JP2006010731A - Label with ic tag, and manufacturing method of base material of the label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a label with IC tag capable of preventing damage or the like to the IC tag, especially damages caused by heating, when the label is attached. <P>SOLUTION: A recessed part 5 is formed on the label body of the label with IC tag, and an IC tag 3 is housed in the recessed part 5. The label body 2 is composed of a foamed resin sheet 23, and the recessed part 5 is formed on a part of the foamed resin sheet 23. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a label with an IC tag in which an IC tag is accommodated, and a method for manufacturing the label original.

Conventionally, a mechanical reading symbol such as a barcode is printed on various labels such as a tack label, a heat-sensitive label, and a cylindrical label, thereby managing the quality and distribution of the product.
However, with recent remarkable progress in IT technology, an IC tag including an ultra-small IC chip is used for management of manufacturing, quality, distribution, etc., instead of the barcode. For example, in Japanese Patent Laid-Open No. 2004-20771, an IC pattern in which an antenna pattern made of conductive ink is printed on a cylindrical label base material surface, and an IC tag is attached so as to be electrically connected to the antenna pattern. A tagged bottle label is disclosed. Such a label is used by being attached to the body of the container.

However, in the label described in the above publication, since the IC tag protrudes from the label base material surface, the IC tag may be damaged or fall off. For example, when the IC tag is attached to the surface of the label base material, the IC tag is likely to be damaged or dropped due to contact or collision with a foreign object when the label mounting container is transported. On the other hand, when the IC tag is attached to the back surface of the label base material, there is no possibility that the IC tag directly contacts the foreign material, but the IC tag protrudes from the back surface of the label base material due to the foreign material colliding with the label surface. Since the IC tag is pressed against the container body, the IC tag is easily damaged. Further, when the label is inserted into the bottle, the IC tag easily interferes with the bottle, which causes a problem that the label is poorly attached.
In addition, when the label described in the above publication is a label that is mounted by heating, such as a shrink label, the IC tag may be damaged by heat during mounting.

JP 200420771 A

  Then, this invention makes it a subject to provide the manufacturing method of the label with an IC tag which can prevent damage etc. of an IC tag, and this label original fabric. Furthermore, this invention makes it a 2nd subject to provide the label with an IC tag which can prevent that an IC tag is damaged by the heating at the time of mounting | wearing.

  As a first means for solving the above-mentioned problems, the present invention provides a label with an IC tag in which a recess is formed in a label body, and an IC tag is accommodated in the recess.

  The label with the IC tag has a recess formed in the label body, and the IC tag is accommodated in the recess, so that the IC tag does not protrude from the label body. Therefore, the IC tag can be prevented from being damaged due to contact or collision with a foreign object.

  Moreover, in a preferred aspect of the present invention, the label main body is a label with an IC tag provided with a foamed resin sheet, and a recess is formed in a part of the foamed resin sheet. According to such a label, the recess Since there is a foamed resin sheet having elasticity around, the impact force applied from the outside can be appropriately absorbed to protect the IC tag.

  Furthermore, in a preferred aspect of the present invention, the label with an IC tag can be attached to an attached body by applying heat from one surface side, and a heat insulating layer is interposed between the heated surface and the recessed portion. According to such a label, heat propagation from the surface to be heated is blocked by the heat insulating layer, so that damage to the IC tag due to heat can be prevented.

The second means of the present invention relates to a method for producing the above-mentioned label with an IC tag, wherein a concave portion is formed by pressing a plastic label raw material, and an IC tag is attached to the concave portion for accommodation. Provided is a method for producing a label original with an IC tag.
According to the said manufacturing method, a desired dent part can be formed in a suitable position, and a label original fabric with an IC tag can be easily manufactured by sticking and accommodating an IC tag in this dent part. The label with the IC tag can be obtained by appropriately forming such a label original with the IC tag into a shape.

Furthermore, a third means of the present invention is an IC tag for forming a recess capable of accommodating an IC tag on a label original made of a laminate of two or more layers in which a second layer is laminated on one surface of a first layer. A method for producing a label original with a label, wherein when a second layer is laminated on one surface of a first layer to produce a label original, a non-laminated portion in which a part of the second layer is not laminated is arranged in a delivery direction. The tape-shaped IC tag continuous in which the IC tag is arranged in parallel at a predetermined interval along the long concave portion while forming a long concave portion on the one surface side of the first layer. Provided is a method of manufacturing a label original with an IC tag that attaches a body and accommodates the body.
According to the above manufacturing method, since the concave portion is formed in the step of stacking the respective layers to produce the label raw material, it is not necessary to provide the step of forming the concave portion separately, and the formed long concave shape Since the IC tag can be accommodated only by adhering the tape-shaped IC tag continuous body along the concave portion, there is no need to individually attach the IC tag. Therefore, the label original with IC tag can be easily manufactured.

Since the IC tag with the IC tag of the present invention is housed in a recess formed in the label body, the IC tag can be prevented from being damaged when the label contacts or collides with a foreign object. Therefore, the mounted body on which the label of the present invention is mounted can read electronic information satisfactorily by the reader / writer device, and can accurately manage production, quality, distribution, and the like.
In a preferred embodiment of the present invention, a label with an IC tag can be provided in which the IC tag is not damaged by heat applied during mounting.

Hereinafter, the present invention will be specifically described with reference to the drawings.
However, the “back surface” refers to the surface facing the mounted body side when mounted, and the “front surface” refers to the surface on the opposite side.
(First embodiment)
1st Embodiment is related with the label with an IC tag of the aspect used by affixing on a to-be-mounted body.
In FIG. 1 and FIG. 2, reference numeral 1 denotes a label main body 2 in which a sticking portion 25 is provided on the back surface 2 a, a concave portion 5 formed inside the label main body 2, and the concave portion 5. The IC tag label provided with the IC tag 3 is shown. The label 1 is used by being affixed to a desired position of a mounted body such as a container.

Specifically, the label main body 2 is made of a laminated film in which a heat insulating layer 23 is laminated between an inner surface layer 21 and an outer surface layer 22, and is formed in a predetermined planar shape (for example, a rectangular shape).
The surface 2b of the label main body 2 is laminated with a design printing layer (not shown) for displaying a trade name, a pattern, and the like from the surface side. These other functional layers can be appropriately laminated.

As the inner surface layer 21 or the outer surface layer 22, a known film can be used as long as it is a flexible film (generally referred to as a sheet), for example, paper, synthetic paper, synthetic resin film. Further, a metal vapor-deposited film, a foamed resin sheet, and the like, or the same or different laminates can be used.
The inner layer 21 or the outer layer 22 has a thickness of about 10 to 80 μm.

On the surface 23 a of the heat insulating layer 23, a recessed portion 5 that is recessed toward the back surface side is formed.
As shown in FIG. 2, the recess 5 is formed so as to open toward the outer surface layer 22, and a heat insulating layer 23 is interposed between the bottom surface of the recess 5 and the inner surface layer 21. The recess 5 is formed in a size that can accommodate an IC tag 3 to be described later. More specifically, the planar shape of the recessed portion 5 is formed larger than the planar shape of the IC tag 3, and the depth of the recessed portion 5 is such that the IC tag 3 to be accommodated is outside the recessed portion 5 (heat insulating layer). 23 so as not to protrude to the surface 23a side).

The heat insulating layer 23 is not particularly limited as long as it is a heat insulating material, and for example, a foamed resin sheet, a nonwoven fabric, a foamed ink layer that is foamed by heating, Japanese paper, or the like can be used. Especially, since the predetermined dent part 5 can be easily formed by pressing one surface, it is preferable to use a heat insulating material with plasticity, for example, a foamed resin sheet. Examples of such foamed resin sheets include relatively soft thermoplastic resin foam sheets such as polystyrene, polyethylene, polypropylene, and polyurethane. The expansion ratio of the foamed resin sheet may be approximately 1.5 to 40 times, but approximately 2 to 20 times is preferable from the viewpoint that the recessed portion 5 can be easily formed by pressing.
Although the thickness of the heat insulation layer 23 will not be specifically limited if it has the thickness which can form the said dent part 5, The thing of about 100-1000 micrometers, Preferably about 200-400 micrometers is used.

  The sticking part 25 can be comprised with an adhesive or an adhesive agent, for example, is formed by apply | coating a well-known pressure sensitive adhesive, a heat sensitive adhesive (adhesive) etc. to the whole back surface of the label main body 2. FIG. . Here, a heat-sensitive adhesive (adhesive) is one that is not adhesive at room temperature but can be bonded by heating, and is an ethylene resin such as an ethylene vinyl acetate copolymer or an ethylene acrylic acid copolymer. Examples include those in which an additive such as a tackifier is blended with a base resin such as.

The IC tag 3 has a module part composed of an IC chip and an antenna part, and can read / write (or read only) electrical information of the IC chip without contact with a reader / writer device. Also included are those expressed as RFID inlets, wireless IC tags, non-contact ICs, non-contact data carriers, and the like.
As the IC tag 3, for example, as shown in FIG. 3, a base material 34 such as a synthetic resin film, a conductive antenna portion 31 formed on the base material 34 in a predetermined pattern, and ends of the antenna portion 31. A module unit 33 composed of an IC chip 32 electrically connected to the unit, or a small unit having an antenna function (for example, a mu chip manufactured by Hitachi, Ltd. [trade name]) Are generally used, and those having a size of several centimeters square to several millimeters square and a thickness of 50 to 500 μm are used.
As shown in FIG. 2, the IC tag 3 has an adhesive on the bottom surface of the recess portion 5 with a space 4 between the periphery and the inner peripheral surface of the recess portion 5 and the back surface of the outer surface layer 22. It is pasted through such as.

A method for manufacturing the label 1 with the IC tag will be described.
As shown in FIG. 4, a label original fabric 100 on which an inner surface layer 21 and a plastic heat insulating layer 23 such as a foamed resin sheet are laminated and to which a release paper 6 is attached is drawn through an adhesive portion 25, and this original fabric is drawn out. By pressing one surface of the heat insulating layer 23 of the 100 with the protrusion 101a of the embossing roll 101, a plurality of the recessed portions 5 are formed at predetermined intervals in the sending direction and the width direction.
In the next step, by attaching the IC tag 3 to each of the formed recesses 5, the label original 114 with an IC tag can be produced. The IC tag 3 may be attached by applying an adhesive or an adhesive to the inner surface of the IC tag 3 immediately before attachment, or the IC tag 3 to which a pressure-sensitive adhesive or the like is applied in advance (tack label mode) May be used.
After the fact, although not shown in particular, the label 1 with the IC tag is manufactured by laminating the outer surface layer 22 on the heat insulating layer 23 of the label original 114 with the IC tag, and cutting out into a predetermined shape including the IC tag 3. be able to. In addition, lamination | stacking of each layer can be laminated | stacked by well-known lamination methods, such as dry lamination. Further, in this manufacturing method, the label original 100 to which the release paper 6 is attached is used. For example, the label original 100 to which no adhesive or the like is applied is used, and the IC tag 3 is attached thereto. After housing, an adhesive such as an adhesive may be applied.

Since the label 1 with an IC tag having the above-described configuration has a recess 5 formed in the label body 2 and the IC tag 3 is accommodated in the recess 5 and is covered with the outer surface layer 22, the IC tag 3 Does not protrude from the surface of the label 1. Therefore, there is no possibility that the IC tag 3 is damaged even if the mounted body to which the label 1 is attached comes into contact with a foreign object. In particular, since the IC tag 3 is accommodated with the space 4 between the IC tag 3 and the outer surface layer 22, foreign matters come into spot contact with the corresponding portions of the recess 5 in the outer surface layer 22 of the label 1. However, it is possible to mitigate the impact applied to the IC tag 3.
Furthermore, in the label 1 with an IC tag in which the sticking part 25 is made of a heat-sensitive adhesive (adhesive), it can be used as a so-called heat-sensitive label. When the label 1 is attached to a mounted body such as a container, the back surface 2a side (adhering portion 25) is heated in order to activate the adhesive, and between the surface to be heated and the IC tag 3 is heated. Since the heat insulating layer 23 such as a foamed resin sheet is interposed, the propagation of heat to the IC tag 3 can be mitigated. Therefore, the IC tag 3 can be prevented from being damaged by heat.
Thus, since the label 1 with an IC tag of the present invention is such that the provided IC tag 3 is not easily damaged, the package on which the IC tag 3 is mounted can read and write information on the IC chip 32 with a reader device, The production, quality, distribution, etc. can be managed accurately.

Next, various modifications of the present embodiment are shown.
In each said embodiment, although the rectangular label 1 is illustrated, the planar shape is not specifically limited, According to a use and the objective, it can form in various shapes.
For example, FIG. 5A shows a case where the planar shape of the label body 2 is formed in a circular shape, FIG. 5B shows a case where a large area portion and a small area portion are integrally formed, (C) has illustrated what was formed in the magnitude | size which can be wound around the trunk | drum of a container. The label 1 shown in FIG. 2B is a label 1 with an IC tag having a POP effect in which a sticking portion 25 is provided in a small area portion of the label body 2 and the large area portion protrudes from a mounted body such as a container. Can be used. The label 1 shown in FIG. 3C can be used as the label 1 with the IC tag for winding, in which the sticking portions 25 are provided in a multistage shape in the width direction and are stuck while being wound around the body portion of the container.

Moreover, in each said embodiment, although the label main body 2 consists of laminated | multilayer film by which the heat insulation layer 23 in which the recessed part 5 was formed was laminated | stacked between the inner surface layer 21 and the outer surface layer 22, the layer structure of the label main body 2 Is not limited to this, and can be changed to various layer configurations.
For example, FIG. 6A shows a structure in which a second heat insulating layer 23 ′ is laminated on the heat insulating layer 23 in which the recessed portion 5 is formed so as to cover the recessed portion 5, and FIG. A flat heat insulating layer 23 is laminated with a second heat insulating layer 23 ", part of which is cut out, so as to form the recess 5. In FIG. 5B, the inner surface layer 21 is omitted. ) Heat insulation layer 23 also used as inner surface layer 21, (c) in the figure (in which inner surface layer 21 and outer surface layer 22 are omitted), heat insulation layer 23 also uses inner surface layer 21 and outer surface layer 22. The thing is illustrated.
The labels 1 shown in FIGS. 6A and 6C are excellent in heat shielding properties because the entire circumference of the dent portion 5 is covered with the heat insulating layer 23. Further, when the heat insulating layer 23 is made of a material having elasticity such as a foamed resin sheet, the IC tag 3 can be protected by reliably absorbing the externally applied impact by the heat insulating layer 23.

  Next, FIG. 7 illustrates various labels 1 that do not have the heat insulating layer 23 between the back surface 2 a side of the label main body 2 and the recessed portion 5. FIG. 4A shows a state in which the recessed portion 5 is formed inside the label body by cutting out a part of the heat insulating layer 23, and FIG. 4B shows an intermediate between the inner surface layer 21 and the outer surface layer 22. The recess 27 is formed in the layer 27, and each of the layers 21, 22, 27 is made of a non-insulating material (for example, a synthetic resin film). FIG. An example is shown in which a recess 5 is formed in the back surface 2a of the label body 2 by cutting out a part thereof. Further, although not particularly illustrated, the label body 2 may be formed with an opening formed in the surface 2b of the label body 2. In any of these aspects of the label 1, since the IC tag 3 is accommodated in the recessed portion 5, damage to the IC tag 3 due to contact with a foreign object can be prevented. However, since these examples do not have the heat insulating layer 23 between the back surface 2a of the label body 2 and the IC tag 3, the pasting part 25 can be non-heat-bonded such as a pressure-sensitive adhesive. Is preferably used.

Moreover, in each said embodiment, although the recessed part 5 is formed in planar substantially rectangular shape, if the recessed part 5 is formed so that the IC tag 5 can be accommodated, the shape will not be specifically limited, For example, As shown in FIG. 8, it may be formed in a long concave shape extending in a belt shape.
FIG. 8A shows a structure in which a long concave portion 5 is formed by laminating a second heat insulating layer 23 ′ at a predetermined interval on a flat heat insulating layer 23. FIG. FIG. 5C shows a structure in which a long concave portion 5 is formed by laminating a heat insulating layer 23 at a predetermined interval on the inner surface layer 21. FIG. The tape 35 provided with the tag 3 is illustrated. In addition, in FIG. 8, although using heat insulation layers 23, such as a foamed resin sheet, is illustrated, it replaces with the heat insulation layer 23 and uses the non-heat insulation sheet | seats, such as a synthetic resin film, and the said long concave shape recessed part 5 is used. It can also be formed.

The label 1 with an IC tag having such a long concave portion 5 is a non-laminated layer in which a part of the second layer is not laminated when the second layer is laminated on one surface of the first layer to produce a label original. It can be manufactured by forming the part in the delivery direction.
As shown in FIG. 9, for example, as the first layer 102, a laminated body 102 in which a heat insulating layer 23 is laminated on an inner surface layer 21 is used, and an adhesive 104 is applied to the surface of the laminated body 102 using a gravure roll 103 or the like. Then, after passing through the solvent recovery zone 105 (the laminated body 102 after application of the adhesive is shown in FIG. 5B), this is guided between the pressure rolls 106. On the other hand, for example, a foamed resin sheet 107 is used as the second layer 107 laminated on the laminated body 102. The sheet 107 is pulled out and cut by a cutter 108 in the feeding direction by a predetermined width. Note that the strip-shaped cut piece 109 cut by the cutter 108 is wound and collected by the collection roller 110.
By this cutting, the foamed resin sheet 107 is divided into a plurality of sheets 107 ′ having gaps 111 of a predetermined width, as shown in FIG. Next, a tape-like IC tag continuous body 112 in which the IC tags 3 are arranged in parallel at a predetermined interval is inserted into the gap 111 of the divided sheets 107 ′ as shown in FIG. After that, both are guided between the pressure-bonding rolls 106 and are superposed on the laminate 102. By passing the pressure-bonding roll 106 and integrally laminating and bonding them together, a label original 114 with an IC tag can be obtained.
After the fact, although not shown in particular, the label 1 with the IC tag can be manufactured by laminating the outer surface layer 22 and the like as necessary and cutting it into a predetermined shape.

Furthermore, instead of the manufacturing method in which a part of the second layer 107 is cut off to form a non-laminated portion immediately before the second layer 107 is stacked on the first layer 102 as described above, the manufacturing method is as follows. You can also.
For example, as shown in FIG. 10, after the first layer 102 and the second layer 107 are led to the pressure roll 106 and laminated, the second layer 107 is not completely bonded to the first layer 102. The second layer 107 is cut by a predetermined width by the cutter 115 capable of cutting only the layer 107 in the feeding direction, and the cut piece 109 is collected by the collection roller 110. Next, a tape-like IC tag continuous body 112 in which the IC tags 3 are arranged in parallel at a predetermined interval is inserted into the cut portion of the second layer 107 and is crimped by the crimping roll 116, whereby the IC tag A label original 114 can be obtained. However, the IC tag continuum 112 can be adhered by the adhesive 104 applied to the first layer 102. However, if sufficient adhesive strength cannot be obtained, the IC tag continuum 112 with an adhesive is used. .
In addition, although the manufacturing method shown in FIG.9 and FIG.10 has illustrated dry lamination as a lamination method, it is also possible to employ | adopt other lamination methods, such as a heat lamination and a wet lamination.

In addition, as a method for forming the recessed portion 5, in the above, a formation method by pressing and a method of laminating the second layer by providing a non-adhesive portion are exemplified, but as other methods, foamable ink is used. Thus, it is possible to form a heat insulating layer having the recess 5. Although not particularly illustrated, for example, foamed ink is applied to the inner surface layer (or outer surface layer) except for the region where the recess portion 5 is to be formed, and foamed. When the foamed ink swells, a dent 5 is formed in the non-coated portion of the foamed ink. In addition, when apply | coating a foaming ink, the recessed part 5 can be similarly formed even if it applies and foams thinly the area | region where the recessed part 5 is formed compared with another part.
As the foaming ink, a microcapsule encapsulating a low-boiling liquid expanding agent such as propane in a thermoplastic resin capsule such as vinylidene chloride-acrylonitrile copolymer, which is foamed by heating, is an aqueous emulsion. Examples thereof include foamed inks obtained by mixing them.

(Second Embodiment)
The second embodiment relates to a label with an IC tag formed into a cylindrical shape. Hereinafter, parts different from those of the first embodiment will be mainly described, description of similar structures may be omitted, and terms and figure numbers may be used.
11 and 12, the label 1 with an IC tag according to the present embodiment is formed into a cylindrical shape by overlapping both side ends of the label body 2 and performing center sealing.
A concave portion 5 is formed on the back surface 2a of the label main body 2, and the IC tag 3 is accommodated in the concave portion 5 as in the first embodiment.

The label main body 2 is composed of a heat-shrinkable film, for example, a heat-shrinkable synthetic resin film such as polyester, polystyrene, or polyolefin, or heat-shrinkable such as polystyrene, polyethylene, or polypropylene. These foamed resin sheets and the like, and laminates thereof can be used. In addition, a laminated body in which a material having strong heat shrinkability and a material having low heat shrinkability are laminated can be used.
In FIG. 12, the label main body 2 comprised by the heat insulation layer 23 which consists of a heat-shrinkable foamed resin sheet is illustrated. The expansion ratio is, for example, about 1.5 to 10 times, and a thickness of about 100 to 400 μm is used. In addition, as shown in the said 1st Embodiment, the recessed part 5 can be easily formed by pressing.

Such a cylindrical label 1 with an IC tag can be shrink-mounted by being inserted into a mounted body such as a body portion of a container, guided to a shrink tunnel, and heated.
In the cylindrical label 1 with an IC tag according to the present embodiment, a concave portion 5 is formed in the label main body 2 and the IC tag 3 is accommodated in the concave portion 5, so that the IC tag 3 protrudes from the back surface of the label 1. do not do. Therefore, when it is inserted into the mounted body, it does not interfere with the mounted body, and label mounting failure caused by the IC tag 3 can be prevented. Further, even if the attached label 1 comes into contact with a foreign substance, there is no possibility that the IC tag 3 is damaged, and a foamed resin sheet (heat insulating layer 23) is interposed between the surface of the label 1 and the IC tag 3. Therefore, it is possible to prevent the IC tag 3 from being damaged by heat applied when the shrink is mounted.

In addition, the layer structure of the label main body 2 of this embodiment is not restricted to the thing of FIG. 12, A various thing can be used. For example, as shown in FIG. 13A, a heat insulating layer 23 is laminated between the outer surface layer 22 and the inner surface layer 21, and a recess portion 5 is formed on the back surface side of the heat insulating layer 23. As shown in (b), the concave portion 5 is formed on the back surface of the heat insulating layer 23, and the inner surface layer 21 is laminated on the back surface of the heat insulating layer 23, and other various types shown in the first embodiment. These layers can be selected as appropriate (excluding the sticking part).
Moreover, the recessed part 5 may be formed in long concave shape like the said 1st Embodiment, and also about the various manufacturing methods shown to the said 1st Embodiment also about the label raw material with an IC tag to be used. Can be appropriately manufactured.

  Moreover, in this embodiment, although the heat-shrinkable cylindrical label is illustrated as the cylindrical label 1 with an IC tag, even if it winds around outer periphery, such as a container, it joins both ends and makes it cylindrical. Well, by appropriately changing the film constituting the label main body 2, a self-stretchable (stretch) tubular label or a shrink stretch tubular label having both heat-shrinkability and self-stretchability is used. You can also.

The cylindrical label with an IC tag which concerns on 1st Embodiment is shown, (a) is the top view seen from the surface side, (b) is the top view seen from the back surface side. In (b), the part provided with the sticking part is shown by shading for convenience. FIG. 2 is a longitudinal sectional view taken along line AA in FIG. 1. However, for the sake of convenience, the heat-insulating layer is indicated by light ink painting. Hereinafter, in each cross-sectional view, the heat insulating layer is indicated by light ink painting. (A) is a top view which shows one Embodiment of an IC tag, (B) is a BB line end elevation. The reference drawing which shows the manufacturing method of the label original fabric with an IC tag. A partially omitted perspective view including an enlarged cross section of a part of the label original fabric in each process is inserted. (A)-(c) The top view seen from the back side which shows the modification of a label with an IC tag. For convenience, the portion where the sticking portion is provided is shown by shading. (A)-(c) is a partially abbreviate | omitted longitudinal cross-sectional view which shows the modification of a label with an IC tag. (A)-(c) is a partially abbreviate | omitted longitudinal cross-sectional view which shows the modification of a label with an IC tag. (A)-(c) is a partially abbreviated perspective view including the cross section which shows the modification of the label main body in which the long concave part was formed. (A) is a reference diagram showing a modified example of the manufacturing method of the label original with IC tag, (b) is an enlarged view of the circled portion of (a), and (c) is viewed from the direction of arrow B. The top view seen from the arrow C direction. The reference drawing which shows the modification of the manufacturing method of the label original fabric with an IC tag. The perspective view which shows the cylindrical label with an IC tag which concerns on 2nd Embodiment. The CC sectional view taken on the line of FIG. (A)-(b) is a partially abbreviate | omitted longitudinal cross-sectional view which shows the modification of the cylindrical label with an IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Label with IC tag, 2 ... Label main body, 2a ... Label back surface, 2b ... Label surface, 21 ... Inner surface layer, 22 ... Outer surface layer, 23, 23 ', 23 "... Heat insulation layer, 25 ... Adhering part DESCRIPTION OF SYMBOLS 3 ... IC tag, 31 ... Antenna part, 32 ... IC chip, 33 ... Module part, 34 ... Base material, 35 ... Tape with IC tag, 5 ... Recessed part, 6 ... Release paper, 100 ... Original label, 101 DESCRIPTION OF SYMBOLS ... Embossing roll, 102 ... Laminated body (first layer), 107 ... Foamed resin sheet (second layer), 109 ... Cut-off piece, 112 ... IC tag continuous body, 114 ... Original label with IC tag

Claims (5)

  A label with an IC tag, wherein a concave portion is formed in the label main body, and an IC tag is accommodated in the concave portion.   The label with an IC tag according to claim 1, wherein the label main body includes a foamed resin sheet, and the recessed portion is formed in a part of the foamed resin sheet.   The label with an IC tag according to claim 1 or 2, wherein the label can be mounted on a mounted body by applying heat from one side, and a heat insulating layer is interposed between the heated surface and the recess.   A method for producing a label original with an IC tag, wherein a concave part is formed by pressing a label raw material having plasticity, and an IC tag is affixed and accommodated in the concave part. A method for producing a label original with an IC tag that forms a recess that can accommodate an IC tag on a label original made of a laminate of two or more layers in which a second layer is laminated on one surface of a first layer,
When producing a label original fabric by laminating the second layer on one surface of the first layer, the first layer is formed by forming a non-laminated portion in which a part of the second layer is not laminated in the feeding direction. A tape-shaped IC tag continuous body in which IC tags are arranged in parallel at a predetermined interval along the long-concave recess is pasted and accommodated. A method for producing a label original with an IC tag.

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