CN103839101A - High temperature resistant PC card for automobile electronic mark - Google Patents
High temperature resistant PC card for automobile electronic mark Download PDFInfo
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- CN103839101A CN103839101A CN201410099973.5A CN201410099973A CN103839101A CN 103839101 A CN103839101 A CN 103839101A CN 201410099973 A CN201410099973 A CN 201410099973A CN 103839101 A CN103839101 A CN 103839101A
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Abstract
A high temperature resistant PC card for an automobile electronic mark comprises an upper PC layer, an upper PVC layer, a substrate layer, a lower PVC layer and a lower PC layer. The high temperature resistant PC card for the automobile electronic mark is characterized in that the substrate layer is composed of an antenna and a chip, the PC card is formed by overlaying the upper PC layer, the upper PVC layer, the substrate layer, the lower PVC layer and the lower PC layer in sequence, the thickness of the upper PVC layer is different from that of the lower PVC layer, the larger thickness ranges from 0.25 mm to 0.3 mm, and the smaller thickness ranges from 0.1 mm to 0.15 mm. A groove similar to the chip in size is milled in the specific position of the thick PVC layer. The high temperature resistant PC card for the automobile electronic mark can normally work in the environment with the temperature of -60 DEG C to 120 DEG C, the PC card can penetrate through an automobile front windshield and an automobile metal film, and the requirements of a reader-writer for remote and reliable recognition of the ultrahigh frequency passive electronic mark in an automobile free stream environment are met.
Description
Technical field
The present invention relates to electronic label card encapsulation field and field of traffic control, be specifically related to the high temperature resistant PC card for automotive electronics mark.
Background technology
At present, in city and highway wisdom field of traffic control, electronic mark generally all can be installed on vehicle, conventionally require electronic tag to be mounted on shield glass, to facilitate the management to automobile.Conventionally to have two kinds of packing forms, one be pottery to the common automotive electronics for traffic mark on the market, and one is PVC, and the popularity that especially packing forms of pottery uses is particularly outstanding.These two kinds of packaging technologies are ultrahigh-frequency passive electronic tag to be used the materials such as pottery, PVC encapsulated through specific technique.But the electronic label card of above-mentioned base material encapsulation has its superiority-inferiority.The advantage of ceramic card is the environmental requirement that can meet automotive electronics mark higher temperature, but because its higher cost of manufacture adds that its material is frangible, gives in actual use and bring a lot of inconvenience; And although the price comparison of PVC material is low, can not be high temperature resistant, generally can only tolerate 80-90 degree Celsius, but in practical application, PVC card just starts distortion at the temperature of more than 70 degrees Celsius, affects the normal use of electronic mark.
For the defect of existing automotive electronics tag card, need especially a kind of Electronic Identification Card high temperature resistant, that cost is low to meet automotive electronics to identify the needs of normal environment for use.
Summary of the invention
The object of the present invention is to provide the high temperature resistant PC card for automotive electronics mark, solved automotive electronics and be identified under low cost, hot environment and normally effectively work.
The technical solution adopted in the present invention is specifically achieved in that
The invention provides the high temperature resistant PC card for automotive electronics mark, comprise PC layer, upper PVC layer, substrate layer, lower PVC layer, lower PC layer composition, it is characterized by, described substrate layer is made up of label antenna and label chip; The base material of described upper PC layer, lower PC layer is resistant to elevated temperatures polycarbonate (being called for short " PC "); The base material of described upper PVC layer, lower PVC layer is low temperature resistant polyvinyl chloride (being called for short " PVC "); Described substrate layer is made up of polyethylene terephthalate (being called for short " PET ") material.
The described high temperature resistant PC card for automotive electronics mark, is characterized in that, is superposeed and forms successively by upper PC layer, upper PVC layer, substrate layer, lower PVC layer, lower PC layer.
The described high temperature resistant PC card for automotive electronics mark, is characterized in that, the thickness of antenna is at 0.008-0.01 millimeter, and the thickness of chip is at 0.08-0.12 millimeter, and the thickness of substrate is at 0.048-0.052 millimeter, and the thickness of upper and lower PC layer is in 0.2 millimeter.
The described high temperature resistant PVC card for automotive electronics mark, is characterized in that, the variable thickness of upper PVC layer, lower PVC layer, and thicker thickness is at 0.25-0.3 millimeter, and thinner thickness is at 0.1-0.15 millimeter.
The described high temperature resistant PC card for automotive electronics mark, is characterized in that, mills out the groove of a die size at the ad-hoc location of thicker PVC layer.
The high temperature resistant PC card of described automotive electronics mark, it is characterized in that, described chip is super high frequency radio frequency chip, and signal frequency range is 840～845MHz or the 920～925MHz that is applicable to Chinese radio communication standard, or the international frequency range of 860～960MHz.
The high temperature resistant PVC card of described automotive electronics mark, it is characterized in that, the side contacting with upper PVC layer, lower PVC layer at upper PC layer, lower PC layer is coated and is made PC, the organic solvent that PVC bi-material can dissolve is the mixed adhesive of epoxy resin, cyclohexanone, ethyl acetate, b propanol, under the temperature and pressure of 130-135 degree, it is combined together completely.
Preferably, described PC, PVC bi-material are because its different characteristic, can not mix in the ordinary course of things, therefore just well combination, for its combination well, be coated with the special solvent of last layer at its surface of contact, dry volatilization, under the temperature and pressure through 130-135 degree, combine together.
High temperature resistant PC card for automotive electronics mark of the present invention, can in the environment of-60-120 degree Celsius, normally work, and penetrable shield glass, automobile metal pad pasting, met that under vehicle Free-flow environment read write line is remote to automotive electronics mark PC card, the demand of reliable recognition.
Brief description of the drawings
Fig. 1 is the structural representation of the high temperature resistant PC card for automotive electronics mark of instantiation of the present invention
The represented corresponding component title of numeral in figure:
10, upper PC layer 20, upper PVC layer 30, substrate layer 40, lower PVC layer 50, lower PC layer
11, the inside surface of upper PC layer inside surface 21, upper PVC layer outside surface 41, lower PVC layer outside surface 51, lower PC layer
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail, it will be more clear making above-mentioned and other object of the present invention, Characteristics and advantages.
As Fig. 1, shown in the high temperature resistant PC card for automotive electronics mark of the specific embodiment of the invention, it comprises PC layer 10, upper PVC layer 20, substrate layer 30, lower PVC layer 40, lower PC layer 50.
In instantiation of the present invention, 0.2 millimeter of the thickness of upper and lower PC layer, 0.25 millimeter of the thickness of upper PVC layer, 0.15 millimeter of the thickness of lower PVC layer.
In instantiation of the present invention, upper PC layer 10, upper PVC layer 20, lower PVC layer 40, lower PC layer 50 are identical under normal circumstances, 85 millimeters of the length in this instantiation, 54 millimeters of width, the requirement in can using according to reality be made.
In instantiation of the present invention, successively upper PVC layer 20, substrate layer 30, lower PVC layer 40 are superposeed, by the chip of substrate layer; fill out and put into the groove milling out at the ad-hoc location of upper PVC layer 20 in advance; protection chip, under the temperature environment of 127 degree, first combines together above-mentioned three layers.
In instantiation of the present invention, between upper PC layer inside surface 11 and upper PVC layer outside surface 21, between the outside surface 41 of lower PVC layer and lower PC layer inside surface 51, figure last layer can make the organic solvent that PC, PVC material can both dissolve respectively, the organic solvent of selecting is in this example the mixed adhesive of epoxy resin, cyclohexanone, ethyl acetate, b propanol, at the high temperature through 130 degree by its temperature.
In above description, a lot of details are set forth so that fully understand the present invention.But above description is only preferred embodiment of the present invention, the present invention can implement to be much different from alternate manner described here, and therefore the present invention is not subject to the restriction of disclosed concrete enforcement above.Any skilled personnel are not departing from technical solution of the present invention scope situation simultaneously, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (8)
1. for the high temperature resistant PC card of automotive electronics mark, comprise PC layer, upper PVC layer, substrate layer, lower PVC layer, lower PC layer composition, it is characterized by, described substrate layer is made up of label antenna, label chip; The base material of described upper PC layer, lower PC layer is resistant to elevated temperatures polycarbonate (being called for short " PC "); The base material of described upper PVC layer, lower PVC layer is low temperature resistant polyvinyl chloride (being called for short " PVC "); Described substrate layer is made up of polyethylene terephthalate (being called for short " PET ") material.
2. the high temperature resistant PC card for automotive electronics mark according to claim 1, is characterized in that, is superposeed and forms successively by upper PC layer, upper PVC layer, substrate layer, lower PVC layer, lower PC layer.
3. the high temperature resistant PC card for automotive electronics mark according to claim 1, it is characterized in that, the thickness of antenna is at 0.008-0.01 millimeter, and the thickness of chip is at 0.08-0.12 millimeter, the thickness of substrate is at 0.048-0.052 millimeter, and the thickness of upper and lower PC layer is in 0.2 millimeter.
4. the high temperature resistant PVC card for automotive electronics mark according to claim 1, is characterized in that, the thickness difference of upper PVC layer, lower PVC layer, and thicker thickness is at 0.25-0.3 millimeter, and thinner thickness is at 0.1-0.15 millimeter.
5. the high temperature resistant PC card for automotive electronics mark according to claim 3, is characterized in that, mills out the groove of a die size at the ad-hoc location of thicker PVC layer.
6. the high temperature resistant PVC card of automotive electronics mark according to claim 1, it is characterized in that, between upper PC layer and upper PVC layer, between lower PC layer and lower PVC layer, coat and make PC, the organic solvent that PVC bi-material can dissolve, as the mixed adhesive of epoxy resin, cyclohexanone, ethyl acetate, b propanol, under the temperature and pressure of 130-135 degree Celsius, it is combined together completely.
7. the high temperature resistant PC card of automotive electronics mark according to claim 1, it is characterized in that, described label chip is super high frequency radio frequency chip, signal frequency range is 840～845MHz or the 920～925MHz that is applicable to Chinese radio communication standard, or the international frequency range of 860～960MHz.
8. the high temperature resistant PC card for automotive electronics mark according to claim 1; it is characterized in that; described PC card can be packaged into vehicle annual test mark, danger mark, environmental mark etc. are forced in traffic; be pasted on shield glass inner side, the relevant PC cards such as automotive electronics car plate, electronics Vehicle Certificate are also at this protection domain and so on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099973.5A CN103839101A (en) | 2014-03-18 | 2014-03-18 | High temperature resistant PC card for automobile electronic mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099973.5A CN103839101A (en) | 2014-03-18 | 2014-03-18 | High temperature resistant PC card for automobile electronic mark |
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| Publication Number | Publication Date |
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| CN103839101A true CN103839101A (en) | 2014-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410099973.5A Pending CN103839101A (en) | 2014-03-18 | 2014-03-18 | High temperature resistant PC card for automobile electronic mark |
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| CN (1) | CN103839101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113902083A (en) * | 2021-10-18 | 2022-01-07 | 华大恒芯科技有限公司 | Anti-dismantling electronic mark and preparation method thereof |
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| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| JP2002283524A (en) * | 2001-03-27 | 2002-10-03 | Toppan Printing Co Ltd | Card |
| CN101097607A (en) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | RFID tag manufacturing methods and RFID tags |
| CN101310293A (en) * | 2005-11-16 | 2008-11-19 | 共同印刷株式会社 | Noncontact IC card |
| US20090128297A1 (en) * | 2007-11-21 | 2009-05-21 | Fujitsu Limited | Rfid tag and method for manufacturing the same |
| CN101474923A (en) * | 2008-12-10 | 2009-07-08 | 上海密特印制有限公司 | Non-contact type embedded body of electronic credential and method for producing the same |
| KR20090093606A (en) * | 2008-02-29 | 2009-09-02 | 주식회사 엘지화학 | Radio frequency identification tag and card having the same |
| CN101646563A (en) * | 2007-03-29 | 2010-02-10 | 三菱树脂株式会社 | Core sheet for card |
| CN203950332U (en) * | 2014-03-18 | 2014-11-19 | 陈昊 | For the high temperature resistant PC card of automotive electronics mark |
-
2014
- 2014-03-18 CN CN201410099973.5A patent/CN103839101A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| JP2002283524A (en) * | 2001-03-27 | 2002-10-03 | Toppan Printing Co Ltd | Card |
| CN101310293A (en) * | 2005-11-16 | 2008-11-19 | 共同印刷株式会社 | Noncontact IC card |
| CN101097607A (en) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | RFID tag manufacturing methods and RFID tags |
| CN101646563A (en) * | 2007-03-29 | 2010-02-10 | 三菱树脂株式会社 | Core sheet for card |
| US20090128297A1 (en) * | 2007-11-21 | 2009-05-21 | Fujitsu Limited | Rfid tag and method for manufacturing the same |
| KR20090093606A (en) * | 2008-02-29 | 2009-09-02 | 주식회사 엘지화학 | Radio frequency identification tag and card having the same |
| CN101474923A (en) * | 2008-12-10 | 2009-07-08 | 上海密特印制有限公司 | Non-contact type embedded body of electronic credential and method for producing the same |
| CN203950332U (en) * | 2014-03-18 | 2014-11-19 | 陈昊 | For the high temperature resistant PC card of automotive electronics mark |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113902083A (en) * | 2021-10-18 | 2022-01-07 | 华大恒芯科技有限公司 | Anti-dismantling electronic mark and preparation method thereof |
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Owner name: JIANGSU BELLON TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHEN HAO Effective date: 20141202 Free format text: FORMER OWNER: LIN XIAOPING Effective date: 20141202 |
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Free format text: CORRECT: ADDRESS; FROM: 210002 NANJING, JIANGSU PROVINCE TO: 210036 NANJING, JIANGSU PROVINCE |
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Effective date of registration: 20141202 Address after: 210036, Jiangsu, Hanzhoung Nanjing Avenue 298, Yuhua, 2, 2, 701 rooms Applicant after: JIANGSU BELLON TECHNLOGY CORP. Address before: 210002, Jiangsu, Hanzhoung Nanjing Avenue 298, Yuhua, 2, 2, 701 rooms Applicant before: Chen Hao Applicant before: Lin Xiaoping |
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Application publication date: 20140604 |