JP5401843B2 - Tag and manufacturing method thereof - Google Patents

Description

  The present invention relates to a tag attached to a package at an airline, a transportation company, etc., and a method for manufacturing the tag. More specifically, it is a tag that can be easily installed without any problem in workability when attaching a tag, without peeling off the release paper covering the adhesive layer of the tag and discarding it. The present invention relates to a method capable of manufacturing the tag with a simple method without using it.

  In industries such as aviation and transportation, a lot of management tags that record various service identifications and logistics information are used when carrying packages. For example, as shown in Patent Documents 1 and 2, in a strip-shaped packing tag in which a pressure-sensitive adhesive layer is provided on one surface of a substrate and release paper is superimposed on the pressure-sensitive adhesive layer, the release paper Is peeled off to expose the pressure-sensitive adhesive layer and passed through a part of the baggage (such as a bag handle) in a loop, and both ends of the tag are adhered.

  However, from the viewpoint of emphasizing environmental issues in recent years, there is a problem that waste is generated because the release paper is peeled off and discarded in the work of attaching the tag, and the work of peeling off the release paper and throwing it away There is also a problem of workability such as that it takes time. On the other hand, Patent Document 3 provides a tear line for separating each of the above-mentioned tickets in a packing tag in which a voucher, a management ticket, and a transport ticket are connected in a series, and an adhesive on the back of the management ticket and the transport ticket. On the other hand, there has been proposed a tag that is formed by providing a peelable resin layer on the back side of a voucher and folding the bill into two so that the peelable resin layer is superposed on the adhesive layer.

However, even when using the above tag, there is a problem that it is necessary to separate the voucher and a product with good workability has not been put into practical use.
No. 7-1657 JP-A-5-197339 Japanese Utility Model Publication 2-45893

  Therefore, the present invention provides a tag that can be easily mounted without any problem in workability when the tag is attached without peeling off and discarding the release paper covering the pressure-sensitive adhesive layer. An object of the present invention is to provide a manufacturing method capable of manufacturing the tag with a simple method without using the method.

In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention is such that a strip-like long base material A and a short base material B are aligned with one end aligned in close contact with each other. In the tag, the base material A and the base material B are bonded through the pressure-sensitive adhesive layer A in the vicinity of the aligned side end portions, and on the surface in contact with the base material A in the vicinity of the other end portion of the base material B. A pressure-sensitive adhesive layer B is formed, a release layer is formed on the surface of the base material A facing the pressure-sensitive adhesive layer B, and the base material B and the base material A are polymerized so as to be peelable by the pressure-sensitive adhesive layer B. It relates to a tag that is characterized by
In the invention according to claim 2, the difference in length between the base material A and the base material B is larger than the width (a) of the pressure-sensitive adhesive layer B in a state where the base material A and the base material B are in close contact with each other. The present invention relates to a tag according to claim 1.

The invention of claim 3 is the method of manufacturing a tag according to claim 1 or 2, wherein the continuous base material of the base material A is wound up and supplied to the printing unit, and a release layer is formed on one side of the base material A by printing . and, said the punch holes on at least one end of the base material a is formed at regular intervals to produce a supply of substrate a, supplying a continuous substrate of the substrate B to the printing unit in the winding, group on the side where the adhesive layer a of wood B is formed by forming a punch hole at regular intervals to produce a supply of substrate B, a separate collation apparatus a supply of the substrate a and the substrate B Attached to the unit, the base material A and the base material B are conveyed in the same direction by the punch holes, and the adhesive layer A is located in the vicinity of the inside of the punch holes of the base material A on the side where the base materials A and B are aligned. It is formed and to form a pressure-sensitive adhesive layer B on the inner release layer of the base material a, and pressed by polymerizing so that the substrate a and the substrate B is in close contact, cutting unit collated device A method of manufacturing a tag characterized in that it cut into a predetermined size.

The invention of claim 4 is the method of manufacturing a tag according to claim 1 or 2, wherein the continuous base material of the base material A is wound up and supplied to the printing unit, and a release layer is formed on one side of the base material A by printing . and, said the punch holes on at least one end of the base material a is formed at regular intervals to produce a supply of substrate a, supplying a continuous substrate of the substrate B to the printing unit in the winding, group on the side where the adhesive layer a of wood B is formed by forming a punch hole at regular intervals to produce a supply of substrate B, a separate collation apparatus a supply of the substrate a and the substrate B Attached to the unit, the base material A and the base material B are conveyed in the same direction by the punch holes, and the adhesive layer A is located in the vicinity of the inside of the punch holes of the base material B on the side where the base materials A and B are aligned. It is formed and the adhesive layer B is formed so as to be coated on the release layer on the substrate B surface facing the release layer of the base material a, so that the substrate a and the substrate B is in close contact Polymerized and pressed, a method for manufacturing a tag characterized in that it cut into a predetermined size cutting unit collation apparatus.

Since the tag of the present invention does not use release paper, it can be easily mounted without any problem in workability when the tag is attached without peeling off and discarding the release paper covering the adhesive layer.

Moreover, the manufacturing method of the tag of this invention WHEREIN: When collating the base material A and the base material B which are two base materials, both base materials are adhesive layer A in the position of the one end of this base material. The adhesive layer B is peelably polymerized and collated on the release layer provided on one base material at the other end position of the base material. , The release layer is printed on the continuous base material A of the base material A , and at least one end of the base material A is provided with punch holes at regular intervals to engage with the conveying unit of the collating apparatus. Preparing a supply body for the base material A, and for engaging the transport part of the collating device at the end of the position where the adhesive layer A of the continuous base material B of the base material B is to be provided. Punch holes are provided at regular intervals to prepare a supply body for the base material B, and then in the release layer region and the release layer of the base material A on the side where the release layer of the base material A is provided. The adhesive layer A and the adhesive layer B are applied to the end surface opposite to the formed side, and then the base material A and the base material B are aligned with the punch holes provided in both. The base material A and the base material B are polymerized by a collating apparatus, and then cut into a predetermined size to manufacture a tag.

By taking the above manufacturing method, the release layer is printed on the continuous base material A of the base material A, and the adhesive layer A is applied to the end faces on one side of the base material A and the base material B. The adhesive layer B is applied between the base material A and the base material B so that the material is adhered and covered with the release layer, and the base material A and the base material B are polymerized by a collating apparatus. Then, by cutting into a predetermined size, the tag can be manufactured by a simple method without using a complicated method. At that time, using the punch holes formed in the base material A and the base material B, the base material A and the base material A and the base material are engaged while engaging the pin in the pin tractor of the transport unit of the collating apparatus and the punch hole of the base material. By aligning the material B, the tag defined in claim 1 can be manufactured.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic diagram for explaining a method of handling a tag, showing an embodiment of the present invention. FIG. 1 (1) is a cross-sectional view showing a configuration in which two base materials A (2) and B (3) are polymerized, and the base material A (2) and the base material B (3) are at the left end. The adhesive layer A (4) is bonded to the substrate B, and the adhesive layer B (5) is bonded to the substrate A through the release layer 6 at the right end portion of the substrate B (3). Polymerized.

  FIG. 1 (2) is a schematic view showing a state where the pressure-sensitive adhesive layer B (5) is peeled off from the release layer 6 from the state where the two substrates shown in FIG. 1 (1) are polymerized. As shown in the figure, the tag 1 has two base materials A (2) and B (3) with the left end portion of the base material B (3) adhered to the adhesive layer A (4). At the right end portion, the pressure-sensitive adhesive layer B (5) is peeled off from the release layer 6 provided on the substrate A (2) and separated.

  Next, as shown in FIG. 1 (3), the right end portion of the base material A (2) and the right end portion of the base material B (3) are arranged so that the tag 1 forms a loop-shaped ring. It is the schematic which shows the state adhere | attached by adhesive layer B (5). However, although not shown, a bag handle or the like is positioned in a loop-shaped ring of the tag. That is, both ends of the luggage tag are bonded so as to form a ring through the opening of a part of the luggage such as the handle of the bag, as shown in FIG. In FIG. 1 (3), the peeling layer 6 exists in the circumference | surroundings of the ring | wheel of a tag, and it is trying not to overlap with the adhesive layer B (5). If the adhesive layer B (5) overlaps with the release layer 6 even partly, the adhesive layer B (5) easily peels off from the base material A (2) and is attached to the luggage. This is because there is a tendency for the tag to come off.

  2 is used by bonding both ends of the tag 1 with the adhesive layer B (5) so as to form a ring through the tag 1 shown in FIG. 1 (2) through the opening of the handle 20 of the bag. It is explanatory drawing which shows the done example. As shown in the enlarged view of the portion where both ends of the tag 1 are bonded, the pressure-sensitive adhesive layer B (5) and the tag base material (A) 2 are overlapped and bonded. However, the substrate A (2) and the substrate B (3) are bonded to the end surface of the substrate opposite to the portion bonded with the adhesive B (5) by the adhesive layer A (4). Yes. And in the tag 1, as shown to FIG. 1 (2), the width a of adhesive layer B (5) is set smaller than the distance c from the edge of the peeling layer 6 to the right end of the base material A (2). Thus, when the tag 1 is rolled up and bonded to both ends as a ring, the adhesive layer B (5) and the tag substrate A (2) ( Positioning can be easily performed so that the adhesive layer B (5) and the release layer 6 do not overlap with each other so that the portion at the right end of the substrate indicated by the distance c) overlaps, and the tag once rounded. Can be prevented from peeling off. In FIG. 1 (2), the width of the portion where the release layer 6 is formed is indicated by b, and the width b is set larger than the width a of the pressure-sensitive adhesive layer B. This is because when the pressure-sensitive adhesive layer B (5) and the release layer 6 are polymerized, as shown in FIG. 1 (1), the pressure-sensitive adhesive layer B (5) is entirely covered with the release layer 6. .

Examples of the tag shown in FIGS. 1 and 2 will be described below.
The base material A (2) and base material B (3) used in the tag are used by bonding the both ends of the tag so as to form a ring through a part of the opening of the package, The material is not limited as long as it can withstand the use. As the substrate, for example, various plastic films or sheets such as polyolefin (polyethylene, polypropylene, etc.), polystyrene, polycarbonate, polyethylene terephthalate, polyvinyl chloride, polymethacrylate and the like can be used.

  In addition, a white opaque film formed by adding a white pigment or a filler to these synthetic resins, or a film (so-called synthetic paper) having fine voids (micro voids) inside the substrate can be used. Moreover, the laminated body by the arbitrary combinations of the said base material can also be used. The thickness of the base material used in the tag of the present invention may be arbitrary, for example, a thickness of about 10 to 300 μm is common.

As the release layer 6 provided on the packing tag of the present invention, a coating liquid in which a release resin such as a silicone resin, a fluorine resin, or polyethylene wax is dissolved or dispersed in an organic solvent or the like is prepared, and flexographic printing or gravure printing is performed. It can be formed in a predetermined pattern on the substrate by printing or the like. In addition, a release layer can be formed in a predetermined pattern on a base material by letterpress printing or offset printing by adding silicone oil or silicone acrylate to the ultraviolet curable ink. The thickness of the release layer is usually 0.5 to 10 g / m ² in terms of solid content after drying.

  The pressure-sensitive adhesive layer A (4) and the pressure-sensitive adhesive layer B (5) used in the tag of the present invention can be formed using various types of pressure-sensitive adhesives conventionally known. 5) has a function capable of being peeled from the release layer, and it is practically preferable to use a pressure-sensitive adhesive. For example, acrylic resins, natural rubber resins, synthetic rubber resins, silicone resins and the like can be mentioned. The pressure-sensitive adhesive layer A (4) is not particularly limited as long as it can firmly bond the base material A and the base material B, and a general adhesive can be used.

However, it is practically preferable that the pressure-sensitive adhesive layer A (4) and the pressure-sensitive adhesive layer B (5) are formed by coating with a shared material in terms of production efficiency. Printing can be performed using a water-based or solvent-based coating solution made of an adhesive resin as described above to form an adhesive layer. The printing method is a general method such as a flexographic printing method or a gravure printing method, and the adhesive layer is formed by printing on a base material of a label or a release layer. As for the thickness of the adhesive layer, 0.1-50 g / m < ² > (solid content after drying) is preferable.

  Although not shown in the figure on the side opposite to the surface on which the peel-off layers and adhesive layers of the tag base materials A and B are formed, when carrying luggage, etc., in order to record identification of various services and logistics information Information and records are given. The information and record may be formed by a known printing method such as offset printing, gravure printing, silk screen printing, or printed by non-impact recording such as thermal transfer recording or inkjet recording, or dot impact recording. Can be formed.

  Since the tag described above does not use release paper, the release paper covering the pressure-sensitive adhesive layer is not peeled off and discarded, and no dust is generated. Further, when attaching the tag, the adhesive layer B is peeled off from the release layer so that the tag forms a loop-shaped ring, and both ends of the base materials A and B of the tag are put together to form the adhesive layer B and the tag base. By simply adhering the material A, it was easy to install without any problem in workability.

An embodiment of the method for manufacturing a tag according to the present invention will be described below with reference to FIGS. As shown in FIG. 3 (1), a continuous base material A (11) of the base material A constituting the tag is supplied by a winding 12, and the continuous base material A (11) is supplied to a predetermined unit by a printing unit 13. The release layer is printed with the pattern of, and then, at least one end of the continuous base material A (11) , punch holes are continuously formed at intervals of 0.5 inches at the punch hole processing unit 14, The supply body 15 of the base material A is produced. Further, as shown in FIG. 3 (2), the continuous base material B (11 ′) of the base material B is supplied by the winding 12 ′, and the adhesive layer A of the continuous base material B (11 ′) is provided. At the end of a certain position, punch holes are continuously formed at intervals of 0.5 inches by the punch hole processing portion 14 ′, and the supply body 15 ′ of the base material B is manufactured.

  Using the base material B supply body 15 ′ and the base material A supply body 15 as shown in FIG. 3, the tag 1 is manufactured by the manufacturing apparatus 50 (also a collating apparatus) shown in FIG. can do. The supply body 15 of the base material A is installed in the first paper feed unit 21 of the manufacturing apparatus (collation apparatus) shown in FIG. 4 to be transported and supplied, and on the side where the release layer of the base material A is provided. In the release layer region and on the end surface of the base material A opposite to the side where the release layer is formed, the adhesive printing unit 16 applies and prints the adhesive, and then the second paper feeding unit 22 The supply body 15 'of the installed base material B is sent out, and the base material A and the base material B are polymerized and collated so that the adhesive layer of the base material A and the base material B face each other. .

  At that time, as shown in FIG. 1 (1), the adhesive layers A and B of the tag 1 are placed at predetermined positions of the base material B, that is, the end face of the adhesive layer A and the left end face of the base material B. The punch holes provided on both sides of the adhesive layer B and the right end surface of the base material B are engaged with the pins of the pin tractor 18 serving as a conveyance unit so as to be aligned with each other. To do. The pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B are simultaneously formed of the same pressure-sensitive adhesive material by the pressure-sensitive adhesive printing unit 16 shown in FIG. However, the pressure-sensitive adhesive printing unit for forming the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive printing unit for forming the pressure-sensitive adhesive layer B are prepared separately, and different pressure-sensitive adhesives are used in each pressure-sensitive adhesive printing unit. It is also possible to form an agent layer.

  However, the base material A and the base material B are devices as shown in FIG. 3 respectively, and punch hole processing and the base material A are subjected to release layer printing, but the base material A and the base material B are In any case, it is premised that the punched hole processing portion and the release layer printing portion are accurately processed and printed so that the positions are set values. Thereby, by matching the positions of the punch holes of the base material A and the base material B, as a result, the end surface of the base material B and the end surface of the pressure-sensitive adhesive layer B coincide with each other. The left end surface of the material B has the adhesive layer A in between, and the end surfaces coincide with each other.

  In addition, after the base material A and the base material B are polymerized by the pressure-sensitive adhesive layers A and B, the packing tag is pressure-bonded by the pressure-bonding unit 19 to enhance the adhesion between the base material A and the base material B. Thereafter, the cutting unit 17 performs cutting (sheet cutting) so that the long continuous tag polymer becomes a sheet-like tag polymer 1 as shown in FIG. As a result, a large number of sheet-like tag polymers 1 can be formed. In addition, although not shown in figure, the part containing the punch hole of the edge | side on the side adhere | attached with the adhesive layer A in the form which the continuous base material A and the continuous base material B superposed | polymerized is also a peeling layer of the continuous base material A If there is a punch hole on the end surface on the forming part side, the part including the punch hole is also cut and removed continuously with a slitter or the like in the flow direction to form a tag as shown in FIG. it can.

  The manufacturing apparatus shown in FIG. 4 shows an example in which an adhesive is applied and printed on the supply body 15 of the base material A. However, the present invention is not limited thereto, and a predetermined amount is applied to the supply body 15 ′ of the base material B. Adhesive is applied and printed at the pattern and at a predetermined position, the base material A and the base material B are polymerized, and cut into a predetermined size to form a tag as shown in FIG. can do.

  According to the method for manufacturing a tag described above, the tag can be manufactured by a simple method without using a complicated manufacturing method. Moreover, the tag obtained by the manufacturing method can exhibit the effects of the invention as described above.

It is the schematic explaining the handling method of the tag which shows one Example of this invention. It is explanatory drawing which shows the example which adhere | attached and used the adhesive layer B for the both ends of the tag so that it might become a ring | wheel through the tag shown in FIG.1 (2) through the opening part of the bag. It is the schematic explaining the peeling layer printing and punch hole processing which are applied with the manufacturing method of the tag of this invention. It is the schematic which superpose | polymerizes an adhesive layer printing applied with the manufacturing method of the tag of this invention, and two base materials, and demonstrates a collation process.

Explanation of symbols

1 Tag 2 Base material A
3 Base material B
4 Adhesive layer A
5 Adhesive layer B
6 Release layer 20 Bag handle

Claims (4)

In both cases, the strip-shaped long base material A and the short base material B are arranged in close contact with each other with one end aligned ,
The base material A and the base material B are bonded via the pressure-sensitive adhesive layer A in the vicinity of the aligned side edges ,
The adhesive layer B is formed on the surface in contact with the substrate A in the vicinity of the other end of the substrate B, and the release layer is formed on the surface of the substrate A facing the adhesive layer B. The packing material, wherein the base material B and the base material A are polymerized so as to be peelable by the pressure-sensitive adhesive layer B. The difference in length between the base material A and the base material B is larger than the width (a) of the pressure-sensitive adhesive layer B in a state where the base material A and the base material B are in close contact with each other. The tag according to Item 1.
The method of manufacturing a tag according to claim 1 or 2, supplying a continuous substrate of the substrate A to the printing unit by winding to form a printing a release layer on one side of the substrate A, of the base material A to produce a supply of substrate a to form a punch hole at regular intervals on at least one end,
Supplying a continuous substrate of the substrate B to the printing unit by winding, to form punch holes at regular intervals to produce a supply of base material B on the side of the pressure-sensitive adhesive layer A of the base material B is formed,
The base material A and the base material B are mounted on separate units of the collating apparatus, the base material A and the base material B are conveyed in the same direction by the punch holes, and the base material A and the base material B are aligned. The pressure-sensitive adhesive layer A is formed in the vicinity of the inside of the punch hole of the base material A on the formed side, the pressure-sensitive adhesive layer B is formed on the inner side of the peeling layer of the base material A, and the base material A and the base material B are in close contact with each other. A method for producing a tag, characterized in that it is superposed and pressure-bonded and cut into a predetermined size by a cutting unit of a collating apparatus . The method of manufacturing a tag according to claim 1 or 2, supplying a continuous substrate of the substrate A to the printing unit by winding to form a printing a release layer on one side of the substrate A, of the base material A to produce a supply of substrate a to form a punch hole at regular intervals on at least one end,
Supplying a continuous substrate of the substrate B to the printing unit by winding, to form punch holes at regular intervals to produce a supply of base material B on the side of the pressure-sensitive adhesive layer A of the base material B is formed,
The base material A and the base material B are mounted on separate units of the collating apparatus, the base material A and the base material B are conveyed in the same direction by the punch holes, and the base material A and the base material B are aligned. The pressure-sensitive adhesive layer A is formed in the vicinity of the inside of the punch hole of the base material B on the formed side, and the pressure-sensitive adhesive layer B is coated on the surface of the base material B facing the release layer of the base material A so as to be covered with the release layer. A method for producing a label, comprising forming, polymerizing and press-bonding so that the substrate A and the substrate B are in close contact with each other, and cutting to a predetermined size by a cutting unit of a collating apparatus .

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