KR20090093606A - Radio frequency identification tag and card having the same - Google Patents

Abstract

A radio frequency identification tag and a card having the same are provided to prevent the damage of a connection part between an IC and an antenna or the damage of the IC caused by the load applied to the IC on an RFID inlayer. An RFID(Radio Frequency IDentification) inlayer(3) is prepared in an upper side of a base layer(4), and includes an integrated circuit chip electrically connected to an antenna. A cover layer(2) is laminated on the upper side of the RFID inlayer, and is made of a polyvinyl chloride, amorphous polyester, a polyolefin and a soft material. A coating layer(1) is laminated on the upper part of the cover layer.

Description

RADIO FREQUENCY IDENTIFICATION TAG AND CARD HAVING THE SAME}

The present invention relates to a radio frequency identification tag and a card including the same, and more particularly, due to a load applied to an IC chip of an RFID inlay layer, an integrated circuit chip is broken or integrated. The present invention relates to a radio frequency identification tag and a card including the same.

Technologies using radio frequency (RF) are widely used in all industries including mobile communication technology, logistics distribution, safety diagnosis and security / search.

In particular, the use of radio frequency technology is expanding in areas such as vehicle collision prevention systems, smart tags, and radio frequency identification (RFID) devices. In addition, the radio recognition device is a radio frequency identification (RFID) tag (tag) form that can be largely recognized individually; A reader that transmits and receives a tag; And an integrated circuit chip (IC Chip) capable of storing information in a tag, and using the device, it is possible to track the location of individual tagged readers and the flow of individual information.

Common RFID tag types include an active tag that amplifies a signal transmitted / received by a built-in battery to drive both an integrated integrated circuit chip having a large signal sensitivity and a transmission / reception distance; A passive tag for driving a transmitting / receiving function and an integrated circuit chip with power generated in an antenna through an electromagnetic field around a reader without a built-in battery; The built-in battery is used only for driving the integrated circuit chip, and the transmit / receive function is a semi-active tag that is driven by the power generated by the antenna.

Passive tags include: a flexible thin film insulating polymer film of constant thickness; An antenna patterned to transmit and receive a constant frequency thereon; And an integrated circuit chip driven by power generated through the antenna.

The thin film polymer film may be formed of a polymer material or paper of mainly polyethylene terephthalate (PET), polyvinyl chloride (PVC), and polyethylene (PE) having electrical insulation. The antenna pattern may be copper, aluminum, gold, silver, carbon nano Carbon nanotubes and their conductive composites may be formed by sputtering on a thin polymer film, or by printing in the form of a paste and printing, or inkjetting by manufacturing with a conductive ink. ink jetting).

After the antenna pattern is manufactured, the integrated circuit chip is connected to both ends of the antenna pattern by flip-chip bonding with both ends of the integrated circuit chip. In the case of such a linked tag, the tag only works passively for commands given by the reader.

The active tag is amplified by the built-in battery and transmitted to the integrated circuit chip by the built-in battery, and the built-in battery includes a circuit controller and ID memory. In the integrated circuit chip, sufficient power for signal processing is supplied, and the signal processed in the integrated circuit chip is modulated to a set radio frequency (RF) amplified by an internal battery and transmitted to a reader.

Therefore, the transmission / reception distance between the reader and the radio frequency identification (RFID) tag is relatively longer than the passive tag and the transmission and reception sensitivity is considerably higher than that of the passive tag.

The semi-active tag has the function of maximizing the life of the built-in battery by optimizing the transmission and reception signal processing between the antenna and the reader through the power management module embedded in the integrated circuit chip. .

As such, various kinds of radio frequency identification (RFID) tags are being researched and developed, and their fields of application are becoming increasingly diverse.

The general configuration of such a radio frequency identification (RFID) tag is shown in FIG. As shown in FIG. 7, the conventional radio frequency identification tag includes a base layer 104 formed of hard polyvinyl chloride (PVC); An RFID inlay layer 103 provided on an upper surface of the base layer 104 and including an antenna and an integrated circuit chip (IC Chip) electrically connected to the antenna; The packaging layer 101 formed of hard polyvinyl chloride (PVC) stacked on the RFID ID inlay layer 103 is included. Overlay layers 110 and 120 are stacked on the lower surface of the base layer 104 and the upper surface of the packaging layer 101, respectively.

However, in the manufacturing process of such a conventional radio frequency identification tag, after inserting the RFID inlay layer 103, and then laminated the packaging layer 101 formed of rigid PVC on the high temperature and high pressure conditions Pressing from the top to the bottom (pressing) to proceed with the press (press) process, at this time, since the packaging layer 101 is formed of a rigid PVC, the RFID is located below the rigid packaging layer 101 Since the inlay layer 103 is pressed by the packaging layer 101, there is a problem that an IC chip is broken or a connection part, that is, a bonding part, of an IC chip and an antenna is broken, thereby making it difficult to secure a manufacturing yield. .

In addition, since the base layer 104 and the packaging layer 101 are formed of hard PVC having low heat resistance, when the article with the conventional radio frequency identification tag is exposed to a high temperature environment, the radio frequency identification tag is There is a problem of bending or twisting.

Accordingly, an object of the present invention is to recognize radio frequency recognition that can prevent damage due to a load applied to an IC chip of an RFID inlay layer or damage to a connection portion between an integrated circuit chip and an antenna. It is to provide a tag and a card including the same.

In addition, even when the article with the radio frequency identification tag is exposed to a high temperature environment, thereby providing a radio frequency identification tag and a card including the same, which can prevent the radio frequency identification tag from being warped or twisted.

The present invention, the base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; It is laminated on the RFID inlay layer and formed of at least one soft material selected from soft polyvinyl chloride (PVC), amorphous polyester, polyolefin, and paper. Cover layer; And it provides a radio frequency identification tag comprising a packaging layer stacked on top of the cover layer.

The present invention, the base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; And a packing layer stacked on the RF ID inlay layer and having a through hole formed through the plate surface or a recess formed in the plate surface so as to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip. A radio frequency identification tag is provided.

Provided is a card comprising a radio frequency identification tag according to the present invention.

According to the present invention, the load applied to the IC chip of the RFID inlay layer prevents the integrated circuit chip from being broken or the connection portion of the integrated circuit chip and the antenna from being broken, thereby increasing the manufacturing yield and Device reliability can be improved.

In addition, as the heat resistance of the radio frequency identification tag according to the present invention is excellent, dimensional stability can be ensured, and even if the article with the radio frequency identification tag is exposed to a high temperature environment, this causes the radio frequency identification tag to be curved. Can be prevented or twisted.

1 is a diagram illustrating a radio frequency identification tag according to a first embodiment of the present invention;

2a to 2c are views showing various forms of the antenna of the RF ID inlay layer according to the present invention,

3 is a diagram illustrating a radio frequency identification tag according to a second embodiment of the present invention;

4 is a diagram illustrating a radio frequency identification tag according to a third embodiment of the present invention;

5 is a diagram illustrating an application example of a radio frequency identification tag according to FIG. 4;

6 is a view showing a radio frequency identification tag according to a fourth embodiment of the present invention;

7 is a diagram illustrating a conventional radio frequency identification tag.

Radio Frequency Identification (Radio Frequency Identification) tag according to an embodiment of the present invention, the base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; It is laminated on the RFID inlay layer and formed of at least one soft material selected from soft polyvinyl chloride (PVC), amorphous polyester, polyolefin, and paper. Cover layer; And a packaging layer laminated on the cover layer.

Here, the cover layer may be preferably formed of soft PVC, and the amorphous polyester (amorphous polyester) capable of forming the cover layer is glycol modified copolymerized polyethylene terephthalate (PET-G) and amorphous polyethylene terephthalate Amorphous Polyethylene Terephthalate (A-PET) may be exemplified. Examples of the polyolefin may include polyethylene (PE) and polypropylene (PP), but are not limited thereto.

The cover layer may have a thickness of about 0.1 mm to about 0.4 mm.

At least one of the base layer and the packaging layer may include polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polystyrene (PS), nylon (Nylon), and polycarbonate ( polycarbonate, PC) may be a layer formed of one or more hard resins. However, the present invention is not particularly limited thereto, and any material used to form the base layer and the packaging layer in the art may be used.

When the base layer and / or the packaging layer are formed of the hard resin having excellent heat resistance, dimensional stability can be ensured, even when the article with the radio frequency identification tag according to the present invention is exposed to a high temperature environment. For example, even when they are attached to a place such as a vehicle or an industrial site and they are exposed to a high temperature environment, the radio frequency identification tag can be prevented from being warped or warped due to the high temperature environment.

The radio frequency identification tag according to the present invention may further include an overlay layer stacked on at least one of a lower surface of the base layer and an upper surface of the packaging layer. Here, a bar code for identification may be formed on the overlay layer according to the use of a printing pattern or a tag for decoration.

The overlay layer may be formed using a transparent polyvinyl chloride (PVC) or UV paint for surface protection. It is not easy to form a printing pattern or bar code for decoration on the surface of the heat-resistant resin layer when the card is manufactured, but when the overlay layer is formed of polyvinyl chloride, the printed pattern or bar code can be easily printed.

Here, the oligomer (oligomer) applied to the UV paint (Unsaturated polyester), urethane acrylate (Urethane acrylate), epoxy acrylate (Epoxy acrylate), polyester acrylate (Polyester acrylate ), full acrylic oligomer ( Full acrylic oligomer), and amino acrylate (Amino acrylate), for example, but this is not limited to the type of UV paint.

The radio frequency identification tag according to the present invention further includes an adhesive layer formed on an outer surface of the overlay layer laminated on a lower surface of the base layer and / or an outer surface of the overlay layer laminated on an upper surface of the packaging layer. can do. Using the adhesive layer, the radio frequency identification tag according to the present invention may be attached to a desired position.

The adhesive layer is a polyvinyl chloride (PVC) adhesive, an acrylic adhesive (Acrylic adhesive), a polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (SBR), and hot melt It may be formed of one or more selected from (Hotmelt).

The adhesive layer may be directly formed on at least one of a lower surface of the base layer and an upper surface of the packaging layer without the overlay layer.

On the other hand, the above-described configuration, that is, each layer of the radio frequency identification tag according to the present invention, polyvinyl chloride (PVC) adhesive, acrylic adhesive (Acrylic adhesive), polyurethane adhesive (Polyurethane adhesive), natural rubber ( NR), styrene-butadiene rubber (SBR), and hot melt may be bonded using an adhesive layer formed of at least one selected from hotmelt.

As described above, in the case of a radio frequency identification tag according to one embodiment of the present invention, the cover layer is one selected from amorphous polyester, polyolefin, and paper. As formed of the above soft material, an integrated circuit of the RFID ID inlay layer located below the cover layer during a press process of pressing the cover layer from the top to the bottom by bonding the cover layer under high temperature and high pressure conditions. When the chip is pressed against the cover layer, i.e., the load applied to the integrated circuit chip of the RFID inlay layer, the IC chip is broken or the connection part of the integrated circuit chip and the antenna, that is, the bonding part is broken. It can be prevented. This can improve the manufacturing yield and device reliability.

In addition, in order to further improve the above-described effect, the cover surface formed of the soft polyvinyl chloride (PVC), in order to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip additionally, the plate surface It is possible to form a recessed recess formed from the through-hole or plate surface formed through.

Radio Frequency Identification tag according to another embodiment of the present invention, the base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; And a packing layer stacked on the RF ID inlay layer and having a through hole formed through the plate surface or a recess formed in the plate surface so as to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip. do.

At least one of the base layer and the packaging layer may include polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polystyrene (PS), nylon (Nylon), and polycarbonate ( polycarbonate, PC) may be a layer formed of one or more hard resins. However, the present invention is not particularly limited thereto, and any material used to form the base layer and the packaging layer in the art may be used.

When the base layer and / or the packaging layer are formed of the hard resin having excellent heat resistance, dimensional stability can be ensured, even when the article with the radio frequency identification tag according to the present invention is exposed to a high temperature environment. For example, even when they are attached to a place such as a vehicle or an industrial site and they are exposed to a high temperature environment, the radio frequency identification tag can be prevented from being warped or warped due to the high temperature environment.

The radio frequency identification tag according to the present invention may further include an overlay layer stacked on at least one of a lower surface of the base layer and an upper surface of the packaging layer. Here, a bar code for identification may be formed on the overlay layer according to the use of a printing pattern or a tag for decoration.

The overlay layer may be formed using a transparent polyvinyl chloride (PVC) or UV paint for surface protection. It is not easy to form a printing pattern or bar code for decoration on the surface of the heat-resistant resin layer when the card is manufactured, but when the overlay layer is formed of polyvinyl chloride, the printed pattern or bar code can be easily printed.

Here, the oligomer (oligomer) applied to the UV paint (Unsaturated polyester), urethane acrylate (Urethane acrylate), epoxy acrylate (Epoxy acrylate), polyester acrylate (Polyester acrylate ), full acrylic oligomer ( Full acrylic oligomer), and amino acrylate (Amino acrylate), for example, but this is not limited to the type of UV paint.

The radio frequency identification tag according to the present invention further includes an adhesive layer formed on an outer surface of the overlay layer laminated on a lower surface of the base layer and / or an outer surface of the overlay layer laminated on an upper surface of the packaging layer. can do. Using the adhesive layer, the radio frequency identification tag according to the present invention may be attached to a desired position.

The adhesive layer is a polyvinyl chloride (PVC) adhesive, an acrylic adhesive (Acrylic adhesive), a polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (styrene-butadiene rubber (SBR) and hot melt ( Hotmelt) may be formed of one or more selected.

The adhesive layer may be directly formed on at least one of a lower surface of the base layer and an upper surface of the packaging layer without the overlay layer.

As described above, in the case of a radio frequency identification tag according to another embodiment of the present invention, the packaging layer penetrates a plate surface to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip. Since the recessed grooves are formed from the formed through-holes or plate surface, the pressing layer is pressed under the packaging layer by pressing the packaging layer from top to bottom under high temperature and high pressure conditions. When the integrated circuit chip of the RFID inlay layer located is pressed against the packaging layer, that is, the load applied to the integrated circuit chip of the RFID inlay layer, the IC chip is damaged or the connection of the integrated circuit chip and the antenna is connected. It is possible to prevent the portion, that is, the bonding portion, from being broken. This can improve the manufacturing yield and device reliability.

In addition, a cover layer is further provided between the RFID inlay layer and the packaging layer in order to further improve the above-described effect, and additional through holes or additional depressions are provided at positions corresponding to the through holes or the recessed grooves in the cover layer. Grooves can be formed.

The radio frequency identification tag according to the present invention may be an active tag with a battery (not shown) or a passive tag without a battery.

Meanwhile, the card including the radio frequency identification tag according to the present invention may be a contactless RFID card. Here, the recognition distance of the contactless RFID card may be 5 cm to 100 m.

In the case of a contactless RFID card including a radio frequency identification tag according to the present invention, an existing credit card, a bonus card, and a smart card function are added to the RFID function to further improve the convenience of use. Can be.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

As shown in Fig. 1, the radio frequency identification tag according to the first embodiment of the present invention comprises: a base layer 4; An RFID inlay layer 3 provided on an upper surface of the base layer 4 and including an antenna and an integrated circuit chip (IC Chip) electrically connected to the antenna; A cover layer 2 laminated on the RF ID inlay layer 3 and formed of soft polyvinyl chloride (PVC); And a packaging layer 1 stacked on top of the cover layer 2.

Here, the antenna form of the RFID inlay layer may be a dipole antenna, a folded dipole antenna, and a multi-loop antenna as illustrated in FIGS. 2A to 2C. loop antenna).

As shown in FIG. 3, the radio frequency identification tag according to the second embodiment of the present invention has a through hole 2a formed through a plate surface to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip. Alternatively, except that the recessed grooves formed from the plate surface are formed in the cover layer 2 covering the RF ID inlay layer 3, the configuration is the same as the radio frequency identification tag according to the first embodiment of FIG. 1.

As shown in FIG. 4, the radio frequency identification tag according to the third embodiment of the present invention includes an overlay layer 10 and a top surface of the packaging layer 1 and a bottom surface of the base layer 4, respectively. The configuration is the same as that of the radio frequency identification tag according to the first embodiment of FIG. 1 except that 20) is stacked.

Here, an adhesive layer is formed on the outer surface of each of the overlay layers 10 and 20.

As an application form of the radio frequency identification tag according to the third embodiment of the present invention, a radio frequency identification tag of a magnetic strip type and a contact chip type radio frequency identification tag of FIG. 5 may be used. For example. In this case, the magnetic strip type and the contact chip type may be used for a hardware (H / W) system configuration.

As shown in Fig. 6, the radio frequency identification tag according to the fourth embodiment includes: a base layer 4; An RFID inlay layer 3 provided on an upper surface of the base layer 4 and including an antenna and an integrated circuit chip (IC Chip) electrically connected to the antenna; And a package having a through hole 1a through which the plate surface is formed so as to be stacked on the RF ID inlay layer 3 and receiving the integrated circuit chip at a position corresponding to the integrated circuit chip, or a recess formed in the plate surface. Layer (1).

Here, overlay layers 10 and 20 are laminated on the top surface of the packaging layer 1 and the bottom surface of the base layer 4, respectively, and an adhesive layer is formed on the outer surface of each of the overlay layers 10 and 20. Formed.

As described above, in the present invention, a cover layer is formed of a soft polyvinyl chloride having a modulus lower than that of the heat resistant resin so as to disperse the pressure without using a heat resistant resin having a high modulus, or to the packaging layer. When the radio frequency identification tag according to the present invention, in which an IC chip is bonded by forming a through hole or a recessed groove, is manufactured in a card form, the thickness of an integrated circuit chip and an RFID ID inlay Due to the load applied to the IC chip of the layer and the brittle nature of the heat-resistant resin, it is possible to prevent the bonding portion, which is the connection portion between the integrated circuit chip or the integrated circuit chip and the antenna, from being damaged. Manufacturing cost, manufacturing yield, and device reliability can be improved. In addition, in the related art, a process of encapsulating the integrated circuit chip or the bonding portion with a high strength resin may be omitted in order to reduce the thickness of the card, thereby simplifying the manufacturing process.

In addition, when the base layer and / or the packaging layer is formed of a hard resin having excellent heat resistance, excellent heat resistance can be imparted and dimensional stability can be ensured, so that the article with the radio frequency identification tag according to the present invention is attached. Even when exposed to this high temperature environment, for example, when it is attached to a vehicle or an industrial site and they are exposed to a high temperature environment, the radio frequency identification tag can be prevented from being warped or warped due to the high temperature environment.

Claims (21)

Base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; It is laminated on the RFID inlay layer and formed of at least one soft material selected from soft polyvinyl chloride (PVC), amorphous polyester, polyolefin, and paper. Cover layer; And And a packaging layer stacked on top of the cover layer. The radio frequency identification tag according to claim 1, wherein the cover layer has a thickness of 0.1 to 0.4 mm. The method of claim 1, wherein at least one of the base layer and the packaging layer, polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polystyrene (polystyrene, PS), nylon (Nylon) And a layer formed of at least one hard resin selected from polycarbonate (PC). The RFID tag of claim 1, further comprising an overlay layer stacked on at least one of a lower surface of the base layer and an upper surface of the packaging layer. The RFID tag of claim 4, wherein the overlay layer is formed using transparent polyvinyl chloride (PVC) or UV paint for surface protection. The RFID tag of claim 4, further comprising an adhesive layer formed on an outer surface of the overlay layer. The method of claim 6, wherein the adhesive layer is polyvinyl chloride (PVC) adhesive, acrylic adhesive (Acrylic adhesive), polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (styrene-butadiene rubber, SBR) ), And at least one selected from hot melt (Hotmelt). The RFID tag of claim 1, further comprising an adhesive layer formed on at least one of a lower surface of the base layer and an upper surface of the packaging layer. The method of claim 8, wherein the adhesive layer is polyvinyl chloride (PVC) adhesive, acrylic adhesive (Acrylic adhesive), polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (styrene-butadiene rubber, SBR) ), And those formed of at least one selected from hot melts A radio frequency identification tag characterized by. The method according to any one of claims 1 to 9, wherein the cover layer has a through hole formed through the plate surface or recessed groove formed from the plate surface so as to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip. A radio frequency identification tag, characterized in that formed. A card comprising a radio frequency identification tag according to any one of claims 1 to 9. Base layer; An RFID inlay layer provided on an upper surface of the base layer and including an antenna and an IC chip electrically connected to the antenna; And A packing layer stacked on the RF ID inlay layer and having a through hole through which a plate surface is formed so as to accommodate the integrated circuit chip at a position corresponding to the integrated circuit chip or a recess formed in the plate surface. Radio frequency identification tag, characterized in that. The method of claim 12, wherein at least one of the base layer and the packaging layer, polyethylene terephthalate (polyethyleneterephthalate (PET), acrylonitrile butadiene styrene (ABS), polystyrene (polystyrene, PS), nylon (Nylon) And a layer formed of at least one hard resin selected from polycarbonate (PC). The RFID tag of claim 12, further comprising an overlay layer stacked on at least one of a lower surface of the base layer and an upper surface of the packaging layer. The tag of claim 14, wherein the overlay layer is formed using transparent polyvinyl chloride (PVC) or UV paint for surface protection. The tag of claim 14, further comprising an adhesive layer formed on an outer surface of the overlay layer. The method of claim 16, wherein the adhesive layer is polyvinyl chloride (PVC) adhesive, acrylic adhesive (Acrylic adhesive), polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (styrene-butadiene rubber, SBR) ), And those formed of at least one selected from hot melts A radio frequency identification tag characterized by. The RFID tag of claim 12, further comprising an adhesive layer formed on at least one of a lower surface of the base layer and an upper surface of the packaging layer. The method of claim 18, wherein the adhesive layer is polyvinyl chloride (PVC) adhesive, acrylic adhesive (Acrylic adhesive), polyurethane adhesive (Polyurethane adhesive), natural rubber (NR), styrene-butadiene rubber (styrene-butadiene rubber, SBR) ), And at least one selected from hot melt (Hotmelt). The method according to any one of claims 12 to 19, further comprising a cover layer interposed between the RFID inlay layer and the packaging layer, The cover layer has a radio frequency identification tag, characterized in that an additional through hole or an additional recessed groove is formed in a position corresponding to the through hole or the recessed groove. 20. A card comprising a radio frequency identification tag according to any of claims 12-19.