KR20100043945A

KR20100043945A - Manufacturing method and apparatus of radio frequency identification tag

Info

Publication number: KR20100043945A
Application number: KR1020080103210A
Authority: KR
Inventors: 임세진
Original assignee: 삼성테크윈 주식회사
Priority date: 2008-10-21
Filing date: 2008-10-21
Publication date: 2010-04-29

Abstract

The present invention relates to a method and a manufacturing apparatus for manufacturing a wireless recognition tag with improved reliability by a simple method of forming an antenna by pressing a metal thin film to a circuit module disposed on a surface of a substrate. And preparing a substrate on which a circuit module having a semiconductor chip and a strap electrically connected to the semiconductor chip is prepared, and pressing the metal thin film toward the substrate on which the circuit module is disposed by using a mold having an antenna shape. Forming an antenna.

Description

Manufacturing method and apparatus for manufacturing a radio recognition tag TECHNICAL FIELD

The present invention relates to a method and apparatus for manufacturing a wireless identification tag, and more particularly, to manufacture a wireless identification tag having improved reliability by a simple method of forming an antenna by pressing a metal thin film to a circuit module disposed on a surface of a substrate. It relates to a method and an apparatus that can be.

Recently, technology using radio frequency (RF) has been widely used not only in communication technology but also in all industries including distribution. Radio frequency technology is used not only in radar devices but also in technical fields such as safety devices such as vehicle collision avoidance systems, smart cards and wireless recognition devices. Among them, with the rapid development of information technology, wireless recognition technology is used as a basis for realizing electronic commerce.

Radio frequency identification (RFID) is a technology that recognizes information embedded in an IC chip by a radio signal recognizer, and can accurately read information of a tag within several tens of meters. For example, the wireless recognition technology may more effectively support the production and sales of goods by grasping the overall flow of goods, such as location tracking and inventory management.

In general, an RFID (radio frequency identification) tag is a thin tag having a small chip storing information and an antenna connected to the small chip. RFID tags can be used to identify information on a small chip using frequencies without touching the outside. Recently, the RFID tag of this type has been used as a device to replace the conventional barcode or magnetic card.

The RFID tag is manufactured through a series of processes of applying a conductive adhesive to the antenna and then attaching and pressing a small chip to the antenna to which the adhesive is applied. In general, antennas used in the manufacture of RFID tags are provided in a roll wound manner. Therefore, in the conventional process of manufacturing the RFID tag, a device for applying an adhesive to the chip mounting position of the antenna released from the roll, and a device for placing and pressing the chip on the antenna (roll to roll flip chip bonder) Etc. are required. However, according to this conventional method, a process of manufacturing an RFID tag is complicated, such as a roll having an antenna pattern must be prepared using a process such as etching, and an adhesive is applied to the antenna in advance. In addition, due to the massive size of the manufacturing equipment has a problem that requires a large space.

In addition, the work to mount a small chip on the antenna is difficult to work because the precision is required, the adhesive reliability of the chip and the antenna was also poor. Since the wireless identification tag can be applied to various products, the electrical signal transmission between the chip and the antenna must be maintained in any use environment. However, the wireless tag according to the conventional manufacturing method as described above has a problem that the failure rate of the wireless tag tag product has a low adhesive reliability.

An object of the present invention is to provide a method and apparatus for manufacturing a simplified radio recognition tag.

Another object of the present invention is to provide a method of manufacturing a wireless identification tag that can reduce the size of the manufacturing equipment.

It is still another object of the present invention to provide a method and a manufacturing apparatus capable of manufacturing a wireless identification tag in which the reliability of a product is improved.

The present invention provides a method and an apparatus for manufacturing a wireless recognition tag with improved reliability by a simple method of forming an antenna by pressing a metal thin film on a circuit module disposed on a surface of a substrate.

The method of manufacturing a wireless identification tag according to the present invention includes a substrate preparation step of preparing a substrate on which a circuit module having a semiconductor chip and a strap electrically connected to the semiconductor chip is disposed, and a metal thin film formed of a metal mold having an antenna shape. And forming an antenna on the strap by pressing toward the disposed substrate.

In the present invention, the antenna forming step may be performed by hot stamping to pressurize and heat the metal thin film toward the substrate.

In the present invention, in the substrate preparation step, the substrate may be prepared with a plurality of circuit modules arranged on the surface spaced apart at predetermined intervals and wound on a roll, and the substrate may be unwound and transferred from the roll to perform the antenna forming step. have.

In the present invention, the antenna forming step may further include an adhesive applying step of applying a conductive adhesive to the surface of the strap.

An apparatus for manufacturing a radio recognition tag according to the present invention includes an antenna for a substrate transfer device for transferring a substrate at predetermined intervals, and an electrical connection portion of a circuit module arranged on the surface of the substrate by applying heat to the substrate while pressing a metal thin film toward the substrate. And an antenna forming apparatus for forming a.

According to another aspect of the present invention, there is provided a method of manufacturing a wireless identification tag, comprising: a substrate transfer step of releasing and transferring a substrate wound on a roll from a roll; Module placement step of placing in position and the antenna forming step of forming an antenna on the strap by pressing the metal thin film toward the substrate on which the circuit module is arranged with a mold having an antenna shape.

In another aspect of the invention, the module placement step may further comprise an adhesive application step of applying the adhesive on the substrate.

As described above, the method and manufacturing apparatus of the RFID tag according to the present invention form a antenna by pressing a metal thin film to a circuit module disposed on a surface of a substrate, thereby greatly simplifying the manufacturing method. As a result, the size of equipment for manufacturing the wireless identification tag may be reduced, and since the connection between the antenna and the circuit module is made stable by a method such as hot stamping, the reliability of the product may be greatly improved.

Hereinafter, the configuration and operation of a method and apparatus for manufacturing a radio recognition tag according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a schematic configuration of an apparatus for manufacturing a wireless tag by a method of manufacturing a wireless tag according to an embodiment of the present invention, Figure 2 is a view of an embodiment of the present invention shown in FIG. It is a flowchart explaining the manufacturing method of a radio recognition tag.

The method of manufacturing a wireless identification tag according to the embodiment shown in FIGS. 1 and 2 includes a substrate preparation step (S100) of preparing a substrate, and an antenna formation step (S130) of forming an antenna on the substrate.

The apparatus for manufacturing a radio recognition tag according to the embodiment shown in FIG. 1 includes substrate transfer devices 11 and 12 for transferring the substrate 10 at predetermined intervals, and antennas are formed on the circuit module 40 of the substrate 10. An antenna forming apparatus is provided.

According to the method of manufacturing the wireless identification tag according to the embodiment shown in FIG. 2, in the substrate preparation step S100, the substrate 10 having the circuit module 40 disposed on the surface is prepared. The substrate transfer apparatuses 11 and 12 which transfer the board | substrate 10 are equipped with the supply roll 11 and the collection roll 12 which wind and feed the flexible substrate 10 in roll form, and collect | recover. The flexible substrate 10 is prepared while being wound on the supply roll 11, and the recovery roll 12 is arranged to wind and recover the substrate. Therefore, the substrate 10 wound on the supply roll 11 may be unwound by the recovery roll 12, and the process of each step for manufacturing the radio recognition tag may be sequentially performed.

In order to perform each step of the method of manufacturing the radio recognition tag along the direction of movement of the substrate 10 from the supply roll 11 to the recovery roll 12, devices are arranged in sequence, and in FIG. 1, a conductive adhesive is applied from the left side. The device 2 and the hot stamping device 30 are shown in sequence. The hot stamping apparatus 30 is an example of an antenna forming apparatus for pressing the metal thin film 32 toward the substrate 10 to form the antenna 43 at an electrical connection portion of the circuit module 40.

The illustrated devices are schematically shown as one example of performing each step of the method of manufacturing a radio recognition tag, and the present invention is not limited thereto, and more devices may be arranged in various forms.

The substrate 10 may be made of an insulating material, and may include a material having flexibility such as polyimide resin. The substrate 10 has a circuit module 40. Conventionally, the pattern of the antenna is first supplied in the form of a roll, and a circuit module is mounted on the antenna. However, in the present embodiment, the substrate having the circuit modules 40 on the surface for simplicity and improvement of efficiency is used. 10) Prepare in advance. As a result, in the subsequent step, an antenna may be formed on each of the circuit modules 40 disposed on the surface of the substrate 10 transferred by the supply roll 11 and the recovery roll 12.

3 is a cross-sectional view of a radio recognition tag manufactured by a method for manufacturing a radio identification tag according to an embodiment of the present invention shown in FIG. 1.

The semiconductor chip 41 is a part which secures electric power by using the received signal, and performs the process of creating and transmitting an appropriate response signal according to the instruction content of the received signal (control signal). The semiconductor chip 41 may include a central processing circuit, a memory circuit, and the like, after receiving request data from a reader or interrogator through an antenna and performing a process such as calculation and storage. The response data can be sent to an external reader.

The strap 42 is a conductive member electrically connected to the semiconductor chip 41 to electrically connect the antenna 43 and the semiconductor chip 41, and is an example of an electrical connection unit. The strap 42 may be manufactured in the form of a thin film including a conductive material such as aluminum or copper.

Adhesive 15 may be applied to the surface of the substrate 10 to attach the strap 42 and the antenna 43.

1 and 2, the substrate 10 is transferred at predetermined intervals by the substrate transfer step S110. When the substrate 10 is transferred, the conductive adhesive 45 is applied to the surface of the strap 42 of the circuit module 40 by the conductive adhesive applying device 2.

As the conductive adhesive 45 to be applied, a conductive material that enables electrical connection between the antenna 43 and the strap 42 may be used. Examples of the conductive adhesive 45 include an anisotropic conductive paste or an anisotropic conductive film. Anisotropic conductive paste (ACP) is an adhesive in which conductive balls are dispersed in a flowable binder. In addition, anisotropic conductive film (ACF) is formed by mixing conductive particles in the form of metal particles such as plastic particles or metal particles, adhesives, additives (dispersants), etc. to be.

In the antenna forming step S130, the antenna 43 is formed on the strap 42 by pressing the metal thin film 32 toward the substrate 10 on which the circuit module 40 is disposed using a mold 31 having an antenna shape. Step. Hot stamping device 30 performing the antenna forming step (S130) has a function of winding the antenna material supply roll 33 wound around the conductive metal thin film 32 and the metal thin film 32 subjected to the hot stamping treatment An antenna material recovery roll 34 is provided.

Although not shown, an antenna-shaped mold is formed on the lower surface of the mold 31 facing the substrate 10. The mold of the mold 31 may cut the metal thin film 32 and press the cut metal thin film 32 to the substrate 10 while pressing the metal thin film 32 toward the substrate 10. In addition, the hot stamping device 30 may be applied to the junction of the metal thin film 32 and the strap 42 through the mold 31, thereby enabling a firm adhesion. Process conditions set in the hot stamping device 30, the temperature is in the range of 170 ± 10 ℃, the pressure is in the range of 5 ± 2 kg / mm 2, the pressing time may be in the range of 5 ± 2 seconds.

The cut portion of the metal thin film 32 is attached to the strap 42 to function as the antenna 43. A cut hole 35 is formed in the cut portion of the metal thin film 32.

In the antenna forming step (S130) of the method of manufacturing a wireless tag according to the embodiment illustrated in FIG. 1, a hot stamping technique of pressing the metal thin film 32 with heat is applied, but the present invention is not limited thereto. That is, various techniques may be used to bond the cut metal thin film 32 to the strap 42 while simultaneously cutting the metal thin film 32 into an antenna shape. For example, by cutting and pressing the metal thin film 32 with the mold 31 and transmitting ultrasonic waves through the mold 31, the antenna 43 and the strap 42 can be connected by fusion by ultrasonic waves. have.

After the antenna forming step (S130), as shown in FIG. 1, the wireless identification tag 50 is completed. By performing the process of cutting the wireless recognition tag 50, a product that can be attached to the product can be completed.

In the related art, a method of aligning and bonding a strap to a junction portion of an antenna while transferring an antenna provided in a roll form is used. Therefore, various steps using various devices including a high precision flip chip bonding device are performed to perform a wireless tag tag product. Was prepared. This has led to an increase in the overall size of the equipment that manufactures the RFID tags.

However, according to the method of manufacturing the RFID tag according to the above-described embodiment, the RFID tag may be pressurized by a simple operation of forming the antenna 43 by pressing the metal thin film 32 after transferring the substrate 10 by a predetermined length. 50) can be prepared. Therefore, there is an advantage that the overall configuration of the manufacturing equipment is simplified and the manufacturing process is also simplified. In addition, since a stable bonding of the metal thin film 32 and the strap 42 is achieved by a technique such as hot stamping, excellent peel strength of at least 1 kgf / cm may be obtained.

FIG. 4 is a perspective view illustrating a schematic configuration of an apparatus for manufacturing a wireless tag by a method of manufacturing a wireless tag according to another embodiment of the present invention, and FIG. 5 is a view of an embodiment of the present invention shown in FIG. It is a flowchart explaining the manufacturing method of a radio recognition tag. Reference numerals such as those of FIG. 1 of FIG. 4 indicate the same components as those of FIG. 1.

4 and 5, the method for manufacturing a wireless identification tag according to the embodiment shown in FIG. An antenna forming step (S250) is included.

According to the method of manufacturing the radio recognition tag according to the embodiment shown in FIGS. 4 and 5, in the substrate preparation step S200, the flexible substrate 10 is prepared while being wound on the supply roll 11. Since the other end of the flexible substrate 10 is wound and recovered by the recovery roll 12, the substrate transfer step S210 in which the substrate 10 is transferred by the rotational action of the supply roll 11 and the recovery roll 12 is performed. Can be performed. Therefore, the substrate 10 wound on the supply roll 11 may be unwound by the recovery roll 12, and the process of each step for manufacturing the radio recognition tag may be sequentially performed.

In order to perform each step of the manufacturing method of the radio recognition tag along the direction of movement of the substrate 10 from the supply roll 11 to the recovery roll 12, devices are arranged in sequence, and in FIG. 60, the module conveying device 70, the conductive adhesive applying device 2, and the hot stamping device 30 are shown in this order. These devices perform each process every time the substrate 10 is transferred at predetermined intervals.

In the exemplary embodiment shown in FIGS. 1 and 2, the substrate 10 is supplied with the circuit module disposed on the surface of the substrate 10. However, in the embodiments of FIGS. 4 and 5, the substrate 10 is transferred. The circuit module 40 is disposed on the surface of the substrate 10. The adhesive application device 60 performs an adhesive application step S220 of applying an adhesive to the surface of the substrate 10 so that the circuit module 40 can be attached to the substrate 10.

After the adhesive application step (S220), the module placement step (S230) for placing the circuit module 40 in a predetermined position of the substrate 10 by the module transfer device 70 may be performed. The module transfer device 70 may be implemented by a gantry robot or the like that absorbs the circuit module 40 and moves in a vertical coordinate system.

When the circuit module 40 is disposed, the conductive adhesive applying step S240 is performed in which the conductive adhesive 45 is applied to the surface of the strap 42 of the circuit module 40 by the conductive adhesive applying device 2. As the conductive adhesive 45 to be applied, a conductive material that enables electrical connection between the antenna 43 and the strap 42 may be used. As the conductive adhesive 45, an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), or the like may be used.

In the antenna forming step S250, the antenna 43 is formed on the strap 42 by pressing the metal thin film 32 toward the substrate 10 on which the circuit module 40 is disposed using a mold 31 having an antenna shape. Step. The hot stamping apparatus 30 performing the antenna forming step S250 has a function of winding and collecting the antenna material supply roll 33 on which the conductive metal thin film 32 is wound, and the metal thin film 32 subjected to the hot stamping process. An antenna material recovery roll 34 is provided.

The mold formed on the lower surface of the mold 31 has an antenna shape, and when the metal thin film 32 is pressed against the substrate 10, the metal thin film 32 is cut off while simultaneously cutting the metal thin film 32. It can adhere to (10). The hot stamping device 30 may apply heat to the junction of the metal thin film 32 and the strap 42 through the mold 31, so that a strong bonding may be achieved. Process conditions set in the hot stamping device 30, the temperature is in the range of 170 ± 10 ° C, the pressure is in the range of 5 ± 2 kg / mm 2, the pressing time may be in the range of 5 ± 2 seconds.

Although the present invention has been described with reference to the above-described embodiments, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.

1 is a perspective view showing a schematic configuration of an apparatus for manufacturing a wireless identification tag by a method for manufacturing a wireless identification tag according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating a method of manufacturing a radio recognition tag according to an embodiment of the present invention shown in FIG. 1.

4 is a perspective view showing a schematic configuration of an apparatus for manufacturing a wireless identification tag by a method for manufacturing a wireless identification tag according to another embodiment of the present invention.

FIG. 5 is a flowchart illustrating a method of manufacturing a radio recognition tag according to an embodiment of the present invention shown in FIG. 4.

DESCRIPTION OF THE REFERENCE NUMERALS

2: conductive adhesive application device 35: cutting hole

10: board 40: circuit module

11: supply roll 41: semiconductor chip

12: recovery roll 42: strap

15: adhesive 43: antenna

30: hot stamping device 45: conductive adhesive

31: Mold 50: Wireless Recognition Tag

32: metal thin film 60: adhesive coating device

33: antenna material supply roll 70: module transfer device

34: antenna material recovery roll

Claims

Preparing a substrate on which a circuit module having a semiconductor chip and a strap electrically connected to the semiconductor chip is prepared; And

And forming an antenna on the strap by pressing a metal thin film toward the substrate on which the circuit module is disposed by a mold having an antenna shape.

The method of claim 1,

The antenna forming step is performed by hot stamping to pressurize and heat the metal thin film toward the substrate.

The method of claim 1,

In the preparing of the substrate, the substrate is prepared in a state in which a plurality of the circuit modules are spaced apart at predetermined intervals and wound on a roll, and the substrate is unwound and transferred from the roll to perform the antenna forming step. Method of manufacturing the identification tag.

The method of claim 1,

The antenna forming step further comprises an adhesive applying step of applying a conductive adhesive to the surface of the strap, the method of manufacturing a wireless identification tag.

A substrate transfer step of unwinding and transferring the substrate wound on the roll;

Disposing a circuit module having a semiconductor chip and a strap electrically connected to the semiconductor chip at a predetermined position on the substrate to be transferred; And

The method of claim 5,

The module disposing step further comprises an adhesive applying step of applying an adhesive on the substrate, a method of manufacturing a wireless identification tag.

The method of claim 5,

A substrate transfer device for transferring substrates at predetermined intervals; And

And an antenna forming apparatus for forming an antenna at an electrical connection portion of a circuit module arranged on a surface of the substrate by pressing a metal thin film toward the substrate and simultaneously applying heat to the substrate.