KR20090084499A - Method for manufacturing radio frequency identification tag and radio frequency identification tag manufactured by the method - Google Patents

Abstract

A method for manufacturing radio frequency identification tag and radio frequency identification tag manufactured by the method is provided to improve the productivity by converting a batch process of thermo-compression method by thermode into in line process. An antenna is formed on a base layer. A bonding layer is formed within a chip mount space formed on the base material layer. An integrated circuit chip including a circuit pattern is adhered to the bonding layer formed within the chip mount space. In the antenna, the conductive paste is coated to the integrated circuit chip. In that way the conductive connector is formed.

Description

Method of manufacturing a radio frequency identification tag and a radio frequency identification tag manufactured by the present invention TECHNICAL FIELD

The present invention relates to a method for manufacturing a radio frequency identification tag and a radio frequency identification tag manufactured by the same, more specifically, after bonding an integrated circuit chip, The conductive bridge between the antenna and the integrated circuit chip can be implemented by printing, the pressure variable can be removed during the curing process, and the manufacturing method of the radio frequency identification tag suitable for high speed and mass production in a continuous process and the manufacturing To a radio frequency identification tag.

Technologies using radio frequency (RF) have been widely used in all industries including mobile communication technology, logistics distribution, safety diagnosis, and security / search.

In particular, the use of radio frequency technology is expanding in areas such as vehicle collision prevention systems, smart cards, and radio frequency identification (RFID) devices.

In addition, the radio frequency technology is largely in the form of a radio frequency identification tag (RFID tag) capable of individual recognition of the radio recognition device; A tag reader for transmitting and receiving to and from a radio frequency identification tag; And an integrated circuit chip (IC Chip) capable of storing information in a radio frequency identification tag, and can track the location of individual recognition partners with radio frequency identification tags and the flow of individual information.

Common types of radio frequency identification tags include: an active tag that amplifies a transmission / reception signal of a radio frequency identification tag by a built-in battery, and has a high signal sensitivity and transmission / reception distance, and drives both integrated circuit chips; A passive tag for transmitting / receiving and driving an integrated circuit chip with power generated by an antenna through an electromagnetic field around a tag reader without an embedded battery; The built-in battery is used only for driving the integrated circuit chip, and the transmit / receive function is a semi-active tag that is driven by the power generated by the antenna.

In the case of the active tag, the signal received by the antenna is amplified by the built-in battery and transmitted to the integrated circuit chip, and in the integrated circuit chip including a circuit controller, ID memory, and the like. Sufficient power for signal processing is supplied by the built-in battery, and the signal processed in the integrated circuit chip is modulated to a set radio frequency (RF) amplified by the built-in battery and transmitted to the tag reader.

Accordingly, in the case of an active tag, the transmission / reception distance between the tag reader and the tag is relatively longer than that of the passive tag, and the transmission and reception sensitivity is considerably higher than that of the passive tag.

In the case of semi-active tags, the power management module embedded in the integrated circuit chip optimizes signal processing between the antenna and the tag reader to maximize the life of the built-in battery. Have

In the case of passive tags, it only works passively for instructions given by the tag reader.

As an example of the conventional radio frequency identification tag, the conventional radio frequency identification tag shown in FIG. 10 includes: a base layer 100; An antenna 200 patterned to transmit and receive a predetermined frequency thereon; An integrated circuit chip 400 driven by power generated through the antenna 200 and including a circuit pattern 400-1; And an adhesive 300 for bonding the antenna 200 to the integrated circuit chip 400.

Here, after the antenna 200 is formed, both ends of the antenna 200 are flip-chip bonded with the circuit pattern 400-1 of the integrated circuit chip 400 to thereby form an integrated circuit chip 400. ) And the antenna 200 are connected.

However, in the method of connecting the integrated circuit chip and the antenna, conventionally, an anisotropic conductive paste 300 using a conductive ball or the like as a direct chip assembly method is applied to the antenna 200. Dispensing or printing, pick & place bumped dies with Flip chip assembly, and then apply Thermalmode or Hot Plate There was a method of thermal compression using.

However, the method of heating and compressing by using a thermal mode or a hot plate in the process of curing the adhesive is highly influenced by the pressure conditions and generates parasitic capacitance due to the adhesive. However, there is a problem that it is not suitable for high speed and mass production as a batch process.

To this end, various methods have been tried so far, and one of the most widely used methods is to produce an interposer or a strap through a chip assembly in a small pattern, and then There is a method of attaching the antenna at high speed and in large quantities using a conductive adhesive.

However, the number of processes increases compared to the conventional direct chip assembly, and even when the interposer or the strap and the antenna are bonded, they are still affected by the pressure conditions, and the interposer or the strap Due to the conductivity between the (strap) and the antenna, the adhesive strength, there is a problem that the yield in production may be lower than the conventional method.

An object of the present invention, after bonding the integrated circuit chip, can be realized by printing a conductive bridge between the antenna and the integrated circuit chip, can remove the pressure variable during the curing process, high-speed, large volume in a continuous process A method of manufacturing a radio frequency identification tag suitable for production and a radio frequency identification tag manufactured thereby are provided.

The present invention, a) forming an antenna on the base layer, the step of forming an antenna to form a chip installation space on the base layer; b) forming an adhesive layer in the chip installation space formed on the substrate layer; c) attaching the integrated circuit chip including the circuit pattern to the adhesive layer formed in the chip installation space, and attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above. ; And d) forming a conductive connection for electrically connecting the antenna and the circuit pattern of the integrated circuit chip, wherein the conductive connection is formed by applying a conductive paste from the antenna to the integrated circuit chip. A method of manufacturing a radio frequency identification tag is provided.

The present invention, a) forming an adhesive layer on the base layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to the circuit pattern of the integrated circuit chip, wherein the conductive paste is applied from the upper surface of the adhesive layer to the integrated circuit chip to directly connect to the circuit pattern of the integrated circuit chip. It provides a method of manufacturing a radio frequency identification tag comprising the step of forming a.

The present invention, a) forming an adhesive layer on a portion of the upper surface of the base layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to a circuit pattern of the integrated circuit chip, wherein the conductive paste is applied from the upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip. It provides a method of manufacturing a radio frequency identification tag comprising the step of forming an antenna directly connected to the circuit pattern of.

The present invention, the base layer; An antenna formed on the base layer to form a chip installation space on the base layer; An adhesive layer formed on the base layer to be located in the chip installation space; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer located in the chip installation space such that the circuit pattern is located above; And a conductive connection part formed to apply a conductive paste from the antenna to the integrated circuit chip to connect the antenna and the circuit pattern of the integrated circuit chip.

The present invention, the base layer; An adhesive layer formed on the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And an antenna formed to apply a conductive paste from the upper surface of the adhesive layer to the integrated circuit chip to have a form directly connected to the circuit pattern of the integrated circuit chip.

The present invention, the base layer; An adhesive layer formed on a portion of an upper surface of the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And an antenna formed to apply a conductive paste from the upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip to have a form directly connected to the circuit pattern of the integrated circuit chip. Provide a tag.

According to the present invention, it is possible to improve the productivity due to the conversion from the thermal compression process batch process by the thermal mode to the in-line process, compared to the flip chip process Since the bumping process, which is a post-wafer process, may be eliminated, manufacturing costs may be reduced.

In addition, by implementing a thin wafer through a back side grinding process of 60 μm or less, flexibility of a radio frequency identification tag may be improved.

In addition, the yield can be improved by excluding the junction element caused by the pressure between the integrated circuit chip and the antenna, which is a yield inhibiting factor.

Method for manufacturing a radio frequency identification tag according to an embodiment of the present invention, a) forming an antenna on a base layer, the step of forming an antenna to form a chip installation space on the base layer; b) forming an adhesive layer in the chip installation space formed on the substrate layer; c) attaching the integrated circuit chip including the circuit pattern to the adhesive layer formed in the chip installation space, and attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above. ; And d) forming a conductive connection for electrically connecting the antenna and the circuit pattern of the integrated circuit chip, wherein the conductive paste is formed by applying a conductive paste from the antenna to the integrated circuit chip.

The base layer of step a), polyethylene terephthalate (polyethyleneterephthalate, PET); Acrylonitrile butadiene styrene (ABS); Polystyrene (PS); Nylon; Polycarbonate (PC); Polyethylene (PE); Polypropylene (PP); And it may be a layer formed using one or more selected from paper (Paper). However, the present invention is not particularly limited thereto, and any material can be used as long as it is a material used to form the base layer in the art.

In the step a), the chip installation space is a space in which an upper surface of the base layer is formed together with both end portions of the antenna (see FIG. 2).

In the step a), the upper surface of the substrate layer may be a flat plate surface (see FIG. 2), or a recessed portion recessed from the upper surface of the substrate layer may be formed on the substrate layer (see FIG. 4). That is, before the step a), the method may further include a notching step of forming a recessed portion recessed from the upper surface of the base layer on the base layer. The depression formed in this step is located in the chip installation space.

The antenna of step a) is formed of copper, aluminum, gold, silver, carbon nanotubes, or conductive composites thereof by sputtering, or copper, aluminum, gold, Silver, carbon nanotubes, or conductive composites thereof may be formed on the substrate layer, and then the film may be formed by etching.

In addition, the antenna of step a), copper, aluminum, gold, silver, carbon nanotube (carbon nanotube), or a conductive composite (composite) thereof in the form of a paste (paste), and printed on the substrate layer Or copper, aluminum, gold, silver, carbon nanotubes, or conductive composites thereof, made of conductive ink, and formed on the substrate layer by using ink jetting. It can also be formed in.

The antenna of step a) may be any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna (see FIGS. 9A to 9C). ).

The adhesive for forming the adhesive layer in step b), Acrylic adhesive (Acrylic) adhesive; Epoxy adhesives; Polyurethane adhesives; Natural rubber adhesives; Styrene butadiene rubber adhesives; And one or more selected from the hotmelt (Hotmelt).

In step b), the adhesive layer may be formed by a method selected from a dispensing method, a printing method, and a jetting method.

When the upper surface of the substrate layer is a flat plate surface in step b), an adhesive layer is formed on the upper surface of the substrate layer that is flat in the chip installation space, and a depression is formed on the upper surface of the substrate layer in the chip installation space. In the case of step b), the adhesive layer may be formed in the depression located in the chip installation space.

In the step c), by using a die bonding method, the integrated circuit chip may be attached to the adhesive layer so that the circuit pattern of the integrated circuit chip is located above. Here, in the case of applying a thin wafer (thin wafer), by using a conventional 150㎛ integrated circuit chip in the case of the label-type tag due to the height of the integrated circuit chip, the integrated circuit chip is blown on the label surface It is possible to solve the problem that the integrated circuit chip or bonding part is easily damaged by frequent friction and shear force when attached to the.

The conductive paste used in step d) may include metal particles and a polymer binder.

The metal particles may be particles of at least one metal selected from gold (Au), nickel (Ni), platinum (Pt), copper (Cu), aluminum (Al), and silver (Ag).

The polymer binder may include polyurethane, epoxy, epoxy hybrid resin, epoxy acrylate, methacrylate, cyanoacrylate, silicone Silicon), and one or more selected from acrylate (Acrylate).

In step d), a gravure printing method, a flat screen printing method, a cylindrical screen printing method, a roll to roll flatbed screen printing method, and a rotary screen ) Printing, Offset Printing, Flexography and Ink Jet Printing The conductive connection can be formed by the selected method.

For example, when the antenna of step a) is a loop antenna provided so that the chip installation space is formed between one end portion and the other end portion on the base layer (see FIGS. 9B and 9C), the step d) may include the Applying the conductive paste to be connected to one side of the circuit pattern at one end of the loop antenna to form a first conductive connection part extending from one end of the loop antenna to one side of the circuit pattern; And applying the conductive paste to be connected from the other end of the loop antenna to the other side of the circuit pattern, thereby forming a second conductive connection part extending from the other end of the loop antenna to the other side of the circuit pattern. . Here, the printing process for forming the first conductive connecting portion and the printing process for forming the second conductive connecting portion may be performed in a divided manner, and the first conductive connecting portion and the second conductive connecting portion may be simultaneously formed in one printing process. It may be.

As another example, the antenna of step a), the first antenna portion of the flat plate shape; And a flat plate-shaped second antenna unit disposed with the first antenna unit and the chip mounting space therebetween (see FIG. 9A), in step d), the circuit pattern is formed at one end of the first antenna unit. Applying the conductive paste so as to be connected to one side of the first to form a first conductive connection part extending from one end of the first antenna part to one side of the circuit pattern; And applying the conductive paste so as to be connected to the other side of the circuit pattern at one end of the second antenna unit, thereby forming a second conductive connection part extending from one end of the second antenna unit to the other side of the circuit pattern. Can be. Here, the printing process for forming the first conductive connecting portion and the printing process for forming the second conductive connecting portion may be performed in a divided manner, and the first conductive connecting portion and the second conductive connecting portion may be simultaneously formed in one printing process. It may be.

Here, the method of manufacturing a radio frequency identification tag according to the present invention comprises the steps of: curing the antenna after step a); Curing the adhesive layer after step c); And after step d), at least one of curing the conductive connection part.

As such, according to the manufacturing method of the present invention, productivity can be greatly improved through a printing process for coating the conductive paste, and is applicable to all antennas having a thickness of less than 30 μm, and a heat source for curing the conductive paste. It can be used to improve the yield by eliminating the pressure variable in that it is used only, it is possible to high-speed, mass production as a continuous process.

On the other hand, a method of manufacturing a radio frequency identification tag according to another embodiment of the present invention, a) forming an adhesive layer on the base layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to the circuit pattern of the integrated circuit chip, wherein the conductive paste is applied from the upper surface of the adhesive layer to the integrated circuit chip to directly connect to the circuit pattern of the integrated circuit chip. Forming a step. Here, the method and material for forming each component are all applicable to the contents of the above-described embodiment, so a detailed description thereof will be omitted.

In the step a), the upper surface of the adhesive layer may be a flat plate surface (see FIG. 6), or a recessed portion recessed from the upper surface of the adhesive layer may be formed on the adhesive layer (see FIG. 7). That is, before the step b), the method may further include forming a recessed portion recessed from the upper surface of the adhesive layer on the adhesive layer.

In the step b), when the upper surface of the adhesive layer is a flat plate surface, the integrated circuit chip is attached on the flat upper surface of the adhesive layer, and in the step b) when the recess is formed on the upper surface of the adhesive layer. The integrated circuit chip may be attached to the recessed portion formed on the adhesive layer.

Here, the method of manufacturing a radio frequency identification tag according to another embodiment of the present invention, after the step b) curing the adhesive layer; And c) curing the antenna after step c).

As described above, according to the manufacturing method of the present invention, since the existing antenna forming process and the chip bonding process can be formed by the printing process, the number of manufacturing processes can be reduced, and the pressure is used because only the heat source for curing the conductive paste is used. By eliminating the variable, the yield can be improved, and the continuous process allows high speed and mass production.

On the other hand, a method of manufacturing a radio frequency identification tag according to another embodiment of the present invention, a) forming an adhesive layer on a portion of the upper surface of the base layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to a circuit pattern of the integrated circuit chip, wherein the conductive paste is applied from the upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip. Forming an antenna directly connected to the circuit pattern of the circuit. Here, the method and material for forming each component are all applicable to the contents of the above-described embodiment, so a detailed description thereof will be omitted.

In the step a), the upper surface of the substrate layer may be a flat plate surface (see FIG. 8), or a recessed portion recessed from the upper surface of the substrate layer may be formed on the substrate layer. That is, before the step a), the method may further include forming a recessed portion recessed from the upper surface of the base layer on the base layer.

When the upper surface of the substrate layer is a flat plate surface in the step a) the adhesive layer is formed on the upper surface of the flat substrate layer, and when the depression is formed in the upper surface of the substrate layer in the step a) The adhesive layer may be formed on the recessed portion formed on the substrate layer.

Here, the method of manufacturing a radio frequency identification tag according to another embodiment of the present invention, after the step b) curing the adhesive layer; And c) curing the antenna after step c).

As described above, according to the manufacturing method of the present invention, since the existing antenna forming process and the chip bonding process can be formed by the printing process, the number of manufacturing processes can be reduced, and the pressure is used because only the heat source for curing the conductive paste is used. By eliminating the variable, the yield can be improved, and the continuous process allows high speed and mass production.

The method of manufacturing the radio frequency identification tag according to the above-described embodiments may further include an additional process of forming another general configuration of a tag known in the art.

In the following, the method and material for forming each component are all applied to the contents of the above-described embodiment, and thus, a detailed description thereof will be omitted.

Radio frequency identification tag according to another embodiment of the present invention, the base layer; An antenna formed on the base layer to form a chip installation space on the base layer; An adhesive layer formed on the base layer to be located in the chip installation space; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer located in the chip installation space such that the circuit pattern is located above; And a conductive connection portion formed to apply a conductive paste from the antenna to the integrated circuit chip to connect the antenna and the circuit pattern of the integrated circuit chip.

Here, the base layer may be flat, and may further include a depression formed from the upper surface of the base layer in the chip installation space, the adhesive layer may be formed in the depression.

The antenna may be a loop antenna provided to form the chip installation space between one end portion and the other end portion on the base layer.

In this case, the conductive connecting part is formed by applying the conductive paste to be connected from one end of the loop antenna to one side of the circuit pattern, and having a form connecting the one end of the loop antenna with one side of the circuit pattern. Conductive connections; And a second conductive connection portion formed to have a form connecting the other end portion of the loop antenna to the other side of the circuit pattern by applying the conductive paste to be connected to the other side of the circuit pattern from the other end portion of the loop antenna. .

In addition, the antenna, the first antenna portion of the flat plate shape; And a flat plate-shaped second antenna unit disposed with the first antenna unit and the chip installation space therebetween.

In this case, the conductive connection portion is formed to have a form connecting the one end portion of the first antenna portion and one side of the circuit pattern by applying the conductive paste so as to be connected from one end portion of the first antenna portion to one side of the circuit pattern. A first conductive connection; And a second conductive connecting portion formed to have a form connecting the one end portion of the second antenna portion to the other side of the circuit pattern by applying the conductive paste so as to be connected from the one end portion of the second antenna portion to the other side of the circuit pattern. can do.

As such, the conductive connection portion may be formed in the form of a conductive bridge connecting the antenna and the circuit pattern of the integrated circuit chip.

On the other hand, the radio frequency identification tag according to another embodiment of the present invention, the base layer; An adhesive layer formed on the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And an antenna formed to have a form directly connected to the circuit pattern of the integrated circuit chip by applying a conductive paste from the upper surface of the adhesive layer to the integrated circuit chip.

Here, the adhesive layer may be flat, and may further include a depression formed from an upper surface of the adhesive layer, and the integrated circuit chip may be attached to the depression.

The antenna may be any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna.

As such, both ends of the antenna may be formed to be in direct contact with the circuit pattern of the integrated circuit chip.

On the other hand, the radio frequency identification tag according to another embodiment of the present invention, the base layer; An adhesive layer formed on a portion of an upper surface of the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And an antenna formed to have a form directly connected to a circuit pattern of the integrated circuit chip by applying a conductive paste from an upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip.

Here, the base layer may be flat, may further include a depression formed from the upper surface of the base layer, the adhesive layer may be formed in the depression.

The antenna may be any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna.

As such, both ends of the antenna may be formed to be in direct contact with the circuit pattern of the integrated circuit chip.

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to the present invention. Hereinafter, the present invention will be described by applying the present invention to a continuous roll process including an unwinder in which the wound substrate layer is unwound and a winder for winding the substrate layer on which various patterns are formed through each step, but the manufacturing method of the present invention. This is not limited in this way.

A radio frequency identification tag and a method of manufacturing the same according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

As shown in FIG. 1, a method of manufacturing a radio frequency identification tag according to a first embodiment of the present invention includes: printing an antenna to form a chip installation space on a base layer; Curing the antenna in an oven; Printing an adhesive layer in a chip installation space formed on the substrate layer; A die attaching step of attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; Curing the adhesive layer using a UV lamp; Printing a conductive connection electrically connecting the antenna and the circuit pattern of the integrated circuit chip; And curing the conductive connection in an oven.

Thus, the radio frequency identification tag according to the first embodiment of the present invention, as shown in Figure 2, the base layer (1); An antenna 2 located on the base layer 1; An adhesive layer 3 positioned on the base layer 1 in the chip installation space 2-1; An integrated circuit chip 4 attached on the adhesive layer 3; And a conductive connection part 5 connecting the circuit pattern 4-1 of the integrated circuit chip 4 to the antenna 2.

A radio frequency identification tag and a method of manufacturing the same according to a second embodiment of the present invention will be described with reference to FIGS. 3 and 4.

In the method of manufacturing the radio frequency identification tag according to the second embodiment of the present invention, as shown in FIG. 3, before the antenna is printed so that the chip installation space is formed on the base layer, it is recessed from the upper surface of the base layer. The method further includes a notching step of forming the recessed portion on the base layer, except that the adhesive layer is formed in the recessed portion when the adhesive layer is printed, and is the same as the manufacturing method according to the first embodiment.

In the case of the radio frequency identification tag according to the second embodiment of the present invention, as shown in FIG. 4, the recess 1-1 is formed in the base layer 1, and the adhesive layer 3 is recessed. Except that formed in (1-1), the configuration is the same as that of the radio frequency identification tag according to the first embodiment.

A radio frequency identification tag and a method of manufacturing the same according to a third embodiment of the present invention will be described with reference to FIGS. 5 and 6.

As shown in FIG. 5, a method of manufacturing a radio frequency identification tag according to a third embodiment of the present invention includes printing an adhesive layer on a base layer; A die attaching step of attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; Curing the adhesive layer using a UV lamp; Printing the antenna from the upper surface of the adhesive layer to the integrated circuit chip such that the antenna is directly connected to the circuit pattern of the integrated circuit chip; And curing the antenna in an oven.

Thus, the radio frequency identification tag according to the third embodiment of the present invention, as shown in Figure 6, the base layer 10; An adhesive layer 20 positioned on the base layer 10; An integrated circuit chip 30 positioned on the adhesive layer 20; And an antenna 40 directly connected to the circuit pattern 30-1 of the integrated circuit chip 30.

On the other hand, the method of manufacturing a radio frequency identification tag according to a fourth embodiment of the present invention, prior to attaching the integrated circuit chip on the adhesive layer, forming a recessed portion from the upper surface of the adhesive layer on the adhesive layer It is the same as the manufacturing method according to the third embodiment except that the integrated circuit chip is attached to the depression formed in the adhesive layer.

In the case of the radio frequency identification tag according to the fourth embodiment of the present invention, as shown in FIG. 7, the recessed portion 20-1 is formed in the adhesive layer 20, and the integrated circuit chip 30 is bonded to the adhesive. The configuration is the same as that of the radio frequency identification tag according to the third embodiment except that it is attached to the depression 20-1 formed in the layer 20.

A radio frequency identification tag and a method of manufacturing the same according to a fifth embodiment of the present invention will be described with reference to FIG. 8.

According to a method of manufacturing a radio frequency identification tag according to a fifth embodiment of the present invention, in the step of printing an adhesive layer on a base layer, the adhesive layer may be arranged on a portion of the upper surface of the base layer according to the size of the integrated circuit chip. In printing, in the step of printing the antenna, the antenna is the same as the manufacturing method according to the third embodiment except that the antenna is printed on an area of the upper surface of the base layer where the adhesive layer is not formed.

In the case of the radio frequency identification tag according to the fifth embodiment of the present invention, as shown in FIG. 8, the adhesive layer 20 ′ has a size corresponding to the size of the integrated circuit chip 30 and the base layer 10. And the antenna 40 is formed on the upper surface of the base layer 10 on which the adhesive layer 20 'is not formed, and is the same as that of the radio frequency identification tag according to the third embodiment. .

On the other hand, the antenna of the radio frequency identification tag according to the first to fifth embodiments of the present invention, as shown in Figures 9a to 9c, a dipole antenna (folded dipole antenna, folded dipole antenna (folded dipole antenna) ) And a multi-loop antenna.

As described above, according to the present invention, productivity can be improved due to the conversion from the thermocompression batch process by the thermal mode to the in-line process, and the flip chip It is possible to eliminate the bumping process, which is a post-wafer process, compared to the process, thereby reducing manufacturing costs.

In addition, by implementing a thin wafer through a back side grinding process of 60 μm or less, flexibility of a radio frequency identification tag may be improved.

In addition, the yield can be improved by excluding the junction element caused by the pressure between the integrated circuit chip and the antenna, which is a yield inhibiting factor.

1 is a manufacturing process diagram of a radio frequency identification tag according to a first embodiment of the present invention;

2 is a cross-sectional view of principal parts of a radio frequency identification tag according to a first embodiment of the present invention;

3 is a manufacturing process diagram of a radio frequency identification tag according to a second embodiment of the present invention;

4 is a sectional view showing the principal parts of a radio frequency identification tag according to a second embodiment of the present invention;

5 is a manufacturing process diagram of a radio frequency identification tag according to a third embodiment of the present invention;

6 is a sectional view showing the principal parts of a radio frequency identification tag according to a third embodiment of the present invention;

7 is a sectional view of principal parts of a radio frequency identification tag according to a fourth embodiment of the present invention;

8 is a sectional view showing the principal parts of a radio frequency identification tag according to a fifth embodiment of the present invention;

9a to 9c are views showing various forms of an antenna of a radio frequency identification tag according to the present invention;

10 is a sectional view of principal parts of a conventional radio frequency identification tag.

Claims (25)

a) forming an antenna on the base layer, the antenna forming a chip installation space on the base layer; b) forming an adhesive layer in the chip installation space formed on the substrate layer; c) attaching an integrated circuit chip including a circuit pattern to the adhesive layer formed in the chip installation space, and attaching the integrated circuit chip to the adhesive layer so that the circuit pattern of the integrated circuit chip is located above. ; And d) forming a conductive connection for electrically connecting the antenna and the circuit pattern of the integrated circuit chip, wherein the conductive paste is formed by applying a conductive paste from the antenna to the integrated circuit chip. A method of manufacturing a radio frequency identification tag. The antenna of claim 1, wherein the antenna of step a) is a loop antenna provided so that the chip installation space is formed between one end portion and the other end portion on the base layer. In the step d), the conductive paste is applied to be connected from one end of the loop antenna to one side of the circuit pattern, thereby forming a first conductive connection part extending from one end of the loop antenna to one side of the circuit pattern. ; And applying the conductive paste to be connected from the other end of the loop antenna to the other side of the circuit pattern, thereby forming a second conductive connection part extending from the other end of the loop antenna to the other side of the circuit pattern. A method of manufacturing a radio frequency identification tag. The antenna of claim 1, wherein the antenna of step a) comprises: a first antenna unit having a flat plate shape; And a flat plate-shaped second antenna unit disposed with the first antenna unit and the chip installation space therebetween. In step d), the conductive paste is coated to be connected from one end of the first antenna to one side of the circuit pattern, thereby forming a first conductive connection part extending from one end of the first antenna to one side of the circuit pattern. Making; And applying the conductive paste so as to be connected from one end of the second antenna to the other side of the circuit pattern, thereby forming a second conductive connection part extending from one end of the second antenna to the other side of the circuit pattern. Method of manufacturing a radio frequency identification tag, characterized in that. The method of claim 1, wherein the step d) comprises: a gravure printing method, a flat screen printing method, a cylindrical screen printing method, a roll to roll flatbed screen printing method, A radio frequency identification tag, wherein the conductive connection is formed by a method selected from among rotary screen printing, offset printing, flexography, and ink jet printing. Manufacturing method. The method of claim 1, further comprising: curing the antenna after step a); Curing the adhesive layer after step c); And d) hardening the conductive connection after step d). The method according to any one of claims 1 to 5, further comprising the step of forming a depression recessed from the upper surface of the base layer on the base layer, In the step b), the adhesive layer is formed in the recess located in the chip installation space, characterized in that the manufacturing method of the radio frequency identification tag. a) forming an adhesive layer on the substrate layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to the circuit pattern of the integrated circuit chip, by applying a conductive paste from the upper surface of the adhesive layer to the integrated circuit chip to form an antenna directly connected to the circuit pattern of the integrated circuit chip. Method of manufacturing a radio frequency identification tag comprising the step of forming. 8. The antenna of claim 7, wherein the antenna of step c) is any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna. Method of manufacturing a radio frequency identification tag. The method of claim 7, wherein the step c) includes a gravure printing method, a flat screen printing method, a cylindrical screen printing method, a roll to roll flatbed screen printing method, Manufacturing of the radio frequency identification tag, wherein the antenna is formed by a method selected from a rotary screen printing method, an offset printing method, a flexography method, and an ink jet printing method. Way. 8. The method of claim 7, further comprising: curing the adhesive layer after step b); And After the step c) at least one of the step of curing the antenna further comprising the step of manufacturing a radio frequency identification tag. The method according to any one of claims 7 to 10, further comprising forming a recessed portion recessed from an upper surface of the adhesive layer on the adhesive layer, And in the step b), attaching the integrated circuit chip to the recess. a) forming an adhesive layer on a partial region of the upper surface of the substrate layer; b) attaching the integrated circuit chip including the circuit pattern to the adhesive layer, the attaching the integrated circuit chip to the adhesive layer such that the circuit pattern of the integrated circuit chip is located above; And c) forming an antenna electrically connected to a circuit pattern of the integrated circuit chip, by applying a conductive paste from the upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip, And forming an antenna directly connected to the circuit pattern. 13. The antenna of claim 12, wherein the antenna of step c) is any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna. Method of manufacturing a radio frequency identification tag. The method of claim 12, wherein the step c) includes a gravure printing method, a flat screen printing method, a cylindrical screen printing method, a roll to roll flatbed screen printing method, Manufacturing of the radio frequency identification tag, wherein the antenna is formed by a method selected from a rotary screen printing method, an offset printing method, a flexography method, and an ink jet printing method. Way. The method of claim 12, further comprising: curing the adhesive layer after step b); And After the step c) at least one of the step of curing the antenna further comprising the step of manufacturing a radio frequency identification tag. The method according to any one of claims 12 to 15, further comprising the step of forming a depression recessed from the upper surface of the substrate layer on the substrate layer, In the step a), the adhesive layer is formed in the depression, characterized in that the manufacturing method of the radio frequency identification tag. Base layer; An antenna formed on the base layer to form a chip installation space on the base layer; An adhesive layer formed on the base layer to be located in the chip installation space; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer located in the chip installation space such that the circuit pattern is located above; And And a conductive connection portion formed to apply a conductive paste from the antenna to the integrated circuit chip to connect the antenna and the circuit pattern of the integrated circuit chip. The method of claim 17, wherein the antenna is a loop antenna provided so that the chip installation space is formed between one end portion and the other end portion on the base layer, The conductive connection part may include: a first conductive connection part formed to have a form connecting the one end part of the loop antenna to one side of the circuit pattern by applying the conductive paste to be connected to one side of the circuit pattern at one end of the loop antenna; And a second conductive connection part formed to have a form connecting the other end part of the loop antenna to the other end of the circuit pattern by applying the conductive paste to be connected from the other end of the loop antenna to the other side of the circuit pattern. Radio frequency identification tag. 18. The antenna of claim 17, wherein the antenna comprises: a flat plate-shaped first antenna unit; And a flat plate-shaped second antenna unit disposed with the first antenna unit and the chip installation space therebetween. The conductive connection part may be coated with the conductive paste so as to be connected from one end portion of the first antenna portion to one side of the circuit pattern, and thus have a first conductivity formed to form one end portion of the first antenna portion and one side of the circuit pattern. Connection part; And a second conductive connecting portion formed to have a form connecting the one end portion of the second antenna portion to the other side of the circuit pattern by applying the conductive paste so as to be connected from the one end portion of the second antenna portion to the other side of the circuit pattern. Radio frequency identification tag, characterized in that. The method according to any one of claims 17 to 19, wherein the base layer further comprises a recess formed in the chip mounting space from the upper surface of the base layer, The adhesive layer is formed in the recessed portion, characterized in that the radio frequency identification tag. Base layer; An adhesive layer formed on the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And And an antenna formed to apply a conductive paste from the upper surface of the adhesive layer to the integrated circuit chip to have a form directly connected to the circuit pattern of the integrated circuit chip. The method according to claim 21, wherein the adhesive layer, further comprises a depression formed from the upper surface of the adhesive layer, And said integrated circuit chip is attached to said recessed portion. Base layer; An adhesive layer formed on a portion of an upper surface of the base layer; An integrated circuit chip comprising a circuit pattern, comprising: an integrated circuit chip attached to the adhesive layer such that the circuit pattern is located above; And And an antenna formed to apply a conductive paste from the upper surface of the base layer on which the adhesive layer is not formed to the integrated circuit chip to have a form directly connected to the circuit pattern of the integrated circuit chip. . The method according to claim 23, wherein the base layer further comprises a depression formed from the upper surface of the base layer, The adhesive layer is formed in the recessed portion, characterized in that the radio frequency identification tag. The antenna of claim 21, wherein the antenna is any one of a dipole antenna, a folded dipole antenna, and a multi-loop antenna. A radio frequency identification tag characterized by.

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