the IC tag label It becomes possible to provide an IC tag label roll without

It is a perspective view which shows the example of an IC tag label roll. It is sectional drawing which shows the structural example of an IC tag label. It is sectional drawing which shows another structural example of an IC tag label. It is a top view which shows another example of an IC tag label roll. It is a top view which shows another example of an IC tag label roll. It is sectional drawing which shows the example of the part which an IC tag label overlaps. It is a perspective view showing the example of the article which stuck the IC tag label. It is a top view which shows the example of the conventional IC tag label roll.

Hereinafter, embodiments of the present invention will be described in detail. Although the drawings will be referred to as appropriate in the following description, the embodiments described in the drawings are illustrative of the present invention, and the present invention is not limited to the embodiments described in these drawings.

  Note that components having the same or similar function are denoted by the same reference numerals throughout the drawings, and redundant description will be omitted.

  FIG. 1 is a perspective view showing an example of an IC tag label roll (10) according to an embodiment of the present invention.

  In FIG. 1, an IC tag label (20) having an IC chip and an antenna on one side of a long strip-shaped separator (11) wound up in a roll shape and having an inlet capable of non-contact communication is attached. The IC tag label (20) has a pressure-sensitive adhesive portion (21) having a pressure-sensitive adhesive layer and a non-adhesive portion (22) in the IC tag label (20).

  The IC chip and the antenna are provided on the non-adhesive portion side, and even when the IC tag label (20) is attached to a metal article, the antenna portion and the like do not contact the metal portion, It becomes possible to reduce communication interference.

  At this time, particularly, as shown in FIG. 1, it is important that the adhesive portion (21) is provided on the flow direction side of the IC tag label roll (10).

  Thus, when the IC tag label roll (10) is attached to the labeling machine and it is intended to attach the IC tag label (20) to the article at a high speed, the IC tag label roll (10) of the labeling machine IC in the transport path. It is possible to reduce tag label peeling and jamming.

  That is, when the adhesive portion (21) is provided on the side of the IC tag label (20) parallel to the flow direction, such as the conventional IC tag label roll (60) shown in FIG. Lifting of the non-adhesive part (22) occurs in the conveyance path of the above, and the IC tag label (20) causes peeling, breakage, breakage, etc. in the turn bar and various roller parts in the labeling machine, causing jamming. It was

  On the other hand, by using the IC tag label roll (10) of the present invention, the entire front of the IC tag label (20) in the transport direction is separated by the adhesive portion (21) when transported to the turn bar or various roller portions. 11) and temporarily transported to the roller from the part that is temporarily attached when passing through various roller parts, so even if the non-adhesive part (22) is floating, it peels off due to contact etc. There are no breaks, breaks or the like.

  Therefore, when the IC tag label (20) is attached to the article, high-speed and stable attachment can be performed using a labeling machine.

  Here, in FIG. 1, in the IC tag label (20), the adhesive portion (21), the IC chip, the antenna, etc. are shown to be clearly recognized, but for convenience, they are shown for easy identification. When the IC tag label (20) temporarily attached to the separator (11) is observed from the upper surface side, the adhesive portion (21), the IC chip, the antenna and the like may not necessarily be visually observed.

  FIG. 2 and FIG. 3 are cross-sectional views showing an example of the cross-sectional configuration of the IC tag label (20) including the separator (11).

Here, as the separator (11), any separator can be used as long as it is generally used as a label separator, and in addition to a graft separator, a glassine separator, etc. in which the surface of paper etc. has been subjected to release treatment Etc. can be used arbitrarily according to the application.

  The label base material (31) of the IC tag label (20) may be any base material used for conventionally known labels.

  Specifically, various plastic films can be used in addition to papers such as high quality paper, coated paper, art paper, etc. As the plastic film, for example, polyester resins such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate and the like Acrylic resin, polyvinyl alcohol, vinyl resin such as vinyl chloride, polyolefin resin such as polypropylene, polyamide resin such as nylon, cellulose resin such as nitrocellulose, triacetyl cellulose, or any resin material alone or A mixture, what was used as a laminate, etc. can be illustrated.

  These plastic films may be used as a transparent film, but an extender pigment such as titanium oxide or calcium carbonate may be mixed, and a coating layer containing such an extender pigment is provided. It may be. There is no problem if bubbles or voids are contained in the plastic film layer.

  Furthermore, such a label base material (31) may be provided with an adhesion facilitating treatment, an antistatic treatment, various printing layers, etc. separately according to the method of use.

  The inlet adhesive layer (32) is for bonding the inlet consisting of the inlet substrate (35) provided with the IC chip (33) and the antenna (34) to the label substrate (31). Any conventionally known adhesive or pressure-sensitive adhesive used in various applications can be used.

  Specifically, for example, hot melt adhesive such as ethylene vinyl acetate (EVA), olefin, rubber, polyamide, polyester, polyurethane, acrylic, rubber, urethane, silicone, etc. And the like can be exemplified, but the present invention is not necessarily limited thereto.

  Such an inlet adhesive layer (32) is provided to cover at least the entire inlet substrate (35), and is adhered to the label substrate (31).

  As the inlet composed of the IC chip (33), the antenna (34) and the inlet base (35), any conventionally known ones used for IC tag applications can be used, and the communication band thereof is also optionally according to the application. It may be selected, and any of UHF band, HF band and the like may be used.

  The antenna (34) may be any antenna such as one obtained by etching a foil of aluminum, copper or the like, one obtained by transfer-forming, one printed with a paste such as copper or silver, or a wire made of a metal such as copper. it can.

  As the inlet base material (35), it is possible to use paper and any plastic sheet such as polyethylene terephthalate, polyethylene naphthalate, polyimide and the like.

Here, in FIG. 2 and FIG. 3, the inlet base material (35) is provided across both the adhesive part (21) and the non-adhesive part (22), but is necessarily limited to such a structure There is no problem if it is provided only in the non-adhesive portion (23) instead of the one.

  In this case, the inlet adhesive layer (32) may be provided at a portion covering at least the entire surface of the inlet base (35).

  In addition, since the IC chip (33) and the antenna (34) are provided in the non-adhesive portion (22), they are protected from rubbing and the like due to contact with the outside when applied to an article for operation. Preferably, it is provided between the inlet substrate (35) and the inlet adhesive layer (32).

  The pressure-sensitive adhesive layer (36) is used to temporarily attach the IC tag label (20) to the separator (11) and to attach it to an article, as long as it is a conventionally known pressure-sensitive adhesive used for applications such as labels. Either can be used.

  Specific examples of the adhesive include acrylic, urethane, rubber and silicone adhesives, but the present invention is not necessarily limited thereto.

  In such an adhesive layer (36), various additives such as tackifiers and plasticizers may be added according to the situation, in addition to various main ingredient resins.

  Moreover, in FIG. 2, the adhesive layer (36) is formed only in the adhesive part (21) of the IC tag label (20).

  As a method of partially providing the adhesive layer (36) in this manner, a method of partially transferring the adhesive formed on the surface of the release paper or the like in advance to a desired position of the IC tag label (20), a printing method Any method may be used such as a method of forming the IC tag label (20) at a desired position by a method such as the above.

  As the printing method, conventionally known printing methods such as gravure printing, offset printing, screen printing, flexo printing can be used.

  Further, in FIG. 3, the adhesive layer (36) is provided on both the adhesive part (21) and the non-adhesive part (22) of the IC tag label (20), and only the non-adhesive part (21) is non-adhesive It becomes the structure in which the process layer (37) was formed.

  As a method of forming an adhesive layer (36) on the entire surface of the IC tag label (20) on the inlet base (35) side, an adhesive formed beforehand on the surface of a release paper or the like is used as an inlet base of the IC tag label (20). (35) Any method such as a method of transferring on the entire surface or a method of coating the entire surface may be used.

  As a coating method, any of conventionally known coating methods such as a gravure coating method, a die coating method, a roll coating method, and a wire bar coating method can be used.

  The non-adhesive processed layer (37) may be, for example, paper such as high-quality paper or capacitor paper, or a plastic film, or may be provided as a printing layer.

  Examples of the plastic film are not particularly limited, and polyester resins such as polyethylene terephthalate, polyethylene naphthalate and polycarbonate, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, and polyamide resins such as nylon A film, an olefin resin film such as polypropylene, a cellulose resin film such as nitrocellulose, or any other film can be selected.

  These films may be subjected to any processing depending on the situation, such as an easy adhesion layer or a matting layer.

  When the non-adhesive processed layer (37) is provided as a printing layer, any material can be used as long as it can prevent adhesion of the adhesive layer (36), and offset printing, flexographic printing, letterpress printing A printing ink, a medium ink, a paste-killing ink, etc. used for printing for each purpose are preferably used, and an ultraviolet-curable ink is particularly preferably used.

  There is no problem even if additives such as silicone and waxes are added to such an ink.

  In the IC tag label (20) obtained as described above, as shown in FIG. 4, the shape of the IC tag label (20) is a shape other than a square, a rounded square, a rectangle, a rounded rectangle, etc. In this case, it is desirable that the width (a) of the adhesive portion (21) be larger than the width (b) of the non-adhesive portion (22).

  This is because the width (b) of the non-adhesive portion (22) is the width (21) of the adhesive portion (21) when the IC tag label roll (10) provided with the IC tag label of the special shape is installed in the labeling machine. If the size is larger than a), the risk of peeling, breakage, or tearing of the IC tag label is increased due to curling or lifting of the non-adhesive portion (22) in the conveyance path of the labeling machine. This risk can be reduced by increasing the width (a) on the side of the adhesive portion (21) as described above.

  Further, as shown in FIGS. 5 and 6, in the IC tag label roll (10), the IC tag labels (20) may be temporarily attached so as to partially overlap with each other.

  At this time, the overlapping portion (40) is temporarily attached behind the non-adhesive portion (22) of the IC tag label (20) temporarily attached to the front with respect to the flow direction of the IC tag label roll (10). At least a part of the adhesive portion (21) of the IC tag label (20) is placed.

  Here, it is desirable that the edge portion of the IC tag label temporarily attached to the rear does not overlap the portion of the IC chip (33) of the preceding IC tag label.

  This is because when the IC tag label roll (10) is wound up and stored, linear pressure is applied to the IC chip (33) by the edge portion of the IC tag label provided below, and the IC chip (33) is broken. To prevent that.

  As described above, by using the IC tag label roll (10) temporarily attached so that the IC tag labels (20) partially overlap, even if the IC tag label roll (10) of the same length, more IC tag labels (20) can be temporarily attached, and furthermore, when the IC tag label (20) is attached to the article by the label attaching machine, the feed amount of the IC tag label roll (10) for each time is reduced. It is possible to improve the manufacturing efficiency and reduce the manufacturing cost.

  FIG. 7 is a perspective view showing an example in which the IC tag label (20) is attached to an article (50) such as a metal cylinder using the IC tag label roll (10) obtained as described above.

  Here, it is desirable that the IC tag label (20) be provided with a bent portion (23), and the bent portion (23) is the adhesive portion (21) and the non-adhesive portion (22) of the IC tag label (20). And is formed by perforations, cuts, broken lines, and the like.

  When the IC tag label (20) is attached to an article (50) made of a metal material or the like by forming such a bent portion (23), the IC chip (33), the antenna (34), etc. The article (50) can be made more difficult to contact, and the risk of communication failure to the IC tag label (20) can be further reduced.

  As described above, by using the IC tag label roll of the present invention, a low-cost IC tag label that can be attached to a metal article can be a high-speed and stable article using a labeling machine. It makes it possible to paste it.

DESCRIPTION OF SYMBOLS 10 ... IC tag label roll 11 ... Separator 20 ... IC tag label 21 ... Adhesive part 22 ... Non-adhesive part 23 ... Folded part 31 ... Label base material 32 ... Adhesive layer for inlets 33 ... IC chip 34 ... Antenna 35 ... Inlet base material 36 ... Adhesive layer 37 ... Non-adhesive processed layer 40 ... Overlap part 50 ... Article (metal tube)
60 ... Conventional IC tag label roll

Claims (5)

An IC tag label roll having an IC chip and a transmitting / receiving antenna and mounted with a non-contact communicable inlet is an IC tag label roll temporarily attached at a predetermined interval on one side of a long strip-shaped separator,
The IC tag label has an adhesive part having an adhesive layer for adhering to an article, and a non-adhesive part.
An IC tag label roll, wherein the adhesive portion is provided on the IC tag label in the flow direction of the IC tag label roll.   The IC tag label roll according to claim 1, wherein in the IC tag label, the IC chip and the transmission / reception antenna are provided in the non-adhesive portion.   The IC according to claim 1 or 2, wherein the width of the adhesive portion orthogonal to the flow direction is the same as or larger than the width of the non-adhesive portion in the IC tag label. Tag label roll.   The IC tag label roll according to any one of claims 1 to 3, wherein the IC tag labels temporarily attached to the IC tag label roll are temporarily attached so as to partially overlap each other.   The IC tag label according to any one of claims 1 to 4, wherein a bent portion such as a perforation, a cut, or a broken line is provided in the vicinity of the boundary between the adhesive portion and the non-adhesive portion. IC tag label roll described.

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