WO2015119399A1

WO2015119399A1 - Stacked structure and method of manufacturing same

Info

Publication number: WO2015119399A1
Application number: PCT/KR2015/000933
Authority: WO
Inventors: 성원모; 이원노
Original assignee: 주식회사 이엠따블유
Priority date: 2014-02-04
Filing date: 2015-01-28
Publication date: 2015-08-13
Also published as: KR20150091899A; KR101567757B1

Abstract

Disclosed are a stacked structure and a method of manufacturing same. A stacked structure according to an embodiment of the present invention may comprise: a pattern assembly including a laminated metal pattern having a plurality of contact portions, and configured of a film for concealing the metal pattern; and a ductile printed circuit board including a plurality of external terminals connected to the outside and a plurality of contact terminals connected to each of the plurality of external terminals, and having one surface thereof laminated on the pattern assembly so as to connect the plurality of contact terminals to the plurality of contact portions.

Description

Laminated Structures and Manufacturing Method Thereof

The present invention relates to a laminated structure and a method of manufacturing the same.

Recently, various antennas have been developed to support various wireless services of portable mobile devices.

In particular, with the expansion of smart phones, a technique for implementing an antenna using a stacked structure has recently emerged. For example, a NFC (Near Field Communication) antenna may be configured of a main circuit part and a terminal part formed based on an antenna pattern.

In the conventional NFC antenna, the main circuit unit is manufactured in a stacked type, for example, a flexible printed circuit board (FPCB) type.

In order to mount an antenna made of such a stacked structure in a device requiring near field communication, research is being made to make the thickness of the stacked structure thin.

In addition, research is underway to reduce the manufacturing cost by simplifying the process of manufacturing a laminated structure.

Embodiments of the present invention by forming a pattern assembly by laminating a masking film and a metal film having a predetermined pattern, by connecting the contact portion of the flexible laminated film to a predetermined pattern to laminate the pattern assembly and the flexible laminated film, the process of the laminated structure It is to provide a laminated structure and a method of manufacturing the same that can simplify the thickness and reduce the thickness.

In addition, embodiments of the present invention is a laminated structure for forming a predetermined pattern by laminating a metal film on one surface of the transparent film and patterning the metal film, and forming a masking film through color printing on the other surface of the transparent film and its It is for providing a manufacturing method.

Embodiments of the present invention are to provide a laminated structure and a method of manufacturing the same to form a predetermined pattern by patterning the metal film after laminating a metal film on a masking film having a predetermined color.

According to an exemplary embodiment of the present invention, a metal pattern having a plurality of contact portions are laminated, the pattern assembly consisting of a film for concealing the metal pattern; And a plurality of external terminals connected to the outside and a plurality of contact terminals connected to each of the plurality of external terminals, the flexible printing having one surface laminated on the pattern assembly to connect the plurality of contact terminals and the plurality of contact portions. There is provided a stacked structure comprising a circuit board.

In the stacked structure, the film may include a film having a color capable of concealing the metal pattern.

In the laminated structure, the film may be a polyimide film or polyethylene terephthalate film having the collar.

In the laminated structure, the film may further include a color printing surface formed by performing a color printing process on a surface opposite to the surface on which the metal pattern is laminated.

In the stacked structure, the metal pattern may be an antenna pattern.

The laminated structure may further include an electromagnetic wave protection sheet sheet bonded to the other surface of the flexible printed circuit board through a bonding sheet.

According to another exemplary embodiment of the present invention, a metal pattern having a plurality of contact parts is laminated, and forming in a pattern assembly composed of a film for concealing the metal pattern; Providing a flexible printed circuit board having a plurality of external terminals connected to the outside and a contact terminal connected to each of the plurality of external terminals; And laminating one surface of the flexible printed circuit board and the pattern assembly such that the plurality of contact terminals and the plurality of contact parts are connected to each other.

The forming of the pattern assembly in the method of manufacturing the stacked structure may include: laminating a metal film on one surface of the film; Patterning the metal film through an etching process on the metal film to form a metal pattern including the plurality of contact parts; And forming a color printing surface for performing a color printing process on the other surface of the film to conceal the metal pattern.

Providing the pattern assembly in the method of manufacturing the stacked structure may include preparing the film having a color for concealing the metal pattern; The method may include forming a metal pattern by laminating a metal film on one surface of the film and then patterning the metal film through an etching process for the metal film.

In the manufacturing method of the laminated structure, the film may be a polyimide film or a polyethylene terephthalate film.

In the method of manufacturing the stacked structure, the metal pattern may be an antenna pattern.

The method of manufacturing the stacked structure may further include bonding an electromagnetic wave protection sheet to the other surface of the flexible printed circuit board through a bonding sheet.

According to an embodiment of the present invention, by directly laminating a metal film having a predetermined pattern on a film having a predetermined color, the color printing process can be omitted, thereby simplifying the process and lowering the production cost.

In addition, according to an embodiment of the present invention, by directly laminating a metal pattern corresponding to the antenna pattern on the colored film, it is possible to simplify the antenna manufacturing process and reduce the antenna thickness to reduce the manufacturing cost as well as to reduce the defective rate have.

1 is a view showing the structure of a stacked structure according to an embodiment of the present invention

2 is a process flow diagram illustrating a manufacturing process of a stacked structure according to an embodiment of the present invention.

3 is a view for explaining a manufacturing process of the NFC antenna to which the stacked structure according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a laminated structure and a method of manufacturing the same according to an embodiment of the present invention.

In adding the reference numerals to the components of the drawings, the same components are to have the same reference numerals as possible even if displayed on different drawings, and known functions that are determined to unnecessarily obscure the subject matter of the present invention Detailed description of the configuration will be omitted. Also, directional terms such as 'one side', 'other side' and the like are used in connection with the orientation of the disclosed figure (s). Since the components of the embodiments of the present invention may be positioned in various orientations, the directional terminology is used for the purpose of illustration and not limitation.

1 is a view showing the structure of a stacked structure according to an embodiment of the present invention.

As shown in FIG. 1, the stacked structure 100 may include a metal pattern 110, a transparent film 120, and a color printing surface 122.

The metal pattern 110 may be formed by pressing a metal film on which the transparent film 120 is stacked, into a molding having a predetermined loop shape. In some embodiments, the metal pattern 110 may be formed using a metal film made of one or two or more alloys of a metal material for antenna radiators including aluminum (Al), copper, brass, phosphor bronze, and the like.

The metal pattern 110 laminated on one surface of the transparent film 120 may be formed by patterning the metal film laminated on the transparent film 120 through a patterning process, for example, an etching process. Here, one surface of the transparent film 120 may be laminated with the metal pattern 110 through a predetermined medium material, for example, an adhesive.

In some embodiments, the metal pattern 110 may include an antenna pattern having a plurality of contact portions 112. In some embodiments, an example of the antenna pattern may include an NFC antenna pattern, but is not limited thereto.

The transparent film 120 may be a polyimide (PI) film or a polyethylene terephthalate (PET) film.

In some embodiments, the other surface of the transparent film 120 may be formed with a color printing surface 122 having a predetermined color through a color printing process. Specifically, a black color printing process may be performed on the other surface of the transparent film 120 to form a color printing surface 122 that may conceal the metal pattern 110.

2 is a view showing the structure of a pattern assembly 200 according to another embodiment of the present invention.

As shown in FIG. 2, the pattern assembly 200 may include a metal pattern 110 and a masking film 210.

The metal pattern 110 may be formed by pressing a metal film on which the masking film 120 is stacked into a molding having a predetermined loop shape. As described with reference to FIG. 1, the metal pattern 110 may be formed using a metal film made of one or two or more alloys of an antenna radiator metal material including aluminum (Al), copper, brass, phosphor bronze, and the like.

The metal pattern 110 laminated on one surface of the masking film 210 may be formed by patterning the metal film laminated on the masking film 210 through a patterning process, for example, an etching process. Here, one surface of the masking film 210 may be laminated with a metal film through a predetermined medium material, for example, an adhesive.

In addition, the metal pattern 110 may include an antenna pattern having a plurality of contact parts 112. In some embodiments, an example of the antenna pattern may include an NFC antenna pattern, but is not limited thereto.

The masking film 210 may have a predetermined color, for example, black, to conceal the metal pattern 110 and may conceal the metal pattern 110 through the color.

In addition, the masking film 210 may be a black polyimide (PI) film or a polyethylene terephthalate (PET) film, but is not limited thereto.

The NFC antenna 300 using the pattern assemblies 100 and 200 described in the embodiments of the present invention as described above will be described with reference to FIG. 3.

3 is a view for explaining the structure of the NFC antenna 300 which is one of the stacked structure to which the pattern assembly 100, 200 according to an embodiment of the present invention can be applied.

As shown in FIG. 3, the NFC antenna 300 is flexible through a pattern assembly 310 having a plurality of contact parts (not shown), a flexible printed circuit board 320, and a bonding sheet 325. It may include an electromagnetic wave protection sheet 330 bonded to the printed circuit board 320.

The pattern assembly 310 may have a structure as described with reference to FIGS. 1 and 2.

Each of the plurality of contact parts of the pattern assembly 310 may be connected to a contact terminal of the flexible printed circuit board 320 described later.

The flexible printed circuit board 320 may include a flexible copper foil laminated film 321 and a coverlay 322 having a circuit pattern formed thereon. The process of forming the flexible printed circuit board 320 will be described. First and second metals stacked on upper and lower surfaces of the flexible copper foil laminated film 321 by performing an etching process on the flexible copper foil laminated film 321. A circuit pattern, for example, a circuit consisting of a plurality of external terminals connected to the outside, a plurality of contact terminals, and a land portion connecting each of the plurality of external terminals to each of the plurality of contact terminals while forming a via hole through the films 321a and 321b. Form a pattern. Then, the coverlay 322 is laminated after conducting a conductor plating process, for example, a copper plating process for connecting the via holes. Thereafter, the flexible printed circuit board 320 may be formed by performing a corrosion prevention process, for example, a titanium nitride (TiN) plating process, to prevent corrosion of the plurality of external terminals.

In certain embodiments, the flexible copper foil laminated film 321 is thin and flexible, has excellent heat resistance, grain resistance, chemical resistance, low dimensional change, and is heat resistant polyimide film or polyethylene terephthalate (PET). Films can be used.

The electromagnetic wave protection sheet 330 is an electromagnetic wave absorber for preventing a magnetic effect generated in the battery, and examples thereof include a ferrite sheet. For example, the ferrite sheet, which is the electromagnetic wave protection sheet 330, is disposed between the battery pack and the flexible printed circuit board 320 to absorb the reaction flux from the metal surface of the battery pack so that the antenna can transmit and receive radio waves smoothly.

The bonding sheet 325 is for attaching the electromagnetic wave protection sheet 330 to the flexible printed circuit board 320 using a thermal fusion film. Specifically, the bonding sheet 325 is easier to precisely position the position compared to using a double-sided tape, thereby simplifying the process. In addition, the electromagnetic wave protection sheet 330 laminated on the flexible printed circuit board 320 by the bonding sheet 325 is thermally compressed using a hot pressing process.

As described above, the flexible printed circuit board 320 having the electromagnetic wave protection sheet 330 laminated thereon may be laminated to the pattern assembly 310. Specifically, the contact terminal of the flexible printed circuit board 320 and the contact portion of the pattern assembly 310 may be laminated to be connected.

The manufacturing method 400 of the NFC antenna 300 having the above structure will be described with reference to FIG. 4.

4 is a flowchart illustrating a method 400 of manufacturing an NFC antenna 300 according to an embodiment of the present invention.

First, as shown in FIG. 4, the NFC antenna 300 forms a pattern assembly 310 having an antenna pattern having the structure of FIG. 1 or 2 (step 410). In the case of the antenna pattern assembly 310 having the structure of FIG. 1, first, a metal film is laminated on one surface of the transparent film 120, and then the laminated metal film is press-processed into a loop-shaped molding having a length capable of NFC communication. An antenna pattern having a plurality of contact parts is formed on one surface of the 120. Then, the other surface of the transparent film 120 is printed in a predetermined color to form a color printing surface 122. Accordingly, the antenna pattern formed on one surface of the transparent film 120 can be concealed.

Meanwhile, in the case of the antenna pattern assembly 310 having the structure of FIG. 2, the metal film is laminated on one surface of the masking film 220 having a predetermined color, and the laminated metal film has a loop-shaped molding having a length capable of NFC communication. Press-processing is performed to form an antenna pattern having a plurality of contact portions on one surface of the masking film 220.

Then, the flexible printed circuit board 320 is formed (step 420). Specifically, the flexible copper foil laminated film 321 and the first and second metal films 321 are formed by performing an etching process on the flexible copper foil laminated film 321 having the first and second metal films 321a and 312b formed on upper and lower surfaces thereof. A plurality of external terminals connected to the outside, a plurality of contact terminals connected to the contact portion 312 of the pattern assembly 310, a plurality of external terminals and a plurality of contact terminals A circuit pattern formed of land portions connecting each of them is formed (step 422). Then, a conductor plating process for connecting to the via hole, such as a copper plating process (step 424), is performed to connect the first and second metal films 321a and 321b inside the via hole, and the coverlay 322 on the resultant. ) Are stacked (step 426). Thereafter, a flexible printed circuit board 320 is formed by performing a corrosion preventing process, such as a titanium nitride plating process (step 428), to prevent corrosion of the plurality of external terminals.

Thereafter, the contact terminal of the flexible printed circuit board 320 and the contact portion of the pattern assembly 310 are connected to each other to laminate the flexible printed circuit board 320 and the pattern assembly 310 (step 430).

Then, the bonding assembly 325 is laminated between the flexible printed circuit board 320 and the electromagnetic wave protective sheet 330 on which the pattern assembly 310 is laminated, and then the electromagnetic wave protective sheet 330 is temporarily attached. Then, a hot press process is performed to finally bond the electromagnetic wave protection sheet 330 to the flexible printed circuit board 320 (step 432).

While the exemplary embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that various modifications can be made to the above-described embodiments without departing from the scope of the present invention. . Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims

A pattern assembly including a plurality of metal patterns including a plurality of contact parts, the film assembly being configured to film to conceal the metal pattern; And

A flexible printed circuit having a plurality of external terminals connected to the outside and a plurality of contact terminals connected to each of the plurality of external terminals, the one surface of which is laminated to the pattern assembly to connect the plurality of contact terminals and the plurality of contact portions. A stacked structure comprising a substrate.
The method according to claim 1,

And the film comprises a film having a color capable of concealing the metal pattern.
The method according to claim 2,

And said film is a polyimide film or polyethylene terephthalate film having said collar.
The method according to claim 1,

The film further comprises a color printing surface formed by performing a color printing process on the opposite side of the surface where the metal pattern is laminated.
The method according to claim 1,

And the metal pattern is an antenna pattern.
The method according to claim 1,

The laminated structure further comprises an electromagnetic wave protection sheet sheet bonded to the other surface of the flexible printed circuit board via a bonding sheet.
Forming a metal pattern having a plurality of contact portions laminated therein, the pattern assembly comprising a film for concealing the metal pattern;

Providing a flexible printed circuit board having a plurality of external terminals connected to the outside and a contact terminal connected to each of the plurality of external terminals; And

And laminating the flexible printed circuit board and the pattern assembly such that the plurality of contact terminals and the plurality of contact portions are connected to each other.
The method according to claim 7,

Forming the pattern assembly,

Laminating the metal film to one surface of the film;

Patterning the metal film through an etching process on the metal film to form a metal pattern including the plurality of contact parts; And

Forming a color printing surface for performing a color printing process on the other surface of the film to conceal the metal pattern.
The method according to claim 7,

Providing the pattern assembly,

Preparing the film having a color for concealing the metal pattern;

Laminating a metal film on one surface of the film and then patterning the metal film through an etching process for the metal film to form the metal pattern.
The method according to any one of claims 7 to 9,

The film is a polyimide film or polyethylene terephthalate film, the manufacturing method of the laminated structure.
The method according to claim 7,

And the metal pattern is an antenna pattern.
The method according to claim 7,

The manufacturing method

Bonding the electromagnetic wave protection sheet to the other surface of the flexible printed circuit board via a bonding sheet, the manufacturing method of the laminated structure.